CN2385497Y - Contactless soldering point type switch power supply module - Google Patents
Contactless soldering point type switch power supply module Download PDFInfo
- Publication number
- CN2385497Y CN2385497Y CN 99217363 CN99217363U CN2385497Y CN 2385497 Y CN2385497 Y CN 2385497Y CN 99217363 CN99217363 CN 99217363 CN 99217363 U CN99217363 U CN 99217363U CN 2385497 Y CN2385497 Y CN 2385497Y
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- Prior art keywords
- pcb
- printed circuit
- circuit board
- transformer
- switch power
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Abstract
The utility model relates to a contactless welding point type switch power supply module, which comprises a base board (1), a transformer, and a PCB board (6). The upper surface of the PCB board supports a power device (3). A coil winding (201) of the transformer is formed by the PCB board. The PCB board is installed between magnetic cores (202, 203) of the transformer, and then, the PCB board is integrally installed on the base board. A heat radiation block (7) is put between the PCB board and the base board, and is put on the right lower part of the PCB board where the power device is positioned. The base board can also be an integral metal base. A bulge on the metal base is put on the right lower part of the PCB board where the power device is positioned. The structure realizes the electric interconnection of transformers without welding points, and has good heat radiation property and good mechanical strength.
Description
The utility model relates to a kind of process structure of switch power module, particularly the process structure of high power density switch power module.
Existing switch power module is an example with DC-DC DC converter type switch power module, can accomplish at so-called blind header (HALF BRICK) structure 61 * 57.9 * 12.7mm
3Realize 150 watts of power outputs in the volume, promptly power density can reach 54.8W/inch
3(3.34W/mm
3).For realizing so high power density, process structure now commonly used is to adopt aluminium base copper-clad plate 1 as substrate, as shown in Figure 1, make planar transformer 2 with thickness less than the planar magnetic core of 10mm, again transformer 2 and other large power semiconductor devices 3 one are reinstated surface mount process and be welded in the aluminium base copper-clad plate 1 to realize electric interconnection.This process structure has following weak point: 1. flat surface transformer 2 is subjected to the restriction of magnetic core height and volumetric spaces, its coil windings can not must adopt certain thickness Copper Foil 4 to combine behind special die stamping with the enamelled wire coiling of routine, as shown in Figure 2, Copper Foil 4 must be through specific anti-oxidation and insulation processing when making for this planar transformer coil, complex process requires high.And the designing requirement of different size model opened different moulds, thus this flat surface transformer infrastructure cost height, the technology controlling and process difficulty.2. existing this high power density switch power module, the primary and secondary termination 5 of its transformer and the interconnection between other power devices 3, be that termination 5 usefulness slicker solder soldering paste reflow soldering processes with transformer are welded on the corresponding pad of aluminium base copper-clad plate, because intrinsic disadvantage such as the slicker solder resistivity of material Da Yi of slicker solder welding itself forms cavity etc., just there is contact resistance in 5 welds in the termination like this, as big electric current by the time on contact resistance
Bigger voltage drop is just arranged and then cause inner power dissipation, thereby reduced switch
The conversion efficiency of power module, internal thermal resistance increases, reliability decrease; In life in enormous quantities
Will influence the rate of finished products of product in the product.
The purpose of this utility model is exactly in order to overcome the above problems, and proposes a kind of process structure of contactless pad type switch power module.
For achieving the above object, the utility model adopts following technical proposals:
Switch power module comprises the printed circuit board (PCB) and the substrate of transformer, upper surface support power device.
The coil windings of described transformer is directly formed by common printed circuit board (PCB), and directly prints the installation weld pattern of high power device on same printed circuit board.
Described substrate plays the effect of heat radiation and mechanical fixation.The printed circuit board (PCB) of making winding coil and be welded with power device is installed in the middle of the magnetic core of transformer, integral installation is on substrate again, heat radiating metal piece with certain thickness and volume size is placed between printed circuit board (PCB) and the substrate, and the heat radiating metal piece must directly fill up under printed circuit board (PCB) place, power device place.Substrate can adopt aluminium base copper-clad plate, the preferred copper billet of heat radiating metal piece.
The substrate of switch power module can also adopt the bulk metal base through processing, in order to replace above-mentioned copper billet and aluminium base copper-clad plate.The shape of metab is similar to the associating shape of above-mentioned copper billet and aluminium base copper-clad plate; Projection on the metab is also filled up under printed circuit board (PCB) place, power device place.
In sum, the high power density switch power module process structure that the utility model proposes is concluded following advantage: fundamentally solved the solder joint contact with the print circuit plates making transformer coli winding 1.
The resistance problem realizes no pad type transformer electrical interconnect structure, has improved switch
The conversion efficiency of source module and other electrical properties.2. with epoxy print circuit plates making transformer coli winding, can utilize conventional printed board
(pcb board) production technology, the technology generalization, control is convenient, and cost is low; Isochrone
The circle winding is anti-oxidation and insulation is reliable.3. copper and so on thermal conductivity good metal piece directly is placed in the printing of power heater members place
Below the circuit board place, can form good heat passage, make switch power module in
Thermal resistance reduces greatly; Simultaneously because the thermal capacity of copper billet is bigger, to the absorbed power device
Very effective because of the transient state heat that the transient state high-current leading rises, this is a kind of good transient state
Heat sink structure, so the overall thermal Performance And Reliability improves greatly.
Also in conjunction with the accompanying drawings the utility model is described in further detail with two embodiment below.In each embodiment, same structure division is marked with same numeral, and the repetitive description thereof will be omitted.
Fig. 1 is the power module structural representation that prior art has the Contact welding contact;
Fig. 2 is the structure composition diagram of Fig. 1 midplane transformer 2, and its coil windings is formed through the mould compacting by several Copper Foils;
Fig. 3 is that the structure of the contactless pad type of the utility model switch power module embodiment one is formed schematic diagram;
Fig. 4 is that the structure of the contactless pad type of the utility model switch power module embodiment two is formed schematic diagram.
Embodiment one:
Designing 48 volts of input voltages, 5 volts of output voltages, 30 amperes of output currents, the DC to DC converter type switch power module that power output is 150 watts is an example.Press Fig. 1 existing processes structure, suppose that there is the contact resistance of 1 milliohm at 5 pad places, transformer termination, when 30 Ampere currents pass through, will there be the voltage drop of 30 * 1=30 (millivolt) at the pad place, the pad place has the power dissipation of 30 * 30 * 1=900 (milliwatt) simultaneously, this shows, will make conversion efficiency reduce nearly 1% 150 watts power outputs; We know that the resistance of 1 milliohm is very little, and in fact the contact resistance at pad place is far longer than 1 milliohm, this shows, eliminate pad and the influence of the contact resistance that brings has sizable raising to properties of product.
As Fig. 3, the coil windings 201 of flat surface transformer is directly formed by common epoxy printed circuit board (PCB) 6 (pcb board), the installation weld pattern of while direct designing high-power device 3 (as high-power Schottky rectifier diode) on same printed circuit board 6, there is not the contact resistance problem of termination pad in termination from transformer to just being electrically connected the power device like this, belong to direct connection, this has just fundamentally solved the big problem of termination pad contact resistance.
The printed circuit board (PCB) 6 that the making transformer coli winding is used can be circuitron or multilayer printed circuit.The circuitron manufacture craft is simple, and cost is low; When adopting two-sided epoxy printed circuit board (PCB), can be according to the thickness of output current concrete in the reality use and power output size selection Copper Foil, can accomplish the thick Copper Foil of two-sided each 0.5mm at present, adapter ring oxygen medium layer thickness is the thinnest to 0.2mm, in epoxy printed circuit prototypes etching process, can suitably increase etching time to thicker Copper Foil, the distance of suitably widening between lines during graphic designs gets final product, and these all belong to general technology, and production in enormous quantities is fully feasible.
The substrate of switch power module still adopts aluminium base copper-clad plate 1, to guarantee good heat radiation and mechanical strength be installed, the epoxy printed circuit board (PCB) 6 of making winding coil 201 and being welded with power device 3 is installed in the middle of the magnetic core of transformer 202,203, and integral installation is in aluminium base copper-clad plate 1 again.As Fig. 3, because epoxy printed circuit board (PCB) 6 is installed in the middle of the magnetic core of transformer 202,203, be separated with magnetic core 203 between the bottom of epoxy printed circuit board (PCB) 6 and the aluminium base copper-clad plate 1, just aluminium base copper-clad plate 1 is except that with magnetic core 203 contacts, with epoxy printed circuit board (PCB) 6 other parts be unsettled.One of solution is that the copper billet 7 with certain thickness and volume size is placed between epoxy printed circuit board (PCB) 6 and the aluminium base copper-clad plate 1, directly pad is under printed circuit board (PCB) place, power device 3 place for key point copper billet 7, and the heat that power device 3 is sent distributes by the heat passage that forms between copper billet 7 and the aluminium base copper-clad plate 1.Aluminium base copper-clad plate 1 upper surface is handled through etching process, and the Copper Foil 101 that forms as shown in Figure 3 contacts with copper billet 7.Copper billet 7 can heat conduction can play effect fixing between epoxy printed circuit board (PCB) 6 and the aluminium base copper-clad plate 1 again.Copper billet 7 also can replace with the big material of other coefficients of heat conduction, as aluminium, titanium etc.
The processing of copper billet 7 has no special requirements, and is the same with the installation welding manner of power device 3 as long as the surfacing two sides is zinc-plated, and the usable surface placement equipment is realized laying automatically, and technology is simple.Embodiment two:
Two of unsettled way to solve the problem are between epoxy printed circuit board (PCB) 6 and the aluminium base copper-clad plate 1, copper billet and aluminium base copper-clad plate that the bulk metal base 8 of employing machine-shaping replaces among the embodiment one, as shown in Figure 4.The projection 801 of bulk metal base 8 upper surfaces is the size and the position of copper billet 7 among the embodiment one just.Projection 801 on the metab 8 is just in time filled up under printed circuit board (PCB) place, power device 3 place, in order to insulate, is stained with insulating heat-conductive glue between power device 3 and projection 801.Such bulk metal base 8 can play the effect of heat conduction, fixed installation and increase mechanical strength equally.Metab 8 adopts heat dispersion and the good aluminum of insulation property usually, can pass through a punching press or casting and forging molding, or by the metalworking moulding.
In sum, this high power density switch power module process structure disclosed in the utility model and intraconnection mode can solve the problem that exists in existing Related product and the technology very effectively, and this process structure and interconnection mode require high power density at other simultaneously. big electric current. in the modular product design of low thermal resistance good value is arranged also.
Claims (9)
1. contactless pad type switch power module, the printed circuit board (PCB) (6) that comprises substrate (1), transformer, upper surface support power device (3), it is characterized in that: the coil windings of transformer (201) is directly formed by printed circuit board (PCB) (6), also is printed with the installation weld pattern of high power device simultaneously on the printed circuit board (PCB) (6); Printed circuit board (PCB) (6) is installed in the middle of the magnetic core of transformer (202,203), and integral installation is on substrate (1) again; Between printed circuit board (PCB) (6) and substrate (1), also lay heat radiating metal piece (7), and heat radiating metal piece (7) pad is under printed circuit board (PCB) place, power device (3) place.
2. switch power module according to claim 1 is characterized in that: described substrate (1) is the aluminium base copper-clad plate of handling through super-corrosion process, and described heat radiating metal piece (7) is a copper billet.
3. switch power module according to claim 2, it is characterized in that: the zinc-plated and described printed circuit board (PCB) of described copper billet (7) upper surface (6) is connected to each other by welding, and Copper Foil (101) is connected to each other by welding in the zinc-plated and described aluminium base copper-clad plate of described copper billet (7) lower surface.
4. contactless pad type switch power module, the printed circuit board (PCB) (6) that comprises substrate (1), transformer, upper surface support power device (3), it is characterized in that: the coil windings of transformer (201) is directly formed by printed circuit board (PCB) (6), also is printed with the installation weld pattern of high power device simultaneously on the printed circuit board (PCB) (6); Substrate (1) is the bulk metal base (8) through machine-shaping, printed circuit board (PCB) (6) is installed in the middle of the magnetic core of transformer (202,203), integral installation is on metab (8) again, and the projection (801) on the metab (8) is just in time filled up the below at printed circuit board (PCB) place, power device (3) place.
5. switch power module according to claim 4 is characterized in that: described metab (8) adopts the good aluminum of heat dispersion.
6. according to claim 4 or 5 described switch power modules, it is characterized in that: described metab (8) passes through a punching press or casting and forging molding, or by the metalworking moulding.
7. according to claim 4 or 5 described switch power modules, it is characterized in that: be stained with insulating heat-conductive glue between described projection (801) and the printed circuit board (PCB) (6).
8. switch power module according to claim 6 is characterized in that: be stained with insulating heat-conductive glue between described projection (801) and the printed circuit board (PCB) (6).
9. according to claim 1 or 4 described switch power modules, it is characterized in that: described printed circuit board (PCB) (6) is circuitron or multilayer printed circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 99217363 CN2385497Y (en) | 1999-08-02 | 1999-08-02 | Contactless soldering point type switch power supply module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 99217363 CN2385497Y (en) | 1999-08-02 | 1999-08-02 | Contactless soldering point type switch power supply module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2385497Y true CN2385497Y (en) | 2000-06-28 |
Family
ID=34008823
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 99217363 Expired - Lifetime CN2385497Y (en) | 1999-08-02 | 1999-08-02 | Contactless soldering point type switch power supply module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2385497Y (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103427599A (en) * | 2012-05-22 | 2013-12-04 | 李尔公司 | Coldplate for use in an electric vehicle (EV) or a hybrid-electric vehicle (HEV) |
| CN103582391A (en) * | 2012-07-27 | 2014-02-12 | Tdk株式会社 | Power supply device |
| CN103841804A (en) * | 2012-11-27 | 2014-06-04 | 李尔公司 | Coldplate for use in electric vehicle (EV) or hybrid electric vehicle (HEV) |
| CN106533156A (en) * | 2016-12-20 | 2017-03-22 | 中国航空工业集团公司雷华电子技术研究所 | DC-DC switching power supply module and conformal encapsulation method of DC-DC switching power supply module |
| CN108141951A (en) * | 2015-08-04 | 2018-06-08 | 保时捷股份公司 | Electical connector |
| CN109862760A (en) * | 2019-03-25 | 2019-06-07 | 杭州士腾科技有限公司 | The radiator structure of electric machine controller |
| CN110165442A (en) * | 2018-02-12 | 2019-08-23 | 泰达电子股份有限公司 | Metal block welds the power module of column combination and its application |
-
1999
- 1999-08-02 CN CN 99217363 patent/CN2385497Y/en not_active Expired - Lifetime
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103427599A (en) * | 2012-05-22 | 2013-12-04 | 李尔公司 | Coldplate for use in an electric vehicle (EV) or a hybrid-electric vehicle (HEV) |
| CN103582391A (en) * | 2012-07-27 | 2014-02-12 | Tdk株式会社 | Power supply device |
| CN103582391B (en) * | 2012-07-27 | 2017-05-10 | Tdk株式会社 | Power supply device |
| CN103841804A (en) * | 2012-11-27 | 2014-06-04 | 李尔公司 | Coldplate for use in electric vehicle (EV) or hybrid electric vehicle (HEV) |
| CN108141951A (en) * | 2015-08-04 | 2018-06-08 | 保时捷股份公司 | Electical connector |
| CN106533156A (en) * | 2016-12-20 | 2017-03-22 | 中国航空工业集团公司雷华电子技术研究所 | DC-DC switching power supply module and conformal encapsulation method of DC-DC switching power supply module |
| CN106533156B (en) * | 2016-12-20 | 2019-06-14 | 中国航空工业集团公司雷华电子技术研究所 | A kind of DC-DC switch power module and the conformal packaging method of DC-DC switch power module |
| CN110165442A (en) * | 2018-02-12 | 2019-08-23 | 泰达电子股份有限公司 | Metal block welds the power module of column combination and its application |
| CN109862760A (en) * | 2019-03-25 | 2019-06-07 | 杭州士腾科技有限公司 | The radiator structure of electric machine controller |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C53 | Correction of patent for invention or patent application | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: PATENTEE ADDRESS; FROM: HOUSE 6, BUILDING 710, LIANTANGPENGJIGONGYE DISTRICT, SHENZHEN CITY, 518004 TO: ZHONGXINGTONGXUN BUILDING, GAOXINJISHUCHANYEYUANKEJI ROAD(SOUTH), NANSHAN DISTRICT, SHENZHEN CITY, 518057 |
|
| CP03 | Change of name, title or address |
Address after: 518057, Shenzhen Nanshan District hi tech Industrial Park, science and technology south road, ZTE building, the Ministry of legal affairs Patentee after: Zte Corp of Shenzhen Address before: 518004 Shenzhen Liantang City Industrial Zone 710 building 6 floor Patentee before: Zte Corp of Shenzhen |
|
| C56 | Change in the name or address of the patentee |
Owner name: ZTE CO., LTD. Free format text: FORMER NAME OR ADDRESS: SHENZHENG CITY ZTE CO., LTD. |
|
| CP03 | Change of name, title or address |
Address after: Yan Huaxiang, Department of legal affairs, Zhongxing building, science and Technology Industrial Park, Nanshan District hi tech Industrial Park, Guangdong, Shenzhen Patentee after: ZTE Corporation Address before: Guangdong Shenzhen hi tech Industrial Park, Nanshan District science and technology south road Zhongxing building law affairs Patentee before: Zhongxing Communication Co., Ltd., Shenzhen City |
|
| C17 | Cessation of patent right | ||
| CX01 | Expiry of patent term |