JP6719541B2 - Circuit board structure and manufacturing method thereof - Google Patents

Description

The present invention relates to a circuit board, and more particularly to a circuit board structure that does not require mechanical perforation and a method for manufacturing the same.

As shown in FIG. 1, in a conventional circuit board structure 100′, a mechanical drilling method is generally used to form a through hole 2′ penetrating the multilayer board 1′. Is. However, as the design density of the circuit board structure increases, it is expected that the mechanical drilling method not only prolongs the production time but also reduces the wiring density of the circuit board structure.

Further, in another conventional circuit board structure (not shown), a plate is pierced by a laser perforation method for each layer of the multilayer board to plate the multilayer board to form a through hole and a conductor plated in the through hole. Form. However, the method of performing laser drilling layer by layer as described above significantly increases the production time and further increases the production cost of the circuit board structure.

Therefore, the present inventor has provided the present invention in which the design is rational and the aforesaid drawbacks are effectively ameliorated as a result of intensive studies and utilization of scientific principles in order to ameliorate the aforesaid drawbacks.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a circuit board structure and a method of manufacturing the same in order to effectively improve the drawbacks that may occur in the conventional method of manufacturing a circuit board structure.

The present invention provides a preparatory step of providing a multilayer board having N conductive layers (N is a positive integer greater than 2), and laser drilling from the first conductive layer of the N conductive layers. And a first laser drilling step of forming a first laser hole that does not penetrate to the Nth conductive layer of the N conductive layers, and the Nth conductive layer of the N conductive layers. Laser drilling from the conductive layer to form a second laser hole communicating with the first laser hole, and the first laser hole and the second laser hole in the first laser hole. Disclosed is a method for manufacturing a circuit board structure, which includes a conductive step of forming a conductor connecting the conductive layer of the Nth layer and the conductive layer of the Nth layer. Embodiments of the present invention further disclose a circuit board structure manufactured by the method for manufacturing a circuit board structure described above.

The present invention also includes a first laser hole and a second laser hole which include N conductive layers (N is a positive integer greater than 2) and are in communication with each other, wherein the first laser hole is The first laser conductive layer of the N conductive layers is recessed from the first conductive layer, and the second laser hole is recessed from the N conductive layer of the N conductive layers. A multilayer plate in which the hole diameter of the first laser hole and the hole diameter of the second laser hole increase in the direction away from each other from both joints; and the first laser hole and the second laser hole. Also disclosed is a circuit board structure including a conductor connecting the first conductive layer and the Nth conductive layer.

As described above, the circuit board structure and the manufacturing method thereof disclosed in the present invention completely use the laser perforation method, and the first laser hole and the first laser hole penetrating the multilayer board with a small number of laser perforations. 2 Laser holes are formed, and by not using mechanical perforations, it is possible to shorten the time required for producing the circuit board structure and the manufacturing method thereof, reduce the production cost, and further increase the wiring density. Applicable to design.

In order to better understand the features and techniques of the present invention, the detailed description and drawings according to the present invention can be referred to as follows, but such description and drawings are only for explaining the present invention, and the present invention It does not limit the scope of protection.

It is a schematic diagram of the conventional circuit board structure. It is a schematic diagram of step S110 of the manufacturing method of the circuit board structure which concerns on this invention. It is a schematic diagram of step S120 of the manufacturing method of the circuit board structure which concerns on this invention. It is a schematic diagram of step S130 of the manufacturing method of the circuit board structure which concerns on this invention. It is a schematic diagram of step S141 of the manufacturing method of the circuit board structure which concerns on this invention. It is a schematic diagram of step S142 of the manufacturing method of the circuit board structure which concerns on this invention. It is a schematic diagram (1) of step S150 of the manufacturing method of the circuit board structure which concerns on this invention. It is a schematic diagram (2) of step S150 of the manufacturing method of the circuit board structure which concerns on this invention.

2-6B, an embodiment of the present invention is shown. It should be noted that the numbers and outer shapes shown in the drawings corresponding to the present embodiment are only for explaining the embodiment of the present invention so that the content of the present invention can be grasped, and limit the protection scope of the present invention. Not a thing.

The present embodiment discloses a circuit board structure and a method for manufacturing the same, and in the present embodiment, the circuit board structure is manufactured by the method for manufacturing the circuit board structure, but the present invention is not limited thereto. That is, in another embodiment (not shown) of the present invention, the circuit board structure may be manufactured by another manufacturing method.

Further, in order to facilitate understanding of a specific structure of the circuit board structure, a method of manufacturing the circuit board structure of the present embodiment will be described below, and then a specific structure of the circuit board structure will be described.
[Method for manufacturing circuit board structure]
Note that, for convenience of description of the present embodiment, only relevant partial structures are shown in the drawings. As shown in FIG. 2 to FIG. 6B, in the present embodiment, the method for manufacturing the circuit board structure includes a preparation step S110, a first laser perforation step S120, a second laser perforation step S130, a conduction step S140, and a layer addition. Although including step S150, the present invention is not limited to the order or implementation of steps S110 to S150.

For example, in another embodiment (not shown) of the present invention, steps S110 to S150 can be adjusted or increased/decreased according to actual design needs. Further, each step S110 to S150 of the method for manufacturing the circuit board structure of the present embodiment will be described below.

As shown in FIG. 2, the preparation step S110 is performed. That is, the multilayer board 1 including the multilayer board 11 and the N-layer (N is a positive integer larger than 2) conductive layer 12 provided on the surface of the multilayer board 11 is provided. In the present embodiment, the number of plate bodies 11 of the multilayer board 1 is N-1 layers, and N is preferably 4 to 10 (for example, N is 4 in the drawing), but is not limited thereto. ..

As shown in FIG. 3, the first laser perforation step S120 is performed. That is, laser drilling is performed from the first conductive layer 12 of the N conductive layers 12 (for example, the uppermost conductive layer 12 in FIG. 3), and N of the N conductive layers 12 is drilled. A first laser hole 13 that does not penetrate to the conductive layer 12 of the layer (for example, the lowermost conductive layer 12 in FIG. 3) is formed.

The hole diameter D13 of the first laser hole 13 is preferably gradually reduced in the direction from the first conductive layer 12 to the Nth conductive layer 12 (for example, downward in FIG. 3). In addition, although a structure similar to a truncated cone is formed, the present invention is not limited thereto. Further, the maximum value of the hole diameter of the first laser hole 13 (for example, the hole diameter of the first laser hole 13 corresponding to the first conductive layer 12) is preferably equal to or smaller than the minimum value of the hole diameter by the conventional mechanical drilling. Is.

As shown in FIG. 4, the second laser perforation step S130 is performed. That is, laser drilling is performed from the Nth conductive layer 12 (for example, the lowermost conductive layer 12 in FIG. 4) of the N conductive layers 12 and communicates with the first laser hole 13. The second laser hole 14 is formed.

The diameter of the second laser hole 14 is preferably gradually reduced in the direction from the Nth conductive layer 12 to the first conductive layer 12 (for example, upward in FIG. 4 ), similar to a truncated cone shape. However, the present invention is not limited thereto. Further, the maximum value of the hole diameter of the second laser hole 14 (for example, the hole diameter of the second laser hole 14 corresponding to the Nth conductive layer 12) is preferably equal to or smaller than the minimum value of the hole diameter by the conventional mechanical drilling. Is.

More specifically, in the present embodiment, the maximum value of the hole diameter of the first laser hole 13 is substantially the same as the maximum value of the hole diameter of the second laser hole 14, and is the same as the hole diameter of the first laser hole 13. The hole diameter of the second laser hole 14 increases from both joints in a direction away from each other (for example, upward and downward in FIG. 4), and the joint is the plate body 11 located substantially at the center. However, the present invention is not limited to the above conditions.

Further, in the present embodiment, the first laser hole 13 and the second laser hole 14 jointly penetrate all the conductive layers 12 of the N conductive layers 12, but the present invention is not limited thereto. .. For example, in another embodiment (not shown) of the present invention, at least one conductive layer 12 among the other conductive layers 12 located between the first conductive layer 12 and the Nth conductive layer 12 (that is, the second conductive layer 12). At least one conductive layer 12) of the (N-1)th conductive layer 12 does not have to be formed in a portion corresponding to the first laser hole 13 and the second laser hole 14. Therefore, it is not penetrated by the laser drilling. Further, in the method of manufacturing a circuit board structure according to the present embodiment, the number of laser perforations performed is preferably larger than 1 and N-2 or less.

As shown in FIGS. 5A and 5B, the conduction step S140 is performed. That is, the conductors 2a and 2b for connecting the first conductive layer 12 and the Nth conductive layer 12 are formed in the first laser hole 13 and the second laser hole 14, respectively. In other words, the conductors 2a and 2b of this embodiment are not installed in the holes formed by mechanical perforation.

Furthermore, in the present embodiment, the first laser hole 13 and the second laser hole 14 jointly penetrate all the conductive layers 12 of the N conductive layers 12, so that the conductors 2a and 2b are Although all of the N conductive layers 12 are connected, the present invention is not limited thereto.

More specifically, the conductors 2a and 2b are formed by a plating method, but the conduction step S140 is selectively performed by the first electroplating step S141 or the first electroplating step according to design needs. It may be carried out in the second electroplating step S142 different from S141. Hereinafter, the first electroplating step S141 and the second electroplating step S142 included in the conduction step S140 will be described.

As shown in FIG. 5A, the first electroplating step S141 is performed. That is, the conductor 2a is plated on the hole wall of the first laser hole 13 and the hole wall of the second laser hole 14, and forms the space 21a surrounded by the inner surface of the conductor 2a. That is, the conductor 2a formed in the first electroplating step S141 in this embodiment has a hollow structure.

As shown in FIG. 5B, the second electroplating step S142 is performed. That is, the conductor 2b is plated in the first laser hole 13 and the second laser hole 14, and the conductor 2b is plated so as to fill the first laser hole 13 and the second laser hole 14. .. That is, the conductor 2b formed in the second electroplating step S142 of this embodiment has a solid structure.

As shown in FIGS. 6A and 6B, the layer adding step S150 is performed. That is, at least one layered structure 3 is added to each of both surfaces (for example, the upper surface of the uppermost plate 11 and the lower surface of the lowermost plate 11 in FIG. 6A or 6B) of the multilayer board 1. The conductors 2a and 2b are sandwiched (or embedded) between the at least two layered structures 3. In FIG. 6A, the space 21 a inside the conductor 2 a is filled with the layered structure 3.

As described above, in the method of manufacturing a circuit board structure, when steps S110 to S150 are performed, the circuit board structure 100 suitable for higher wiring density and shorter in production time is manufactured. However, the manufacture of the circuit board structure 100 of the present invention is not limited to the case of performing the steps S110 to S150. Hereinafter, a specific structure of the circuit board structure 100 of the present embodiment will be briefly described, and the detailed features described above can be referred to as necessary.
[Circuit board structure]
Note that, for convenience of description of the present embodiment, only relevant partial structures are shown in the drawings. As shown in FIGS. 6A and 6B, in the present embodiment, the circuit board structure 100 includes a multilayer board 1, conductors 2a and 2b embedded in the multilayer board 1, and the multilayer board 1 and the multilayer board 1 respectively. And two layered structures 3 coated on both sides of the conductors 2a, 2b.

The multi-layer board 1 includes a multi-layer board 11 and N conductive layers 12 (N is a positive integer larger than 2) provided on the surface of the multi-layer board 11. A first laser hole 13 and a second laser hole 14 communicating with each other are formed in the multilayer plate 1, and the first laser hole 13 and the second laser hole 14 penetrate the multilayer plate 1. Through-holes are jointly configured.

Further, the first laser hole 13 is recessed from the first conductive layer 12 of the N conductive layers 12 (for example, the uppermost conductive layer 12 in FIG. 6A or 6B), and The second laser hole 14 is recessed from the Nth conductive layer 12 (for example, the lowermost conductive layer 12 in FIG. 6A or FIG. 6B) of the N conductive layers 12, and the first laser hole 14 is provided. The hole diameter of the laser hole 13 and the hole diameter of the second laser hole 14 increase in the direction away from each other at both joints.

As shown in FIGS. 6A and 6B, the conductors 2a and 2b are located in the first laser hole 13 and the second laser hole 14 of the multilayer board 1, and the conductors 2a and 2b are one layer. The conductive layer 12 of the second layer is connected to the conductive layer 12 of the Nth layer. In the present embodiment, the conductors 2a and 2b are connected to all the conductive layers 12 of the conductive layers 12 of the Nth layer. The invention is not so limited.

More specifically, in this embodiment, the conductor includes two types shown in FIGS. 6A and 6B. As shown in FIG. 6A, the conductor 2a is plated on the hole wall of the first laser hole 13 and the hole wall of the second laser hole 14 and forms a space 21a surrounded by the inner surface of the conductor 2a. That is, the conductor 2a shown in FIG. 6A has a hollow structure. Further, as shown in FIG. 6B, the conductor 2b is plated on the first laser hole 13 and the second laser hole 14, and is electrically conductive so as to fill the first laser hole 13 and the second laser hole 14. The body 2b is plated, that is, the conductor 2b shown in FIG. 6B is a solid structure.
[Technical effects of the embodiment of the present invention]
As described above, in the circuit board structure 100 and the manufacturing method thereof disclosed in the embodiment of the present invention, the first laser which completely penetrates the multilayer board 1 by using the laser perforation method and with a small number of laser perforations. Since the holes 13 and the second laser holes 14 are formed, the circuit board structure 100 and the method of manufacturing the circuit board structure 100 can reduce the production time, reduce the production cost, and eliminate the need for mechanical perforation. Applicable to higher density wiring design.

The above is a preferred embodiment of the present invention, which does not limit the protection scope of the present invention, and any equivalent variations and modifications that are implemented without departing from the scope of the claims of the present invention It belongs to the protection scope of the claims.

[Prior art]
100': Circuit board structure 1': Multilayer board 2': Through hole [Embodiment of the present invention]
100: Circuit board structure 1: Multilayer plate 11: Plate 12: Conductive layer 13: First laser hole 14: Second laser hole 2a: Conductor 21a: Space 2b: Conductor 3: Layered structure S110: Preparation step S120: First laser perforation step S130: Second laser perforation step S140: Conduction step S140
S141: First electroplating step S142: Second electroplating step S150: Layer addition step

Claims (6)

A method of manufacturing a circuit board structure, comprising:
A preparatory step of providing a multilayer board having N layers of conductive layers (N is a positive integer greater than 2);
Laser drilling is performed from the first conductive layer of the N conductive layers to form a first laser hole that does not penetrate to the N conductive layer of the N conductive layers. A first laser drilling step,
A second laser perforation step of performing laser perforation from the Nth conductive layer of the N conductive layers to form a second laser hole communicating with the first laser hole;
The first laser aperture and the second laser bore, see contains a conduction forming a conductor for connecting the conductive layer and the N-th layer the conductive layer of the first layer,
In the conducting step, the conductor is plated in the first laser hole and the second laser hole, and the conductor is plated over the entire first laser hole and the second laser hole. Method of manufacturing a circuit board structure. The first laser hole and the second laser hole jointly penetrate all the conductive layers of the N conductive layers, and the conductor is used for all the N conductive layers. The method of manufacturing a circuit board structure according to claim 1, wherein conductive layers are connected. The method for manufacturing a circuit board structure according to claim 1, wherein the number of times of laser drilling is greater than 1 and N-2 or less, and N is limited to 4 to 10. The method for manufacturing a circuit board structure according to claim 1, further comprising a layer adding step of adding at least one layered structure to each of both surfaces of the multilayer board after the conducting step. Circuit board structure,
A circuit board structure manufactured by the method for manufacturing a circuit board structure according to claim 1. Circuit board structure,
The conductive layer includes an N-layer (N is a positive integer greater than 2) conductive layer and has a first laser hole and a second laser hole which are in communication with each other, and the first laser hole is an N-layer. The first laser layer is recessed from the first conductive layer, and the second laser hole is recessed from the Nth conductive layer of the N conductive layers. A multilayer plate in which the hole diameter of the hole and the hole diameter of the second laser hole increase in a direction away from each other at both joints;
A conductor located in the first laser hole and the second laser hole and connecting the first conductive layer and the Nth conductive layer ;
The conductor is plated on the first laser aperture and the second laser aperture, and the circuit board structure the conductor throughout the second laser holes and the first laser cavity is characterized that you have been plated.

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