JP6741001B2 - 封止用樹脂組成物および封止用シート - Google Patents
封止用樹脂組成物および封止用シート Download PDFInfo
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- JP6741001B2 JP6741001B2 JP2017515599A JP2017515599A JP6741001B2 JP 6741001 B2 JP6741001 B2 JP 6741001B2 JP 2017515599 A JP2017515599 A JP 2017515599A JP 2017515599 A JP2017515599 A JP 2017515599A JP 6741001 B2 JP6741001 B2 JP 6741001B2
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- PWZFXELTLAQOKC-UHFFFAOYSA-A dialuminum;hexamagnesium;carbonate;hexadecahydroxide;tetrahydrate Chemical compound O.O.O.O.[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Al+3].[Al+3].[O-]C([O-])=O PWZFXELTLAQOKC-UHFFFAOYSA-A 0.000 description 212
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- 238000004381 surface treatment Methods 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- GFZMLBWMGBLIDI-UHFFFAOYSA-M tetrabutylphosphanium;acetate Chemical compound CC([O-])=O.CCCC[P+](CCCC)(CCCC)CCCC GFZMLBWMGBLIDI-UHFFFAOYSA-M 0.000 description 1
- WHDWTYUVZOXXKX-UHFFFAOYSA-M tetrabutylphosphanium;formate Chemical compound [O-]C=O.CCCC[P+](CCCC)(CCCC)CCCC WHDWTYUVZOXXKX-UHFFFAOYSA-M 0.000 description 1
- DFQPZDGUFQJANM-UHFFFAOYSA-M tetrabutylphosphanium;hydroxide Chemical compound [OH-].CCCC[P+](CCCC)(CCCC)CCCC DFQPZDGUFQJANM-UHFFFAOYSA-M 0.000 description 1
- TUNFSRHWOTWDNC-HKGQFRNVSA-N tetradecanoic acid Chemical compound CCCCCCCCCCCCC[14C](O)=O TUNFSRHWOTWDNC-HKGQFRNVSA-N 0.000 description 1
- AYEKOFBPNLCAJY-UHFFFAOYSA-O thiamine pyrophosphate Chemical compound CC1=C(CCOP(O)(=O)OP(O)(O)=O)SC=[N+]1CC1=CN=C(C)N=C1N AYEKOFBPNLCAJY-UHFFFAOYSA-O 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 150000004992 toluidines Chemical class 0.000 description 1
- 238000000411 transmission spectrum Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- JABYJIQOLGWMQW-UHFFFAOYSA-N undec-4-ene Chemical compound CCCCCCC=CCCC JABYJIQOLGWMQW-UHFFFAOYSA-N 0.000 description 1
- 150000003672 ureas Chemical class 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 239000010457 zeolite Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Sealing Material Composition (AREA)
- Electroluminescent Light Sources (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015091052 | 2015-04-28 | ||
| JP2015091052 | 2015-04-28 | ||
| PCT/JP2016/063316 WO2016175271A1 (ja) | 2015-04-28 | 2016-04-28 | 封止用樹脂組成物および封止用シート |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2016175271A1 JPWO2016175271A1 (ja) | 2018-02-15 |
| JP6741001B2 true JP6741001B2 (ja) | 2020-08-19 |
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| JP2017515599A Active JP6741001B2 (ja) | 2015-04-28 | 2016-04-28 | 封止用樹脂組成物および封止用シート |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6741001B2 (zh) |
| TW (1) | TWI713519B (zh) |
| WO (1) | WO2016175271A1 (zh) |
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|---|---|---|---|---|
| KR102465011B1 (ko) * | 2016-10-04 | 2022-11-09 | 아지노모토 가부시키가이샤 | 밀봉용 수지 조성물 및 밀봉용 시트 |
| FR3091406B1 (fr) | 2018-12-31 | 2021-01-15 | Centre National De Recherche Scient Cnrs | Matériau pour l’isolation électrique et procédé de fabrication |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100519650C (zh) * | 2002-02-27 | 2009-07-29 | 日立化成工业株式会社 | 封装用环氧树脂组合物及使用该组合物的电子组件 |
| JPWO2006033380A1 (ja) * | 2004-09-24 | 2008-05-15 | 旭硝子株式会社 | 封着材組成物、それを用いた気密容器および電子部品のオーバーコートならびにそれらの製造方法 |
| JP5504550B2 (ja) * | 2006-01-23 | 2014-05-28 | 日立化成株式会社 | 封止用エポキシ樹脂成形材料及び電子部品装置 |
| CN103295992A (zh) * | 2008-10-10 | 2013-09-11 | 住友电木株式会社 | 半导体装置 |
| JP5577667B2 (ja) * | 2009-10-16 | 2014-08-27 | 味の素株式会社 | 樹脂組成物 |
| JP2012007086A (ja) * | 2010-06-25 | 2012-01-12 | Sumitomo Bakelite Co Ltd | 封止用樹脂組成物及び電子部品装置 |
| EP3067391A4 (en) * | 2013-11-08 | 2017-06-21 | Ajinomoto Co., Inc. | Hydrotalcite-containing sealing resin composition and sealing sheet |
-
2016
- 2016-04-28 JP JP2017515599A patent/JP6741001B2/ja active Active
- 2016-04-28 TW TW105113301A patent/TWI713519B/zh active
- 2016-04-28 WO PCT/JP2016/063316 patent/WO2016175271A1/ja active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| TW201702297A (zh) | 2017-01-16 |
| TWI713519B (zh) | 2020-12-21 |
| JPWO2016175271A1 (ja) | 2018-02-15 |
| WO2016175271A1 (ja) | 2016-11-03 |
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