JP6691560B2 - 対基板作業装置 - Google Patents
対基板作業装置 Download PDFInfo
- Publication number
- JP6691560B2 JP6691560B2 JP2017567575A JP2017567575A JP6691560B2 JP 6691560 B2 JP6691560 B2 JP 6691560B2 JP 2017567575 A JP2017567575 A JP 2017567575A JP 2017567575 A JP2017567575 A JP 2017567575A JP 6691560 B2 JP6691560 B2 JP 6691560B2
- Authority
- JP
- Japan
- Prior art keywords
- storage tray
- storage
- tray
- flux
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000012530 fluid Substances 0.000 claims description 22
- 239000000758 substrate Substances 0.000 claims description 21
- 230000004907 flux Effects 0.000 description 72
- 230000008859 change Effects 0.000 description 7
- 239000002699 waste material Substances 0.000 description 4
- 230000003028 elevating effect Effects 0.000 description 3
- 238000009434 installation Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Supply And Installment Of Electrical Components (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2016/054263 WO2017141306A1 (fr) | 2016-02-15 | 2016-02-15 | Dispositif de traitement de substrat |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2017141306A1 JPWO2017141306A1 (ja) | 2018-12-06 |
JP6691560B2 true JP6691560B2 (ja) | 2020-04-28 |
Family
ID=59625621
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017567575A Active JP6691560B2 (ja) | 2016-02-15 | 2016-02-15 | 対基板作業装置 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP6691560B2 (fr) |
WO (1) | WO2017141306A1 (fr) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP4084046A4 (fr) * | 2019-12-26 | 2023-01-04 | Fuji Corporation | Machine de montage de composants et procédé de transfert de matériau de transfert |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005347775A (ja) * | 2005-08-23 | 2005-12-15 | Juki Corp | 電子部品搭載機及び搭載方法 |
JP4841967B2 (ja) * | 2006-02-17 | 2011-12-21 | Juki株式会社 | フラックス膜形成装置及びフラックス転写装置 |
JP4726005B2 (ja) * | 2006-06-28 | 2011-07-20 | 富士機械製造株式会社 | フラックス転写装置 |
JP5557679B2 (ja) * | 2010-10-04 | 2014-07-23 | 富士機械製造株式会社 | フラックス供給装置 |
-
2016
- 2016-02-15 WO PCT/JP2016/054263 patent/WO2017141306A1/fr active Application Filing
- 2016-02-15 JP JP2017567575A patent/JP6691560B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
WO2017141306A1 (fr) | 2017-08-24 |
JPWO2017141306A1 (ja) | 2018-12-06 |
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