JP6743846B2 - 積層型熱交換器、および、その積層型熱交換器の製造方法 - Google Patents

積層型熱交換器、および、その積層型熱交換器の製造方法 Download PDF

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Publication number
JP6743846B2
JP6743846B2 JP2018090096A JP2018090096A JP6743846B2 JP 6743846 B2 JP6743846 B2 JP 6743846B2 JP 2018090096 A JP2018090096 A JP 2018090096A JP 2018090096 A JP2018090096 A JP 2018090096A JP 6743846 B2 JP6743846 B2 JP 6743846B2
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Japan
Prior art keywords
pipe
protruding
fitting portion
flow path
tube
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JP2018090096A
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English (en)
Japanese (ja)
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JP2019004140A5 (enExample
JP2019004140A (ja
Inventor
亮平 冨田
亮平 冨田
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Denso Corp
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Denso Corp
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Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Priority to DE112018002936.0T priority Critical patent/DE112018002936T5/de
Priority to CN201880037377.0A priority patent/CN110731010B/zh
Priority to PCT/JP2018/019168 priority patent/WO2018225477A1/ja
Publication of JP2019004140A publication Critical patent/JP2019004140A/ja
Publication of JP2019004140A5 publication Critical patent/JP2019004140A5/ja
Priority to US16/704,312 priority patent/US20200111725A1/en
Application granted granted Critical
Publication of JP6743846B2 publication Critical patent/JP6743846B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
    • B23P15/26—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass heat exchangers or the like
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
    • F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
    • F28D1/03—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with plate-like or laminated conduits
    • F28D1/0308—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with plate-like or laminated conduits the conduits being formed by paired plates touching each other
    • F28D1/0325—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with plate-like or laminated conduits the conduits being formed by paired plates touching each other the plates having lateral openings therein for circulation of the heat-exchange medium from one conduit to another
    • F28D1/0333—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with plate-like or laminated conduits the conduits being formed by paired plates touching each other the plates having lateral openings therein for circulation of the heat-exchange medium from one conduit to another the plates having integrated connecting members
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D7/00—Heat-exchange apparatus having stationary tubular conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
    • F28D7/16—Heat-exchange apparatus having stationary tubular conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits being arranged in parallel spaced relation
    • F28D7/1607—Heat-exchange apparatus having stationary tubular conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits being arranged in parallel spaced relation with particular pattern of flow of the heat exchange media, e.g. change of flow direction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/02—Header boxes; End plates
    • F28F9/0219—Arrangements for sealing end plates into casing or header box; Header box sub-elements
    • F28F9/0221—Header boxes or end plates formed by stacked elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2210/00—Heat exchange conduits
    • F28F2210/10—Particular layout, e.g. for uniform temperature distribution
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/04—Fastening; Joining by brazing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D
    • H01L25/074—Stacked arrangements of non-apertured devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in subclass H10D
    • H01L25/117—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/18—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of the types provided for in two or more different main groups of the same subclass of H10B, H10D, H10F, H10H, H10K or H10N

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2018090096A 2017-06-09 2018-05-08 積層型熱交換器、および、その積層型熱交換器の製造方法 Active JP6743846B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE112018002936.0T DE112018002936T5 (de) 2017-06-09 2018-05-17 Gestapelter Wärmetauscher und Verfahren zum Herstellen eines gestapelten Wärmetauschers
CN201880037377.0A CN110731010B (zh) 2017-06-09 2018-05-17 层叠型热交换器及该层叠型热交换器的制造方法
PCT/JP2018/019168 WO2018225477A1 (ja) 2017-06-09 2018-05-17 積層型熱交換器、および、その積層型熱交換器の製造方法
US16/704,312 US20200111725A1 (en) 2017-06-09 2019-12-05 Stacked heat exchanger and method for producing stacked heat exchanger

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017114058 2017-06-09
JP2017114058 2017-06-09

Publications (3)

Publication Number Publication Date
JP2019004140A JP2019004140A (ja) 2019-01-10
JP2019004140A5 JP2019004140A5 (enExample) 2019-06-27
JP6743846B2 true JP6743846B2 (ja) 2020-08-19

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JP2018090096A Active JP6743846B2 (ja) 2017-06-09 2018-05-08 積層型熱交換器、および、その積層型熱交換器の製造方法

Country Status (4)

Country Link
US (1) US20200111725A1 (enExample)
JP (1) JP6743846B2 (enExample)
CN (1) CN110731010B (enExample)
DE (1) DE112018002936T5 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102676721B1 (ko) * 2019-04-24 2024-06-18 현대자동차주식회사 전력변환 장치용 냉각 시스템
KR20220064685A (ko) * 2020-11-12 2022-05-19 엘지전자 주식회사 열교환기, 핀튜브 제조방법 및 열교환기 제조방법

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4077559A (en) * 1976-09-27 1978-03-07 Carrier Corporation Oval bell concept
JPH04309795A (ja) * 1991-04-04 1992-11-02 Furukawa Alum Co Ltd 耐食性に優れたアルミニウム製熱交換器
JP2000097358A (ja) * 1998-09-22 2000-04-04 Saginomiya Seisakusho Inc パイプ継手構造
JP2000171188A (ja) * 1998-12-08 2000-06-23 Kaoru Tada プレ―ト式熱交換器
JP4552805B2 (ja) * 2005-08-19 2010-09-29 株式会社デンソー 積層型熱交換器及びその製造方法
JP2013165093A (ja) * 2012-02-09 2013-08-22 Toyota Motor Corp 半導体積層ユニット
JP6026808B2 (ja) * 2012-08-03 2016-11-16 株式会社ティラド 積層型ヒートシンクのコア
JP6132330B2 (ja) * 2013-01-23 2017-05-24 株式会社Uacj アルミニウム合金クラッド材および該クラッド材を成形したチューブを組み付けた熱交換器

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Publication number Publication date
US20200111725A1 (en) 2020-04-09
DE112018002936T5 (de) 2020-02-20
CN110731010B (zh) 2023-12-15
JP2019004140A (ja) 2019-01-10
CN110731010A (zh) 2020-01-24

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