TWI741988B - 堆疊式透鏡結構及其製造方法，以及電子裝置 - Google Patents
堆疊式透鏡結構及其製造方法，以及電子裝置 Download PDFInfo
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- TWI741988B TWI741988B TW105121638A TW105121638A TWI741988B TW I741988 B TWI741988 B TW I741988B TW 105121638 A TW105121638 A TW 105121638A TW 105121638 A TW105121638 A TW 105121638A TW I741988 B TWI741988 B TW I741988B
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D11/00—Producing optical elements, e.g. lenses or prisms
- B29D11/00009—Production of simple or compound lenses
- B29D11/00365—Production of microlenses
- B29D11/00375—Production of microlenses by moulding lenses in holes through a substrate
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
- G02B1/11—Anti-reflection coatings
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B13/00—Optical objectives specially designed for the purposes specified below
- G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
- G02B13/0085—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing wafer level optics
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
- H10F39/024—Manufacture or treatment of image sensors covered by group H10F39/12 of coatings or optical elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
- H10F39/026—Wafer-level processing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/806—Optical elements or arrangements associated with the image sensors
- H10F39/8063—Microlenses
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- General Physics & Mathematics (AREA)
- Ophthalmology & Optometry (AREA)
- Mechanical Engineering (AREA)
- Health & Medical Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Lens Barrels (AREA)
- Studio Devices (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Cameras In General (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015-152921 | 2015-07-31 | ||
| JP2015152921 | 2015-07-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201710726A TW201710726A (zh) | 2017-03-16 |
| TWI741988B true TWI741988B (zh) | 2021-10-11 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW105121638A TWI741988B (zh) | 2015-07-31 | 2016-07-07 | 堆疊式透鏡結構及其製造方法，以及電子裝置 |
Country Status (7)
| Country | Link |
|---|---|
| US (3) | US10431618B2 (enExample) |
| EP (1) | EP3329314B1 (enExample) |
| JP (1) | JP6764578B2 (enExample) |
| KR (1) | KR20180033167A (enExample) |
| CN (1) | CN107771357B (enExample) |
| TW (1) | TWI741988B (enExample) |
| WO (1) | WO2017022188A1 (enExample) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI781085B (zh) * | 2015-11-24 | 2022-10-21 | 日商索尼半導體解決方案公司 | 複眼透鏡模組及複眼相機模組 |
| KR20190104381A (ko) * | 2017-01-06 | 2019-09-09 | 어비디티 바이오사이언시스 엘엘씨 | 핵산-폴리펩티드 조성물 및 엑손 스키핑을 유도하는 방법 |
| US10222555B2 (en) * | 2017-01-10 | 2019-03-05 | International Business Machines Corporation | Integrated optoelectronic chip and lens array |
| JP6949515B2 (ja) * | 2017-03-15 | 2021-10-13 | ソニーセミコンダクタソリューションズ株式会社 | カメラモジュール及びその製造方法、並びに、電子機器 |
| US10852460B2 (en) * | 2017-08-04 | 2020-12-01 | Canon Kabushiki Kaisha | Diffraction optical element, manufacturing method thereof, and optical apparatus |
| JP7032103B2 (ja) * | 2017-10-27 | 2022-03-08 | 日本電産コパル株式会社 | 撮像装置 |
| KR101855274B1 (ko) * | 2017-11-02 | 2018-05-08 | 에스케이씨 주식회사 | 플라스틱 렌즈의 이형 방법 및 이형 장치 |
| US10818778B2 (en) * | 2017-11-27 | 2020-10-27 | Taiwan Semiconductor Manufacturing Co., Ltd. | Heterogeneous semiconductor device substrates with high quality epitaxy |
| JP2019184719A (ja) | 2018-04-05 | 2019-10-24 | ソニーセミコンダクタソリューションズ株式会社 | 積層レンズ構造体およびその製造方法、並びに、電子機器 |
| WO2019227033A1 (en) * | 2018-05-24 | 2019-11-28 | International Electronic Machines Corp. | Sensitive area management |
| JP7206475B2 (ja) | 2018-08-31 | 2023-01-18 | 日亜化学工業株式会社 | レンズ及び発光装置並びにそれらの製造方法 |
| JP7239804B2 (ja) * | 2018-08-31 | 2023-03-15 | 日亜化学工業株式会社 | レンズ及び発光装置並びにそれらの製造方法 |
| JP6897641B2 (ja) | 2018-08-31 | 2021-07-07 | 日亜化学工業株式会社 | レンズ及び発光装置並びにそれらの製造方法 |
| JP2020136545A (ja) * | 2019-02-21 | 2020-08-31 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像装置及び電子機器 |
| DE102019107075A1 (de) * | 2019-03-20 | 2020-09-24 | HELLA GmbH & Co. KGaA | Beleuchtungsvorrichtung für Fahrzeuge |
| TWI701127B (zh) * | 2019-05-16 | 2020-08-11 | 趙崇禮 | 透鏡陣列的模具設備 |
| CN112582803B (zh) * | 2019-09-30 | 2022-08-12 | Oppo广东移动通信有限公司 | 阵列透镜、透镜天线和电子设备 |
| TWI748791B (zh) * | 2020-07-31 | 2021-12-01 | 友達光電股份有限公司 | 光感測器及其製造方法 |
| TWI752802B (zh) * | 2020-08-17 | 2022-01-11 | 友達光電股份有限公司 | 指紋感測模組及指紋辨識裝置 |
| US12052484B2 (en) | 2021-04-27 | 2024-07-30 | Apple Inc. | Camera integration for portable electronic devices |
| JP7610464B2 (ja) * | 2021-04-28 | 2025-01-08 | 株式会社ジャパンディスプレイ | 検出装置 |
| TWI769814B (zh) * | 2021-05-14 | 2022-07-01 | 聯華電子股份有限公司 | 改善半導體鍵合品質的方法 |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08199118A (ja) * | 1995-01-19 | 1996-08-06 | Mitsubishi Materials Corp | シリコン―シリコン接合方法 |
| CN101269917A (zh) * | 2007-03-21 | 2008-09-24 | 鸿富锦精密工业（深圳）有限公司 | 低辐射玻璃 |
| JP2011186306A (ja) * | 2010-03-10 | 2011-09-22 | Fujifilm Corp | ウェハレンズユニットおよびウェハレンズユニットの製造方法 |
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- 2016-07-15 KR KR1020187000558A patent/KR20180033167A/ko not_active Abandoned
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| US20200365639A1 (en) | 2020-11-19 |
| US11342371B2 (en) | 2022-05-24 |
| US10431618B2 (en) | 2019-10-01 |
| JP6764578B2 (ja) | 2020-10-07 |
| US20180108697A1 (en) | 2018-04-19 |
| CN107771357A (zh) | 2018-03-06 |
| WO2017022188A1 (en) | 2017-02-09 |
| CN107771357B (zh) | 2022-01-14 |
| US10818717B2 (en) | 2020-10-27 |
| EP3329314B1 (en) | 2022-04-20 |
| JP2018525684A (ja) | 2018-09-06 |
| EP3329314A1 (en) | 2018-06-06 |
| US20200006415A1 (en) | 2020-01-02 |
| KR20180033167A (ko) | 2018-04-02 |
| TW201710726A (zh) | 2017-03-16 |
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