JP6701183B2 - ベルヌーイプロセスヘッド - Google Patents

ベルヌーイプロセスヘッド Download PDF

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Publication number
JP6701183B2
JP6701183B2 JP2017517271A JP2017517271A JP6701183B2 JP 6701183 B2 JP6701183 B2 JP 6701183B2 JP 2017517271 A JP2017517271 A JP 2017517271A JP 2017517271 A JP2017517271 A JP 2017517271A JP 6701183 B2 JP6701183 B2 JP 6701183B2
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JP
Japan
Prior art keywords
substrate
bernoulli
process head
pack
laser beam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP2017517271A
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English (en)
Japanese (ja)
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JP2017534461A (ja
Inventor
デイビッド チャールズ ミルン
デイビッド チャールズ ミルン
Original Assignee
エム−ソルヴ・リミテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by エム−ソルヴ・リミテッド filed Critical エム−ソルヴ・リミテッド
Publication of JP2017534461A publication Critical patent/JP2017534461A/ja
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Publication of JP6701183B2 publication Critical patent/JP6701183B2/ja
Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1435—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor involving specially adapted flow control means
    • B23K26/1438—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor involving specially adapted flow control means for directional control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046—Automatically focusing the laser beam
    • B23K26/048—Automatically focusing the laser beam by controlling the distance between laser head and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1435—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor involving specially adapted flow control means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/02—Carriages for supporting the welding or cutting element
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q1/00—Members which are comprised in the general build-up of a form of machine, particularly relatively large fixed members
    • B23Q1/25—Movable or adjustable work or tool supports
    • B23Q1/26—Movable or adjustable work or tool supports characterised by constructional features relating to the co-operation of relatively movable members; Means for preventing relative movement of such members
    • B23Q1/38—Movable or adjustable work or tool supports characterised by constructional features relating to the co-operation of relatively movable members; Means for preventing relative movement of such members using fluid bearings or fluid cushion supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H01L21/263—Bombardment with radiation with high-energy radiation
    • H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Electromagnetism (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Laser Beam Processing (AREA)
JP2017517271A 2014-09-30 2015-09-15 ベルヌーイプロセスヘッド Expired - Fee Related JP6701183B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB1417261.3A GB2530982B (en) 2014-09-30 2014-09-30 Bernoulli process head
GB1417261.3 2014-09-30
PCT/GB2015/052667 WO2016051132A1 (en) 2014-09-30 2015-09-15 Bernoulli process head

Publications (2)

Publication Number Publication Date
JP2017534461A JP2017534461A (ja) 2017-11-24
JP6701183B2 true JP6701183B2 (ja) 2020-05-27

Family

ID=51901373

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017517271A Expired - Fee Related JP6701183B2 (ja) 2014-09-30 2015-09-15 ベルヌーイプロセスヘッド

Country Status (8)

Country Link
US (1) US20170216970A1 (zh)
EP (1) EP3201943A1 (zh)
JP (1) JP6701183B2 (zh)
KR (1) KR20170067778A (zh)
CN (1) CN107078078A (zh)
GB (1) GB2530982B (zh)
TW (1) TW201622864A (zh)
WO (1) WO2016051132A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7402081B2 (ja) * 2020-02-27 2023-12-20 本田技研工業株式会社 レーザ加工装置
JP7426257B2 (ja) 2020-02-27 2024-02-01 本田技研工業株式会社 レーザ加工装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4550241A (en) * 1982-06-14 1985-10-29 W. A. Whitney Corp. Metal melting tool with improved stand-off means
JPS6356391A (ja) * 1986-08-25 1988-03-10 Mitsubishi Electric Corp レ−ザ加工用非接触倣い装置
US5834731A (en) * 1997-06-04 1998-11-10 Hmt Technology Corporation Laser texturing apparatus with bernoulli holder
US6806544B2 (en) * 2002-11-05 2004-10-19 New Wave Research Method and apparatus for cutting devices from conductive substrates secured during cutting by vacuum pressure
GB2414954B (en) * 2004-06-11 2008-02-06 Exitech Ltd Process and apparatus for ablation
GB0427104D0 (en) * 2004-12-10 2005-01-12 Exitech Ltd Positioning device
CN101189502A (zh) * 2005-06-06 2008-05-28 粒子监测系统有限公司 具有改进的图像传感器阵列的粒子计数器
US8104752B2 (en) * 2006-03-20 2012-01-31 Boaz Eidelberg Integrated large XY rotary positioning table with virtual center of rotation
TW200950914A (en) * 2008-06-06 2009-12-16 Contrel Technology Co Ltd Air-floating-type laser repairing device
KR20120108324A (ko) * 2011-03-23 2012-10-05 한국기초과학지원연구원 중성 입자빔을 이용한 발광 소자 제조 방법 및 그 장치
JP2013052400A (ja) * 2011-09-01 2013-03-21 Honda Motor Co Ltd レーザ加工方法
WO2013069155A1 (ja) * 2011-11-11 2013-05-16 日本車輌製造株式会社 レーザ加工装置の加工ヘッド
US20130156530A1 (en) * 2011-12-14 2013-06-20 Intermolecular, Inc. Method and apparatus for reducing contamination of substrate
KR20230055404A (ko) * 2012-11-30 2023-04-25 가부시키가이샤 니콘 반송 시스템, 노광 장치, 반송 방법, 노광 방법 및 디바이스 제조방법, 및 흡인 장치

Also Published As

Publication number Publication date
GB201417261D0 (en) 2014-11-12
TW201622864A (zh) 2016-07-01
GB2530982A (en) 2016-04-13
CN107078078A (zh) 2017-08-18
EP3201943A1 (en) 2017-08-09
JP2017534461A (ja) 2017-11-24
KR20170067778A (ko) 2017-06-16
GB2530982B (en) 2018-10-24
WO2016051132A1 (en) 2016-04-07
US20170216970A1 (en) 2017-08-03

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