JP2018160659A5 - - Google Patents

Download PDF

Info

Publication number
JP2018160659A5
JP2018160659A5 JP2017234068A JP2017234068A JP2018160659A5 JP 2018160659 A5 JP2018160659 A5 JP 2018160659A5 JP 2017234068 A JP2017234068 A JP 2017234068A JP 2017234068 A JP2017234068 A JP 2017234068A JP 2018160659 A5 JP2018160659 A5 JP 2018160659A5
Authority
JP
Japan
Prior art keywords
medium flow
medium
flow path
heat
cooling structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2017234068A
Other languages
English (en)
Japanese (ja)
Other versions
JP6715818B2 (ja
JP2018160659A (ja
Filing date
Publication date
Application filed filed Critical
Priority to KR1020197030866A priority Critical patent/KR102552685B1/ko
Priority to CN201880019822.0A priority patent/CN110520980A/zh
Priority to EP18772334.1A priority patent/EP3605600B1/en
Priority to US16/496,400 priority patent/US11994351B2/en
Priority to BR112019019493-2A priority patent/BR112019019493B1/pt
Priority to PCT/JP2018/010409 priority patent/WO2018173942A1/ja
Priority to TW107109553A priority patent/TWI781993B/zh
Publication of JP2018160659A publication Critical patent/JP2018160659A/ja
Publication of JP2018160659A5 publication Critical patent/JP2018160659A5/ja
Application granted granted Critical
Publication of JP6715818B2 publication Critical patent/JP6715818B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2017234068A 2017-03-22 2017-12-06 冷却構造体、冷却システム、発熱装置および構造物 Active JP6715818B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
CN201880019822.0A CN110520980A (zh) 2017-03-22 2018-03-16 冷却构造体、冷却系统、发热装置以及构造物
EP18772334.1A EP3605600B1 (en) 2017-03-22 2018-03-16 Cooling structural body, cooling system, heat generator and construction
US16/496,400 US11994351B2 (en) 2017-03-22 2018-03-16 Cooling structural body, cooling system, heat generator and construction
BR112019019493-2A BR112019019493B1 (pt) 2017-03-22 2018-03-16 Corpo estrutural de resfriamento, sistema de resfriamento, e gerador de calor
KR1020197030866A KR102552685B1 (ko) 2017-03-22 2018-03-16 냉각 구조체, 냉각 시스템, 발열 장치 및 구조물
PCT/JP2018/010409 WO2018173942A1 (ja) 2017-03-22 2018-03-16 冷却構造体、冷却システム、発熱装置および構造物
TW107109553A TWI781993B (zh) 2017-03-22 2018-03-21 冷卻構造體、冷卻系統、發熱裝置及構造物

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017055419 2017-03-22
JP2017055419 2017-03-22

Publications (3)

Publication Number Publication Date
JP2018160659A JP2018160659A (ja) 2018-10-11
JP2018160659A5 true JP2018160659A5 (https=) 2019-06-20
JP6715818B2 JP6715818B2 (ja) 2020-07-01

Family

ID=63795762

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017234068A Active JP6715818B2 (ja) 2017-03-22 2017-12-06 冷却構造体、冷却システム、発熱装置および構造物

Country Status (6)

Country Link
US (1) US11994351B2 (https=)
EP (1) EP3605600B1 (https=)
JP (1) JP6715818B2 (https=)
KR (1) KR102552685B1 (https=)
CN (1) CN110520980A (https=)
TW (1) TWI781993B (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021019786A1 (ja) * 2019-08-01 2021-02-04 日本電信電話株式会社 冷却装置
JP7486997B2 (ja) * 2020-04-08 2024-05-20 株式会社東芝 紫外線照射装置
CN212084987U (zh) 2020-07-09 2020-12-04 宁波市哈雷换热设备有限公司 一种承压能力强的芯片冷却器
CN111933596A (zh) * 2020-07-16 2020-11-13 杰群电子科技（东莞）有限公司 一种芯片载体及包括该芯片载体的半导体封装产品
CN113782503B (zh) * 2021-09-07 2024-06-11 纳芯半导体科技(浙江)有限公司 一种碳化硅功率器件封装结构及封装方法
EP4601001A1 (en) * 2024-02-08 2025-08-13 LX Semicon Co., Ltd. A heat dissipation substrate for a power semiconductor module, a power semiconductor module including the same and a power converter including the same, and manufacturing method of the heat dissipation substrate for a power semiconductor module
CN120528178B (zh) * 2025-05-30 2026-04-10 舜驱动力科技(南通)有限公司 一种基于风冷与油冷协同散热的新能源汽车电机

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03129896A (ja) * 1989-10-16 1991-06-03 Fujitsu Ltd 冷却装置
JPH08250627A (ja) * 1995-03-13 1996-09-27 Alpha:Kk 熱交換装置
JPH09307040A (ja) 1996-05-15 1997-11-28 Hitachi Ltd 半導体装置、インバータ装置、および半導体装置の製造方法
JP2914342B2 (ja) 1997-03-28 1999-06-28 日本電気株式会社 集積回路装置の冷却構造
JP2001284513A (ja) 2000-03-29 2001-10-12 Mitsubishi Electric Corp パワー半導体装置
JP2002111263A (ja) * 2000-09-27 2002-04-12 Matsushita Electric Ind Co Ltd 排熱、遮熱構造を備えた電子装置
JP2002124123A (ja) * 2000-10-17 2002-04-26 Denso Corp 車両用前照灯
JP2003069267A (ja) * 2001-08-30 2003-03-07 Fujikura Ltd 電子装置の冷却装置
JP3908705B2 (ja) * 2003-08-29 2007-04-25 株式会社東芝 液冷装置及び液冷システム
JP2006100410A (ja) * 2004-09-28 2006-04-13 Kyocera Corp 電子部品収納用パッケージおよび電子装置
US7329033B2 (en) * 2005-10-25 2008-02-12 Visteon Global Technologies, Inc. Convectively cooled headlamp assembly
JP4649359B2 (ja) 2006-04-06 2011-03-09 トヨタ自動車株式会社 冷却器
US20070284091A1 (en) 2006-05-23 2007-12-13 Debashis Ghosh Domed heat exchanger (igloo)
JP2008235572A (ja) * 2007-03-20 2008-10-02 Toyota Industries Corp 電子部品冷却装置
JP5238228B2 (ja) * 2007-11-21 2013-07-17 スタンレー電気株式会社 Ｌｅｄ照明装置
WO2009131810A2 (en) * 2008-04-21 2009-10-29 Hardcore Computer, Inc. A case and rack system for liquid submersion cooling of electronic devices connected in an array
US8143769B2 (en) * 2008-09-08 2012-03-27 Intematix Corporation Light emitting diode (LED) lighting device
JP2010274256A (ja) 2009-01-29 2010-12-09 Kyocera Corp 光照射ヘッド、露光デバイス、画像形成装置、液滴硬化装置、および液滴硬化方法
JP5201612B2 (ja) * 2009-06-24 2013-06-05 Ｎｅｃディスプレイソリューションズ株式会社 光源装置およびこれを備えた投写型表示装置
WO2011021384A1 (ja) * 2009-08-18 2011-02-24 パナソニック株式会社 電子機器の冷却構造
JP2012049453A (ja) 2010-08-30 2012-03-08 Kyocera Corp 光照射デバイス、光照射モジュール、および印刷装置
JP2012119588A (ja) * 2010-12-02 2012-06-21 Fuji Electric Co Ltd 冷却機能付き制御装置
US8987891B2 (en) 2012-03-05 2015-03-24 Centipede Systems, Inc. Heat sink apparatus for microelectronic devices
WO2013157117A1 (ja) 2012-04-19 2013-10-24 株式会社日立製作所 冷却システムを備えた電子計算機
CN102734004A (zh) * 2012-05-15 2012-10-17 浙江银轮机械股份有限公司 一种egr冷却器的废气进气端结构
US8964383B2 (en) 2012-06-08 2015-02-24 Apple Inc. Optimized vent walls in electronic devices
JP2014036050A (ja) * 2012-08-07 2014-02-24 Nidec Sankyo Corp 放熱器および放熱システム
US8987892B2 (en) 2013-05-10 2015-03-24 Raytheon Company Method for creating a selective solder seal interface for an integrated circuit cooling system
US9357675B2 (en) 2013-10-21 2016-05-31 International Business Machines Corporation Pump-enhanced, immersion-cooling of electronic component(s)
US9420728B2 (en) * 2014-04-15 2016-08-16 International Business Machines Corporation Liquid-cooled heat sink configured to facilitate drainage
DE102014209837A1 (de) * 2014-05-23 2015-11-26 Robert Bosch Gmbh Halbleiter-Leistungsmodul mit einer Wärmeschnittstelle

Similar Documents

Publication Publication Date Title
JP2018160659A5 (https=)
CN105932538B (zh) 具备具有散热翅片的l字状热传导部件的空冷式激光装置
JP6482954B2 (ja) 液冷式冷却装置
WO2011145618A1 (ja) 沸騰冷却器
TW201447215A (zh) 冷卻裝置
KR102552685B1 (ko) 냉각 구조체, 냉각 시스템, 발열 장치 및 구조물
JP6482955B2 (ja) 液冷式冷却装置
US20090161311A1 (en) Top mount surface airflow heatsink and top mount heatsink component device
WO2015146110A1 (ja) 相変化冷却器および相変化冷却方法
JP6469521B2 (ja) 液冷式冷却装置
CN101142866B (zh) 吸热构件、冷却装置及电子机器
TWM511069U (zh) 液冷式散熱頭及其散熱系統
TW201433250A (zh) 散熱模組
JP6825615B2 (ja) 冷却システムと冷却器および冷却方法
JP2017216293A (ja) 液冷式冷却装置
JP4558627B2 (ja) 電子機器の筐体および電子機器
CN104427830A (zh) 电子装置
JPWO2019049405A1 (ja) 鉄道車両の電力変換装置および電力変換装置を搭載した鉄道車両
JP2007123641A5 (https=)
US20170031394A1 (en) A heat-dissipating device including a vapor chamber and a radial fin assembly
TWM461980U (zh) 整體式散熱器
TWI553284B (zh) 具有熱對流通道之電子裝置、散熱元件及其散熱方法
TW201407041A (zh) 雙相變化循環式水冷模組及其使用方法
KR20140082353A (ko) 내장형 컴퓨터 전자제어장치의 냉각 장치
WO2016208180A1 (ja) 冷却装置およびこれを搭載した電子機器