JP6719541B2 - 回路基板構造及びその製造方法 - Google Patents

回路基板構造及びその製造方法 Download PDF

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Publication number
JP6719541B2
JP6719541B2 JP2018235034A JP2018235034A JP6719541B2 JP 6719541 B2 JP6719541 B2 JP 6719541B2 JP 2018235034 A JP2018235034 A JP 2018235034A JP 2018235034 A JP2018235034 A JP 2018235034A JP 6719541 B2 JP6719541 B2 JP 6719541B2
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Japan
Prior art keywords
laser
hole
circuit board
board structure
conductive layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2018235034A
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English (en)
Japanese (ja)
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JP2020013973A (ja
Inventor
微▲か▼ 婁
微▲か▼ 婁
奇 孫
奇 孫
政明 呂
政明 呂
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tripod Wuxi Electronic Co Ltd
Original Assignee
Tripod Wuxi Electronic Co Ltd
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Publication date
Application filed by Tripod Wuxi Electronic Co Ltd filed Critical Tripod Wuxi Electronic Co Ltd
Publication of JP2020013973A publication Critical patent/JP2020013973A/ja
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Publication of JP6719541B2 publication Critical patent/JP6719541B2/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Laser Beam Processing (AREA)
JP2018235034A 2018-07-16 2018-12-17 回路基板構造及びその製造方法 Active JP6719541B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201810775696.3A CN110730560A (zh) 2018-07-16 2018-07-16 电路板结构及其制造方法
CN201810775696.3 2018-07-16

Publications (2)

Publication Number Publication Date
JP2020013973A JP2020013973A (ja) 2020-01-23
JP6719541B2 true JP6719541B2 (ja) 2020-07-08

Family

ID=69170018

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018235034A Active JP6719541B2 (ja) 2018-07-16 2018-12-17 回路基板構造及びその製造方法

Country Status (3)

Country Link
JP (1) JP6719541B2 (zh)
KR (1) KR20200008489A (zh)
CN (2) CN110730560A (zh)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06216488A (ja) * 1993-01-19 1994-08-05 Canon Inc プリント配線板及びその加工方法
JPH07115272A (ja) * 1993-10-20 1995-05-02 Hitachi Ltd 薄膜多層配線実装基板の製造方法及び製造装置
CN104302099A (zh) * 2013-07-17 2015-01-21 先丰通讯股份有限公司 电路板及其制造方法
TW201700966A (zh) * 2015-06-18 2017-01-01 Machvision Inc 印刷電路板之孔位資訊的檢測方法及檢測設備
CN105934110B (zh) * 2016-06-08 2018-09-28 华进半导体封装先导技术研发中心有限公司 超薄多层板加工用的三明治结构和多层板制作方法

Also Published As

Publication number Publication date
JP2020013973A (ja) 2020-01-23
KR20200008489A (ko) 2020-01-28
CN110730560A (zh) 2020-01-24
CN116406103A (zh) 2023-07-07

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