CN110520980A - 冷却构造体、冷却系统、发热装置以及构造物 - Google Patents

冷却构造体、冷却系统、发热装置以及构造物 Download PDF

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Publication number
CN110520980A
CN110520980A CN201880019822.0A CN201880019822A CN110520980A CN 110520980 A CN110520980 A CN 110520980A CN 201880019822 A CN201880019822 A CN 201880019822A CN 110520980 A CN110520980 A CN 110520980A
Authority
CN
China
Prior art keywords
medium
heat
hole
medium flow
flow path
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201880019822.0A
Other languages
English (en)
Chinese (zh)
Inventor
佐佐木贝慈
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sasaki Kenji
Original Assignee
Freesia Macross Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Freesia Macross Corp filed Critical Freesia Macross Corp
Priority claimed from PCT/JP2018/010409 external-priority patent/WO2018173942A1/ja
Publication of CN110520980A publication Critical patent/CN110520980A/zh
Pending legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F7/00—Elements not covered by group F28F1/00, F28F3/00 or F28F5/00
    • F28F7/02—Blocks traversed by passages for heat-exchange media
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/02—Manufacture or treatment of conductive package substrates serving as an interconnection, e.g. of metal plates
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K5/00—Casings; Enclosures; Supports
    • H02K5/04—Casings or enclosures characterised by the shape, form or construction thereof
    • H02K5/20—Casings or enclosures characterised by the shape, form or construction thereof with channels or ducts for flow of cooling medium
    • H02K5/203—Casings or enclosures characterised by the shape, form or construction thereof with channels or ducts for flow of cooling medium specially adapted for liquids, e.g. cooling jackets
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K9/00—Arrangements for cooling or ventilating
    • H02K9/14—Arrangements for cooling or ventilating wherein gaseous cooling medium circulates between the machine casing and a surrounding mantle
    • H02K9/16—Arrangements for cooling or ventilating wherein gaseous cooling medium circulates between the machine casing and a surrounding mantle wherein the cooling medium circulates through ducts or tubes within the casing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/258—Metallic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D7/00—Heat-exchange apparatus having stationary tubular conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/006—Tubular elements; Assemblies of tubular elements with variable shape, e.g. with modified tube ends, with different geometrical features
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
    • F28F13/08—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by varying the cross-section of the flow channels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/43—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing gases, e.g. forced air cooling

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Buildings Adapted To Withstand Abnormal External Influences (AREA)
CN201880019822.0A 2017-03-22 2018-03-16 冷却构造体、冷却系统、发热装置以及构造物 Pending CN110520980A (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2017-055419 2017-03-22
JP2017055419 2017-03-22
JP2017-234068 2017-12-06
JP2017234068A JP6715818B2 (ja) 2017-03-22 2017-12-06 冷却構造体、冷却システム、発熱装置および構造物
PCT/JP2018/010409 WO2018173942A1 (ja) 2017-03-22 2018-03-16 冷却構造体、冷却システム、発熱装置および構造物

Publications (1)

Publication Number Publication Date
CN110520980A true CN110520980A (zh) 2019-11-29

Family

ID=63795762

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201880019822.0A Pending CN110520980A (zh) 2017-03-22 2018-03-16 冷却构造体、冷却系统、发热装置以及构造物

Country Status (6)

Country Link
US (1) US11994351B2 (https=)
EP (1) EP3605600B1 (https=)
JP (1) JP6715818B2 (https=)
KR (1) KR102552685B1 (https=)
CN (1) CN110520980A (https=)
TW (1) TWI781993B (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111933596A (zh) * 2020-07-16 2020-11-13 杰群电子科技（东莞）有限公司 一种芯片载体及包括该芯片载体的半导体封装产品
WO2022007563A1 (zh) * 2020-07-09 2022-01-13 宁波市哈雷换热设备有限公司 一种承压能力强的芯片冷却器
CN120528178A (zh) * 2025-05-30 2025-08-22 舜驱动力科技(南通)有限公司 一种基于风冷与油冷协同散热的新能源汽车电机

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021019786A1 (ja) * 2019-08-01 2021-02-04 日本電信電話株式会社 冷却装置
JP7486997B2 (ja) * 2020-04-08 2024-05-20 株式会社東芝 紫外線照射装置
CN113782503B (zh) * 2021-09-07 2024-06-11 纳芯半导体科技(浙江)有限公司 一种碳化硅功率器件封装结构及封装方法
EP4601001A1 (en) * 2024-02-08 2025-08-13 LX Semicon Co., Ltd. A heat dissipation substrate for a power semiconductor module, a power semiconductor module including the same and a power converter including the same, and manufacturing method of the heat dissipation substrate for a power semiconductor module

Citations (13)

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Publication number Priority date Publication date Assignee Title
JPH03129896A (ja) * 1989-10-16 1991-06-03 Fujitsu Ltd 冷却装置
JPH08250627A (ja) * 1995-03-13 1996-09-27 Alpha:Kk 熱交換装置
JP2002111263A (ja) * 2000-09-27 2002-04-12 Matsushita Electric Ind Co Ltd 排熱、遮熱構造を備えた電子装置
JP2002124123A (ja) * 2000-10-17 2002-04-26 Denso Corp 車両用前照灯
JP2003069267A (ja) * 2001-08-30 2003-03-07 Fujikura Ltd 電子装置の冷却装置
JP2005079337A (ja) * 2003-08-29 2005-03-24 Toshiba Corp 液冷装置及び液冷システム
JP2008235572A (ja) * 2007-03-20 2008-10-02 Toyota Industries Corp 電子部品冷却装置
JP2009129642A (ja) * 2007-11-21 2009-06-11 Stanley Electric Co Ltd Ｌｅｄ照明装置
WO2010150366A1 (ja) * 2009-06-24 2010-12-29 Ｎｅｃディスプレイソリューションズ株式会社 光源装置およびこれを備えた投写型表示装置
CN102415229A (zh) * 2009-08-18 2012-04-11 松下电器产业株式会社 电子设备的冷却构造
CN102573412A (zh) * 2010-12-02 2012-07-11 富士电机株式会社 带冷却功能的控制装置
US20130228914A1 (en) * 2012-03-05 2013-09-05 Clockspeed, Inc. Heat Sink Apparatus for Microelectronic Devices
JP2014036050A (ja) * 2012-08-07 2014-02-24 Nidec Sankyo Corp 放熱器および放熱システム

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JPH09307040A (ja) 1996-05-15 1997-11-28 Hitachi Ltd 半導体装置、インバータ装置、および半導体装置の製造方法
JP2914342B2 (ja) 1997-03-28 1999-06-28 日本電気株式会社 集積回路装置の冷却構造
JP2001284513A (ja) 2000-03-29 2001-10-12 Mitsubishi Electric Corp パワー半導体装置
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JP2010274256A (ja) 2009-01-29 2010-12-09 Kyocera Corp 光照射ヘッド、露光デバイス、画像形成装置、液滴硬化装置、および液滴硬化方法
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Publication number Priority date Publication date Assignee Title
JPH03129896A (ja) * 1989-10-16 1991-06-03 Fujitsu Ltd 冷却装置
JPH08250627A (ja) * 1995-03-13 1996-09-27 Alpha:Kk 熱交換装置
JP2002111263A (ja) * 2000-09-27 2002-04-12 Matsushita Electric Ind Co Ltd 排熱、遮熱構造を備えた電子装置
JP2002124123A (ja) * 2000-10-17 2002-04-26 Denso Corp 車両用前照灯
JP2003069267A (ja) * 2001-08-30 2003-03-07 Fujikura Ltd 電子装置の冷却装置
JP2005079337A (ja) * 2003-08-29 2005-03-24 Toshiba Corp 液冷装置及び液冷システム
JP2008235572A (ja) * 2007-03-20 2008-10-02 Toyota Industries Corp 電子部品冷却装置
JP2009129642A (ja) * 2007-11-21 2009-06-11 Stanley Electric Co Ltd Ｌｅｄ照明装置
WO2010150366A1 (ja) * 2009-06-24 2010-12-29 Ｎｅｃディスプレイソリューションズ株式会社 光源装置およびこれを備えた投写型表示装置
US20120069586A1 (en) * 2009-06-24 2012-03-22 Kenji Miyazaki Light source device and projection type display device including the same
CN102415229A (zh) * 2009-08-18 2012-04-11 松下电器产业株式会社 电子设备的冷却构造
CN102573412A (zh) * 2010-12-02 2012-07-11 富士电机株式会社 带冷却功能的控制装置
US20130228914A1 (en) * 2012-03-05 2013-09-05 Clockspeed, Inc. Heat Sink Apparatus for Microelectronic Devices
JP2014036050A (ja) * 2012-08-07 2014-02-24 Nidec Sankyo Corp 放熱器および放熱システム

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022007563A1 (zh) * 2020-07-09 2022-01-13 宁波市哈雷换热设备有限公司 一种承压能力强的芯片冷却器
US12278116B2 (en) 2020-07-09 2025-04-15 Ningbo Halley Heat Exchange Equipment Co., Ltd Chip cooler with high pressure bearing capacity
CN111933596A (zh) * 2020-07-16 2020-11-13 杰群电子科技（东莞）有限公司 一种芯片载体及包括该芯片载体的半导体封装产品
CN120528178A (zh) * 2025-05-30 2025-08-22 舜驱动力科技(南通)有限公司 一种基于风冷与油冷协同散热的新能源汽车电机
CN120528178B (zh) * 2025-05-30 2026-04-10 舜驱动力科技(南通)有限公司 一种基于风冷与油冷协同散热的新能源汽车电机

Also Published As

Publication number Publication date
KR102552685B1 (ko) 2023-07-06
JP6715818B2 (ja) 2020-07-01
BR112019019493A2 (pt) 2020-04-22
EP3605600B1 (en) 2024-07-10
JP2018160659A (ja) 2018-10-11
EP3605600A4 (en) 2020-11-18
TW201841456A (zh) 2018-11-16
TWI781993B (zh) 2022-11-01
US11994351B2 (en) 2024-05-28
KR20190131073A (ko) 2019-11-25
US20210108868A1 (en) 2021-04-15
EP3605600A1 (en) 2020-02-05

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