JP6789774B2 - 成膜装置 - Google Patents
成膜装置 Download PDFInfo
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- JP6789774B2 JP6789774B2 JP2016223561A JP2016223561A JP6789774B2 JP 6789774 B2 JP6789774 B2 JP 6789774B2 JP 2016223561 A JP2016223561 A JP 2016223561A JP 2016223561 A JP2016223561 A JP 2016223561A JP 6789774 B2 JP6789774 B2 JP 6789774B2
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- 230000008021 deposition Effects 0.000 title 1
- 230000001681 protective effect Effects 0.000 claims description 73
- 239000000758 substrate Substances 0.000 claims description 45
- 238000005192 partition Methods 0.000 claims description 26
- 230000015572 biosynthetic process Effects 0.000 claims description 5
- 239000007789 gas Substances 0.000 description 126
- 239000010408 film Substances 0.000 description 54
- 238000001816 cooling Methods 0.000 description 42
- 239000002994 raw material Substances 0.000 description 19
- 239000002019 doping agent Substances 0.000 description 14
- 239000007795 chemical reaction product Substances 0.000 description 13
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 12
- 229910010271 silicon carbide Inorganic materials 0.000 description 12
- 230000001629 suppression Effects 0.000 description 12
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 10
- 239000000463 material Substances 0.000 description 10
- 239000012159 carrier gas Substances 0.000 description 7
- 230000007246 mechanism Effects 0.000 description 7
- 239000003507 refrigerant Substances 0.000 description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 6
- 229910052799 carbon Inorganic materials 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000001294 propane Substances 0.000 description 5
- 239000010453 quartz Substances 0.000 description 5
- 229910000077 silane Inorganic materials 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical compound C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000003779 heat-resistant material Substances 0.000 description 3
- 238000010926 purge Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- -1 for example Substances 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000006722 reduction reaction Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45563—Gas nozzles
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/32—Carbides
- C23C16/325—Silicon carbide
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/46—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/52—Controlling or regulating the coating process
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- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Inorganic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
Description
図1は、第1実施形態による成膜装置1の構成例を示す断面図である。成膜装置1は、チャンバ10と、ライナ20と、第1冷却部31、第2冷却部32、第3冷却部35と、ガス供給部40と、排気部50と、サセプタ60と、支持部70と、回転機構80と、下部ヒータ90と、上部ヒータ95と、リフレクタ100と、保護カバー110、112、114、116とを備えている。
図6は、第2実施形態によるチャンバ10の頭部12の構成例を示す断面図である。第2実施形態は、第1保護カバー110が仕切り板PT110を備えている点で第1実施形態と異なる。仕切り板PT110は、ガス供給部40に対して対向する対向面とは反対側の面に設けられ、ガスの供給方向D1へ延伸している。仕切り板PT110の長さは、特に限定しないが、ノズルNからのガスの噴出速度に応じて任意に設定してよい。第2実施形態のその他の構成は、第1実施形態の対応する構成と同様でよい。
図8は、第3実施形態によるチャンバ10の頭部12の構成例を示す断面図である。第3実施形態による第2保護カバー112は、チャンバ10の第1側壁部16の内面SF12に対向する面において凹凸形状を有する。これに伴い、チャンバ10の第1側壁部16の内面SF12も、第2保護カバー112に対向する面において凹凸形状を有する。第2保護カバー112の凹凸と第1側壁部16の凹凸とは、互い違いに嵌め込まれて嵌合している。即ち、第2保護カバー112の凸部は第1側壁部16の凹部に嵌め込まれ、第2保護カバー112の凹部は第1側壁部16の凸部を受容する。これにより、第2保護カバー112と第1側壁部16との対向面積が増大し、第1冷却部31により温度上昇抑制領域Rcにおけるガスの温度上昇をより効果的に抑制することができる。即ち、第2保護カバー112と第1側壁部16とのそれぞれの対向面を凹凸形状にすることによって、それらの対向面積を増大させ、それにより、第1冷却部31の冷却効果を高めることができる。
図9は、第4実施形態によるチャンバ10の頭部12の構成例を示す断面図である。第4実施形態による成膜装置1は、第1側壁部16に設けられ、第2保護カバーおよび温度上昇抑制領域Rcを観察可能な観察窓200をさらに備えている。観察窓200は、第1側壁部16および第1冷却部31を貫通して第2保護カバー112の直前にまで達している。オペレータは、観察窓200を介して第2保護カバー112の様子を部分的に観察することができる。例えば、第2保護カバー112が透明な石英で形成されている場合、観察窓200から第2保護カバー112を観察することによって、オペレータは、第2保護カバー112に反応生成物(ドーパントを含む)が付着しているか否かを認識することができる。また、第2保護カバー112が透明な石英で形成されている場合、オペレータは、観察窓200および第2保護カバー112を介してチャンバ10内の温度上昇抑制領域Rcの様子を観察することができる。
図10は、第5実施形態によるチャンバ10の頭部12の構成例を示す断面図である。第5実施形態による成膜装置1は、ノズルNの内面に設けられた第4保護カバー118をさらに備えている。第4保護カバー118は、ノズルNの第1開口部OP1側の内面を部分的に被覆している。
Claims (5)
- 基板を収容可能な成膜室と、
前記成膜室の上部に設けられ前記基板の成膜面上にガスを供給する複数のノズルを有するガス供給部と、
前記基板を加熱するヒータと、
前記ガス供給部の下部表面を被覆し、複数の開口部を有する第1保護カバーと、を備え、
前記成膜室は、前記第1保護カバーの下方にガスの温度上昇を抑制する温度上昇抑制領域を有し、
前記温度上昇抑制領域の周囲にある前記成膜室の第1側壁部の内径は、該第1側壁部より下方にある前記成膜室の第2側壁部の内径よりも小さく、
前記第1側壁部と前記第2側壁部との間の段差部を被覆する第3保護カバーをさらに備えている、成膜装置。 - 前記温度上昇抑制領域の周囲にある前記成膜室の第1側壁部を被覆する第2保護カバーをさらに備えた、請求項1に記載の成膜装置。
- 前記第1および第3保護カバーは、それぞれ前記成膜室内に露出する第1の面と、被覆される部分に対向する第2の面とを有し、
前記第1または第3保護カバーは、前記第2の面において前記被覆される部分と嵌合する凹凸形状を有する、請求項1または請求項2に記載の成膜装置。 - 前記第2保護カバーは、前記成膜室内に露出する第1の面と、被覆される部分に対向する第2の面とを有し、
前記第2保護カバーは、前記第2の面において前記被覆される部分と嵌合する凹凸形状を有する、請求項2に記載の成膜装置。 - 前記第1保護カバーは、前記成膜室内に前記ガスの供給方向へ延伸する仕切り板を有する、請求項1から請求項4のいずれか一項に記載の成膜装置。
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JP2016223561A JP6789774B2 (ja) | 2016-11-16 | 2016-11-16 | 成膜装置 |
CN201711130137.9A CN108070904B (zh) | 2016-11-16 | 2017-11-15 | 成膜装置 |
US15/814,172 US20180135175A1 (en) | 2016-11-16 | 2017-11-15 | Film forming apparatus |
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JP2016223561A JP6789774B2 (ja) | 2016-11-16 | 2016-11-16 | 成膜装置 |
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JP2018082063A JP2018082063A (ja) | 2018-05-24 |
JP6789774B2 true JP6789774B2 (ja) | 2020-11-25 |
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US (1) | US20180135175A1 (ja) |
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JP7464692B2 (ja) * | 2019-07-26 | 2024-04-09 | アプライド マテリアルズ インコーポレイテッド | 基板上にフィルムを形成するための蒸発器チャンバ |
WO2021225047A1 (ja) * | 2020-05-08 | 2021-11-11 | 株式会社ニューフレアテクノロジー | 成膜装置およびプレート |
JP2023142285A (ja) * | 2022-03-24 | 2023-10-05 | 株式会社ニューフレアテクノロジー | 成膜方法 |
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JP3362552B2 (ja) * | 1995-03-10 | 2003-01-07 | 東京エレクトロン株式会社 | 成膜処理装置 |
JPH09316644A (ja) * | 1996-05-23 | 1997-12-09 | Nippon Sanso Kk | Cvd装置のシャワーヘッドノズル |
WO1998023788A1 (en) * | 1996-11-27 | 1998-06-04 | Emcore Corporation | Chemical vapor deposition apparatus |
JPH11204443A (ja) * | 1998-01-12 | 1999-07-30 | Tokyo Electron Ltd | 枚葉式の熱処理装置 |
CN2438725Y (zh) * | 2000-09-22 | 2001-07-11 | 中国科学院半导体研究所 | 氧化膜外延设备 |
KR100849929B1 (ko) * | 2006-09-16 | 2008-08-26 | 주식회사 피에조닉스 | 반응 기체의 분사 속도를 적극적으로 조절하는 샤워헤드를구비한 화학기상 증착 방법 및 장치 |
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CN103715050B (zh) * | 2012-09-28 | 2017-01-11 | 细美事有限公司 | 基板支承组件及基板处理装置 |
JP6158025B2 (ja) * | 2013-10-02 | 2017-07-05 | 株式会社ニューフレアテクノロジー | 成膜装置及び成膜方法 |
JP2015156418A (ja) * | 2014-02-20 | 2015-08-27 | 株式会社ニューフレアテクノロジー | 気相成長方法 |
CN105957820B (zh) * | 2015-03-09 | 2019-12-20 | 纽富来科技股份有限公司 | 加热器以及使用了其的半导体装置的制造装置 |
JP2016174056A (ja) * | 2015-03-16 | 2016-09-29 | 株式会社東芝 | 半導体製造装置および半導体装置の製造方法 |
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2016
- 2016-11-16 JP JP2016223561A patent/JP6789774B2/ja active Active
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- 2017-11-15 CN CN201711130137.9A patent/CN108070904B/zh active Active
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US20180135175A1 (en) | 2018-05-17 |
JP2018082063A (ja) | 2018-05-24 |
CN108070904B (zh) | 2023-01-13 |
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