CN116406103A

CN116406103A - Circuit board structure and manufacturing method thereof

Info

Publication number: CN116406103A
Application number: CN202310432853.1A
Authority: CN
Inventors: 娄微卡; 孙奇; 吕政明
Original assignee: Tripod Wuxi Electronic Co Ltd
Current assignee: Tripod Wuxi Electronic Co Ltd
Priority date: 2018-07-16
Filing date: 2018-07-16
Publication date: 2023-07-07
Also published as: KR20200008489A; CN110730560A; JP6719541B2; JP2020013973A

Abstract

The invention discloses a circuit board structure and a manufacturing method thereof, wherein the manufacturing method of the circuit board structure comprises the following steps: providing a multilayer board having N conductive layers (N is a positive integer greater than 2); performing laser drilling from a first conducting layer in the N conducting layers to form a first laser hole which does not penetrate through an Nth conducting layer in the N conducting layers; performing laser drilling from an Nth conductive layer in the N conductive layers to form a second laser hole communicated with the first laser hole; and a conductor connecting the first layer of the conductive layer and the Nth layer of the conductive layer is formed in the first laser hole and the second laser hole. In addition, the invention further discloses a circuit board structure.

Description

Circuit board structure and manufacturing method thereof

The present application is a divisional application of Chinese patent application (application number: 201810775696.3, application date: 2018, month 07, 16, title of the invention: circuit board structure and method of manufacturing the same).

Technical Field

The present invention relates to a circuit board, and more particularly, to a circuit board structure and a method for manufacturing the same without using mechanical drilling.

Background

As shown in fig. 1, the conventional circuit board structure 100' is mostly implemented by mechanical drilling when forming a through hole 2' penetrating the multilayer board 1 '. However, it is expected that the design density of circuit board structures is higher and higher, and the mechanical drilling method is not only used to lengthen the production time, but also reduce the wiring density of the circuit board structures.

In addition, in another conventional circuit board structure, which is not shown, each layer of the multilayer board is perforated by laser drilling and then electroplated, so that the multilayer board is formed with a through hole and an electrical conductor plated in the through hole. However, the above-mentioned manner of performing laser drilling on each laminate obviously lengthens the time course of production, thereby increasing the manufacturing cost of the circuit board structure.

Accordingly, the present inventors considered that the above-mentioned drawbacks could be improved, and have intensively studied and combined with the application of scientific principles, and finally have proposed an invention which is reasonable in design and effectively improves the above-mentioned drawbacks.

Disclosure of Invention

The invention aims to provide a circuit board structure and a manufacturing method thereof, which can effectively improve the defects possibly generated by the manufacturing method of the prior circuit board structure.

The invention discloses a manufacturing method of a circuit board structure, which comprises the following steps: a preparation step is implemented: providing a multilayer board, wherein the multilayer board comprises N conductive layers, and N is a positive integer greater than 2; performing a first laser drilling step: performing laser drilling from a first conducting layer in the N conducting layers to form a first laser hole which does not penetrate through an Nth conducting layer in the N conducting layers; performing a second laser drilling step: performing laser drilling from an Nth conductive layer in the N conductive layers to form a second laser hole communicated with the first laser hole; and implementing a conduction step: a conductor connecting the first layer of the conductive layer and the Nth layer of the conductive layer is formed in the first laser hole and the second laser hole. The embodiment of the invention also discloses a circuit board structure which is manufactured by the manufacturing method of the circuit board structure.

The invention further discloses a circuit board structure, which comprises: the multilayer board comprises N layers of conducting layers, N is a positive integer greater than 2, a first laser hole and a second laser hole which are communicated with each other are formed in the multilayer board, the first laser hole is concavely formed from a first layer of the N layers of the conducting layers, and the second laser hole is concavely formed from an Nth layer of the N layers of the conducting layers; wherein the aperture of the first laser hole and the aperture of the second laser hole are gradually increased from the junction of the two holes in a direction away from each other; and a conductor located in the first laser hole and the second laser hole, and connecting the first layer of the conductive layer and the Nth layer of the conductive layer.

In summary, the circuit board structure and the manufacturing method thereof disclosed by the invention can form the first laser hole and the second laser hole penetrating the multi-layer board by completely using the laser drilling method and with fewer laser drilling times, so that the mechanical drilling is not used, and the circuit board structure and the manufacturing method thereof have shorter production time and lower production manufacturing cost and can be applied to higher-density wiring design.

For a further understanding of the nature and the technical aspects of the present invention, reference should be made to the following detailed description of the invention and the accompanying drawings, which are included to illustrate and not to limit the scope of the invention.

Drawings

FIG. 1 is a schematic diagram of a conventional circuit board structure;

FIG. 2 is a schematic diagram of step S110 of the method for manufacturing a circuit board structure according to the present invention;

FIG. 3 is a schematic diagram of step S120 of the method for manufacturing a circuit board structure according to the present invention;

FIG. 4 is a schematic diagram of step S130 of the method for manufacturing a circuit board structure according to the present invention;

fig. 5A is a schematic diagram of step S141 of the method for manufacturing a circuit board structure according to the present invention;

FIG. 5B is a schematic diagram of step S142 of the method for manufacturing a circuit board structure according to the present invention;

FIG. 6A is a schematic diagram of step S150 of the method for manufacturing a circuit board structure according to the present invention;

fig. 6B is a schematic diagram (two) of step S150 of the manufacturing method of the circuit board structure of the present invention.

Symbol description

[ Prior Art ]

100': circuit board structure

1': multi-layer board

2': through hole

[ embodiment of the invention ]

100: circuit board structure

1: multi-layer board

11: board body

12: conductive layer

13: first laser hole

14: second laser hole

2a: conductive body

21a: space of

2b: conductive body

3: layered structure

S110: preparation step

S120: first laser drilling step

S130: second laser drilling step

S140: conduction step S140

S141: first electroplating step

S142: second electroplating step

S150: layer adding step

Detailed Description

Referring to fig. 2 to 6B, which are exemplary embodiments of the present invention, it should be noted that the number and shape of the embodiments corresponding to the drawings are merely for illustrating the embodiments of the present invention, so as to facilitate understanding of the present invention, and are not intended to limit the scope of the present invention.

The present embodiment discloses a circuit board structure and a manufacturing method thereof, and the circuit board structure is manufactured by the manufacturing method of the circuit board structure in the present embodiment, but the present invention is not limited thereto. That is, in other embodiments of the present invention, which are not shown, the circuit board structure can be manufactured by other manufacturing methods.

In order to facilitate understanding of the specific structure of the circuit board structure, the method for manufacturing the circuit board structure of the present embodiment will be described first, and then the specific structure of the circuit board structure will be described.

[ method for manufacturing Circuit Board Structure ]

It should be noted that, for the convenience of description of the present embodiment, the drawings show only relevant partial configurations. As shown in fig. 2 to 6B, the manufacturing method of the circuit board structure includes a preparation step S110, a first laser drilling step S120, a second laser drilling step S130, a conducting step S140, and a layering step S150 in the present embodiment, but the present invention is not limited to the order or implementation of the steps S110 to S150.

For example, in other embodiments not shown in the present disclosure, the steps S110 to S150 may be adjusted, changed or increased according to the actual design requirement. In addition, the steps S110 to S150 of the manufacturing method of the circuit board structure of the present embodiment will be described below, respectively.

As shown in fig. 2, the preparation step S110 is performed: a multilayer board 1 is provided, and the multilayer board 1 comprises a multilayer board body 11 and N layers of conductive layers 12 arranged on the board surface of the multilayer board body 11, wherein N is a positive integer greater than 2. In the present embodiment, the number of the boards 11 of the multilayer board 1 is N-1 layers, and N is preferably 4-10 (e.g., the drawing shows that N is 4), but is not limited thereto.

As shown in fig. 3, the first laser drilling step S120 is performed: a laser drilling is performed from a first conductive layer 12 (e.g., the uppermost conductive layer 12 in fig. 3) of the N conductive layers 12, so that a first laser hole 13 is formed that does not penetrate through to an nth conductive layer 12 (e.g., the lowermost conductive layer 12 in fig. 3) of the N conductive layers 12.

The aperture D13 of the first laser hole 13 preferably decreases from the first conductive layer 12 toward the nth conductive layer 12 (e.g., downward in fig. 3), so as to form a truncated cone-like structure, but the invention is not limited thereto. Furthermore, the maximum value of the aperture of the first laser hole 13 (e.g., the aperture of the first laser hole 13 corresponding to the first conductive layer 12) is preferably not greater than the minimum value of the aperture of the conventional mechanical drilling.

As shown in fig. 4, the second laser drilling step S130 is performed: a laser drilling is performed from the N-th conductive layer 12 (e.g., the lowest conductive layer 12 in fig. 4) of the N-th conductive layers 12 to form a second laser hole 14 communicating with the first laser hole 13.

The aperture of the second laser hole 14 preferably decreases from the nth conductive layer 12 toward the first conductive layer 12 (e.g., upward in fig. 4), so as to form a truncated cone-like structure, but the invention is not limited thereto. Furthermore, the maximum value of the aperture of the second laser hole 14 (e.g., the aperture of the second laser hole 14 corresponding to the N-th conductive layer 12) is preferably not greater than the minimum value of the aperture of the conventional mechanical drilling.

In more detail, in the present embodiment, the maximum value of the aperture of the first laser hole 13 is substantially equal to the maximum value of the aperture of the second laser hole 14, and the apertures of the first laser hole 13 and the second laser hole 14 are gradually increased from the junction between them in the direction away from each other (e.g. upward and downward in fig. 4), and the junction is the plate 11 located substantially in the center, but the present invention is not limited to the above conditions.

Furthermore, the first laser hole 13 and the second laser hole 14 in the present embodiment pass through all the conductive layers 12 of the N conductive layers 12 in common, but the present invention is not limited thereto. For example, in other embodiments of the present invention, which are not shown, at least one of the conductive layers 12 (i.e., at least one of the conductive layers 12 of the second to N-1 layers) is not formed at the portion corresponding to the first and second laser holes 13 and 14, so that the portion is not penetrated by the laser drilling. In addition, in the method for manufacturing the circuit board structure according to the present embodiment, the number of laser drilling performed is preferably greater than 1 and not greater than N-2.

As shown in fig. 5A and 5B, the conducting step S140 is implemented: a

conductor

2a, 2b connecting the first conductive layer 12 and the nth conductive layer 12 is formed in the first laser hole 13 and the second laser hole 14. In other words, the

conductors

2a, 2b of the present embodiment are excluded from being disposed in the hole formed by the mechanical drilling.

Furthermore, since the first laser hole 13 and the second laser hole 14 of the present embodiment pass through all the N conductive layers 12 in common, the above-mentioned

conductors

2a and 2b connect all the N conductive layers 12 in the present embodiment, but the present invention is not limited thereto.

In more detail, the

conductive bodies

2a, 2b are formed by electroplating, and the conducting step S140 can be selectively performed by a first electroplating step S141 or a second electroplating step S142 different from the first electroplating step S141 according to different design requirements. The first electroplating step S141 and the second electroplating step S142 included in the conducting step S140 will be described below.

As shown in fig. 5A, the first electroplating step S141 is performed: the conductor 2a is plated on the hole wall of the first laser hole 13 and the hole wall of the second laser hole 14, and a space 21a is formed around the inner edge of the conductor 2 a. That is, the conductor 2a formed in the first plating step S141 of the present embodiment is a hollow structure.

As shown in fig. 5B, the second electroplating step S142 is performed: the first laser hole 13 and the second laser hole 14 are plated on the conductor 2b, and the first laser hole 13 and the second laser hole 14 are filled with the conductor 2b. That is, the conductor 2b formed in the second plating step S142 of the present embodiment is a solid structure.

As shown in fig. 6A and 6B, the layering step S150 is performed: at least one layer structure 3 is added to each of opposite plate surfaces (e.g., an upper plate surface of an uppermost plate 11 and a lower plate surface of a lowermost plate 11 in fig. 6A or 6B) of the multilayer board 1. Wherein said

conductors

2a, 2b are sandwiched (or embedded) between said at least two layered structures 3. In fig. 6A, the space 21a inside the conductor 2a is filled with the layered structure 3.

As mentioned above, the manufacturing method of the circuit board structure can be applied to a circuit board structure 100 with a higher wiring density and a shorter production time after implementing the steps S110 to S150, but the manufacturing of the circuit board structure 100 of the present invention is not limited to implementing the steps S110 to S150. The specific configuration of the circuit board structure 100 of the present embodiment will be generally described below, and reference will be made to the detailed features already described above.

[ Circuit Board Structure ]

It should be noted that, for the convenience of description of the present embodiment, the drawings show only relevant partial configurations. As shown in fig. 6A and 6B, the circuit board structure 100 in this embodiment includes a multi-layer board 1, a conductive body 2a, 2B embedded in the multi-layer board 1, and two layered structures 3 respectively covering opposite sides of the multi-layer board 1 and the conductive body 2a, 2B.

The multilayer board 1 includes a multilayer board 11 and N conductive layers 12 disposed on the board surface of the multilayer board 11, where N is a positive integer greater than 2. The multilayer board 1 is formed with a first laser hole 13 and a second laser hole 14 which are mutually communicated, and the first laser hole 13 and the second laser hole 14 together form a through hole which is equivalent to penetrating through the multilayer board 1.

Further, the first laser hole 13 is formed by recessing a first conductive layer 12 (e.g., the uppermost conductive layer 12 in fig. 6A or 6B) of the N conductive layers 12, the second laser hole 14 is formed by recessing an nth conductive layer 12 (e.g., the lowermost conductive layer 12 in fig. 6A or 6B) of the N conductive layers 12, and the aperture of the first laser hole 13 and the aperture of the second laser hole 14 are gradually increased from the junction between the two layers in a direction away from each other.

As shown in fig. 6A and 6B, the conductors 2a and 2B are located in the first laser hole 13 and the second laser hole 14 of the multilayer board 1, and the conductors 2a and 2B connect the first conductive layer 12 and the nth conductive layer 12, and the conductors 2a and 2B connect all the conductive layers 12 in the N conductive layers 12 in the present embodiment, but the present invention is not limited thereto.

In more detail, the conductors include two types as shown in fig. 6A and 6B in the present embodiment. As shown in fig. 6A, the conductor 2a is plated on the hole wall of the first laser hole 13 and the hole wall of the second laser hole 14, and a space 21a is formed around the inner edge of the conductor 2 a. That is, the conductor 2a shown in fig. 6A has a hollow structure. Further, as shown in fig. 6B, the conductor 2B is plated on the first laser hole 13 and the second laser hole 14, and the first laser hole 13 and the second laser hole 14 are filled with the conductor 2B; that is, the conductor 2B shown in fig. 6B is a solid structure.

[ technical Effect of embodiments of the invention ]

In summary, the circuit board structure 100 and the manufacturing method thereof according to the embodiments of the present invention can form the first laser hole 13 and the second laser hole 14 penetrating the multi-layer board 1 by using the laser drilling method and with less laser drilling times, so as to eliminate the use of mechanical drilling, and further make the circuit board structure 100 and the manufacturing method thereof have a shorter production time and lower production cost, and can be applied to a higher density wiring design.

The foregoing description is only of the preferred embodiments of the present invention and is not intended to limit the scope of the invention, but all equivalent changes and modifications according to the claims should be construed to fall within the scope of the claims.

Claims

1. A method of manufacturing a circuit board structure, comprising:

the implementation preparation steps are as follows: providing a multilayer board, wherein the multilayer board comprises N conductive layers, and N is a positive integer greater than 2;

implementing a first laser drilling step: laser drilling from a first one of the N layers of the conductive layers to form a first laser hole that does not extend through to an nth one of the N layers of the conductive layers;

implementing a second laser drilling step: laser drilling from an nth one of the N conductive layers to form a second laser hole communicating to the first laser hole; and

conducting the steps: and a conductor connecting the first layer of the conducting layer with the Nth layer of the conducting layer is formed in the first laser hole and the second laser hole, the conductor is directly contacted with the hole wall of the first laser hole and the hole wall of the second laser hole in the conducting step, a space is formed by surrounding the inner edge of the conductor, and the conductor is of a hollow structure.

2. The manufacturing method of the circuit board structure as defined in claim 1, wherein said first laser hole and said second laser hole pass through all of N layers of said conductive layers in common, and said conductor is directly connected to all of N layers of said conductive layers, said conductor being formed by electroplating.

3. The method of manufacturing a circuit board structure as defined in claim 1, wherein said laser drilling is performed more than 1 and not more than N-2, and N is further limited to 4-10.

4. The method of manufacturing a circuit board structure of claim 1, further comprising, after said conducting step, performing a build-up step: at least one layered structure is additionally arranged on each of two opposite plate surfaces of the multi-layer plate, and the space inside the conductor is filled with the layered structure.

5. A circuit-board structure, characterized in that it is manufactured by a method of manufacturing a circuit-board structure as claimed in any one of claims 1 to 4.

6. A circuit board structure, comprising:

the multilayer board comprises N layers of conducting layers, N is a positive integer greater than 2, the multilayer board is provided with a first laser hole and a second laser hole which are communicated with each other, the first laser hole is formed by concavely arranging a first layer of the N layers of conducting layers, and the second laser hole is formed by concavely arranging an Nth layer of the N layers of conducting layers; wherein the aperture of the first laser hole and the aperture of the second laser hole are gradually increased from the junction of the two holes in a direction away from each other; and

the conductor is positioned in the first laser hole and the second laser hole, the conductor is connected with the first layer of conducting layer and the Nth layer of conducting layer, the conductor is directly contacted with the hole wall of the first laser hole and the hole wall of the second laser hole, a space is formed by surrounding the inner edge of the conductor, and the conductor is of a hollow structure.

7. The circuit board structure of claim 6 wherein at least one layered structure is provided on each of opposite sides of said multi-layer board, said space inside said conductors being filled by said layered structure.