JP6764578B2 - 積層レンズ構造体およびその製造方法、並びに電子機器 - Google Patents

積層レンズ構造体およびその製造方法、並びに電子機器 Download PDF

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JP6764578B2
JP6764578B2 JP2018524588A JP2018524588A JP6764578B2 JP 6764578 B2 JP6764578 B2 JP 6764578B2 JP 2018524588 A JP2018524588 A JP 2018524588A JP 2018524588 A JP2018524588 A JP 2018524588A JP 6764578 B2 JP6764578 B2 JP 6764578B2
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Japan
Prior art keywords
lens
substrate
hole
laminated
light
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JP2018524588A
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English (en)
Japanese (ja)
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JP2018525684A5 (enExample
JP2018525684A (ja
Inventor
松谷　弘康
弘康 松谷
啓之 伊藤
啓之 伊藤
齋藤　卓
卓 齋藤
啓示 大島
啓示 大島
正則 岩崎
正則 岩崎
利彦 林
利彦 林
佐藤　修三
修三 佐藤
宣年 藤井
藤井　　宣年
田澤　洋志
洋志 田澤
白岩　利章
利章 白岩
石田　実
実 石田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
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Sony Corp
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Publication of JP2018525684A5 publication Critical patent/JP2018525684A5/ja
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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • G02B13/0085—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing wafer level optics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/00009—Production of simple or compound lenses
    • B29D11/00365—Production of microlenses
    • B29D11/00375—Production of microlenses by moulding lenses in holes through a substrate
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
    • G02B1/11—Anti-reflection coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H10F39/024—Manufacture or treatment of image sensors covered by group H10F39/12 of coatings or optical elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H10F39/026—Wafer-level processing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • H10F39/8063—Microlenses

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Ophthalmology & Optometry (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Lens Barrels (AREA)
  • Studio Devices (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Cameras In General (AREA)
JP2018524588A 2015-07-31 2016-07-15 積層レンズ構造体およびその製造方法、並びに電子機器 Active JP6764578B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015152921 2015-07-31
JP2015152921 2015-07-31
PCT/JP2016/003350 WO2017022188A1 (en) 2015-07-31 2016-07-15 Stacked lens structure, method of manufacturing the same, and electronic apparatus

Publications (3)

Publication Number Publication Date
JP2018525684A JP2018525684A (ja) 2018-09-06
JP2018525684A5 JP2018525684A5 (enExample) 2019-08-08
JP6764578B2 true JP6764578B2 (ja) 2020-10-07

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JP2018524588A Active JP6764578B2 (ja) 2015-07-31 2016-07-15 積層レンズ構造体およびその製造方法、並びに電子機器

Country Status (7)

Country Link
US (3) US10431618B2 (enExample)
EP (1) EP3329314B1 (enExample)
JP (1) JP6764578B2 (enExample)
KR (1) KR20180033167A (enExample)
CN (1) CN107771357B (enExample)
TW (1) TWI741988B (enExample)
WO (1) WO2017022188A1 (enExample)

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Publication number Publication date
US20200365639A1 (en) 2020-11-19
US11342371B2 (en) 2022-05-24
US10431618B2 (en) 2019-10-01
US20180108697A1 (en) 2018-04-19
CN107771357A (zh) 2018-03-06
WO2017022188A1 (en) 2017-02-09
CN107771357B (zh) 2022-01-14
US10818717B2 (en) 2020-10-27
EP3329314B1 (en) 2022-04-20
JP2018525684A (ja) 2018-09-06
EP3329314A1 (en) 2018-06-06
US20200006415A1 (en) 2020-01-02
KR20180033167A (ko) 2018-04-02
TWI741988B (zh) 2021-10-11
TW201710726A (zh) 2017-03-16

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