JP6781497B1 - 端面入射型半導体受光素子 - Google Patents
端面入射型半導体受光素子 Download PDFInfo
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- JP6781497B1 JP6781497B1 JP2020545380A JP2020545380A JP6781497B1 JP 6781497 B1 JP6781497 B1 JP 6781497B1 JP 2020545380 A JP2020545380 A JP 2020545380A JP 2020545380 A JP2020545380 A JP 2020545380A JP 6781497 B1 JP6781497 B1 JP 6781497B1
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 136
- 239000000758 substrate Substances 0.000 claims abstract description 111
- 239000010410 layer Substances 0.000 description 41
- 238000009792 diffusion process Methods 0.000 description 19
- 238000005530 etching Methods 0.000 description 16
- 229910000980 Aluminium gallium arsenide Inorganic materials 0.000 description 13
- 230000003287 optical effect Effects 0.000 description 12
- 239000013307 optical fiber Substances 0.000 description 12
- 239000011241 protective layer Substances 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 229910052681 coesite Inorganic materials 0.000 description 4
- 238000004891 communication Methods 0.000 description 4
- 229910052906 cristobalite Inorganic materials 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000035945 sensitivity Effects 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 235000012239 silicon dioxide Nutrition 0.000 description 4
- 229910052682 stishovite Inorganic materials 0.000 description 4
- 229910052905 tridymite Inorganic materials 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 2
- CPELXLSAUQHCOX-UHFFFAOYSA-N Hydrogen bromide Chemical compound Br CPELXLSAUQHCOX-UHFFFAOYSA-N 0.000 description 2
- 230000002238 attenuated effect Effects 0.000 description 2
- 230000031700 light absorption Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910021478 group 5 element Inorganic materials 0.000 description 1
- 229910000042 hydrogen bromide Inorganic materials 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
- H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/02—Details
- G01J1/04—Optical or mechanical part supplementary adjustable parts
- G01J1/0407—Optical elements not provided otherwise, e.g. manifolds, windows, holograms, gratings
- G01J1/0411—Optical elements not provided otherwise, e.g. manifolds, windows, holograms, gratings using focussing or collimating elements, i.e. lenses or mirrors; Aberration correction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
- H01L31/02327—Optical elements or arrangements associated with the device the optical elements being integrated or being directly associated to the device, e.g. back reflectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
- H01L31/10—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by potential barriers, e.g. phototransistors
- H01L31/101—Devices sensitive to infrared, visible or ultraviolet radiation
- H01L31/102—Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier
- H01L31/103—Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier the potential barrier being of the PN homojunction type
- H01L31/1037—Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier the potential barrier being of the PN homojunction type the devices comprising active layers formed only by AIVBVI compounds
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Light Receiving Elements (AREA)
Abstract
Description
前記半導体基板の光の入射側端部から光の入射方向に沿って、前記受光部を露出させるように形成された導光部と、前記導光部の光の入射方向端部に、前記主面に対して所定の交差角を有するように形成れた反射部と、前記半導体基板の前記主面に対向する裏面側に、前記導光部に臨むマウント基板反射部を備えたマウント基板とを有し、前記反射部が入射した光を前記マウント基板反射部に向けて反射させ、前記マウント基板反射部が前記反射部で反射された光を前記受光部に向けて反射させるように構成したことを特徴としている。
上記構成によれば、反射部の傾斜角度が自動的に定まり、高い反射率を備えた平滑な反射部を形成できるので、受光感度を向上させることができる。
上記構成によれば、光が導光部から受光部に入射する際の反射を反射防止膜によって低減して、入射した光の大部分を受光部に到達させることができ、受光感度を向上させることができる。
主面10a側に受光部11及び電極12,13が形成され、適切な厚さ(例えば150μm)に加工された半導体基板10の表面10bに、保護層21として例えばフォトレジスト層を形成する(保護層形成工程)。この半導体基板10には、直線L1に対して対称に2つの受光部11が形成されている。
主面30a側に受光部31及び電極32,33が形成され、適切な厚さ(例えば150μm)に加工された半導体基板30の表面30bに、保護層41として例えばフォトレジスト層を形成する(保護層形成工程)。この半導体基板30には、直線L3に対して対称に2つの受光部31が形成されている。
端面入射型半導体受光素子1Bの入射した光が通る導光部38は、受光部31が露出しており半導体基板30がないので光が吸収されず減衰しない。そして、導光部38の光の入射方向端部には、受光部38に光を導くために主面30aに対して所定の交差角θ2を有する反射部39aを有する。従って、入射した光の大部分を反射部39aで反射させることができるので、光の減衰を抑えて受光部31に光を導くことができ、吸収される波長の光に対しても端面入射型半導体受光素子1Bを利用することができる。
30 :半導体基板
30a :主面
30b :表面
30c :裏面
30d :端面
31 :受光部
32,33:電極
34 :マウント基板
38 :導光部
39 :(111)面
39a :反射部
40 :反射防止膜
41 :保護層
42 :誘電体層
42a :開口部
34a :マウント基板反射部
35 :n+拡散層
36 :n−層
36a :p型拡散領域
Claims (3)
- 半導体基板の主面側に受光部を有し、前記主面に対して平行に入射する光を反射させて前記受光部に入射させる端面入射型半導体受光素子において、
前記半導体基板は、入射する光を吸収するIV族半導体基板であり、
前記半導体基板の光の入射側端部から光の入射方向に沿って、前記受光部を露出させるように形成された導光部と、
前記導光部の光の入射方向端部に、前記主面に対して所定の交差角を有するように形成れた反射部と、
前記半導体基板の前記主面に対向する裏面側に、前記導光部に臨むマウント基板反射部を備えたマウント基板とを有し、
前記反射部が入射した光を前記マウント基板反射部に向けて反射させ、前記マウント基板反射部が前記反射部で反射された光を前記受光部に向けて反射させるように構成した
ことを特徴とする端面入射型半導体受光素子。 - 前記反射部は、前記半導体基板の(111)面に形成されたことを特徴とする請求項1に記載の端面入射型半導体受光素子。
- 前記受光部は、前記導光部に臨む側に反射防止膜を有することを特徴とする請求項1に記載の端面入射型半導体受光素子。
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PCT/JP2020/022097 WO2021245874A1 (ja) | 2020-06-04 | 2020-06-04 | 端面入射型半導体受光素子 |
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JP6781497B1 true JP6781497B1 (ja) | 2020-11-04 |
JPWO2021245874A1 JPWO2021245874A1 (ja) | 2021-12-09 |
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US (1) | US11276791B2 (ja) |
JP (1) | JP6781497B1 (ja) |
WO (1) | WO2021245874A1 (ja) |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH0315907U (ja) | 1989-06-29 | 1991-02-18 | ||
JP3152907B2 (ja) | 1998-12-10 | 2001-04-03 | 沖電気工業株式会社 | 半導体受光素子及びその製造方法 |
JP2003142699A (ja) * | 2001-11-06 | 2003-05-16 | Sumitomo Electric Ind Ltd | サブマウント及びこれを用いた光受信器 |
JP2004241746A (ja) * | 2002-12-13 | 2004-08-26 | Yokogawa Electric Corp | 高速受光素子およびその製造方法 |
JP2004241764A (ja) | 2003-01-17 | 2004-08-26 | Matsushita Electric Ind Co Ltd | 電子部品の実装構造 |
WO2019021362A1 (ja) * | 2017-07-25 | 2019-01-31 | 株式会社京都セミコンダクター | 端面入射型受光素子 |
US20200161492A1 (en) * | 2018-11-19 | 2020-05-21 | National Technology & Engineering Solutions Of Sandia, Llc | Light distribution plate for uniform irradiance of compact photovoltaic arrays |
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2020
- 2020-06-04 JP JP2020545380A patent/JP6781497B1/ja active Active
- 2020-06-04 US US16/981,634 patent/US11276791B2/en active Active
- 2020-06-04 WO PCT/JP2020/022097 patent/WO2021245874A1/ja active Application Filing
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JPWO2021245874A1 (ja) | 2021-12-09 |
WO2021245874A1 (ja) | 2021-12-09 |
US20210384365A1 (en) | 2021-12-09 |
US11276791B2 (en) | 2022-03-15 |
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