JP6765368B2 - シロキサンポリマー組成物の製造方法 - Google Patents

シロキサンポリマー組成物の製造方法 Download PDF

Info

Publication number
JP6765368B2
JP6765368B2 JP2017518609A JP2017518609A JP6765368B2 JP 6765368 B2 JP6765368 B2 JP 6765368B2 JP 2017518609 A JP2017518609 A JP 2017518609A JP 2017518609 A JP2017518609 A JP 2017518609A JP 6765368 B2 JP6765368 B2 JP 6765368B2
Authority
JP
Japan
Prior art keywords
bis
group
compound
trimethoxysilyl
particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2017518609A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017518435A5 (enExample
JP2017518435A (ja
Inventor
ヘイッキネン ヤルゥコー
ヘイッキネン ヤルゥコー
ランタラ ユハ
ランタラ ユハ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Inkron Oy
Original Assignee
Inkron Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Inkron Oy filed Critical Inkron Oy
Publication of JP2017518435A publication Critical patent/JP2017518435A/ja
Publication of JP2017518435A5 publication Critical patent/JP2017518435A5/ja
Application granted granted Critical
Publication of JP6765368B2 publication Critical patent/JP6765368B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/06—Preparatory processes
    • C08G77/08—Preparatory processes characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/50—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/24—Crosslinking, e.g. vulcanising, of macromolecules
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/28—Treatment by wave energy or particle radiation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0806—Silver
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2206—Oxides; Hydroxides of metals of calcium, strontium or barium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Silicon Polymers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2017518609A 2014-06-19 2015-06-22 シロキサンポリマー組成物の製造方法 Active JP6765368B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201462014136P 2014-06-19 2014-06-19
FI20145600 2014-06-19
US62/014,136 2014-06-19
FI20145600 2014-06-19
PCT/FI2015/050457 WO2015193558A1 (en) 2014-06-19 2015-06-22 A method of making a siloxane polymer composition

Publications (3)

Publication Number Publication Date
JP2017518435A JP2017518435A (ja) 2017-07-06
JP2017518435A5 JP2017518435A5 (enExample) 2018-08-02
JP6765368B2 true JP6765368B2 (ja) 2020-10-07

Family

ID=54934917

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017518609A Active JP6765368B2 (ja) 2014-06-19 2015-06-22 シロキサンポリマー組成物の製造方法

Country Status (6)

Country Link
US (2) US10487179B2 (enExample)
EP (1) EP3158004A1 (enExample)
JP (1) JP6765368B2 (enExample)
KR (1) KR102480589B1 (enExample)
CN (1) CN106687531A (enExample)
WO (1) WO2015193558A1 (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI20155713A7 (fi) * 2015-10-09 2017-04-10 Inkron Ltd Sähköisesti johtavat siloksaanipartikkelikalvot sekä niitä sisältävät laitteet
TWI738743B (zh) * 2016-03-23 2021-09-11 美商道康寧公司 金屬-聚有機矽氧烷
JP7125434B2 (ja) * 2017-06-30 2022-08-24 ダウ シリコーンズ コーポレーション 二重硬化オルガノポリシロキサン組成物
CN112654687B (zh) 2018-08-10 2023-08-25 陶氏东丽株式会社 压敏粘接层形成性聚有机硅氧烷组合物及其使用
JP7145125B2 (ja) * 2019-06-24 2022-09-30 信越化学工業株式会社 ラジカル硬化型シリコーン組成物及び硬化物
CN114269876B (zh) * 2019-08-13 2024-05-14 陶氏东丽株式会社 压敏粘接层形成性聚有机硅氧烷组合物及其使用
CN114269875B (zh) 2019-08-13 2024-05-14 陶氏东丽株式会社 压敏粘接层形成性聚有机硅氧烷组合物及其使用
KR102331157B1 (ko) * 2019-10-23 2021-11-26 (주)휴넷플러스 폴리실록산 공중합체, 이의 제조방법 및 이를 포함하는 수지 조성물
DE102022205830A1 (de) * 2021-09-27 2023-03-30 Robert Bosch Gesellschaft mit beschränkter Haftung (Poly-)Silsesquioxan ausbildende Kompositzusammensetzung
WO2023046995A1 (de) * 2021-09-27 2023-03-30 Robert Bosch Gmbh (poly-)silsesquioxan ausbildende kompositzusammensetzung
US20230386690A1 (en) * 2022-05-24 2023-11-30 Stark Street Materials Company Silicon enhanced ionizing radiation shielding and its method of manufacture
TWI872373B (zh) * 2022-09-22 2025-02-11 南亞塑膠工業股份有限公司 粉末組成物及其製造方法
CN116063637B (zh) * 2022-12-29 2023-09-15 武汉尚赛光电科技有限公司 用于形成介电膜的组合物及其应用和显示装置
TWI889210B (zh) * 2024-02-22 2025-07-01 財團法人工業技術研究院 聚合物、正型光阻組合物、與形成圖案化光阻層的方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5106538A (en) * 1987-07-21 1992-04-21 Raychem Corporation Conductive polymer composition
FR2742763B1 (fr) * 1995-12-22 1998-03-06 Rhone Poulenc Chimie Elastomere silicone a haute conductibilite thermique
US6534581B1 (en) * 2000-07-20 2003-03-18 Dow Corning Corporation Silicone composition and electrically conductive silicone adhesive formed therefrom
JP3962926B2 (ja) 2003-04-01 2007-08-22 信越化学工業株式会社 室温硬化性オルガノポリシロキサン組成物
KR100614976B1 (ko) 2004-04-12 2006-08-25 한국과학기술원 광소자 또는 디스플레이에 이용되는 무기/유기혼성올리고머, 나노혼성고분자 및 그 제조방법
KR100738650B1 (ko) 2005-04-19 2007-07-11 한국과학기술원 플라즈마 디스플레이 패널용 격벽의 제조방법
JP5392805B2 (ja) 2005-06-28 2014-01-22 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン樹脂組成物および光学部材
KR20120128155A (ko) * 2005-08-12 2012-11-26 캄브리오스 테크놀로지즈 코포레이션 나노와이어 기반의 투명 도전체
EP2017295A1 (en) * 2006-04-26 2009-01-21 Sekisui Chemical Co., Ltd. Thermosetting composition for optical semiconductor, die bond material for optical semiconductor device, underfill material for optical semiconductor device, sealing agent for optical semiconductor device, and optical semiconductor device
US20090088547A1 (en) 2006-10-17 2009-04-02 Rpo Pty Limited Process for producing polysiloxanes and use of the same
JP2008189917A (ja) * 2007-01-11 2008-08-21 Sekisui Chem Co Ltd 光半導体用熱硬化性組成物、光半導体素子用ダイボンド材、光半導体素子用アンダーフィル材、光半導体素子用封止剤及び光半導体素子
GB0806820D0 (en) * 2008-04-16 2008-05-14 Dow Corning Polymeric compositions
KR100980270B1 (ko) 2008-07-31 2010-09-07 한국과학기술원 Ｌｅｄ 봉지용 실록산 수지
JP5386314B2 (ja) 2009-01-13 2014-01-15 コリア アドバンスト インスティテュート オブ サイエンス アンド テクノロジー 透明複合体組成物
JP2011079927A (ja) * 2009-10-06 2011-04-21 Nagase Chemtex Corp 透明複合材
TWI467336B (zh) 2012-10-08 2015-01-01 Everlight Chem Ind Corp 黑色感光樹脂組成物及使用其之遮光層
KR101822042B1 (ko) * 2011-01-21 2018-01-25 프라운호퍼-게젤샤프트 츄어 푀르더룽 데어 안게반텐 포르슝에.파우. 중합가능한 조성물, 이에 의해 수득된 경화물, 및 그 물질의 용도
JP5409695B2 (ja) 2011-04-26 2014-02-05 信越化学工業株式会社 オルガノポリシロキサン、オルガノポリシロキサンを含む仮接着剤組成物、及びそれを用いた薄型ウエハの製造方法
US8559249B1 (en) 2012-03-27 2013-10-15 Apple Inc. Memory with redundant sense amplifier
CN103059573B (zh) * 2012-12-19 2015-08-05 中科院广州化学有限公司 无机/有机杂化纳米复合树脂及其制备的led封装用材料

Also Published As

Publication number Publication date
CN106687531A (zh) 2017-05-17
US10487179B2 (en) 2019-11-26
US20170152350A1 (en) 2017-06-01
US20200095379A1 (en) 2020-03-26
KR102480589B1 (ko) 2022-12-22
US11001674B2 (en) 2021-05-11
WO2015193558A1 (en) 2015-12-23
JP2017518435A (ja) 2017-07-06
KR20170020887A (ko) 2017-02-24
EP3158004A1 (en) 2017-04-26

Similar Documents

Publication Publication Date Title
JP6885866B2 (ja) シロキサンポリマー及び粒子を有する組成物
JP6765368B2 (ja) シロキサンポリマー組成物の製造方法
JP6869973B2 (ja) ３次元印刷材料および３ｄ印刷物品を作成する方法
JP2017518435A5 (enExample)
JP6712589B2 (ja) 透明シロキサン封入剤及び接着剤
JP6684273B2 (ja) シロキサン粒子材料を用いたｌｅｄランプ
JP6948315B2 (ja) 導電性シロキサン粒子膜およびそれを有するデバイス
TWI694112B (zh) 具有矽氧烷聚合物的組成物及製造矽氧烷粒子組成物的方法
TWI785389B (zh) 矽氧烷聚合物組成物及其製造方法
TWI746428B (zh) 矽氧烷聚合物組成物及其製造方法
TWI784922B (zh) Led燈、led燈之製造方法以及led裝置之密封方法
TW202111062A (zh) Led燈、led燈之製造方法以及led裝置之密封方法

Legal Events

Date Code Title Description
A524 Written submission of copy of amendment under article 19 pct

Free format text: JAPANESE INTERMEDIATE CODE: A524

Effective date: 20180413

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20180619

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20180619

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20190214

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20190305

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20190605

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20190723

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20191105

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20200205

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20200304

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20200825

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20200915

R150 Certificate of patent or registration of utility model

Ref document number: 6765368

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250