CN219395352U

CN219395352U - Water-cooling power supply magnetic device mounting device

Info

Publication number: CN219395352U
Application number: CN202222285946.XU
Authority: CN
Inventors: 陈文进
Original assignee: Guangdong Gausbao Electric Technology Co ltd
Current assignee: Guangdong Gausbao Electric Technology Co ltd
Priority date: 2022-08-30
Filing date: 2022-08-30
Publication date: 2023-07-21
Anticipated expiration: 2032-08-30

Abstract

The utility model relates to a magnetic device mounting device of a water-cooling power supply, which comprises a base, heat conducting grooves, heat conducting silica gel, an electric connecting assembly, a first group of device modules and a second group of device modules, wherein each group of device modules comprises a PCB clamping plate and electronic components integrated on the PCB clamping plate, the heat conducting grooves are mounted on the base, more than two heat conducting grooves are formed, each heat conducting groove is respectively provided with a corresponding group of device modules and a PCB cover plate, the electronic components of the first group of device modules comprise three-phase PFC inductors, the electronic components of the second group of device modules comprise DC/DC power transformers and resonance inductors, the electronic components on each group of device modules are packaged in the heat conducting grooves in a heat conducting silica gel filling mode, and the electronic components on each group of device modules are respectively and electrically connected to the outside through the electric connecting assembly. The installation structure is compact, does not occupy redundant space, and the heat conduction silica gel has very high heat conduction coefficient and good heat dissipation effect.

Description

Water-cooling power supply magnetic device mounting device

Technical Field

The utility model relates to a high-frequency high-power switching power supply, in particular to a magnetic device mounting device of a water-cooling power supply.

Background

With the rapid development of switching power supply technology, high-power switching power supplies are not uncommon in life. In high-power switching power supply applications, the input voltage is mostly three-phase ac input, and after three-phase PFC, the DC bus voltage is as high as about 800, and such high bus voltage presents challenges for the design of the subsequent stage DC/DC converter. The volume requirement on the high-power switching power supply is smaller and smaller, and the efficiency requirement is higher and higher; the high efficiency and high power supply circuit is realized and becomes a continuously pursued target in the switching power supply technology, so that energy sources are saved.

At present, a high-power supply is commonly used, and a three-phase PFC (Vienna structure) resonant circuit and a half-bridge LLC resonant circuit are relatively popular, and generally comprise a square wave generator, a PFC boost network and a DC/DC resonant network. Because the design and location of the magnetic device is the core of the overall power supply for high power, its heat dissipation affects its reliability and operational life, and the design and installation of the magnetic element can also produce immeasurable losses to EMI and the power grid. In this case, for the high-power supply with the desired power of 5-6KW or more, the design and assembly of the magnetic element are made and the high-power supply is properly processed, so that the efficiency and the reliability are required to be further improved.

Disclosure of Invention

In view of the above, it is necessary to provide a water-cooled power magnetic device mounting apparatus that has a compact mounting structure, a small volume, smooth assembly, a remarkable heat dissipation effect, and a high power density.

The utility model provides a water-cooling power magnetic device installation device, includes base, heat conduction groove, heat conduction silica gel, electrical connection subassembly, first group device module and second group device module, and every group device module includes PCB cardboard and the electronic components of integration on the PCB cardboard, the heat conduction groove install in on the base, the heat conduction groove has more than two, every the heat conduction groove is installed respectively and is corresponded a set of device module and cover and be equipped with the PCB apron, the electronic components of first group device module includes three-phase PFC inductance, the electronic components of second group device module includes DC/DC power transformer and resonance inductance, the electronic components encapsulation is in the heat conduction groove on each subassembly module in the form of heat conduction silica gel encapsulating, and electronic components are electric connection to outside respectively through electrical connection subassembly on each group device module.

Further, the heat conduction groove is enclosed by a plurality of lateral walls, the heat conduction groove is divided into a first heat conduction groove and a second heat conduction groove, the bottom of the inner side of each lateral wall is provided with a groove, and the top end of each lateral wall is provided with a limiting part.

Further, the three-phase PFC inductor is arranged on the corresponding PCB clamping plate side by side through three inductors, the PCB clamping plate is provided with a protrusion, the three-phase PFC inductor is embedded into the first heat conducting groove, and the protrusion of the PCB clamping plate is clamped into the groove at the bottom of the inner side wall.

Further, locating hole, window and screens portion have been seted up to the PCB apron, electrical connection subassembly includes the copper post, the copper post is worn to locate in the locating hole when the PCB apron is packed in on the first heat conduction groove, screens portion with spacing portion block, three-phase PFC inductance passes through the copper post connects corresponding power electric device.

Further, the DC/DC power transformer and the resonant inductor are multiple and are arranged on the corresponding PCB clamping plates, the PCB clamping plates are provided with protrusions, the DC/DC power transformer and the resonant inductor are embedded into the second heat conduction groove, and the protrusions of the PCB clamping plates are clamped into the side wall grooves.

Further, locating holes and clamping portions are formed in the PCB cover plate, the electric connection assembly comprises copper columns, the copper columns penetrate through the locating holes, when the PCB cover plate is installed on the second heat conducting grooves, the clamping portions are clamped with the limiting portions, and the DC/DC power transformer and the resonant inductor are connected with corresponding power electric devices through the copper columns.

Further, the three-phase PFC inductor is connected with the copper column and the capacitor through a boost diode; the capacitor is connected with the LLC-MOS, the copper column and the transformer, and the transformer and the resonant inductor are connected in series to form a closed loop.

Further, the base and the side wall of the heat conducting groove are made of aluminum-containing materials.

According to the water-cooling power supply magnetic device mounting device, the first group of device modules and the second group of device modules are respectively mounted in the heat conduction groove, the electronic elements on the groups of device modules are packaged in the heat conduction groove in a glue filling mode of heat conduction silica gel, so that the mounting structure is compact, redundant space is not occupied, the heat conduction groove is mounted on the base, and the groups of devices are fully contacted with the heat conduction silica gel and the base, and the good heat dissipation effect is achieved.

Drawings

The accompanying drawings, which are included to provide a further understanding of embodiments of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the description serve to explain the principles of the utility model. It is evident that the figures in the following description are only some embodiments of the utility model, from which other figures can be obtained without inventive effort for a person skilled in the art. In the drawings:

fig. 1 is a schematic diagram of a water-cooled power supply magnetic device mounting apparatus according to an embodiment of the present utility model.

Fig. 2 is a schematic diagram of a three-phase PFC inductor of a water-cooled power magnetic device mounting apparatus according to an embodiment of the present utility model.

Fig. 3 is a schematic diagram of a DC/DC power transformer and a resonant inductor of a water-cooled power magnetic device mounting apparatus according to an embodiment of the present utility model.

Wherein,,

water-cooled power supply magnetic device mounting device 100

10, base: 11 a first heat conduction groove, 12 a second heat conduction groove and 13 a limit part;

20 PCB cardboard: 21 protrusions;

30 PCB cover plate: 31 positioning holes, 32 windows, 33 clamping parts and 34 copper columns;

40 three-phase PFC inductance;

50 DC/DC power transformer and resonant inductor.

Detailed Description

It is to be understood that the terminology used herein, the specific structural and functional details disclosed are merely representative for the purpose of describing particular embodiments, but that the utility model may be embodied in many alternate forms and should not be construed as limited to only the embodiments set forth herein.

The present utility model will be described in detail with reference to specific embodiments and drawings.

Referring to fig. 1, 2 and 3, a water-cooled power magnetic device mounting apparatus 100 provided by an embodiment of the present utility model includes a base 10, a heat conducting slot, a heat conducting silica gel, an electrical connection assembly, a first group of device modules and a second group of device modules, each group of device modules includes a PCB card 20 and electronic components integrated on the PCB card 20, the heat conducting slot is mounted on the base 10, the heat conducting slot has more than two, each heat conducting slot is respectively mounted with a corresponding group of device modules and covered with a PCB cover plate 30, the electronic components of the first group of device modules include a three-phase PFC inductor 40, the electronic components of the second group of device modules include a DC/DC power transformer and a resonant inductor 50, the heat conducting silica gel encapsulating the electronic components on each group of device modules in the heat conducting slot, and the electronic components on each group of device modules are respectively electrically connected to the outside through the electrical connection assembly. Because the heat conduction silica gel has very high (3.0) heat conduction coefficient, and each group of device modules fully contact with the heat conduction silica gel and the base 10, the heat dissipation effect is good, the volume of each component can be smaller, the whole volume of the power supply can be smaller along with the reduction, and meanwhile, the area of the water cooling plate can be properly reduced, so that the weight of the system is reduced, the space occupation of a power supply system used by a terminal customer is small, the operation is more convenient, the base 10 is preferably made of a molded aluminum material, and the heat dissipation effect is good. The base 10 may also be a PCB motherboard.

Specifically, the heat conduction groove is enclosed by a plurality of lateral walls, the heat conduction groove has two, divide into first heat conduction groove 11 and second heat conduction groove 12, every lateral wall inboard bottom is equipped with the recess, every the lateral wall top has spacing portion 13.

Specifically, the three-phase PFC inductor 40 is installed on the corresponding PCB clamping board 20 by three inductors side by side, the PCB clamping board 20 is provided with a protrusion 21, the three-phase PFC inductor 40 is embedded in the first heat conducting groove 11, and the protrusion 21 of the PCB clamping board 20 is clamped in the groove at the bottom of the inner side wall. The three inductors are annular, and do not occupy redundant space.

Specifically, the PCB cover 30 is provided with a positioning hole 31, a window 32 and a positioning portion 33, the electrical connection assembly includes a copper column 34, the copper column 34 is disposed in the positioning hole 31 in a penetrating manner, when the PCB cover 30 is mounted on the first heat conducting slot 11, the positioning portion 33 is engaged with the positioning portion 13, and the three-phase PFC inductor 40 is connected with a corresponding power electric device through the copper column 34. Preferably, three toroidal inductors are welded and fixed on the PCB clamping plate 20 side by side, the inductors and the PCB clamping plate 20 are welded and then are sunk into the base 10, the welding spot positions are fixed, the adjusted heat-conducting silica gel is poured, and the baking is performed for several hours, preferably 2 hours. After the heat-conducting silica gel is solidified, the electric PCB cover plate 30 is welded, and the corresponding power electric device is connected through the copper column 34.

Specifically, the plurality of DC/DC power transformers and the resonant inductors 50 are arranged on the corresponding PCB clamping boards 20, the PCB clamping boards 20 are provided with protrusions 21, the DC/DC power transformers and the resonant inductors are embedded into the second heat conducting grooves 12, and the protrusions 21 of the PCB clamping boards 20 are clamped into the side wall grooves. The DC/DC power transformer and resonant inductor 50 is preferably two high power transformers and two corresponding resonant inductors.

Specifically, the PCB cover 30 is provided with a positioning hole 31 and a clamping portion 33, the electrical connection assembly includes a copper column 34, the copper column 34 is inserted into the positioning hole 31, when the PCB cover 30 is mounted on the second heat conducting slot 12, the clamping portion 33 is clamped with the limiting portion 13, and the DC/DC power transformer and the resonant inductor 50 are connected with corresponding power electric devices through the copper column 34. Preferably, the DC/DC power transformer and the resonant inductor 50 are welded on the fixed PCB clamping board 20, after the DC/DC power transformer and the resonant inductor 50 are welded with the PCB clamping board 20, they are sunk into the base 10, the welding spot positions are fixed, the adjusted heat-conducting silica gel is poured, after the heat-conducting silica gel is baked for several hours, the electric PCB cover board 30 is welded, and the corresponding power electric device is connected through the copper column 34.

Specifically, the three-phase PFC inductor 40 is connected to the copper pillar 34 and the capacitor through a boost diode; the capacitor is connected with the LLC-MOS, the copper column 34 and the transformer, and the transformer and the resonant inductor are connected in series to form a closed loop.

Specifically, the base 10 and the side wall of the heat conducting groove are made of aluminum-containing materials. The aluminum-containing material has good heat dissipation effect.

Above-mentioned water-cooling power magnetic device installation device 100 installs first group device module and second group device module respectively in the heat conduction inslot, encapsulates the electronic component on each group device module in the heat conduction inslot through heat conduction silica gel encapsulating form, and the mounting structure is compact like this, does not occupy unnecessary space, each group device and heat conduction silica gel reaches base 10 fully contacts, and heat conduction silica gel has very high coefficient of heat conductivity, has good radiating effect, just base 10 adopts the aluminum product preparation, and the aluminum product also has good radiating effect for the radiating effect is better, has further improved the life and the reliability of product.

The above description of the utility model in connection with specific alternative embodiments is further detailed and it is not intended that the utility model be limited to the specific embodiments disclosed. It will be apparent to those skilled in the art that several simple deductions or substitutions may be made without departing from the spirit of the utility model, and these should be considered to be within the scope of the utility model.

Claims

1. The utility model provides a water-cooling power magnetic device installation device, its characterized in that includes base, heat conduction groove, heat conduction silica gel, electrical connection subassembly, first group device module and second group device module, and every group device module includes PCB cardboard and the electronic components of integration on the PCB cardboard, the heat conduction groove install in on the base, the heat conduction groove has more than two, every the heat conduction groove is installed respectively and is corresponded a set of device module and cover and be equipped with the PCB apron, the electronic components of first group device module includes three-phase PFC inductance, the electronic components of second group device module includes DC/DC power transformer and resonance inductance, the heat conduction silica gel is with encapsulating the electronic components on each group device module in the heat conduction groove in the form of encapsulating, and the electronic components on each group device module is electric connection to outside respectively through electrical connection subassembly.

2. The water-cooled power supply magnetic device mounting apparatus as claimed in claim 1, wherein the heat conducting grooves are formed by a plurality of side walls, the number of the heat conducting grooves is two, the heat conducting grooves are divided into a first heat conducting groove and a second heat conducting groove, the bottom of the inner side of each side wall is provided with a groove, and the top end of each side wall is provided with a limiting part.

3. The water-cooled power supply magnetic device mounting device according to claim 2, wherein the three-phase PFC inductor is mounted on the corresponding PCB clamping board side by three inductors, the PCB clamping board is provided with a protrusion, the three-phase PFC inductor is embedded in the first heat conducting groove, and the PCB clamping board protrusion is clamped into the groove.

4. The water-cooling power supply magnetic device mounting device according to claim 3, wherein the PCB cover plate is provided with a positioning hole, a window and a clamping part, the electric connection assembly comprises a copper column, the copper column penetrates through the positioning hole, when the PCB cover plate is mounted on the first heat conduction groove, the clamping part is clamped with the limiting part, and the three-phase PFC inductor is connected with a corresponding power electric device through the copper column.

5. The water-cooled power supply magnetic device mounting apparatus of claim 4, wherein the plurality of DC/DC power transformers and resonant inductors are mounted on the corresponding PCB card, the PCB card is provided with a protrusion, the DC/DC power transformers and resonant inductors are embedded in the second heat-conducting groove, and the PCB card protrusion is clamped in the sidewall groove.

6. The water-cooled power supply magnetic device mounting apparatus of claim 5, wherein the PCB cover plate is provided with a positioning hole and a clamping portion, the electrical connection assembly comprises a copper column, the copper column is inserted into the positioning hole, and when the PCB cover plate is mounted on the second heat conduction groove, the clamping portion is clamped with the limiting portion, and the DC/DC power transformer and the resonant inductor are connected with the corresponding power electric device through the copper column.

7. The water-cooled power supply magnetic device mounting apparatus of claim 6, wherein the three-phase PFC inductor is connected to the copper pillar and capacitor through a boost diode; the capacitor is connected with the LLC-MOS, the copper column and the transformer, and the transformer and the resonant inductor are connected in series to form a closed loop.

8. The water-cooled power supply magnetic device mounting apparatus of any one of claims 1-7, wherein the base and the heat conducting slot side walls are aluminum profiles.