JP6680850B2 - Metal block welding column combination and power supply module applying it - Google Patents

Metal block welding column combination and power supply module applying it Download PDF

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JP6680850B2
JP6680850B2 JP2018195584A JP2018195584A JP6680850B2 JP 6680850 B2 JP6680850 B2 JP 6680850B2 JP 2018195584 A JP2018195584 A JP 2018195584A JP 2018195584 A JP2018195584 A JP 2018195584A JP 6680850 B2 JP6680850 B2 JP 6680850B2
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welding
metal
welding column
metal ingot
circuit board
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JP2019140088A (en
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シャオ−ジュン チェン
シャオ−ジュン チェン
ダー ジン
ダー ジン
ヤー−ホン シオン
ヤー−ホン シオン
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Delta Electronics Thailand PCL
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • H01R4/029—Welded connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/70—Insulation of connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/12—Copper or alloys thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/18—Dissimilar materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0256—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for soldering or welding connectors to a printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1031—Surface mounted metallic connector elements

Description

本発明は、電気コネクタ及びそれを適用する電源モジュールに関し、特に、表面実装工程（Ｓｕｒｆａｃｅ Ｍｏｕｎｔ Ｄｅｖｉｃｅ；ＳＭＤ）に好適に使用される電気コネクタ及びそれを適用する電源モジュールに関する。   The present invention relates to an electrical connector and a power supply module to which the electrical connector is applied, and more particularly, to an electrical connector preferably used in a surface mount process (SMD) and a power supply module to which the electrical connector is applied.

現在、電源モジュールは、体積がより小さく出力電力密度がより高くなっているため、体積がより小さい状況で如何に出力電力密度をより高くするかは、現在の電源モジュールが直面している実際的な問題である。   Currently, power modules have smaller volumes and higher output power densities, so how to achieve higher output power densities in smaller volumes is a practical challenge facing current power modules. Problem.

電源モジュールの平面空間は限られており、３次元空間を効果的に利用して出力電力密度を高めることができる。複数層の回路基板により積層された電源モジュールでは、電源モジュールの高さ方向を十分に利用することで、集積度及び出力電力密度を高めることができる。   The plane space of the power supply module is limited, and the output power density can be increased by effectively utilizing the three-dimensional space. In a power supply module stacked with a plurality of layers of circuit boards, the degree of integration and output power density can be increased by fully utilizing the height direction of the power supply module.

現在、複数層の回路基板により積層された電源モジュールでは、各回路基板間の大電流の電気的接続が一般的に単独の銅塊により実現されており、単独の銅塊のアスペクト比があまり大きくない状況で工程が何とか達成される。しかしながら、単独の銅塊の高さが大きく且つ幅が小さい場合、工程の危険性が大きくなる。例えば、１）表面実装工程（Ｓｕｒｆａｃｅ Ｍｏｕｎｔｅｄ Ｄｅｖｉｃｅｓ；ＳＭＤ）の過程中、単独の銅塊の第１の溶接面を第１の回路基板に溶接する場合、銅塊は、アスペクト比が大きすぎ、重心が高すぎるため、倒れやすい。２）銅塊の数が多すぎるので、複数回吸い込む必要がある。３）銅塊の第１の溶接面を第１の回路基板に溶接した後で、銅塊の第２の溶接面（第１の溶接面に対向する溶接面）を第２の回路基板に溶接する場合、銅塊の第１の溶接面と第１の回路基板との間のはんだが再溶融し、且つ銅塊の第１の溶接面が第１の回路基板を載せることで、銅塊の重心が更に上がり、銅塊がより倒れやすくなる。   Currently, in power supply modules stacked with multiple layers of circuit boards, large-current electrical connections between the circuit boards are generally realized by a single copper block, and the aspect ratio of a single copper block is too large. The process is managed to be achieved without the situation. However, if the height and width of a single copper ingot are large, the risk of the process becomes large. For example, 1) When the first welding surface of a single copper ingot is welded to the first circuit board during the surface mounting process (SMD), the copper ingot has an excessively large aspect ratio and a center of gravity. Is too high, so it easily falls. 2) Since there are too many copper ingots, it is necessary to inhale them several times. 3) After welding the first welded surface of the copper ingot to the first circuit board, weld the second welded surface of the copper ingot (the welded surface facing the first welded surface) to the second circuit board. In this case, the solder between the first welding surface of the copper ingot and the first circuit board is re-melted, and the first welding surface of the copper ingot is placed on the first circuit board, thereby The center of gravity rises further and the copper ingot is more likely to fall.

本発明は、革新的な金属塊溶接コラム組合せを提供することで、上記の表面実装工程の問題を解決する。   The present invention solves the above surface mount process problem by providing an innovative metal block welding column combination.

本発明の一実施例において、金属塊溶接コラム組合せは、第１端及び第１端に対向する第２端を有し、少なくとも一方の第１端と第２端の何れも溶接面を有する少なくとも２つの金属塊溶接コラムと、前記金属塊溶接コラムを一体に接続する少なくとも１つの絶縁塊と、を含む。   In one embodiment of the present invention, a metal block welding column combination has a first end and a second end opposite the first end, and at least one of the first end and the second end has a welding surface. It includes two metal ingot welding columns and at least one insulating ingot connecting the metal ingot welding columns together.

本発明の一実施例において、少なくとも１つの金属塊溶接コラムのアスペクト比は１以上である。   In one embodiment of the present invention, the aspect ratio of the at least one metal block welding column is 1 or more.

本発明の一実施例において、少なくとも１つの金属塊溶接コラムのアスペクト比は１よりも小さい。   In one embodiment of the present invention, the aspect ratio of the at least one solid metal weld column is less than one.

本発明の一実施例において、各金属塊溶接コラムの材料は、銅又は銅合金、銀又は銀合金である。   In one embodiment of the present invention, the material of each metal ingot welding column is copper or copper alloy, silver or silver alloy.

本発明の一実施例において、絶縁塊の材料は、プラスチックである。   In one embodiment of the invention, the material of the insulating mass is plastic.

本発明の一実施例において、金属塊溶接コラム組合せのアスペクト比は２よりも小さい。   In one embodiment of the present invention, the aspect ratio of the metal ingot welding column combination is less than 2.

本発明の一実施例において、絶縁塊は、少なくとも１つの絶縁間隙部及び少なくとも２つの係合突出部を含み、絶縁間隙部が隣接する金属塊溶接コラムを分離させる。   In one embodiment of the invention, the insulation mass includes at least one insulation gap and at least two engagement protrusions, the insulation gap separating the adjacent metal mass weld columns.

本発明の一実施例において、各係合突出部の厚さが均一ではなく、絶縁間隙部に近い厚さが絶縁間隙部から離れる厚さよりも小さい。   In one embodiment of the present invention, the thickness of each engaging protrusion is not uniform, and the thickness close to the insulating gap is smaller than the thickness away from the insulating gap.

本発明の一実施例において、前記金属塊溶接コラムの形は、同じ又は異なる。   In one embodiment of the present invention, the shapes of the metal block welding columns are the same or different.

本発明の一実施例において、各金属塊溶接コラムは、対応する前記係合突出部をそれぞれ挿入させるための、少なくとも１つのスルーホール又は凹溝を有する。   In one embodiment of the present invention, each metal block welding column has at least one through hole or groove for inserting the corresponding engaging protrusion.

本発明の一実施例において、前記係合突出部は、長方形、半円状又は三角形の断面を有する。   In one embodiment of the present invention, the engaging protrusion has a rectangular, semi-circular or triangular cross section.

本発明の一実施例において、少なくとも１つの金属塊溶接コラムは、第１端又は第２端がスロットを有し、又は第１端と第２端が何れもスロットを有する。   In one embodiment of the invention, the at least one metal block welding column has slots at the first end or the second end, or both the first end and the second end.

本発明の一実施例において、前記金属塊溶接コラムの第１端が面一であり、且つ少なくとも１つの金属塊溶接コラムの第２端と他の前記金属塊溶接コラムの第２端が面一ではない。   In one embodiment of the present invention, the first end of the metal ingot welding column is flush and the second end of at least one metal ingot welding column is flush with the second end of the other metal ingot welding column. is not.

本発明の一実施例において、少なくとも１つの前記金属塊溶接コラムの第１端と他の前記金属塊溶接コラムの第１端が面一ではなく、且つ少なくとも１つの金属塊溶接コラムの第２端と他の前記金属塊溶接コラムの第２端が面一ではない。   In an embodiment of the present invention, the first end of at least one metal ingot welding column and the first end of another metal ingot welding column are not flush and the second end of at least one metal ingot welding column. And the second ends of the other metal block welding columns are not flush.

本発明の一実施例において、前記金属塊溶接コラムの第１端が面一であり、且つ前記金属塊溶接コラムの第２端が面一である。   In one embodiment of the present invention, the first end of the metal block welding column is flush and the second end of the metal block welding column is flush.

本発明の一実施例において、前記金属塊溶接コラムの第１端と第２端の何れも溶接面を有する。   In one embodiment of the present invention, both the first end and the second end of the metal block welding column have a welding surface.

本発明の一実施例において、電源モジュールは、少なくとも１つの回路基板と、回路基板に設けられ、且つ少なくとも１つの金属塊溶接コラムの溶接面が回路基板に溶接される金属塊溶接コラム組合せと、を含む。   In one embodiment of the present invention, a power supply module includes at least one circuit board, and a metal block welding column combination provided on the circuit board, and a welding surface of at least one metal block welding column is welded to the circuit board. including.

本発明の一実施例において、少なくとも１つの回路基板は、第１の回路基板と第２の回路基板を含み、少なくとも１つの金属塊溶接コラムの第１端の溶接面と第２端の溶接面がそれぞれ第１の回路基板と第２の回路基板に溶接される。   In one embodiment of the present invention, the at least one circuit board comprises a first circuit board and a second circuit board, the first end welding surface and the second end welding surface of the at least one metal block welding column. Are respectively welded to the first circuit board and the second circuit board.

本発明の一実施例において、少なくとも１つの回路基板は、システムボードである。   In one embodiment of the invention, at least one circuit board is a system board.

本発明の一実施例において、少なくとも１つの回路基板は、プリント回路基板又はアルミニウム基板である。   In one embodiment of the invention, the at least one circuit board is a printed circuit board or an aluminum board.

本発明の一実施例において、少なくとも１つの回路基板の金属塊溶接コラム組合せに向かう面と前記金属塊溶接コラムの第１端とが互いに接触し、且つ少なくとも１つの回路基板の金属塊溶接コラム組合せに向かう面は、少なくとも１つの突出部を有する。   In an embodiment of the present invention, the surface of at least one circuit board facing the metal block welding column combination and the first end of said metal block welding column are in contact with each other, and the metal block welding column combination of at least one circuit board. The surface facing toward has at least one protrusion.

本発明の一実施例において、前記金属塊溶接コラムの第１端と第２端の何れも溶接面を有する。   In one embodiment of the present invention, both the first end and the second end of the metal block welding column have a welding surface.

要するに、本発明の金属塊溶接コラム組合せによれば、少なくとも２つのアスペクトの大きい金属塊溶接コラムを絶縁塊によって結合させて構造全体のアスペクト比を減少させ、表面実装工程時に安定して垂直に立たせることができる。金属塊溶接コラム組合せは、表面実装工程中に一回だけ吸い込めばよいが、単独の銅塊を採用すれば、生産中に複数回吸い込む必要がある。比べると、金属塊溶接コラム組合せを採用すると、表面実装工程の効率を向上させることができる。金属塊溶接コラム組合せは、複数層の回路基板により積層された電源モジュールにより多くの高さ空間を提供し、電源モジュールの集積化、出力電力密度をより高くすることができる。   In short, according to the metal ingot welding column combination of the present invention, at least two large aspect metal ingot welding columns are connected by the insulating lump to reduce the aspect ratio of the entire structure, and to make it stably stand vertically during the surface mounting process. You can The metal ingot welding column combination need only be sucked in once during the surface mounting process, but if a single copper ingot is employed, it must be sucked in multiple times during production. By comparison, the adoption of the metal block welding column combination can improve the efficiency of the surface mounting process. The metal block welding column combination can provide more height space for the power supply module stacked by the plurality of layers of circuit boards, and can increase the integration of the power supply module and the output power density.

下記図面の説明は、本発明の前記または他の目的、特徴、メリット、実施例をより分かりやすくするためのものである。
本発明の一実施例による電源モジュールを示す外観斜視図である。 本発明の一実施例による金属塊溶接コラム組合せを示す。 図２の金属塊溶接コラム組合せを示す分解図である。 本発明の別の実施例による金属塊溶接コラム組合せを示す。 本発明のまた別の実施例による金属塊溶接コラム組合せを示す。 本発明の更に１つの実施例による金属塊溶接コラム組合せを示す。 本発明のまた１つの実施例による金属塊溶接コラム組合せを示す。 図７の金属塊溶接コラム組合せを示す分解図である。 本発明の更に１つの実施例による金属塊溶接コラム組合せを示す。 図９の金属塊溶接コラム組合せを示す分解図である。 本発明のまた１つの実施例による金属塊溶接コラム組合せを示す。 図１１の金属塊溶接コラム組合せを示す分解図である。 図１１の金属塊溶接コラム組合せを示す側面図である。 本発明の一実施例による溶接面が面一ではない金属塊溶接コラム組合せを示す。 本発明の別の実施例の溶接面が面一ではない金属塊溶接コラム組合せを示す。 本発明の一実施例による回路基板を示す側面図である。 The following description of the drawings is intended to make the above and other objects, features, advantages and embodiments of the present invention more comprehensible.
FIG. 3 is an external perspective view showing a power supply module according to an embodiment of the present invention. 3 illustrates a metal block welding column combination according to one embodiment of the present invention. FIG. 3 is an exploded view showing the metal ingot welding column combination of FIG. 2. 3 shows a metal block welding column combination according to another embodiment of the present invention. 3 illustrates a metal block welding column combination according to yet another embodiment of the present invention. 3 illustrates a metal block welding column combination according to yet another embodiment of the present invention. 3 illustrates a metal block welding column combination according to another embodiment of the present invention. FIG. 8 is an exploded view showing the metal ingot welding column combination of FIG. 7. 3 illustrates a metal block welding column combination according to yet another embodiment of the present invention. FIG. 10 is an exploded view showing the metal ingot welding column combination of FIG. 9. 3 illustrates a metal block welding column combination according to another embodiment of the present invention. FIG. 12 is an exploded view showing the metal ingot welding column combination of FIG. 11. FIG. 12 is a side view showing the metal ingot welding column combination of FIG. 11. 3 illustrates a metal mass weld column combination with non-flush weld surfaces according to one embodiment of the present invention. 3 shows another embodiment of the present invention, a non-flush welded metal mass weld column combination. FIG. 3 is a side view showing a circuit board according to an exemplary embodiment of the present invention.

本発明の記述をより詳細化し十分させるためには、添付図面及び下記の多様な実施例を参考してよい。図面において、同じ番号は、同じ又は類似な素子を示す。一方、本発明に不要な制限を与えないように、周知の素子とステップを実施例において説明しない。   For a more detailed and complete description of the invention, reference may be made to the accompanying drawings and various examples below. In the drawings, the same numbers indicate the same or similar elements. On the other hand, well known elements and steps have not been described in the examples so as not to impose unnecessary limitations on the present invention.

実施形態と特許請求の範囲において、正文で冠詞に対して特別に限定しない限り、「一」と「前記」は、単一又は複数を総括して指してもよい。   In the embodiments and the claims, "one" and "said" may collectively refer to a single or a plurality, unless otherwise specified in the full text.

本発明の一つの態様は、電源モジュールを提供するが、他の一つの態様は、電源モジュール内の電気コネクタ又は支持素子として各種類の表面実装工程（ＳＭＤ）に適用される金属塊溶接コラム組合せを提供する。本発明の電源モジュールは、少なくとも１つの回路基板と、回路基板に設けられ、且つその少なくとも一方の第１端又は第２端の溶接面が回路基板に電気的に接続される金属塊溶接コラム組合せと、を含む。以下、図１〜図１６に合わせて金属塊溶接コラム組合せ及び電源モジュールの具体的な実施形態を説明する。図１〜図３を参照されたい。図１は、本発明の一実施例による電源モジュールを示す外観斜視図である。図２は、本発明の一実施例による金属塊溶接コラム組合せを示す。図３は、図２の金属塊溶接コラム組合せを示す分解図である。   One aspect of the present invention provides a power supply module, while another aspect provides a metal block welding column combination applied to each type of surface mount process (SMD) as an electrical connector or a supporting element in the power supply module. I will provide a. The power supply module of the present invention is a combination of at least one circuit board and a metal block welding column provided on the circuit board, and a welding surface of at least one first end or second end thereof is electrically connected to the circuit board. And, including. Hereinafter, specific embodiments of the metal ingot welding column combination and the power supply module will be described with reference to FIGS. 1 to 16. Please refer to FIGS. FIG. 1 is an external perspective view showing a power supply module according to an embodiment of the present invention. FIG. 2 illustrates a metal block welding column combination according to one embodiment of the present invention. FIG. 3 is an exploded view showing the metal ingot welding column combination of FIG.

本実施例において、電源モジュール１００は、例えば第１の回路基板１０４及び第２の回路基板１０２の２つの回路基板を含む。第１の回路基板１０４が第２の回路基板１０２の上方に設けられる。第１の回路基板１０４と第２の回路基板１０２とが積層して設けられ、且つ金属塊溶接コラム組合せ１５０によって互いに電気的に接続される。つまり、金属塊溶接コラム組合せ１５０は、第１端の溶接面（１５２ａ、１５４ａ）が第１の回路基板１０４に溶接され、第２端の溶接面（１５２ｂ、１５４ｂ）が第２の回路基板１０２に溶接される。これにより、金属塊溶接コラム組合せ１５０が第１の回路基板１０４と第２の回路基板１０２との間の大電流の導電通路となる。本実施例において、金属塊溶接コラム組合せ１５０が第１の回路基板１０４と第２の回路基板１０２との間に支持作用を発揮することで、第１の回路基板１０４と第２の回路基板１０２との間に、第１の回路基板１０４と第２の回路基板１０２における素子を収容するための収容空間１０６を有する。金属塊溶接コラム組合せ１５０の存在により、収容空間１０６に部品をもう２層置くことができ、金属塊溶接コラム組合せ１５０が電源モジュール１００の集積化と電力密度を効果的に向上させることができる。本実施例において、第１の回路基板１０４は電力回路基板であってよく、第２の回路基板１０２は控制回路基板であってよい。他の実施例において、第１の回路基板１０４又は第２の回路基板１０２は、プリント回路基板又はアルミニウム基板又はユーザーのシステムボードであってよい。   In this embodiment, the power supply module 100 includes two circuit boards, for example, a first circuit board 104 and a second circuit board 102. The first circuit board 104 is provided above the second circuit board 102. The first circuit board 104 and the second circuit board 102 are provided in a stacked manner and electrically connected to each other by a metal block welding column combination 150. That is, in the metal block welding column combination 150, the first end welding surface (152a, 154a) is welded to the first circuit board 104, and the second end welding surface (152b, 154b) is the second circuit board 102. Be welded to. As a result, the metal block welding column combination 150 serves as a high-current conductive path between the first circuit board 104 and the second circuit board 102. In the present embodiment, the metal block welding column combination 150 exerts a supporting action between the first circuit board 104 and the second circuit board 102, so that the first circuit board 104 and the second circuit board 102. And a housing space 106 for housing the elements in the first circuit board 104 and the second circuit board 102. Due to the existence of the metal ingot welding column combination 150, another two layers of parts can be placed in the accommodation space 106, and the metal ingot welding column combination 150 can effectively improve the integration and power density of the power supply module 100. In this embodiment, the first circuit board 104 may be a power circuit board and the second circuit board 102 may be a control circuit board. In other embodiments, the first circuit board 104 or the second circuit board 102 may be a printed circuit board or an aluminum board or a user's system board.

他の実施例において、電源モジュールは、１つの回路基板（例えば第１の回路基板１０４又は第２の回路基板１０２の一方）のみを含んでよい。金属塊溶接コラム組合せ１５０が前記回路基板に設けられ、且つ少なくとも１つの金属塊溶接コラムの第１端又は第２端の溶接面が前記回路基板に電気的に接続され、即ち、金属塊溶接コラム組合せ１５０の第１端の溶接面が回路基板に溶接され、又は金属塊溶接コラム組合せ１５０の第２端の溶接面が回路基板に溶接され、外部素子との電気的接続のために回路基板に大電流の導電通路を提供する。   In other embodiments, the power supply module may include only one circuit board (eg, one of the first circuit board 104 or the second circuit board 102). A metal block welding column combination 150 is provided on the circuit board, and a welding surface at a first end or a second end of at least one metal block welding column is electrically connected to the circuit board, i.e., a metal block welding column. The welding surface of the first end of the combination 150 is welded to the circuit board, or the welding surface of the second end of the metal block welding column combination 150 is welded to the circuit board, and the circuit board is electrically connected for external connection. It provides a high current conducting path.

他の実施例において、電源モジュールは、２つ以上の回路基板（例えば第１の回路基板１０４と第２の回路基板１０２に加えて、より多くの回路基板を更に積層して設ける）を含んでもよい。隣接する２つの回路基板は、積層して設けられ、且つ隣接する２つの回路基板同士が金属塊溶接コラム組合せ１５０によって電気的に接続する。   In another embodiment, the power supply module may include two or more circuit boards (for example, in addition to the first circuit board 104 and the second circuit board 102, more circuit boards are further stacked and provided). Good. Two adjacent circuit boards are provided in a stacked manner, and the two adjacent circuit boards are electrically connected to each other by the metal block welding column combination 150.

金属塊溶接コラム組合せ１５０は、少なくとも２つの金属塊溶接コラム（例えば金属塊溶接コラム１５２、１５４）及び少なくとも１つの絶縁塊（例えば絶縁塊１５６）を含む。各金属塊溶接コラムは、第１端及び第１端に対向する第２端を有し、少なくとも１つの金属塊溶接コラムの第１端と第２端の何れも溶接面（例えば溶接面１５２ａ、１５４ａ、１５２ｂ、１５４ｂ）を有する。金属塊溶接コラムの材料は、銅、銅合金、銀又は銀合金であってよい。絶縁塊の材料は、例えばプラスチックのような、隣接する金属塊溶接コラムに対して接続及び絶縁作用を発揮するための絶縁材料である。本実施例において、金属塊溶接コラム組合せ１５０としては、金属塊溶接コラム１５２と金属塊溶接コラム１５４の２つの金属塊溶接コラムを例として説明するが、実用において、金属塊溶接コラム組合せ１５０における金属塊溶接コラムの数は必要に応じて定められるが、これに限定されない。金属塊溶接コラム１５０は、第１端の溶接面が第１の回路基板１０４に溶接され、第２端の溶接面が第２の回路基板１０２に溶接される。例えば、金属塊溶接コラム１５２の第１端と第２端は、溶接面１５２ａと溶接面１５２ｂをそれぞれ有し、金属塊溶接コラム１５４の第１端と第２端は、溶接面１５４ａと溶接面１５４ｂをそれぞれ有し、溶接面１５２ａと１５４ａが第１の回路基板１０４に溶接され、溶接面１５２ｂと１５４ｂが第２の回路基板１０２に溶接される。他の実施例において、金属塊溶接コラム１５２の第１端と第２端は、溶接面１５２ａと溶接面１５２ｂをそれぞれ有するが、金属塊溶接コラム１５４の第１端と第２端は何れも、溶接面を有しない。金属塊溶接コラム１５２は大電流の導通通路として回路基板に電気的に接続されるが、金属塊溶接コラム１５４は回路基板に電気的に接続せず、単なる支持作用を発揮する。２つの金属塊溶接コラム（１５２、１５４）は、絶縁塊１５６によって一体に接続され、且つ２つの金属塊溶接コラム（１５２、１５４）の第１端が面一であり、同時に第２端も面一である。例えば、金属塊溶接コラム１５２の第１端と金属塊溶接コラム１５４の第１端が面一であり、即ち溶接面１５２ａが溶接面１５４ａに揃える。金属塊溶接コラム１５２の第２端と金属塊溶接コラム１５４の第２端が面一であり、即ち、溶接面１５２ｂが溶接面１５４ｂに揃える。本実例において、２つの金属塊溶接コラム（１５２、１５４）の何れも「工」字状の金属塊であり、絶縁塊１５６の上面が「工」字状であり、側面が「十」字状である。   Metal mass welding column combination 150 includes at least two metal mass welding columns (eg, metal mass welding columns 152, 154) and at least one insulating mass (eg, insulating mass 156). Each metal ingot welding column has a first end and a second end opposite the first end, and at least one of the first end and the second end of the at least one metal ingot welding column has a welding surface (for example, a welding surface 152a, 154a, 152b, 154b). The material of the metal ingot welding column may be copper, copper alloy, silver or silver alloy. The material of the insulative mass is an insulative material, such as plastic, for providing a connection and insulation effect to adjacent metal mass welding columns. In the present embodiment, as the metal ingot welding column combination 150, two metal ingot welding columns, that is, the metal ingot welding column 152 and the metal ingot welding column 154 will be described as an example, but in practice, the metal in the metal ingot welding column combination 150 is used. The number of ingot welding columns is set as needed, but is not limited thereto. The metal lump welding column 150 has a first end welding surface welded to the first circuit board 104 and a second end welding surface welded to the second circuit board 102. For example, the first end and the second end of the metal ingot welding column 152 have a welding surface 152a and a welding surface 152b, respectively, and the first end and the second end of the metal ingot welding column 154 have a welding surface 154a and a welding surface 154a, respectively. Welding surfaces 152a and 154a are welded to the first circuit board 104 and welding surfaces 152b and 154b are welded to the second circuit board 102, respectively. In another embodiment, the first end and the second end of the metal ingot welding column 152 have welding surfaces 152a and 152b, respectively, but both the first and second ends of the metal ingot welding column 154 are: It has no welding surface. Although the metal ingot welding column 152 is electrically connected to the circuit board as a high-current conducting path, the metal ingot welding column 154 does not electrically connect to the circuit board and merely serves as a support function. The two metal mass welding columns (152, 154) are integrally connected by an insulating mass 156, and the first ends of the two metal mass welding columns (152, 154) are flush with each other, and at the same time, the second ends are also flush with each other. Is one. For example, the first end of the metal ingot welding column 152 and the first end of the metal ingot welding column 154 are flush with each other, that is, the welding surface 152a is aligned with the welding surface 154a. The second end of the metal ingot welding column 152 and the second end of the metal ingot welding column 154 are flush with each other, that is, the welding surface 152b is aligned with the welding surface 154b. In this example, both of the two metal ingot welding columns (152, 154) are “industrial” shaped metal ingots, the upper surface of the insulating ingot 156 is “industrial” shaped, and the side surface is “ten” shaped. Is.

電源モジュールの出力電力密度を高めるために、電源モジュールの素子密度を相応的に高める必要がある。通常、第１の回路基板１０４と第２の回路基板１０２における素子をできる限り両者の間の収容空間１０６内に置く。これは前記収容空間の十分な高さを要求し、即ち、金属塊溶接コラム組合せ１５０の各金属塊溶接コラムの高さＨがその幅Ｗ２よりも大きく、例えばアスペクト比（Ｈ／Ｗ２）が２よりも大きい。アスペクト比が２よりも大きい単一の金属塊溶接コラムを使用する場合、下記の問題がある。１）表面実装工程（ＳＭＤ）の過程中、単一の金属塊溶接コラムを回路基板１０４に溶接する過程中に、単一の金属塊の重心が高すぎ、安定して垂直に立つことができなく、倒れやすい。２）表面実装工程において、必要な銅塊の数が多すぎるので、複数回吸い込む必要がある。３）銅塊の第１の溶接面を第１の回路基板１０４に溶接した後で、更に銅塊の第２の溶接面（第１の溶接面に対向する溶接面）を第２の回路基板１０２に溶接する場合、銅塊の第１の溶接面と第１の回路基板１０４との間のはんだが再溶融され、且つ銅塊の第１端の溶接面が第１の回路基板１０４を載せることで、銅塊重心が更に上がり、銅塊がより倒れやすい。金属塊溶接コラム組合せ１５０を採用する場合、整体アスペクト比を２よりも小さくし、表面実装工程の時に金属塊溶接コラム組合せ１５０の重心が大幅に下がり、第１の回路基板を載せる前提でも、安定して垂直に立つことができ、倒れにくく、工程で一回吸い込むだけでよく、表面実装工程の効率を向上させる。具体的に（図２参照）、金属塊溶接コラム組合せ１５０のアスペクト比Ｈ／Ｗ１は２よりも小さい。本実例において、金属塊溶接コラム組合せ１５０のアスペクト比Ｈ／Ｗ１の比は約１に等しい。   In order to increase the output power density of the power module, it is necessary to increase the element density of the power module accordingly. Usually, the elements on the first circuit board 104 and the second circuit board 102 are placed in the accommodation space 106 between them as much as possible. This requires a sufficient height of the accommodation space, ie the height H of each metal ingot welding column of the metal ingot welding column combination 150 is greater than its width W2, for example an aspect ratio (H / W2) of 2. Greater than. When using a single metal block welding column with an aspect ratio greater than 2, there are the following problems. 1) During the process of surface mounting process (SMD), during the process of welding the single metal ingot welding column to the circuit board 104, the center of gravity of the single metal ingot is too high and can be stably and vertically stood. Not easy to fall 2) In the surface mounting process, the number of copper lumps required is too large, so it is necessary to suck in multiple times. 3) After the first welding surface of the copper ingot is welded to the first circuit board 104, the second welding surface of the copper ingot (the welding surface facing the first welding surface) is further attached to the second circuit board. When welding to 102, the solder between the first weld surface of the copper mass and the first circuit board 104 is remelted, and the weld surface at the first end of the copper mass mounts the first circuit board 104. As a result, the center of gravity of the copper ingot is further raised, and the copper ingot is more likely to fall. When the metal ingot welding column combination 150 is adopted, the manipulative aspect ratio is made smaller than 2, and the center of gravity of the metal ingot welding column combination 150 is significantly lowered during the surface mounting process, which is stable even on the assumption that the first circuit board is mounted. And it can stand upright, is hard to fall down, needs only to be sucked in once in the process, and improves the efficiency of the surface mounting process. Specifically (see FIG. 2), the aspect ratio H / W1 of the metal ingot welding column combination 150 is less than 2. In this example, the aspect ratio H / W1 ratio of the ingot weld column combination 150 is equal to about 1.

他の実施例において、少なくとも１つの金属塊溶接コラムのアスペクト比（Ｈ／Ｗ２）は１以上である。又は、少なくとも１つの金属塊溶接コラムのアスペクト比（Ｈ／Ｗ２）は１よりも小さい。   In another embodiment, the aspect ratio (H / W2) of the at least one metal block welding column is 1 or more. Alternatively, the aspect ratio (H / W2) of at least one metal ingot welding column is less than one.

絶縁塊１５６は、少なくとも１つの絶縁間隙部１５６ａ及び２つ以上の係合突出部１５６ｂを含む。絶縁間隙部１５６ａは、２つの金属塊溶接コラム（１５２、１５４）を分離させる。本実例において、係合突出部１５６ｂの断面は、正方形又は長方形である。   The insulating mass 156 includes at least one insulating gap 156a and two or more engaging protrusions 156b. The insulating gap 156a separates the two metal mass welding columns (152, 154). In this example, the engagement protrusion 156b has a square or rectangular cross section.

本実例において、各金属塊溶接コラムは、対応する前記係合突出部をそれぞれ挿入させるための、１つ以上の凹溝を有する。例えば、金属塊溶接コラム１５２は、対応する係合突出部１５６ｂを挿入させるための、２つの凹溝１５２ｃを有する。金属塊溶接コラム１５４は、対応する係合突出部１５６ｂをそれぞれ挿入させるための、２つの凹溝１５４ｃを有する。   In the present example, each metal block welding column has one or more recessed grooves for respectively inserting the corresponding engaging protrusions. For example, the metal block welding column 152 has two concave grooves 152c for inserting the corresponding engaging protrusions 156b. The metal block welding column 154 has two recessed grooves 154c into which the corresponding engaging protrusions 156b are respectively inserted.

金属塊溶接コラム組合せ１５０のアスペクト比Ｈ／Ｗ１が小さく（各金属塊溶接コラムと比べると）、重心が低いので、表面実装工程の時に、金属塊溶接コラム組合せ１５０が回路基板を載せても、絶対的に安定して垂直に立つことができ、生産中に一回吸い込むだけでよく、複数回吸い込む金属塊溶接コラムより、表面実装工程の効率が向上する。   Since the aspect ratio H / W1 of the metal ingot welding column combination 150 is small (compared to each metal ingot welding column) and the center of gravity is low, even if the metal ingot welding column combination 150 mounts a circuit board during the surface mounting process, It is absolutely stable and can stand vertically, and only needs to be sucked once during production, and the efficiency of the surface mounting process is improved compared to a metal block welding column that sucks multiple times.

金属塊溶接コラム組合せ１５０と電源モジュール１００の構造と機能の関係については、上記のように説明したが、金属塊溶接コラム組合せの構造は上記の金属塊溶接コラム組合せ１５０に限定されない。以下、より多くの金属塊溶接コラム組合せの実施形態を挙げる。   Although the relationship between the structure and function of the metal ingot welding column combination 150 and the power supply module 100 has been described above, the structure of the metal ingot welding column combination is not limited to the above metal ingot welding column combination 150. In the following, more metal block welding column combination embodiments will be given.

図４を参照されたい。図４は、本発明の別の実施例による金属塊溶接コラム組合せ１５０ａを示す。上記の金属塊溶接コラム組合せ１５０と異なり、本実例において、各係合突出部１５６ｂの厚さが均一ではなく、係合突出部１５６ｂの側断面が逆テーパ面であり、絶縁間隙部１５６ａに近い厚さＴ１が絶縁間隙部１５６ａから離れる厚さＴ２よりも小さいので、金属塊溶接コラム（１５２、１５４）と絶縁塊１５６との結合信頼性を確保し、その高温溶接工程中に熱膨張と収縮の時の金属塊溶接コラム（１５２、１５４）と絶縁塊１５６の結合をより安定にする。本実例において、２つの金属塊溶接コラムの構造の形は同じである。   See FIG. FIG. 4 illustrates a metal block welding column combination 150a according to another embodiment of the present invention. Unlike the metal block welding column combination 150 described above, in this example, the thickness of each engagement protrusion 156b is not uniform, and the side cross section of the engagement protrusion 156b is an inverse tapered surface, which is close to the insulating gap 156a. Since the thickness T1 is smaller than the thickness T2 separating from the insulating gap portion 156a, the reliability of the connection between the metal block welding column (152, 154) and the insulating block 156 is ensured, and the thermal expansion and contraction during the high temperature welding process. At this time, the connection between the metal block welding column (152, 154) and the insulating block 156 is made more stable. In this example, the shapes of the structures of the two metal mass welding columns are the same.

図５を参照されたい。図５は、本発明のまた別の実施例による金属塊溶接コラム組合せ１５０ｂである。上記の金属塊溶接コラム組合せ１５０と異なり、本実例において、各係合突出部１５６ｂの断面は、半円状（前記の正方形又は長方形の断面と異なる）である。各金属塊溶接コラムの複数の組合せの凹溝（例えば凹溝１５２ｃ）も対応的に半円状の断面に変わる必要がある。本実例において、２つの金属塊溶接コラムの構造の形は同じである。   See FIG. FIG. 5 is a metal block welding column combination 150b according to another embodiment of the present invention. Unlike the metal block welding column combination 150 described above, in the present example, the cross section of each engagement protrusion 156b is semi-circular (different from the square or rectangular cross section described above). A plurality of combinations of grooves (for example, grooves 152c) of each metal ingot welding column also need to be correspondingly changed to a semicircular cross section. In this example, the shapes of the structures of the two metal mass welding columns are the same.

図６を参照されたい。図６は、本発明の更に１つの実施例による金属塊溶接コラム組合せ１５０ｃを示す。上記の金属塊溶接コラム組合せ１５０と異なり、本実例において、金属塊溶接コラム組合せ１５０ｃは、３つの金属塊溶接コラム（１５４’、１５２’、１５２’）を含み、必要に応じて柔軟的に組み合せて金属塊溶接コラムを設置し、異なる構造の絶縁塊１５６を使用してよい。２つの金属塊溶接コラム１５２’の構造が同じ且つ面一となるが、金属塊溶接コラム１５４’の構造と異なり、且つ２つの金属塊溶接コラム１５２’が金属塊溶接コラム１５４’に平行して設けられる。各金属塊溶接コラム１５２’により提供される溶接面は、金属塊溶接コラム１５４’の溶接面よりも小さい。   Please refer to FIG. FIG. 6 illustrates a metal ingot welding column combination 150c according to yet another embodiment of the invention. Unlike the above-described metal ingot welding column combination 150, in this example, the metal ingot welding column combination 150c includes three metal ingot welding columns (154 ', 152', 152 '), and can be flexibly combined as needed. A metal block welding column may be installed to use a different structure of the insulating block 156. The two metal ingot welding columns 152 'have the same structure and are flush with each other, but different from the structure of the metal ingot welding columns 154', and the two metal ingot welding columns 152 'are parallel to the metal ingot welding column 154'. It is provided. The weld surface provided by each metal ingot welding column 152 'is smaller than the weld surface of the metal ingot welding column 154'.

図７、図８を同時に参照されたい。図７は、本発明のまた１つの実施例による金属塊溶接コラム組合せ１５０ｄである。図８は、図７の金属塊溶接コラム組合せ１５０ｄを示す分解図である。上記の金属塊溶接コラム組合せ１５０ｃと異なり、本実例において、金属塊溶接コラム組合せ１５０ｄは、平行して配列する３つの金属塊溶接コラム（１５２、１５４、１５８）を含む。具体的に、金属塊溶接コラム（１５２、１５４、１５８）の上、下溶接面の長さ方向は互いに平行する。金属塊溶接コラム（１５２、１５４）の何れも「工」字状の金属塊であるが、金属塊溶接コラム１５８は「Ｔ」字状の金属塊である。絶縁塊１５６’は、「井」字状の絶縁塊であり、「Ｔ」字状の金属塊溶接コラム１５８を挿入させるための中心の溝孔１５６ｃを有する。絶縁塊１５６’の両側にも、それぞれ金属塊溶接コラム（１５２、１５４）の対応する凹溝（１５２ｃ、１５４ｃ）に挿入する係合突出部１５６ｂを有する。本実例において、金属塊溶接コラム組合せ１５０ｄの高さＨと幅Ｗ３の比値が１よりも小さく、即ちアスペクト比Ｈ／Ｗ３が１よりも小さく、且つ絶縁塊１５６’の上面が「井」字状であり、側面がダブル十字状である。   Please refer to FIG. 7 and FIG. 8 at the same time. FIG. 7 is a metal block welding column combination 150d according to another embodiment of the present invention. FIG. 8 is an exploded view showing the metal ingot welding column combination 150d of FIG. Unlike the metal ingot welding column combination 150c described above, in this example, the metal ingot welding column combination 150d includes three metal ingot welding columns (152, 154, 158) arranged in parallel. Specifically, the length directions of the upper and lower welding surfaces of the metal ingot welding columns (152, 154, 158) are parallel to each other. While each of the metal ingot welding columns (152, 154) is a "work" shaped metal ingot, the metal ingot welding column 158 is a "T" shaped metal ingot. The insulating mass 156 'is a "well" shaped insulating mass and has a central slot 156c into which the "T" shaped metal mass welding column 158 is inserted. On both sides of the insulating block 156 ', there are engaging protrusions 156b to be inserted into the corresponding concave grooves (152c, 154c) of the metal block welding column (152, 154), respectively. In this example, the ratio value of the height H and the width W3 of the metal lump welding column combination 150d is smaller than 1, that is, the aspect ratio H / W3 is smaller than 1, and the upper surface of the insulating lump 156 ′ is “well”. It is shaped like a double cross.

図９、図１０を同時に参照されたい。図９は、本発明の更に１つの実施例による金属塊溶接コラム組合せ１５０ｅである。図１０は、図９の金属塊溶接コラム組合せ１５０ｅを示す分解図である。上記の金属塊溶接コラム組合せ１５０と異なり、本実例において、絶縁塊１５６”の絶縁間隙部１５６ａは中へ縮む。本実例において、絶縁間隙部１５６ａの両側の係合突出部１５６ｄは、数が１つまで減少され、且つ三角形の断面である。２つの金属塊溶接コラム（１５２”、１５４”）の組合せのスルーホール（１５２ｄ、１５４ｄ）も、対応する係合突出部１５６ｄが挿入し組み合せるための三角形の断面である。本実例において、２つの金属塊溶接コラムの構造の形は同じである。   Please refer to FIG. 9 and FIG. 10 at the same time. FIG. 9 is a block of metal welding column combination 150e according to yet another embodiment of the present invention. FIG. 10 is an exploded view showing the metal ingot welding column combination 150e of FIG. Unlike the metal block welding column combination 150 described above, in this example, the insulating gap 156a of the insulating block 156 "contracts in. In this example, the number of engagement protrusions 156d on both sides of the insulating gap 156a is one. The cross-section is reduced to three and has a triangular cross-section. The through holes (152d, 154d) of the combination of the two metal ingot welding columns (152 ", 154") are also inserted and combined by the corresponding engaging protrusions 156d. In the present example, the two metal ingot welding columns have the same structural shape.

図１１〜図１３を同時に参照されたい。図１１は、本発明のまた１つの実施例による金属塊溶接コラム組合せ１５０ｆである。図１２は、図１１の金属塊溶接コラム組合せ１５０ｆを示す分解図である。図１３は、図１１の金属塊溶接コラム組合せ１５０ｆを示す側面図である。上記の金属塊溶接コラム組合せ１５０と異なり、本実例において、金属塊溶接コラム組合せ１５０は、大きい高さを有するので、電源モジュールの集積化及び電力密度を高めるように、高さが小さい素子を内蔵するためのスロット１６２を底端に加えることができる。スロット１６２は、必要に応じて金属塊溶接コラムのトップ端に設計されてもよく、底端に限定されない。図１３の視角から分かるように、２つの金属塊溶接コラム（１５２、１５４）のスロット１６２は互いに揃え且つ連通し、ロングストリップ型の素子又は少なくとも１つの素子を内蔵することができる。本実例において、２つの金属塊溶接コラムの構造の形は同じである。他の実施例において、１つの金属塊溶接コラムの第１端又は前記第２端の一方しかスロットを有しなく、又は第１端と第２端の何れもスロットを有する。他の実施例において、一部の金属塊溶接コラムの第１端又は前記第２端がスロットを有し、又は第１端と第２端の何れもスロットを有し、他の金属塊溶接コラムの第１端と第２端の何れもスロットを有しなくてもよい。他の実施例において、一部の金属塊溶接コラムの第１端がスロットを有し、他の金属塊溶接コラムの第２端がスロットを有してもよい。金属塊溶接コラムに必要な第１端又は第２端の必要とするスロットは、実際の状況によって定められるので、具体的にどの又はどのような金属塊溶接コラムの第１端又は第２端でスロッティングを行うかは限定されない。   Please refer to FIG. 11 to FIG. 13 at the same time. FIG. 11 is a metal block welding column combination 150f according to another embodiment of the present invention. 12 is an exploded view showing the metal ingot welding column combination 150f of FIG. FIG. 13 is a side view showing the metal ingot welding column combination 150f of FIG. Unlike the metal block welding column combination 150 described above, in this example, the metal block welding column combination 150 has a large height, so that a device having a small height is incorporated to increase the integration and power density of the power supply module. A slot 162 for doing so can be added to the bottom edge. The slot 162 may be designed at the top end of the metal mass welding column if desired and is not limited to the bottom end. As can be seen from the viewing angle of FIG. 13, the slots 162 of the two metal mass welding columns (152, 154) are aligned and in communication with each other and can contain long strip type elements or at least one element. In this example, the shapes of the structures of the two metal mass welding columns are the same. In other embodiments, only one of the first end or the second end of one metal block welding column has slots, or both the first and second ends have slots. In another embodiment, the first end or the second end of some metal ingot welding columns has slots, or both the first end and the second end have slots, and other metal ingot welding columns Neither the first end nor the second end of the slot may have slots. In other embodiments, the first ends of some metal ingot welding columns may have slots and the second ends of other metal ingot welding columns may have slots. The required slots at the first end or the second end required for the metal ingot welding column are determined by the actual situation, and therefore, at what or what first or second end of the metal ingot welding column is required. Whether to perform slotting is not limited.

前記の金属塊溶接コラムとしては、まずスタンピング又は機械成形加工を行ってから、絶縁塊と共にプラスチック鋳型によって成形して結合することで金属塊溶接コラム組合せを形成する。又は、金属塊溶接コラムと絶縁塊に対して、まずそれぞれ成形してから、組み立てて合わせる。例えば、金属塊溶接コラムと絶縁塊との結合部は遊嵌され、ジグによって組み立てて位置決めして接着剤で接着させる。又は、金属塊溶接コラムと絶縁塊との結合部は移行又は密着となり、ジグによってプレスして組立要求を満たせる。   As the metal block welding column, first, stamping or mechanical forming process is performed, and then the metal block welding column combination is formed by molding together with an insulating block by a plastic mold to form a metal block welding column combination. Alternatively, the metal block welding column and the insulating block are first molded, respectively, and then assembled and combined. For example, the joint between the metal block welding column and the insulating block is loosely fitted, assembled by a jig, positioned, and adhered with an adhesive. Alternatively, the joining portion between the metal block welding column and the insulating block becomes a transition or a close contact and can be pressed by a jig to meet the assembly requirement.

上記の図１〜１３の実施例において、金属塊溶接コラム組合せの２つの端（第１端と第２端）は何れも面一である。   In the embodiments of FIGS. 1-13 above, both of the two ends (first end and second end) of the metal block welding column combination are flush.

図１４〜図１６を同時に参照されたい。図１４〜図１６は、溶接面が面一ではない金属塊溶接コラム組合せ及びそれに合わせた回路基板を示す。図１４において、金属塊溶接コラム組合せ１５０ｇの金属塊溶接コラム（１５２、１５４）は、その一端で面一ではなく、即ち溶接面１５２ａと溶接面１５４ａとが面一ではなく、金属塊溶接コラム組合せ１５０ｇの金属塊溶接コラム（１５２、１５４）は他端で面一である。他の実施例において、図１４に示す金属塊溶接コラム組合せを電源モジュールに適用し且つ金属塊溶接コラム１５２と１５４の第１端と第２端の何れも溶接面を有する場合、前記電源モジュールは３つの回路基板を有してよい。回路基板の厚さが均一であり、一方の回路基板が金属塊溶接コラム１５２の第１端の溶接面に電気的に接続され、他方の回路基板が金属塊溶接コラム１５４の第１端の溶接面に電気的に接続され、また１つの回路基板が金属塊溶接コラム１５２と１５４の第２端の溶接面に電気的に接続される。他の実施例において、図１４に示す金属塊溶接コラム組合せを電源モジュールに適用し且つ金属塊溶接コラム１５２と１５４の第１端と第２端の何れも溶接面を有する場合、前記電源モジュールは、２枚の回路基板を有してよい。金属塊溶接コラム１５２と１５４の第２端の溶接面に電気的に接続される回路基板は厚さが均一であり、金属塊溶接コラム１５２と１５４の第１端の溶接面に電気的に接続される回路基板は厚さが均一ではなく、厚さが均一ではない回路基板としては図１６に示す回路基板を採用してよい。回路基板の金属塊溶接コラム組合せに向かう面は、溶接部Ａと溶接部Ｂを有し、溶接部Ｂが溶接部Ａに対して突出部を形成することで、金属塊溶接コラム１５２と１５４の第１端の溶接面に電気的に接続される。   Please refer to FIG. 14 to FIG. 16 at the same time. 14 to 16 show a metal block welding column combination in which the welding surfaces are not flush with each other and a circuit board adapted to the combination. In FIG. 14, the metal ingot welding column combination 150g of the metal ingot welding columns (152, 154) is not flush at one end, that is, the welding surface 152a and the welding surface 154a are not flush, and the metal ingot welding column combination is shown. The 150 g metal block welding column (152, 154) is flush with the other end. In another embodiment, if the metal ingot welding column combination shown in FIG. 14 is applied to a power supply module and both the first end and the second end of the metal ingot welding columns 152 and 154 have welding surfaces, the power supply module is It may have three circuit boards. The circuit boards have a uniform thickness, one circuit board is electrically connected to the welding surface of the first end of the metal ingot welding column 152, and the other circuit board is welded to the first end of the metal ingot welding column 154. The circuit board is electrically connected to the surface and one circuit board is electrically connected to the welding surface of the second ends of the metal block welding columns 152 and 154. In another embodiment, if the metal ingot welding column combination shown in FIG. 14 is applied to a power supply module and both the first end and the second end of the metal ingot welding columns 152 and 154 have welding surfaces, the power supply module is It may have two circuit boards. The circuit board electrically connected to the welding surfaces at the second ends of the metal ingot welding columns 152 and 154 has a uniform thickness, and is electrically connected to the welding surfaces at the first ends of the metal ingot welding columns 152 and 154. The circuit board to be formed does not have a uniform thickness, and the circuit board shown in FIG. 16 may be adopted as the circuit board having a non-uniform thickness. The surface of the circuit board facing the metal ingot welding column combination has a weld portion A and a weld portion B, and the weld portion B forms a protrusion with respect to the weld portion A, whereby the metal ingot welding columns 152 and 154 are formed. It is electrically connected to the welding surface at the first end.

図１５において、金属塊溶接コラム組合せ１５０ｈの金属塊溶接コラム（１５２、１５４）は、その第１端と第２端で何れも面一ではなく、即ち第１端における溶接面１５２ａと溶接面１５４ａが面一ではなく、且つ第２端における溶接面１５２ｂと溶接面１５４ｂも面一ではない。図１５に示す金属塊溶接コラム組合せを電源モジュールに適用し且つ金属塊溶接コラム組合せの溶接面が面一ではない場合、前記電源モジュールは、それぞれ金属塊溶接コラム１５２の第１端、第２端及び金属塊溶接コラム１５４の第１端、第２端に電気的に接続される４つの均一な厚さを有する回路基板を含んでよい。他の実施例において、図１５に示す金属塊溶接コラム組合せを電源モジュールに適用し且つ金属塊溶接コラム組合せの溶接面が面一ではない場合、前記電源モジュールは、２つの回路基板を含んでよい。金属塊溶接コラム１５２と１５４の第１端の溶接面に電気的に接続される回路基板は厚さが均一ではなく、金属塊溶接コラム１５２と１５４の第２端の溶接面に電気的に接続される回路基板は厚さが均一ではなく、厚さが均一ではない回路基板としては、図１６に示すような回路基板を採用してよい。回路基板の金属塊溶接コラム組合せに向かう面は、溶接部Ａと溶接部Ｂを有し、溶接部Ｂが溶接部Ａに対して突出部を形成することで、金属塊溶接コラム１５２と１５４の第１端の溶接面に電気的に接続され、及び別の回路基板の金属塊溶接コラム組合せに向かう面は、溶接部Ａと溶接部Ｂを有し、溶接部Ｂが溶接部Ａに対して突出部を形成することで、金属塊溶接コラム１５２と１５４の第２端の溶接面に電気的に接続される。   In FIG. 15, the metal ingot welding columns (152, 154) of the metal ingot welding column combination 150h are not flush with each other at the first end and the second end, that is, the weld surface 152a and the weld surface 154a at the first end. However, the welding surface 152b and the welding surface 154b at the second end are not flush with each other. When the metal ingot welding column combination shown in FIG. 15 is applied to a power supply module and the weld surfaces of the metal ingot welding column combination are not flush, the power supply module respectively includes a first end and a second end of the metal ingot welding column 152. And a circuit board having four uniform thicknesses electrically connected to the first end and the second end of the metal block welding column 154. In another embodiment, if the metal ingot welding column combination shown in FIG. 15 is applied to a power supply module and the weld surfaces of the metal ingot welding column combination are not flush, the power supply module may include two circuit boards. . The circuit board electrically connected to the welding surfaces at the first ends of the metal ingot welding columns 152 and 154 does not have a uniform thickness, and is electrically connected to the welding surfaces at the second ends of the metal ingot welding columns 152 and 154. The circuit board to be formed does not have a uniform thickness, and as the circuit board having a non-uniform thickness, a circuit board as shown in FIG. 16 may be adopted. The surface of the circuit board facing the metal ingot welding column combination has a weld portion A and a weld portion B, and the weld portion B forms a protrusion with respect to the weld portion A, whereby the metal ingot welding columns 152 and 154 are formed. The surface electrically connected to the welding surface at the first end and facing the metal block welding column combination of another circuit board has a weld A and a weld B, the weld B being relative to the weld A. By forming the protrusions, they are electrically connected to the welding surfaces of the second ends of the metal ingot welding columns 152 and 154.

説明する必要があるのは、金属塊溶接コラム組合せと電気的に接続される回路基板の形は、金属塊溶接コラム組合せにおける第１端又は第２端の面一の状況によって定められ、ここで一部の実施例のみを挙げるが、これに限定されない。   It should be explained that the shape of the circuit board electrically connected to the metal block welding column combination is defined by the flush condition of the first end or the second end of the metal block welding column combination, where Only some examples are given, but not limited to.

要するに、本発明の金属塊溶接コラム組合せによれば、少なくとも２つのアスペクトの大きい金属塊溶接コラムを絶縁塊によって結合させて金属塊溶接コラムの構造全体のアスペクト比を減少させ、表面実装工程時に安定して垂直に立たせることができる。金属塊溶接コラム組合せは、工程中に一回だけ吸い込めばよいが、複数の独立した金属塊溶接コラムを採用すれば、工程中に複数回吸い込む必要がある。それに対して、金属塊溶接コラム組合せは、表面実装工程における効率がより高い。金属塊溶接コラム組合せの設計によれば、より多くの高さ空間を積層する多層回路基板を提供し、電源モジュールの出力電力密度及び集積化を高める。   In short, according to the metal ingot welding column combination of the present invention, at least two large aspect metal ingot welding columns are connected by the insulating ingot to reduce the aspect ratio of the entire structure of the metal ingot welding column and stabilize during the surface mounting process. Then you can stand vertically. The metal ingot welding column combination only needs to be sucked in once during the process, but if a plurality of independent metal ingot welding columns are adopted, it is necessary to suck in multiple times during the process. In contrast, the metal block welding column combination is more efficient in the surface mount process. The metal block welding column combination design provides a multi-layer circuit board that stacks more height space to increase the output power density and integration of the power module.

本発明を実施形態により前記の通りに開示したが、これは本発明を限定するものではなく、当業者なら誰でも、本発明の精神と領域から逸脱しない限り、多様の変更や修飾を加えることができる。従って、本発明の保護範囲は、後の特許請求の範囲で指定した内容を基準とするものである。   Although the present invention has been disclosed above by the embodiments, this is not intended to limit the present invention, and any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. You can Therefore, the protection scope of the present invention is based on the content specified in the claims below.

１００ 電源モジュール
１０２ 第２の回路基板
１０４ 第１の回路基板
１０６ 収容空間
１５０、１５０ａ、１５０ｂ、１５０ｃ、１５０ｄ、１５０ｅ、１５０ｆ、１５０ｇ、１５０ｈ、 金属塊溶接コラム組合せ
１５２、１５２’、１５２”、１５４、１５４’、１５４”、１５８ 金属塊溶接コラム
１５２ａ、１５２ｂ、１５４ａ、１５４ｂ 溶接面
１５２ｃ、１５４ｃ 凹溝
１５２ｄ、１５４ｄ スルーホール
１５６ 絶縁塊
１５６ａ 絶縁間隙部
１５６ｂ、１５６ｄ 係合突出部
１５６ｃ 溝孔
１６２ スロット
Ｈ 高さ
Ｗ１、Ｗ２、Ｗ３ 幅
Ｔ１、Ｔ２ 厚さ
Ｄ１、Ｄ２ 方向
Ａ、Ｂ 溶接部
100 power supply module 102 second circuit board 104 first circuit board 106 accommodation space 150, 150a, 150b, 150c, 150d, 150e, 150f, 150g, 150h, metal ingot welding column combination 152, 152 ', 152 ", 154 154 ′, 154 ″, 158 Metal lump welding columns 152a, 152b, 154a, 154b Welding surfaces 152c, 154c Grooves 152d, 154d Through holes 156 Insulation lumps 156a Insulation gaps 156b, 156d Engagement protrusions 156c Groove holes 162 Slots H Height W1, W2, W3 Width T1, T2 Thickness D1, D2 Direction A, B Weld

Claims (14)

それぞれ第１端及び前記第１端に対向する第２端を有し、少なくとも一方の前記第１端と前記第２端の何れも溶接面を有する少なくとも２つの金属塊溶接コラムと、
前記金属塊溶接コラムを一体に接続する少なくとも１つの絶縁塊であって、少なくとも１つの絶縁間隙部及び少なくとも２つの係合突出部を含み、前記絶縁間隙部が隣接する前記金属塊溶接コラムを分離させる絶縁塊と、
を含むことを特徴とする金属塊溶接コラム組合せ。 At least two metal ingot welding columns each having a first end and a second end facing the first end, and at least one of the first end and the second end has a welding surface,
At least one insulation block connecting the metal block welding columns together, comprising at least one insulation gap and at least two engaging protrusions, the insulation gap separating the adjacent metal block welding columns. An insulating lump
Metal lump welding column combination characterized by including. 少なくとも１つの前記金属塊溶接コラムのアスペクト比は１以上であることを特徴とする請求項１に記載の金属塊溶接コラム組合せ。   The metal ingot welding column combination according to claim 1, wherein the aspect ratio of at least one of the metal ingot welding columns is 1 or more. 少なくとも１つの前記金属塊溶接コラムのアスペクト比は１よりも小さく、前記金属塊溶接コラム組合せのアスペクト比は２よりも小さいことを特徴とする請求項１に記載の金属塊溶接コラム組合せ。   The metal ingot welding column combination according to claim 1, wherein the aspect ratio of at least one of the metal ingot welding columns is less than 1, and the aspect ratio of the metal ingot welding column combination is less than 2. 前記金属塊溶接コラムの材料は、銅、銅合金、銀又は銀合金であり、前記絶縁塊の材料は、プラスチックであることを特徴とする請求項１に記載の金属塊溶接コラム組合せ。   2. The metal ingot welding column combination according to claim 1, wherein the material of the metal ingot welding column is copper, copper alloy, silver or silver alloy, and the material of the insulating ingot is plastic. 各前記係合突出部の厚さが均一ではなく、前記絶縁間隙部に近い厚さが前記絶縁間隙部から離れる厚さよりも小さい請求項１に記載の金属塊溶接コラム組合せ。 The metal ingot welding column combination according to claim 1 , wherein the engaging protrusions are not uniform in thickness, and a thickness close to the insulating gap is smaller than a thickness apart from the insulating gap. 各前記金属塊溶接コラムは、対応する前記係合突出部をそれぞれ挿入させるための、少なくとも１つのスルーホール又は凹溝を有し、前記係合突出部が長方形、半円状又は三角形の断面を有する請求項１に記載の金属塊溶接コラム組合せ。 Each of the metal ingot welding columns has at least one through hole or groove for inserting the corresponding engaging protrusion, and the engaging protrusion has a rectangular, semicircular or triangular cross section. The metal ingot welding column combination of claim 1 having. 少なくとも１つの前記金属塊溶接コラムの前記第１端又は前記第２端は、スロットを有し、或いは前記第１端と前記第２端の何れもスロットを有することを特徴とする請求項１に記載の金属塊溶接コラム組合せ。   The first end or the second end of at least one of the metal block welding columns has a slot, or both the first end and the second end have a slot. The described metal ingot welding column combination. 前記金属塊溶接コラムの前記第１端が面一であり、且つ少なくとも１つの前記金属塊溶接コラムの前記第２端と他の前記金属塊溶接コラムの前記第２端が面一ではないことを特徴とする請求項１に記載の金属塊溶接コラム組合せ。   The first end of the metal ingot welding column is flush, and the second end of at least one metal ingot welding column and the second end of another metal ingot welding column are not flush. The metal ingot welding column combination of claim 1 characterized. 少なくとも１つの前記金属塊溶接コラムの前記第１端と他の前記金属塊溶接コラムの前記第１端が面一ではなく、且つ少なくとも１つの前記金属塊溶接コラムの前記第２端と他の前記金属塊溶接コラムの前記第２端が面一ではないことを特徴とする請求項１に記載の金属塊溶接コラム組合せ。   The first end of at least one of the metal ingot welding columns and the first end of another of the metal ingot welding columns are not flush, and the second end of the at least one of the metal ingot welding columns and the other of the other The metal ingot welding column combination according to claim 1, wherein the second end of the metal ingot welding column is not flush. 前記金属塊溶接コラムの前記第１端が面一であり、且つ前記金属塊溶接コラムの前記第２端が面一であることを特徴とする請求項１に記載の金属塊溶接コラム組合せ。   The metal ingot welding column combination according to claim 1, wherein the first end of the metal ingot welding column is flush and the second end of the metal ingot welding column is flush. 前記金属塊溶接コラムの前記第１端と前記第２端の何れも前記溶接面を有する請求項８又は９又は１０に記載の金属塊溶接コラム組合せ。 8. or 9 or slug welding column combination according to 10 both having the welding surface of the first end and the second end of said metallic mass welded column. 少なくとも１つの回路基板と、
前記少なくとも１つの回路基板に設けられ、且つ少なくとも１つの金属塊溶接コラムの前記溶接面が前記少なくとも１つの回路基板に溶接される請求項１〜１１の何れか１項に記載の金属塊溶接コラム組合せと、
を含む電源モジュール。 At least one circuit board,
Said provided at least one circuit board, and at least one metal block the welding surface of the welding column the at least one circuit slug welding column according to any one of claims 1 to 11 which is welded to the substrate Combination with
Including power module. 前記少なくとも１つの回路基板は、第１の回路基板と第２の回路基板を含み、少なくとも１つの前記金属塊溶接コラムの前記第１端の溶接面と前記第２端の前記溶接面がそれぞれ前記第１の回路基板及び前記第２の回路基板に溶接される請求項１２に記載の電源モジュール。 The at least one circuit board includes a first circuit board and a second circuit board, and the at least one welding surface at the first end and the welding surface at the second end of the metal block welding column are respectively the The power supply module according to claim 12 , which is welded to the first circuit board and the second circuit board. 前記少なくとも１つの回路基板の前記金属塊溶接コラム組合せに向かう面と前記金属塊溶接コラムの前記第１端とが互いに接触し、且つ前記少なくとも１つの回路基板の前記金属塊溶接コラム組合せに向かう面は、少なくとも１つの突出部を有する請求項１２に記載の電源モジュール。 A surface of the at least one circuit board facing the metal mass welding column combination and the first end of the metal mass welding column contact each other, and a surface of the at least one circuit board facing the metal mass welding column combination. The power supply module according to claim 12 , wherein the power supply module has at least one protrusion.
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US20190252809A1 (en) 2019-08-15
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