JP6715818B2 - 冷却構造体、冷却システム、発熱装置および構造物 - Google Patents

冷却構造体、冷却システム、発熱装置および構造物 Download PDF

Info

Publication number
JP6715818B2
JP6715818B2 JP2017234068A JP2017234068A JP6715818B2 JP 6715818 B2 JP6715818 B2 JP 6715818B2 JP 2017234068 A JP2017234068 A JP 2017234068A JP 2017234068 A JP2017234068 A JP 2017234068A JP 6715818 B2 JP6715818 B2 JP 6715818B2
Authority
JP
Japan
Prior art keywords
medium
heat
medium flow
heat dissipation
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2017234068A
Other languages
English (en)
Japanese (ja)
Other versions
JP2018160659A (ja
JP2018160659A5 (https=
Inventor
ベジ 佐々木
ベジ 佐々木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to KR1020197030866A priority Critical patent/KR102552685B1/ko
Priority to CN201880019822.0A priority patent/CN110520980A/zh
Priority to EP18772334.1A priority patent/EP3605600B1/en
Priority to US16/496,400 priority patent/US11994351B2/en
Priority to BR112019019493-2A priority patent/BR112019019493B1/pt
Priority to PCT/JP2018/010409 priority patent/WO2018173942A1/ja
Priority to TW107109553A priority patent/TWI781993B/zh
Publication of JP2018160659A publication Critical patent/JP2018160659A/ja
Publication of JP2018160659A5 publication Critical patent/JP2018160659A5/ja
Application granted granted Critical
Publication of JP6715818B2 publication Critical patent/JP6715818B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/02—Manufacture or treatment of conductive package substrates serving as an interconnection, e.g. of metal plates
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F7/00—Elements not covered by group F28F1/00, F28F3/00 or F28F5/00
    • F28F7/02—Blocks traversed by passages for heat-exchange media
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K5/00—Casings; Enclosures; Supports
    • H02K5/04—Casings or enclosures characterised by the shape, form or construction thereof
    • H02K5/20—Casings or enclosures characterised by the shape, form or construction thereof with channels or ducts for flow of cooling medium
    • H02K5/203—Casings or enclosures characterised by the shape, form or construction thereof with channels or ducts for flow of cooling medium specially adapted for liquids, e.g. cooling jackets
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K9/00—Arrangements for cooling or ventilating
    • H02K9/14—Arrangements for cooling or ventilating wherein gaseous cooling medium circulates between the machine casing and a surrounding mantle
    • H02K9/16—Arrangements for cooling or ventilating wherein gaseous cooling medium circulates between the machine casing and a surrounding mantle wherein the cooling medium circulates through ducts or tubes within the casing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/258—Metallic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D7/00—Heat-exchange apparatus having stationary tubular conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/006—Tubular elements; Assemblies of tubular elements with variable shape, e.g. with modified tube ends, with different geometrical features
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
    • F28F13/08—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by varying the cross-section of the flow channels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/43—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing gases, e.g. forced air cooling

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Buildings Adapted To Withstand Abnormal External Influences (AREA)
JP2017234068A 2017-03-22 2017-12-06 冷却構造体、冷却システム、発熱装置および構造物 Active JP6715818B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
CN201880019822.0A CN110520980A (zh) 2017-03-22 2018-03-16 冷却构造体、冷却系统、发热装置以及构造物
EP18772334.1A EP3605600B1 (en) 2017-03-22 2018-03-16 Cooling structural body, cooling system, heat generator and construction
US16/496,400 US11994351B2 (en) 2017-03-22 2018-03-16 Cooling structural body, cooling system, heat generator and construction
BR112019019493-2A BR112019019493B1 (pt) 2017-03-22 2018-03-16 Corpo estrutural de resfriamento, sistema de resfriamento, e gerador de calor
KR1020197030866A KR102552685B1 (ko) 2017-03-22 2018-03-16 냉각 구조체, 냉각 시스템, 발열 장치 및 구조물
PCT/JP2018/010409 WO2018173942A1 (ja) 2017-03-22 2018-03-16 冷却構造体、冷却システム、発熱装置および構造物
TW107109553A TWI781993B (zh) 2017-03-22 2018-03-21 冷卻構造體、冷卻系統、發熱裝置及構造物

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017055419 2017-03-22
JP2017055419 2017-03-22

Publications (3)

Publication Number Publication Date
JP2018160659A JP2018160659A (ja) 2018-10-11
JP2018160659A5 JP2018160659A5 (https=) 2019-06-20
JP6715818B2 true JP6715818B2 (ja) 2020-07-01

Family

ID=63795762

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017234068A Active JP6715818B2 (ja) 2017-03-22 2017-12-06 冷却構造体、冷却システム、発熱装置および構造物

Country Status (6)

Country Link
US (1) US11994351B2 (https=)
EP (1) EP3605600B1 (https=)
JP (1) JP6715818B2 (https=)
KR (1) KR102552685B1 (https=)
CN (1) CN110520980A (https=)
TW (1) TWI781993B (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021019786A1 (ja) * 2019-08-01 2021-02-04 日本電信電話株式会社 冷却装置
JP7486997B2 (ja) * 2020-04-08 2024-05-20 株式会社東芝 紫外線照射装置
CN212084987U (zh) 2020-07-09 2020-12-04 宁波市哈雷换热设备有限公司 一种承压能力强的芯片冷却器
CN111933596A (zh) * 2020-07-16 2020-11-13 杰群电子科技（东莞）有限公司 一种芯片载体及包括该芯片载体的半导体封装产品
CN113782503B (zh) * 2021-09-07 2024-06-11 纳芯半导体科技(浙江)有限公司 一种碳化硅功率器件封装结构及封装方法
EP4601001A1 (en) * 2024-02-08 2025-08-13 LX Semicon Co., Ltd. A heat dissipation substrate for a power semiconductor module, a power semiconductor module including the same and a power converter including the same, and manufacturing method of the heat dissipation substrate for a power semiconductor module
CN120528178B (zh) * 2025-05-30 2026-04-10 舜驱动力科技(南通)有限公司 一种基于风冷与油冷协同散热的新能源汽车电机

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03129896A (ja) * 1989-10-16 1991-06-03 Fujitsu Ltd 冷却装置
JPH08250627A (ja) * 1995-03-13 1996-09-27 Alpha:Kk 熱交換装置
JPH09307040A (ja) 1996-05-15 1997-11-28 Hitachi Ltd 半導体装置、インバータ装置、および半導体装置の製造方法
JP2914342B2 (ja) 1997-03-28 1999-06-28 日本電気株式会社 集積回路装置の冷却構造
JP2001284513A (ja) 2000-03-29 2001-10-12 Mitsubishi Electric Corp パワー半導体装置
JP2002111263A (ja) * 2000-09-27 2002-04-12 Matsushita Electric Ind Co Ltd 排熱、遮熱構造を備えた電子装置
JP2002124123A (ja) * 2000-10-17 2002-04-26 Denso Corp 車両用前照灯
JP2003069267A (ja) * 2001-08-30 2003-03-07 Fujikura Ltd 電子装置の冷却装置
JP3908705B2 (ja) * 2003-08-29 2007-04-25 株式会社東芝 液冷装置及び液冷システム
JP2006100410A (ja) * 2004-09-28 2006-04-13 Kyocera Corp 電子部品収納用パッケージおよび電子装置
US7329033B2 (en) * 2005-10-25 2008-02-12 Visteon Global Technologies, Inc. Convectively cooled headlamp assembly
JP4649359B2 (ja) 2006-04-06 2011-03-09 トヨタ自動車株式会社 冷却器
US20070284091A1 (en) 2006-05-23 2007-12-13 Debashis Ghosh Domed heat exchanger (igloo)
JP2008235572A (ja) * 2007-03-20 2008-10-02 Toyota Industries Corp 電子部品冷却装置
JP5238228B2 (ja) * 2007-11-21 2013-07-17 スタンレー電気株式会社 Ｌｅｄ照明装置
WO2009131810A2 (en) * 2008-04-21 2009-10-29 Hardcore Computer, Inc. A case and rack system for liquid submersion cooling of electronic devices connected in an array
US8143769B2 (en) * 2008-09-08 2012-03-27 Intematix Corporation Light emitting diode (LED) lighting device
JP2010274256A (ja) 2009-01-29 2010-12-09 Kyocera Corp 光照射ヘッド、露光デバイス、画像形成装置、液滴硬化装置、および液滴硬化方法
JP5201612B2 (ja) * 2009-06-24 2013-06-05 Ｎｅｃディスプレイソリューションズ株式会社 光源装置およびこれを備えた投写型表示装置
WO2011021384A1 (ja) * 2009-08-18 2011-02-24 パナソニック株式会社 電子機器の冷却構造
JP2012049453A (ja) 2010-08-30 2012-03-08 Kyocera Corp 光照射デバイス、光照射モジュール、および印刷装置
JP2012119588A (ja) * 2010-12-02 2012-06-21 Fuji Electric Co Ltd 冷却機能付き制御装置
US8987891B2 (en) 2012-03-05 2015-03-24 Centipede Systems, Inc. Heat sink apparatus for microelectronic devices
WO2013157117A1 (ja) 2012-04-19 2013-10-24 株式会社日立製作所 冷却システムを備えた電子計算機
CN102734004A (zh) * 2012-05-15 2012-10-17 浙江银轮机械股份有限公司 一种egr冷却器的废气进气端结构
US8964383B2 (en) 2012-06-08 2015-02-24 Apple Inc. Optimized vent walls in electronic devices
JP2014036050A (ja) * 2012-08-07 2014-02-24 Nidec Sankyo Corp 放熱器および放熱システム
US8987892B2 (en) 2013-05-10 2015-03-24 Raytheon Company Method for creating a selective solder seal interface for an integrated circuit cooling system
US9357675B2 (en) 2013-10-21 2016-05-31 International Business Machines Corporation Pump-enhanced, immersion-cooling of electronic component(s)
US9420728B2 (en) * 2014-04-15 2016-08-16 International Business Machines Corporation Liquid-cooled heat sink configured to facilitate drainage
DE102014209837A1 (de) * 2014-05-23 2015-11-26 Robert Bosch Gmbh Halbleiter-Leistungsmodul mit einer Wärmeschnittstelle

Also Published As

Publication number Publication date
KR102552685B1 (ko) 2023-07-06
BR112019019493A2 (pt) 2020-04-22
CN110520980A (zh) 2019-11-29
EP3605600B1 (en) 2024-07-10
JP2018160659A (ja) 2018-10-11
EP3605600A4 (en) 2020-11-18
TW201841456A (zh) 2018-11-16
TWI781993B (zh) 2022-11-01
US11994351B2 (en) 2024-05-28
KR20190131073A (ko) 2019-11-25
US20210108868A1 (en) 2021-04-15
EP3605600A1 (en) 2020-02-05

Similar Documents

Publication Publication Date Title
JP6715818B2 (ja) 冷却構造体、冷却システム、発熱装置および構造物
US7651253B2 (en) Heat exchange enhancement
US7440280B2 (en) Heat exchange enhancement
JP6561846B2 (ja) 冷却装置及び電子装置
US20080258598A1 (en) Heat Exchange Enhancement
CN105932538A (zh) 具备具有散热翅片的l字状热传导部件的空冷式激光装置
JP2016119345A (ja) 冷却機構付き基板及び電子機器
WO2018173942A1 (ja) 冷却構造体、冷却システム、発熱装置および構造物
JP2013026527A (ja) 冷却ユニット
JP4693924B2 (ja) 電子機器
JP5117287B2 (ja) 電子機器の冷却装置
JP2008211001A (ja) 電子機器の冷却装置
HK40017140A (en) Cooling structure, cooling system, heating device, and structural object
JP2004094961A (ja) ディスプレイ装置一体型コンピュータ及びこれに用いる冷却モジュール
CN120530298A (zh) 用于冷却处理器的装置、系统和方法
BR112019019493B1 (pt) Corpo estrutural de resfriamento, sistema de resfriamento, e gerador de calor
CN120858660A (zh) 用于控制器的液冷散热装置、控制器和可移动平台

Legal Events

Date Code Title Description
AA64 Notification of invalidation of claim of internal priority (with term)

Free format text: JAPANESE INTERMEDIATE CODE: A241764

Effective date: 20180130

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20180216

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20190514

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20190514

A711 Notification of change in applicant

Free format text: JAPANESE INTERMEDIATE CODE: A711

Effective date: 20200207

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A821

Effective date: 20200207

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20200511

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20200609

R150 Certificate of patent or registration of utility model

Ref document number: 6715818

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250