JP6688543B2 - 半導体装置の製造方法及び半導体装置の製造装置 - Google Patents
半導体装置の製造方法及び半導体装置の製造装置 Download PDFInfo
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- JP6688543B2 JP6688543B2 JP2016067398A JP2016067398A JP6688543B2 JP 6688543 B2 JP6688543 B2 JP 6688543B2 JP 2016067398 A JP2016067398 A JP 2016067398A JP 2016067398 A JP2016067398 A JP 2016067398A JP 6688543 B2 JP6688543 B2 JP 6688543B2
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0657—Stacked arrangements of devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16135—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/16145—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016067398A JP6688543B2 (ja) | 2016-03-30 | 2016-03-30 | 半導体装置の製造方法及び半導体装置の製造装置 |
CN201780032694.9A CN109155304B (zh) | 2016-03-30 | 2017-03-21 | 半导体装置的制造方法和半导体装置的制造装置 |
PCT/JP2017/011088 WO2017169944A1 (ja) | 2016-03-30 | 2017-03-21 | 半導体装置の製造方法及び半導体装置の製造装置 |
KR1020187027597A KR102196325B1 (ko) | 2016-03-30 | 2017-03-21 | 반도체 장치의 제조 방법 및 반도체 장치의 제조 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016067398A JP6688543B2 (ja) | 2016-03-30 | 2016-03-30 | 半導体装置の製造方法及び半導体装置の製造装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017183457A JP2017183457A (ja) | 2017-10-05 |
JP6688543B2 true JP6688543B2 (ja) | 2020-04-28 |
Family
ID=59964958
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016067398A Active JP6688543B2 (ja) | 2016-03-30 | 2016-03-30 | 半導体装置の製造方法及び半導体装置の製造装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6688543B2 (zh) |
KR (1) | KR102196325B1 (zh) |
CN (1) | CN109155304B (zh) |
WO (1) | WO2017169944A1 (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6349539B2 (ja) | 2016-09-30 | 2018-07-04 | 株式会社新川 | 半導体装置の製造方法および実装装置 |
CN113013307A (zh) * | 2021-03-01 | 2021-06-22 | 东莞市中麒光电技术有限公司 | 一种显示模块故障芯片修复方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3822043B2 (ja) * | 2000-09-25 | 2006-09-13 | 太陽誘電株式会社 | チップ部品組立体の製造方法 |
JP3718205B2 (ja) * | 2003-07-04 | 2005-11-24 | 松下電器産業株式会社 | チップ積層型半導体装置およびその製造方法 |
JP4824327B2 (ja) * | 2005-03-16 | 2011-11-30 | Okiセミコンダクタ株式会社 | 半導体装置の製造方法 |
JP2007036143A (ja) * | 2005-07-29 | 2007-02-08 | Disco Abrasive Syst Ltd | 半導体ウエーハの加工方法 |
JP2008177215A (ja) * | 2007-01-16 | 2008-07-31 | Sharp Corp | 基板貼り合わせ方法および基板貼り合わせ装置 |
TWI482961B (zh) * | 2009-11-16 | 2015-05-01 | Rudolph Technologies Inc | 接合基板的紅外線檢查 |
JP5289484B2 (ja) * | 2011-03-04 | 2013-09-11 | 株式会社東芝 | 積層型半導体装置の製造方法 |
JP2012222038A (ja) * | 2011-04-05 | 2012-11-12 | Elpida Memory Inc | 半導体装置の製造方法 |
TW201330217A (zh) * | 2011-11-11 | 2013-07-16 | Sumitomo Bakelite Co | 半導體裝置之製造方法 |
WO2013133015A1 (ja) * | 2012-03-07 | 2013-09-12 | 東レ株式会社 | 半導体装置の製造方法および半導体装置の製造装置 |
JP2015095499A (ja) * | 2013-11-11 | 2015-05-18 | 東レ株式会社 | 半導体装置の製造方法 |
JP6454283B2 (ja) * | 2013-11-27 | 2019-01-16 | 東レエンジニアリング株式会社 | 3次元実装方法および3次元実装装置 |
-
2016
- 2016-03-30 JP JP2016067398A patent/JP6688543B2/ja active Active
-
2017
- 2017-03-21 WO PCT/JP2017/011088 patent/WO2017169944A1/ja active Application Filing
- 2017-03-21 KR KR1020187027597A patent/KR102196325B1/ko active IP Right Grant
- 2017-03-21 CN CN201780032694.9A patent/CN109155304B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
JP2017183457A (ja) | 2017-10-05 |
WO2017169944A1 (ja) | 2017-10-05 |
CN109155304A (zh) | 2019-01-04 |
KR20180128412A (ko) | 2018-12-03 |
CN109155304B (zh) | 2021-10-22 |
KR102196325B1 (ko) | 2020-12-29 |
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