JP6721486B2 - イオンビーム照射装置及び基板処理装置 - Google Patents
イオンビーム照射装置及び基板処理装置 Download PDFInfo
- Publication number
- JP6721486B2 JP6721486B2 JP2016204174A JP2016204174A JP6721486B2 JP 6721486 B2 JP6721486 B2 JP 6721486B2 JP 2016204174 A JP2016204174 A JP 2016204174A JP 2016204174 A JP2016204174 A JP 2016204174A JP 6721486 B2 JP6721486 B2 JP 6721486B2
- Authority
- JP
- Japan
- Prior art keywords
- grid electrode
- beam irradiation
- grid
- ion beam
- offset
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32412—Plasma immersion ion implantation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
- H01J37/08—Ion sources; Ion guns
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/06—Sources
- H01J2237/083—Beam forming
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/30—Electron or ion beam tubes for processing objects
- H01J2237/303—Electron or ion optical systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/30—Electron or ion beam tubes for processing objects
- H01J2237/31—Processing objects on a macro-scale
- H01J2237/3151—Etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/30—Electron or ion beam tubes for processing objects
- H01J2237/317—Processing objects on a microscale
- H01J2237/31701—Ion implantation
Landscapes
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Electron Sources, Ion Sources (AREA)
- Drying Of Semiconductors (AREA)
- Plasma Technology (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016204174A JP6721486B2 (ja) | 2016-10-18 | 2016-10-18 | イオンビーム照射装置及び基板処理装置 |
| US15/785,500 US10204766B2 (en) | 2016-10-18 | 2017-10-17 | Ion beam irradiation apparatus and substrate processing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016204174A JP6721486B2 (ja) | 2016-10-18 | 2016-10-18 | イオンビーム照射装置及び基板処理装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018067408A JP2018067408A (ja) | 2018-04-26 |
| JP2018067408A5 JP2018067408A5 (enExample) | 2019-12-05 |
| JP6721486B2 true JP6721486B2 (ja) | 2020-07-15 |
Family
ID=61904690
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016204174A Active JP6721486B2 (ja) | 2016-10-18 | 2016-10-18 | イオンビーム照射装置及び基板処理装置 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US10204766B2 (enExample) |
| JP (1) | JP6721486B2 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20210132599A (ko) * | 2020-04-24 | 2021-11-04 | 아이엠에스 나노패브릭케이션 게엠베하 | 대전 입자 소스 |
| EP4095882A1 (en) | 2021-05-25 | 2022-11-30 | IMS Nanofabrication GmbH | Pattern data processing for programmable direct-write apparatus |
| US12154756B2 (en) | 2021-08-12 | 2024-11-26 | Ims Nanofabrication Gmbh | Beam pattern device having beam absorber structure |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2858776B2 (ja) * | 1989-03-08 | 1999-02-17 | 日本原子力研究所 | ビーム照射装置 |
| US5218218A (en) * | 1990-02-01 | 1993-06-08 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device and manufacturing method thereof |
| US5218210A (en) * | 1992-02-18 | 1993-06-08 | Eaton Corporation | Broad beam flux density control |
| US5365070A (en) * | 1992-04-29 | 1994-11-15 | The Regents Of The University Of California | Negative ion beam injection apparatus with magnetic shield and electron removal means |
| JP3509343B2 (ja) * | 1995-10-30 | 2004-03-22 | 日新電機株式会社 | イオン源 |
| WO2001001438A1 (en) * | 1999-06-23 | 2001-01-04 | Applied Materials, Inc. | Ion beam generation apparatus |
| JP4443816B2 (ja) * | 2002-09-06 | 2010-03-31 | シャープ株式会社 | イオンドーピング装置及びイオンドーピング装置用多孔電極 |
| DE602006020899D1 (de) * | 2005-09-06 | 2011-05-05 | Applied Materials Israel Ltd | Teilchenoptische Anordnung mit teilchenoptischer Komponente |
| JP2007173069A (ja) | 2005-12-22 | 2007-07-05 | Japan Atomic Energy Agency | 超低エネルギーイオン源用電極 |
| JP2009217980A (ja) * | 2008-03-07 | 2009-09-24 | Nissin Ion Equipment Co Ltd | イオン源の電圧決定方法 |
| TW201133534A (en) * | 2009-09-18 | 2011-10-01 | Mapper Lithography Ip Bv | Multiple beam charged particle optical system |
| JP5041260B2 (ja) * | 2010-06-04 | 2012-10-03 | 日新イオン機器株式会社 | イオン注入装置 |
| US8309937B2 (en) * | 2010-10-05 | 2012-11-13 | Veeco Instruments, Inc. | Grid providing beamlet steering |
-
2016
- 2016-10-18 JP JP2016204174A patent/JP6721486B2/ja active Active
-
2017
- 2017-10-17 US US15/785,500 patent/US10204766B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2018067408A (ja) | 2018-04-26 |
| US20180108516A1 (en) | 2018-04-19 |
| US10204766B2 (en) | 2019-02-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP7254791B2 (ja) | 異方性パターンエッチングおよび処理のための方法および装置 | |
| US10522332B2 (en) | Plasma processing system, electron beam generator, and method of fabricating semiconductor device | |
| KR102603581B1 (ko) | 플라즈마 소스, 기판을 패턴화하는 방법, 및 기판 프로세싱 시스템 | |
| KR102212621B1 (ko) | 기판을 프로세싱하기 위한 시스템 및 방법 | |
| JP2017510932A5 (ja) | 基板に供給されるイオンビームを制御する処理装置及び方法 | |
| JP6721486B2 (ja) | イオンビーム照射装置及び基板処理装置 | |
| JP6324231B2 (ja) | イオン注入装置 | |
| JP6324223B2 (ja) | イオン注入装置及びイオン注入方法 | |
| JP2008174777A (ja) | 薄膜形成装置 | |
| KR20150063940A (ko) | 이온주입장치 | |
| KR102578766B1 (ko) | 이온 빔 에칭 장치 | |
| TWI795794B (zh) | 處理系統、包括高角度提取光學元件之提取總成 | |
| TW201519275A (zh) | 用於對基底進行圖案化的系統與方法 | |
| US12224163B2 (en) | Ion beam source, substrate process apparatus including the same, and method of processing a substrate using the same | |
| KR101665935B1 (ko) | 이온빔 전하밀도의 공간 산포 균일화를 위한 전극구조를 구비하는 이온빔가공장치 및 이를 이용한 기판가공방법 | |
| US12020893B2 (en) | Ion milling device | |
| JP2018067408A5 (enExample) | ||
| JP2018522135A (ja) | 多層堆積装置及び方法 | |
| JP6503859B2 (ja) | イオンビーム照射装置およびイオンビーム照射方法 | |
| JP2005116865A (ja) | イオンミリング装置およびイオンミリング方法 | |
| US10381192B2 (en) | Ion implantation apparatus and ion implantation method | |
| CN1320947A (zh) | 采用接地导电栅网的直流等离子体离子注入装置 | |
| US20250132133A1 (en) | Grid for semiconductor process | |
| US20250372354A1 (en) | System and method for plasma treatment with independent control of neutral particle and ion fluxes | |
| JP2007324058A (ja) | イオンビーム処理装置及びイオンビーム処理方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20191018 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20191018 |
|
| A871 | Explanation of circumstances concerning accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A871 Effective date: 20191018 |
|
| A975 | Report on accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A971005 Effective date: 20191030 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20200120 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20200128 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20200325 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20200519 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20200618 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 6721486 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |