KR102536990B1 - Dc-dc converter - Google Patents

Abstract

This embodiment includes a housing including a cooling plate; a cooling passage disposed on one surface of the cooling plate; an insulating layer disposed on the other surface of the cooling plate; a pattern layer disposed on the insulating layer; an electric element disposed on the pattern layer; It relates to a DC-DC converter including a substrate spaced apart from the cooling plate and electrically connected to the pattern layer.

Description

DC-DC converter {DC-DC CONVERTER}

This embodiment relates to a DC-DC converter.

The contents described below provide background information on the present embodiment, but do not describe the prior art.

Along with the advent of eco-friendly vehicles using electric power, there is a demand for light weight and size reduction of electric parts for vehicles. A vehicle DC-DC converter is a device that controls DC voltage in a vehicle.

In particular, in an electric vehicle, the voltage of the current produced by the battery is changed and supplied to the motor. In addition, when the electric vehicle goes down a slope, the motor becomes a generator and charges the battery. In this case, the voltage of the current produced by the motor is changed and supplied to the battery.

Various electronic components are placed in the DC-DC converter, and it is necessary to improve the cooling efficiency of the heating module for various reasons such as lightening the DC-DC converter and realizing a compact structure.

On the other hand, the main components of the DC-DC converter are a primary coil through which current supplied from the outside flows, a secondary coil in which an induced current is generated by the current flowing through the primary coil, and a converted current electrically connected to the secondary coil. It is an inductor coil that controls the frequency of In more detail, the current conversion is performed by the electromagnetic interaction between the primary coil and the secondary coil, and the converted current is passed through an inductor coil to filter the noise frequency, and then to an external device through a busbar. are supplied In general, secondary coils, inductor coils, and bus bars are manufactured as single members through complicated processes such as sheet press cutting, bolt hole punching, bending, and forging, and then joined by bolts to be electrically connected. However, such a manufacturing process is too complicated, and furthermore, there is a problem in that the bolt is not completely fastened or a gap may be caused due to distortion of the material. In particular, the gap between the secondary coil and the inductor coil and the inductor coil and the bus bar not only deteriorates electrical characteristics but also causes problems such as heat generation due to an increase in contact resistance. In addition, there is a problem in that the size and weight of the DC-DC converter increase because the secondary coil, the inductor coil, and the bus bar are manufactured as a single member.

Meanwhile, the DC-DC converter may include a housing and a cooling plate disposed in the housing in the form of a horizontal partition wall to divide the housing into a first area and a second area. In addition, a cooling passage is formed in the first region so that cooling water flows, and an electronic component (for example, a board on which various elements are mounted) is disposed in the second region. That is, the first region performs a function of cooling the electronic component with a cooling unit, and the second region performs an electronic control function of converting a voltage of an external power source to the electronic component. Recently, due to the request of vehicle manufacturers and the advent of smart and hybrid vehicles, research on reducing the size of DC-DC converters and increasing the cooling efficiency of electronic parts has been conducted.

The first embodiment aims to provide a DC-DC converter with improved cooling efficiency of a heating module.

In the second embodiment, by integrally forming the secondary coil, the inductor coil, and the bus bar, the manufacturing process can be simplified, conversion efficiency can be improved, and DC including a coil module having a compact structure. -We want to provide a DC converter.

In this third embodiment, it is intended to provide a DC-DC converter that can be reduced in size and has high cooling efficiency.

The DC-DC converter of the first embodiment includes a housing; a plurality of electronic components disposed within the housing; and a flow path disposed on a lower plate of the housing, the flow path including an extension portion, a horizontal width of the extension portion greater than a transverse width of the flow passage at the front end of the extension portion, and a vertical width of the extension portion of the flow passage at the front end of the extension portion. A difference between a portion having the largest and smallest area of a cross section that is smaller than the vertical width of and perpendicular to the moving direction of the cooling material in the passage may be within 10%.

The plurality of electronic components may include a plurality of heating elements, and one of the plurality of heating elements may be disposed to correspond to the expansion part.

One of the plurality of heating elements may overlap the expansion part in a vertical direction.

An area overlapping one of the plurality of heat generating elements in a vertical direction in a maximum horizontal cross section of the expansion part may be 30% or more.

A maximum horizontal cross section of the expansion part may be 90% or more of a maximum horizontal cross section of one of the plurality of heat generating elements.

A protrusion protruding in the direction of the lower plate may be located on a bottom surface of the expansion part.

The protruding height of the protruding part may increase and then decrease along the moving direction of the cooling material.

A vertical cross section of the protrusion may have a quadrangular shape, and an area of a vertical cross section of the protrusion may increase and then decrease along a moving direction of the cooling material.

A horizontal cross section of the protrusion may be convexly curved toward the lower plate, and an area of the horizontal cross section of the protrusion may decrease from a center to an edge of a horizontal width of the passage.

An area of a vertical section of the passage may be the same along a moving direction of the cooling material.

The plurality of electronic components may include a plurality of heating elements, the plurality of heating elements may include a diode module, and the diode module may be disposed to correspond to the expansion part in a vertical direction.

The passage further includes an inlet through which the cooling material sequentially moves, a first curve, a second curve, and an outlet, the inlet and the outlet being spaced apart in a transverse direction of the passage, The first curve part and the extension part may be spaced apart from each other in a transverse direction of the passage.

The inlet and the outlet are disposed parallel to each other, the first curve has a convex curvature in a direction in which the extension is located, and the second curve has a space between the first curve and the extension. The curvature may be convexly formed in a direction opposite to the direction.

The plurality of electronic components include a heating element, the heating element includes an inductor, a transformer, a zero-voltage-switching (ZVS) inductor, a switching module, and a diode module, and the inductor includes the inductor The transformer is disposed to correspond in a vertical direction to the first curve portion, and the ZVS (Zero-Voltage-Switching) inductor is disposed to correspond in a vertical direction to the front end of the second curve portion. The switching module may be disposed to correspond to the second curve portion in a vertical direction, and the diode module may be disposed to correspond to the expansion portion in a vertical direction.

The inductor continuously controls the flow of current, the transformer controls power by changing the voltage of the current, and the ZVS (Zero-Voltage-Switching) inductor controls a light load, , The switching module can control the On/Off of the current, and the diode module can control the direction of the current.

The housing may include a side plate extending upward from the lower plate and an upper cover disposed on the side plate, and the plurality of electronic components may be disposed in a space formed by the lower plate, the side plate, and the upper cover.

Further comprising a connector electrically connected to an external electronic device, an inlet through which a cooling material flows into the flow path, and an outlet through which the cooling material is discharged from the flow path, wherein the connector is disposed on the side plate, and the inlet and the The outlet is located on the opposite side of the connector and may be disposed on the side plate.

The housing includes a first sidewall extending downward from the lower plate, a second sidewall extending downward from the lower plate and spaced apart from the first sidewall, and a lower cover disposed under the first sidewall and the second sidewall. Including, the passage may be formed by the lower plate, the first sidewall, the second sidewall and the lower cover.

A ceiling surface of the passage may be positioned on the lower plate, a bottom surface of the passage may be positioned on the lower cover, and side surfaces of the passage may be positioned on the first sidewall and the second sidewall.

The vertical width of the flow path may be defined by the shortest vertical distance between the lower plate and the lower cover, and the horizontal width of the flow path may be defined by the shortest horizontal distance between the first sidewall and the second sidewall. .

The DC-DC converter of the second embodiment includes a primary coil; a secondary coil in which an induced current is generated by the primary coil; a first terminal and a second terminal extending from the secondary coil; an inductor coil connected to the second terminal to rectify current; and a third terminal extending from the inductor coil, and the first terminal, the primary coil, the second terminal, the inductor coil, and the third terminal may be integrally formed.

The secondary coil may have a shape in which a plate including upper and lower surfaces forms an open ring, and one end may be connected to the first terminal and the other end may be connected to the second terminal.

The inductor coil may have a shape in which a plate including upper and lower surfaces grows in a three-dimensional spiral.

The inductor coil may have an angled three-dimensional spiral shape including a plurality of corner portions.

At least one of the first terminal, the second terminal, and the third terminal may include at least one of a bent portion and a bent portion.

Current may flow in both directions through the first terminal, the secondary coil, the second terminal, the inductor coil, and the third terminal.

It may further include a first magnetic core on which the secondary coil is disposed, and a second magnetic core on which the inductor coil is disposed.

It further includes a bus bar extending from the third terminal, and the first terminal, the secondary coil, the second terminal, the inductor coil, the third terminal, and the bus bar can be integrally formed.

The DC-DC converter of the second embodiment includes a primary coil; a secondary coil and a tertiary coil in which an induced current is generated by the primary coil; a first terminal and a second terminal extending from the secondary coil; a third terminal and a fourth terminal extending from the tertiary coil; a fifth terminal connected to the second terminal and the fourth terminal; an inductor coil extending from the fifth terminal and rectifying current; a sixth terminal extending from the inductor coil; It includes a bus bar extending from the sixth terminal, the secondary coil, the first terminal, and the second terminal are integrally formed, and the tertiary coil, the third terminal, and the fourth terminal are integrally formed. The fifth terminal, the inductor coil, the sixth terminal, and the bus bar may be integrally formed.

The secondary coil is disposed above the primary coil, the tertiary coil is disposed below the primary coil, the secondary coil is electrically connected to the diode module by the first terminal, and the 3 The car coil may be electrically connected to the diode module through the third terminal.

The DC-DC converter of the third embodiment includes a housing including a cooling plate; a cooling passage disposed on one side of the cooling plate; an insulating layer disposed on the other surface of the cooling plate; a pattern layer disposed on the insulating layer; an electric element disposed on the pattern layer; A substrate spaced apart from the cooling plate and electrically connected to the pattern layer may be included.

The electric element may include an upper surface and a lower surface, and the lower surface of the electric element may be soldered to the pattern layer to face the cooling plate.

The cooling plate may be integrally formed with the housing.

A plurality of heat dissipation fins are formed on one surface of the cooling plate, and the heat dissipation fins may have a protrusion shape extending to one side.

The first substrate and the second substrate may be electrically connected by soldering a signal bridge or by a press-fit method.

The signal bridge may include a first conducting member forming a part of the pattern layer; It may include a second conducting member that is bent or bent from the first conducting member and electrically connected to the substrate.

The signal bridge may include a first conducting member electrically connected to the pattern layer; It may include a second conducting member that is bent or bent from the first conducting member and electrically connected to the substrate.

The signal bridge is electrically connected to the pattern layer and includes a first conductive member in the form of a plate; A second conducting member extending from the center of the first conducting member toward the second substrate and electrically connected to the substrate may be included.

The signal bridge may include a first conductive member forming a part of the pattern layer and having a plate-shaped groove in the center; A protrusion received in the groove of the first conducting member may be formed, and a second conducting member extending from the protrusion toward the substrate and electrically connected to the substrate may be included.

One end and the other end of the housing are open, and the housing includes: a first cover covering the opening of the one end; A second cover covering the opening of the other end may be further included.

The insulating layer may be coated on the other surface of the cooling plate.

The DC-DC converter of the third embodiment includes a first area where a cooling fluid flow path is formed, a second area separated from the first area where electronic components are disposed, and a cooling plate disposed between the first and second areas. housing to; a main substrate spaced apart from the cooling plate and disposed in the second region; an insulating layer disposed on the cooling plate; a pattern layer disposed on the insulating layer; An electric element disposed on the pattern layer may be included.

In the DC-DC converter of the first embodiment, since the difference in the area of the vertical section in all parts of the flow path is within 10%, the flow rate of the cooling material is increased and the pressure drop width is reduced to improve the cooling efficiency. can Furthermore, an electronic component (for example, a diode module) having a large heating value and a large area may be intensively cooled by matching with an expansion part (a part having a large horizontal width and a small vertical width) of a flow path.

The second embodiment provides a DC-DC converter including a lightweight coil module having a compact structure and a secondary coil, an inductor coil, and a bus bar integrally formed by a casting process to increase conversion efficiency. .

According to the third embodiment, the size of the electronic component assembly and the converter can be reduced by increasing the mounting rate of devices in the same space using the stacked main board and auxiliary board. Furthermore, cooling efficiency can be increased by mounting an active element having a high calorific value on an auxiliary substrate in direct contact with the cooling plate.

1 is a perspective view from above of a DC-DC converter of the first embodiment.
2 is an exploded perspective view of an upper cover in the DC-DC converter of the first embodiment.
3 is an exploded perspective view of an upper cover and a protective plate in the DC-DC converter of the first embodiment.
4 is a cross-sectional view showing the DC-DC converter of the first embodiment with reference to line A-A'.
5 is a perspective view of the DC-DC converter of the first embodiment, viewed from below, with the lower cover removed.
6 is a plan view of the DC-DC converter according to the first embodiment with the lower plate removed.
Fig. 7 is a plan view of the DC-DC converter of the first embodiment with the lower cover removed.
8 is a plan view and a side view showing the lower cover of the first embodiment.
Fig. 9(1) shows a "vertical section" of the expanded portion of the first embodiment, and Fig. 9(2) shows a "vertical section" of another part of the passage.
10 is a perspective view showing a DC-DC converter of a comparative example of the second embodiment.
11 is a perspective view showing a DC-DC converter of the second embodiment.
Fig. 12 is a perspective view showing a state in which the coil module of the second embodiment is mounted on the first and second magnetic cores (the primary coil is omitted).
13 is a perspective view showing the coil module of the second embodiment (the primary coil is omitted).
Fig. 14 is a perspective view showing a state in which coil modules of a modified example of the second embodiment are mounted on first and second magnetic cores.
15 is an exploded perspective view showing a coil module of a modified example of the second embodiment.
Fig. 16 is a perspective view showing the DC-DC converter of the third embodiment with the first cover removed.
17 is a cut perspective view showing the DC-DC converter of the third embodiment.
18 is a cross-sectional conceptual view showing a main board, an auxiliary board, and a cooling plate of a DC-DC converter according to the third embodiment.
19 is a conceptual diagram showing the signal bridge of the DC-DC converter according to the third embodiment.
20 is a cross-sectional conceptual view showing a main substrate, an auxiliary substrate, and a cooling plate of a DC-DC converter according to a modified example of the third embodiment.

Hereinafter, some embodiments of the present invention will be described through exemplary drawings. In describing the reference numerals for the components of each drawing, the same numerals indicate the same components as much as possible, even if they are displayed on different drawings. In addition, in describing an embodiment of the present invention, if it is determined that a detailed description of a related known configuration or function hinders understanding of the embodiment of the present invention, the detailed description thereof will be omitted.

Also, terms such as first, second, A, B, (a), and (b) may be used to describe components of an embodiment of the present invention. These terms are only used to distinguish the component from other components, and the nature, order, or order of the corresponding component is not limited by the term. When an element is described as being “connected,” “coupled to,” or “connected” to another element, the element may be directly connected, coupled, or connected to the other element, but not between the element and the other element. It should be understood that another component may be “connected”, “coupled” or “connected” between elements.

<First Embodiment>

Hereinafter, “vertical direction” may mean an upper and/or lower direction, and “horizontal direction” may mean one of arbitrary directions on a plane perpendicular to the “vertical direction”. In addition, the "vertical direction" may be the vertical width direction of the flow path 200, and the "horizontal direction" may be the transverse direction of the flow path 200. Also, the "vertical cross section" may mean a cross section perpendicular to the moving direction of the cooling material, and the "horizontal cross section" may mean a cross section perpendicular to the "vertical cross section".

Hereinafter, the DC-DC converter 1 of the first embodiment will be described with reference to the drawings. 1 is a perspective view of a DC-DC converter of the first embodiment viewed from above, FIG. 2 is a perspective view of an upper cover disassembled in the DC-DC converter of the first embodiment, and FIG. 3 is a DC-DC converter of the first embodiment. Figure 4 is a cross-sectional view showing the DC-DC converter of the first embodiment along the line A-A' as a reference, Figure 5 is a DC-DC converter of the first embodiment A perspective view from below with the lower cover removed, FIG. 6 is a plan view of the DC-DC converter of the first embodiment with the lower plate removed, and FIG. 7 is a plan view of the DC-DC converter of the first embodiment with the lower cover removed, Fig. 8 is a plan view and a side view showing the lower cover of the first embodiment, Fig. 9(1) shows a "vertical cross section" of the extension part of the first embodiment, and Fig. 9(2) shows another part of the flow path. The "vertical section" of was shown.

The DC-DC converter 1000 may be used in vehicles. Taking an electric vehicle as an example, the DC-DC converter 1000 receives current from an external power supply device (lithium ion battery, etc.), boosts or lowers the voltage, and supplies it to an external electronic device (motor, etc.) to It can play a role in controlling the number of revolutions.

The DC-DC converter 1000 includes a housing 100, a flow path 200, a plurality of electronic components 300, an inlet 400, an outlet 500, a terminal 600, and one or more connectors 700. can do.

The housing 100 may be an external member of the DC-DC converter 1000 . A flow path 200 may be formed in the housing 100 . A plurality of electronic components 300 may be accommodated inside the housing 100 . A plurality of electronic components 300 are disposed inside the housing 100 with the lower plate 110 interposed therebetween, and a flow path 200 may be located below. The plurality of electronic components 300 may be cooled by the cooling material flowing along the flow path 200 . The housing 100 may be connected to an inlet 400 , an outlet 500 , a terminal 600 and one or more connectors 700 . The material of the housing 100 may include a plastic material and/or a metal material.

The housing 100 may include a lower plate 110, a side plate 120, a protective plate 121, an upper cover 130, a lower cover 140, a first side wall 150 and a second side wall 160. .

The lower plate 110 may form a lower surface of the inner space of the housing 100 . The lower plate 110 may have a substantially rectangular plate shape. The side plate 120 may form a side surface of the inner space of the housing 100 . The side plate 120 may extend upward from the edge of the lower plate 110 . The housing 100 may be provided with an inner space whose upper surface is opened by the lower plate 110 and the side plate 120 . A plurality of electronic components 300 may be accommodated in the inner space of the housing 100 .

An inlet 400, an outlet 500, and a terminal 600 may be positioned on one side of the side plate 120. One or more connectors 700 may be positioned on the other side of the side plate 120 . In this case, the inlet 400 , the outlet 500 and the terminal 600 may be located on opposite sides of one or more connectors 700 .

The protective plate 121 may be located in the inner space of the housing 100 . The protective plate 121 may be spaced apart from the main substrate 310 . The protective plate 121 may overlap at least a portion of the main substrate 310 in a vertical direction. That is, a portion of the upper surface of the main substrate 310 may be covered by the protective plate 121 . The protective plate 121 may be a cover member for protecting a specific portion of the main substrate 310 .

The upper cover 130 may be disposed on the side plate 120 . The upper cover 130 and the side plate 120 may be fastened by screws. The upper cover 130 may have a substantially rectangular plate shape. The upper cover 130 may close the inner space of the housing 100 by the upper cover 130 . The upper cover 130 may include a pattern portion 131 convexly protruding upward in a lattice pattern at the center. The pattern unit 131 may perform a function of protecting the plurality of electronic components 300 accommodated in the inner space of the housing 100 by increasing the strength of the upper cover 130 . The upper cover 130 may include a flange portion 132 protruding from an edge in a horizontal direction. The flange portion 132 has a plate shape and may have a hole into which a screw is inserted.

A flow path 200 may be formed in the lower plate 110 . The flow path 200 may be located on the lower surface of the lower plate 110 . The first sidewall 150 and the second sidewall 160 may be horizontally spaced from each other and extend downward from the lower surface of the lower plate 110 . The first sidewall 150 and the second sidewall 160 may be connected to each other at a point where the flow path 200 is connected to the inlet 400 and the outlet 500 . The lower plate 110 , the first sidewall 150 , and the second sidewall 160 may form a channel 200 with an open lower surface. The lower cover 140 may be positioned under the first side wall 150 and the second side wall 160 to close the lower surface that is open.

That is, the flow path 200 may be formed by the lower surface of the lower plate 110 , the inner surface of the first side wall 150 , the inner surface of the second side wall 160 , and the upper surface of the lower cover 140 . In this case, the ceiling surface of the flow path 200 may be located on the lower surface of the lower plate 110, and both sides of the flow path 200 are on the inner surface of the first side wall 150 and the inner surface of the second side wall 160. Each may be positioned, and the bottom surface of the flow path 200 may be positioned on the top surface of the lower cover 140 .

The horizontal width (a, a') of the passage 200 may be the shortest distance between the inner surface of the first side wall 150 and the inner surface of the second side wall 160 in a "horizontal direction". The vertical width (b, b') of the passage 200 may be the shortest distance between the lower surface of the lower plate 110 and the upper surface of the lower cover 140 in the "vertical direction". The vertical widths (a, a') and the horizontal widths (b, b') of the flow path 200 may be the vertical and horizontal sides of the "vertical sections 40 and 50" of the flow path 200. .

A cooling material flowing through the flow path 200 may absorb heat emitted from the plurality of electronic components 300 . In this case, heat transfer occurs through the lower plate 110, and the plurality of electronic components 300 may be cooled.

The lower cover 140 may have a plate shape. The lower cover 140 may be spaced downward from the lower plate 110 . The upper surface of the lower cover 140 and the lower surface of the lower plate 110 may be connected by a first side wall 150 and a second side wall 160 . The lower cover 140 may include a protruding portion 141 protruding from the upper surface to the upper side (a direction in which the lower plate of the housing is located). The protruding portion 141 may be positioned to correspond in a vertical direction to the expansion portion 240 of the flow path 200 . On the “vertical section 40” of the extension 240, the horizontal width a increases, but the vertical width b may decrease. Therefore, the area of the “vertical section 50” at the extension 240, the front end (upstream side) of the extension 240, and the rear end (downstream side) of the extension 250 can be maintained constant (10%). within, see Figure 9). As a result, it is possible to prevent a decrease in cooling efficiency due to an increase in the pressure difference of the cooling material and a slow flow rate.

The lower cover 140 may have a plate shape. The lower cover 140 may include a first sealing part 142 and a second sealing part 143 . The material of the first sealing part 142 and the second sealing part 143 may include a sealing material such as rubber. The first sealing part 142 and the second sealing part 143 may protrude downward from the lower surface of the lower cover 140 . The first sealing part 142 and the second sealing part 143 may be spaced apart from each other in a “horizontal direction” (transverse direction of the passage).

The first sealing part 142 may overlap the first sidewall 150 in a “vertical direction”. The first sealing part 142 may contact the lower surface of the first sidewall 150 . The first sealing part 142 may have a shape corresponding to the first sidewall 150 .

The second sealing portion 143 may overlap the second sidewall 160 in a “vertical direction”. The second sealing part 143 may contact the lower surface of the second sidewall 160 . The second sealing part 143 may have a shape corresponding to the second sidewall 160 .

The first sealing part 142 may serve to close the gap between the lower cover 140 and the first sidewall 150, and the second sealing part 143 may serve to close the gap between the lower cover 140 and the second sidewall. (160) can perform the function of closing the gap between.

Like the first side wall 150 and the second side wall 160, the first sealing part 142 and the second sealing part 143 are located at the point where the flow path 200 is connected to the inlet 400 and the outlet 500. may be connected to each other.

The lower cover 140 may be fastened to the first sidewall 150 and the second sidewall 160 by screws. The lower cover 140 may include a guide hole 144 . A guide protrusion 111 protruding downward from the lower plate 110 is inserted into the guide hole 144 to guide the lower cover 140 . The lower cover 140 may include a flange portion 145 . A hole into which a screw is inserted may be formed in the flange portion 145 of the lower cover 140 .

The flow path 200 may be formed in the housing 100 . The flow path 200 may be located on one side of the housing 100 . The flow path 200 may be located under the lower plate 110 of the housing 100 . Accordingly, the lower plate 110 of the housing 100 may be a “cooling plate”. The flow path 200 may be connected to the inlet 400 . The flow path 200 may be connected to the outlet 500 . An uppermost portion of the flow path 200 may be connected to the inlet 400 to receive a cooling material. The most downstream of the passage 200 is connected to the outlet 500 so that the cooling material can be discharged. The cooling material may flow along the flow path 200 and cool heat generated from the plurality of electronic components 300 . Various types of heat exchange fluids (eg, cooling water) may be used as the cooling material.

The passage 200 may be formed by the lower plate 110 , the first sidewall 150 , the second sidewall 160 and the lower cover 140 . A bottom surface of the flow path 200 may be located on an upper surface of the lower cover 140 . That is, the upper surface of the lower cover 140 may be the bottom surface of the flow path 200 . A ceiling surface of the flow path 200 may be located on a lower surface of the lower plate 110 . That is, the lower surface of the lower plate 110 may be the ceiling surface of the flow path 200 . Both side surfaces of the flow path 200 may be respectively positioned on inner surfaces of the first sidewall 150 and the second sidewall 160 . That is, inner surfaces of the first sidewall 150 and the second sidewall 160 may be opposite side surfaces of the flow path 200 .

The horizontal width (a, a') of the flow path 200 may be defined by the shortest distance in the "horizontal direction" between the inner surface of the first side wall 150 and the inner surface of the second side wall 160, and the flow path ( 200) may be defined by the shortest distance in the "vertical direction" between the lower surface of the lower plate 110 and the upper surface of the lower cover 140. The horizontal widths (a, a') and the vertical widths (b, b') of the flow path 200 may vary along the moving direction of the cooling material. For example, the horizontal width (a) of the flow path 200 in the expansion unit 240 is the horizontal width (a') of the front end (upstream side of the expansion unit) or the rear end (downstream side of the expansion unit) of the expansion unit 240 . can be bigger In addition, the vertical width (b) of the flow path 200 in the expansion part 240 is greater than the vertical width (b') of the front end (upstream side of the extension part) or the rear end (downstream side of the extension part) of the extension part 240. can be small

The passage 200 may include an inlet 210 , a first curve 220 , a second curve 230 , an extension 240 and an outlet 250 . An upstream of the inlet 210 may be connected to the inlet 400 . A downstream side of the outlet 250 may be connected to the outlet 500 . The downstream of the inlet 210 may be connected to the upstream of the first curve 220, the downstream of the first curve 220 may be connected to the upstream of the second curve 230, and the second curve A downstream side of the extension 230 may be connected to an upstream side of the expansion unit 240, and a downstream side of the extension unit 240 may be connected upstream of the discharge unit 250. Therefore, the cooling material introduced from the inlet 400 sequentially moves through the inlet 210, the first curve 220, the second curve 230, the extension 240, and the outlet 250, and then , It may be discharged through the outlet 500.

The inlet 210 and the outlet 250 may be disposed adjacent to each other. The inlet 210 and the outlet 250 may be disposed parallel to each other. The inlet part 210 and the outlet part 250 may be spaced apart in a “horizontal direction” (transverse width direction of the passage). The first curve part 220 and the extension part 240 may be disposed adjacent to each other. The first curve part 220 and the expansion part 240 may be spaced apart in a “horizontal direction” (the horizontal width direction of the passage). The second curve portion 230 may be a point at which the flow direction of the coolant in the flow path 200 is completely reversed (turn-up or U-turn). The second curve portion 230 may be formed in a “U-shape” shape. One end of the second curve part 230 may be connected to the first curve part 220 . The other end of the second curve part 230 may be connected to the extension part 240 . The second curve part 230 may connect the first curve part 220 and the extension part 240 . Due to the second curve 230, the moving direction of the cooling material in the inlet 210 and the outlet 250, which are disposed in parallel, may be reversed.

A convex curvature may be formed in the direction in which the expansion part 240 is located in the first curve part 220 . Therefore, the shortest "horizontal" distance between the first curve 220 and the extension 240 may be shorter than the shortest "horizontal" distance between the inlet 210 and the outlet 250 . The second curved portion 230 may have a convex curvature in the opposite direction where the inlet portion 210 and the outlet portion 250 are located (U-shaped). The extension 240 may be convexly curvature in a “horizontal direction”. Therefore, the horizontal width (a) of the flow path 200 in the expansion part 240 may be greater than the horizontal width (a') of other parts of the flow path 200 (for example, the front end or the rear end of the extension part 240). ).

In the first embodiment, the inlet 210, the first curve 220, the second curve 230, the extension 240, and the outlet 250 are formed in the flow path 200, and the heating element is formed. This is to efficiently cool the (320).

The plurality of heating elements 320 include an inductor 321, a transformer 322, a zero-voltage-switching (ZVS) inductor 323, a switching module 324, a diode module 325, and the like. 210 may be disposed corresponding to the inductor 210 in the vertical direction (vertical width direction of the flow path), and the first curve portion 220 may be disposed corresponding to the transformer 220 in the vertical direction, The front end (upstream side of the second curve part) of the second curve part 230 may be arranged to correspond in the vertical direction to the ZVS inductor 323, and the second curve part 230 is perpendicular to the switching module 324. direction, and the expansion part 240 may be arranged to correspond to the diode module 240 in the vertical direction (see FIG. 7 ).

In this case, the first curve portion 220 is directed in the direction where the extension portion 240 is located to efficiently cool the transformer 322 having a wider "horizontal area" than the inductor 321 (cooling the center of the transformer). It has a convex curvature.

In addition, the expansion part 240 has a larger "horizontal area" than other parts of the flow path 200 in order to efficiently cool the diode module 325 having a high calorific value. In addition, the expansion part 240 is disposed between the diode module 325 as well as the transformer 322 and the diode module 325 by a large "horizontal area", and the conductive member 326 electrically connecting the two. ) can also be cooled. To this end, the maximum “horizontal area” of the expansion unit 240 (10, the largest horizontal area of the expansion unit) is the maximum “horizontal area” of the diode module 325 (20, the largest area of the horizontal area of the diode module). ) of 90% or more. In addition, the area 30 overlapping the diode module 325 in the "vertical direction" in the maximum "horizontal area" 10 of the expansion unit 240 may be 30% or more.

Meanwhile, the passage 200 of the first embodiment is characterized in that the "vertical section 50" is uniform along the moving direction of the cooling material. A difference between a portion having the largest area and a portion having the smallest area of the "vertical section 50" of the flow path 200 may be within 10% (or less). The area of the "vertical section 50" of the flow path 200 may be equal along the direction of movement of the cooling material. As a result, the flow rate of the cooling material is increased and the pressure drop width is reduced, so that the cooling efficiency can be improved.

In the expansion part 240, the horizontal width (a) of the passage 200 increases, so that the diode module 325 can be efficiently cooled. Because of this, the area of the "vertical section 40" in the expansion part 240 may be larger than the area of the "vertical section 50" in other parts of the flow path 200. This may conflict with the intent of the first embodiment of equalizing the "vertical section 50" of the flow path 200.

In the first embodiment, in order to solve this problem, the vertical width (b) of the "vertical section 40" in the expansion part 240 is set to the "vertical section" of another part of the flow path 200 (eg, the front end of the expansion part). It was made smaller than the vertical width (b') of (50) ". As a result, the area of the “vertical section 40” of the extension 240 may be the same as or similar to the area of the “vertical section 50” of the other portion of the flow path 200 (see FIG. 9).

To this end, the protrusion 141 may be positioned on the bottom surface of the extension 240 . That is, the protrusion 141 may be located at a position corresponding to the extension 240 in the “vertical direction” of the lower cover 140 . As a result, while maintaining the heights of the first sidewall 150 and the second sidewall 160 , the vertical width b of the expansion part 240 may be increased.

The protruding part 141 may protrude from the bottom surface of the expansion part 240 in a direction where the lower plate 110 is located. The protruding height of the protruding portion 141 may increase and then decrease along the moving direction of the cooling material. The “vertical cross section” of the protrusion 141 may be a square shape (see FIG. 8(A)). The area of the "vertical section" of the protrusion 141 may increase and then decrease along the direction of movement of the cooling material. The “horizontal section” of the protrusion 141 may be convexly curved in the direction in which the lower plate 110 is located (see (B) of FIG. 8 ). The area of the “horizontal section” of the protrusion 141 may decrease from the center to the edge of the horizontal width a of the extension 240 .

The discharge part 250 may include an inclined part 251 . The inclined portion 251 may be positioned between the discharge portion 250 and the discharge port 500 . The inclined portion 251 may be located at the most downstream of the discharge portion 250 . In the inclined portion 251, the bottom surface of the flow path 200 may be inclined upward toward the downstream side.

The plurality of electronic components 300 may be located in the inner space of the housing 100 . The plurality of electronic components 300 may be disposed on the lower plate 110 (cooling plate). A passage 200 through which a cooling material flows is formed under the lower plate 110 (cooling plate) to cool heat generated from the plurality of electronic components 300 .

The plurality of electronic components 300 may include a main board 310 , a plurality of heating elements 320 , a first auxiliary board 330 and a second auxiliary board 340 .

The main board 320 may be disposed on the lower plate 110 . The main board 320 may be spaced upward from the lower plate 110 . Various electronic component chips may be mounted on the main board 320 . Circuits connecting various electronic component chips may be formed on the main board 320 . The main substrate 320 may be electrically connected to the first auxiliary substrate 330 and the second auxiliary substrate 340 .

One of the plurality of heating elements 320 may overlap the expansion part 240 in a “vertical direction”. The maximum “horizontal area” 10 of the expansion unit 240 may be 90% or more of the maximum “horizontal area” 20 of one of the plurality of heating elements 320 overlapping in the “vertical direction”. In the maximum “horizontal area” 10 of the expansion unit 240, an area 30 overlapping in the “vertical direction” with one of the plurality of heating elements 320 overlapping in the “vertical direction” may be 30% or more. In this case, among the plurality of heating elements 320 , a heating element overlapping the expansion part 240 in a “vertical direction” may be a diode module 325 .

The plurality of heating elements 320 include an inductor 321, a transformer 322, a zero-voltage-switching (ZVS) inductor 323, a switching module 324, a diode module 325, and a conductive member 326. can include

The inductor 321 , the transformer 322 , and the zero-voltage-switching (ZVS) inductor 323 may be disposed on the upper surface of the lower plate 110 . The switching module 324 may be mounted on the first auxiliary board 330 . The diode module 325 may be mounted on the second auxiliary substrate 340 . The conductive member 326 may be a member electrically connecting the transformer 322 and the diode module 325.

The inductor 321 , the transformer 322 , and the zero-voltage-switching (ZVS) inductor 323 may be electrically connected to the main substrate 320 by a conductive member. The main substrate 320 may not be disposed at a portion of the lower substrate 110 where the inductor 321, the transformer 322, and the zero-voltage-switching (ZVS) inductor 323 are disposed.

The inductor 321 may perform functions of smoothing current and reducing ripple current. Furthermore, the current flow can be made continuous. That is, the inductor 321 may perform a rectifying function. The inductor 321 may be disposed to correspond to the inlet 210 of the flow path 200 in a “vertical direction”.

The transformer 322 may perform a function of stepping up or stepping down the current. The transformer 322 may perform a function of converting power. The transformer 322 may be disposed to correspond to the first curved portion 220 of the flow path 200 in a “vertical direction”.

A zero-voltage-switching (ZVS) inductor 323 may control a light load. That is, it may be an auxiliary inductor for improving light load efficiency. A zero-voltage-switching (ZVS) inductor 323 may be disposed to correspond to the front end of the second curve part 230 in a “vertical direction”.

The switching module 324 may control On/Off of current. Furthermore, the switching module 324 may be integrated with the transformer 322 to reduce and output the input DC. The switching module 324 may be disposed to correspond to the second curve part 230 in a “vertical direction”.

The diode module 325 can control the direction of current. That is, the diode module 325 may perform a function of moving current in a specific direction. The diode module 325 may be disposed to correspond to the expansion part 240 in a “vertical direction”.

The conductive member 326 may electrically connect the transformer 322 and the diode module 325.

The first auxiliary substrate 330 and the second auxiliary substrate 340 may be positioned below the main substrate 310 . The first auxiliary substrate 330 and the second auxiliary substrate 340 may be spaced downward from the main substrate 310 . The first auxiliary substrate 330 and the second auxiliary substrate 340 may be disposed between the lower substrate 110 and the main substrate 310 . The first auxiliary substrate 330 and the second auxiliary substrate 340 may be electrically connected to the main substrate 310 by separate conductive members. A switching module 324 may be mounted on the first auxiliary board 330 . A diode module 325 may be mounted on the second auxiliary substrate 340 .

The inlet 400 and the outlet 500 may be located on one side of the side plate 120 of the housing 100 . An external cooling material may flow into the flow path 200 through the inlet 400 . Cooling material may be discharged from the flow path 200 through the outlet 500 .

The terminal 600 may be located on one side of the side plate 120 of the housing 100 . The terminal 600 may be located between the inlet 400 and the outlet 500 . An external power supply may be electrically connected to the terminal 600 . That is, an external current may be supplied to the plurality of electronic components 300 through the terminal 600 .

One or more connectors 700 may be located on the other side of the side plate 120 of the housing 100 . One or more connectors 700 may be located opposite inlet 400 and outlet 500 . An external electronic component (eg, an electric motor) may be electrically connected to one or more connectors 700 .

<Second Embodiment>

Hereinafter, a DC-DC converter 2001 of a comparative example of the second embodiment will be described with reference to the drawings. 10 is a perspective view showing a DC-DC converter of a comparative example of the second embodiment.

The DC-DC converter 2001 of this comparative example may be a DC-DC converter used in a vehicle. Taking an electric vehicle as an example, the DC-DC converter 2001 receives current from an external power supply device (lithium ion battery, etc.), boosts or lowers the voltage, and supplies it to an external electronic device (motor, etc.) to It can play a role in controlling the number of revolutions. The DC-DC converter 2001 may include a case 2010, a conversion unit 2020, an inductor unit 2030, a bus bar (not shown), and an external terminal 2050.

The case 2010 may be an external member of the DC-DC converter 2001. An internal space is formed in the case 2001 to accommodate the conversion unit 2020, the inductor unit 2030, and a bus bar (not shown). In addition, the first, second, third, fourth, and fifth case terminals 2010a, 2010b, 2010c, 2010d, and 2010e and an external terminal 2050 may be formed in the case 2010.

The conversion unit 2020 may include a primary coil 2021 and a secondary coil 2022 spaced apart from the primary coil 2021 . Current supplied from an external power supply device flows through the primary coil 2021 , and the secondary coil 2022 electromagnetically interacts with the primary coil 2021 to output the converted current. The primary coil 2021 may be electrically connected to the first and second case terminals 2010a and 2010b to receive current from an external power supply device. The secondary coil 2022 may be electrically connected to the third, fourth, and fifth case terminals 2010c, 2010d, and 2010e. In this case, the third case terminal 2010c and the fourth case terminal 2010d may be electrically connected to the diode module. Accordingly, the secondary coil 2022 may be electrically connected to the diode module. Also, the fifth case terminal 2010e may be electrically connected to the inductor unit 2030 .

The inductor unit 2030 may include an inductor coil 2031 . The inductor coil 2031 may have a three-dimensional spiral shape. Such a solid helix is also called a "screw helix". A start portion of the inductor coil 2031 may be electrically connected to the fifth case terminal 2010e. Also, the beginning of the inductor coil 2031 may be electrically connected to the secondary coil 2022 at the fifth case terminal 2010e. An end of the inductor coil 2031 may be electrically connected to an external terminal 2050 through a bus bar (not shown). The conversion current output from the secondary coil 2022 may flow through the inductor coil 2031 . Furthermore, the inductor coil 2031 may rectify the converted current output from the secondary coil 2022 . In addition, the current rectified in the inductor coil 2031 may be supplied to the external terminal 2050.

In summary of the foregoing, when current is supplied from an external power supply device to the primary coil 2021, a boosted or dropped converted current may be output from the secondary coil 2022. The converted current output from the secondary coil 2022 may be rectified by the inductor coil 2031 . The rectified current may be supplied to an external electronic device (eg, a motor) through the external terminal 2050 . In this case, the secondary coil 2022 may be electrically connected to one side of the external terminal 2050 through the third case terminal 2010c. In addition, the secondary coil 2022 may be electrically connected to the other side of the external terminal 2050 through the fifth case terminal 2010e, the inductor coil 2031, and the bus bar 2040. Accordingly, a circuit in which the current generated in the secondary coil 2022 is rectified in the inductor coil 2031 and supplied to an external electronic device may be formed. As a result, the external electronic device connected to the external terminal 2050 can be supplied with electricity converted in the secondary coil 2022 and rectified in the inductor coil 2031 .

In the comparative example of the second embodiment, the secondary coil 2022, the inductor coil 2031, and the bus bar (not shown, bus bar) are electrically connected to each other, but each is manufactured as a single member. After that, the secondary coil 2022 and the inductor coil 2031 may be electrically connected by being bolted at the fifth case terminal 2010e. In addition, the inductor coil 2031 and a bus bar (not shown) may also be electrically connected by bolting. During this fastening process, a gap may occur, which leads to a decrease in electrical characteristics and an increase in contact resistance, thereby lowering the conversion efficiency of the DC-DC converter 2001. In addition, in order to manufacture each of the secondary coil 2022 and the inductor coil 2031, complicated manufacturing processes such as sheet press cutting, bolt hole punching, bending, and forging are required. As a result, there is a problem that is not good in terms of production efficiency.

Hereinafter, the DC-DC converter 2100 of the second embodiment will be described with reference to the drawings. 11 is a perspective view showing a DC-DC converter of the second embodiment, and FIG. 12 is a perspective view showing a state in which coil modules of the second embodiment are mounted on first and second magnetic cores (primary coils omitted). 13 is a perspective view showing the coil module of the second embodiment (the primary coil is omitted).

The DC-DC converter 2100 of the second embodiment may include a case 2110, a conversion unit 2120, an inductor unit 2130, a bus bar 2140, and a first external terminal 2150. can Among them, the secondary coil 2122 of the conversion unit 2120, the inductor coil 2131 of the first and second terminals 2123 and 2124 and the inductor unit 2130, the third terminal 2132 and the bus bar 2140 ) may be referred to as a "coil module". Among the "coil modules," the first, second, and third terminals 2123, 2124, and 2132 and the bus bar 2140 are conductive members for electrical connection and may be omitted due to design requirements. Among the "coil modules", the secondary coil 2122, the first and second terminals 2123 and 2124, the inductor coil 2131, the third terminal 2132, and the bus bar 2140 are integrally manufactured by casting. can That is, among the "coil module", the secondary coil 2122, the first and second terminals 2123 and 2124, the inductor coil 2131, the third terminal 2132, and the bus bar 2140 may be integrally formed. there is.

In summary, the DC-DC converter 2100 of the second embodiment has a secondary coil 2122, an inductor coil 2131, and a bus bar 2140 compared to the DC-DC converter 2010 of the comparative example. There may be a difference that is made integrally by "casting". That is, the secondary coil 2122, the inductor coil 2131, and the bus bar 2140 may be integrally formed. Therefore, complicated processes such as sheet press cutting, bolt hole punching, bending, and forging for manufacturing the secondary coil 2122 and the inductor coil 2131 can be omitted. In addition, bolt fastening for connecting the secondary coil 2122 and the inductor coil 2131 may be omitted. In addition, bolt fastening for connection between the inductor coil 2131 and the bus bar 2140 may be omitted (as a result, the fifth case terminal 2010e of the comparative example for bolt fastening may also be omitted). Since such an integrated coil module does not require bolt fastening, there is no gap that may occur due to bolt fastening. As a result, the above-described bolt fastening problem does not occur, and the conversion efficiency of the DC-DC converter 2100 can be increased.

The case 2110 may be an external member of the DC-DC converter 2100 . An internal space is formed in the case 2110 to accommodate the conversion unit 2120, the inductor unit 2130, and the bus bar 2140. Also, first, second, and third case terminals 2110a, 2110b, and 2110c and a first external terminal 2150 may be formed in the case 2110.

The converter 2120 may receive current from an external power supply. In addition, the conversion unit 2120 may convert and output an external current. The conversion unit 2120 may include a primary coil 2121, a secondary coil 2122, a first terminal 2123, a second terminal 2124, and a first magnetic core 2125.

The primary coil 2121 may receive current from an external power supply. The primary coil 2121 has a three-dimensional spiral shape, and a starting portion of the spiral growth may be electrically connected to the first case terminal 2100a by a conductive member. An end portion of the spiral growth of the primary coil 2121 may be electrically connected to the second case terminal 2100b through a conductive line. External power devices may be electrically connected to the first and second case terminals 2100a and 2100b. As a result, the current supplied from the external power supply may flow through the primary coil 2121 . In this embodiment, the primary coil 2121 is described as having a three-dimensional spiral shape having a curve, but the three-dimensional spiral shape of the primary coil 2121 is not limited thereto.

The secondary coil 2122 may be a component of a "coil module". The secondary coil 2122 may be disposed to be spaced apart from the primary coil 2121 . The secondary coil 2122 may be disposed above the primary coil 2121 . The secondary coil 2122 may electromagnetically interact with the primary coil 2121 . In the secondary coil 2122, a current is induced by the current of the primary coil 2121, so that an induced current may be generated. The induced current generated in the secondary coil 2122 may be a current flowing through the primary coil 2121 that is boosted or stepped down.

The secondary coil 2122 may have a shape in which a plate including upper and lower surfaces forms an open ring. A starting portion (one end) of the secondary coil 2122 may be extended from the first terminal 2123 . Also, the end (other end) of the secondary coil 2122 may be connected to the second terminal 2124. That is, one end of the secondary coil 2122 may be electrically connected to the first terminal 2123, and the other end of the secondary coil 2122 may be electrically connected to the second terminal 2124. The secondary coil 2122 and the first and second terminals 2123 and 2124 may be integrally formed. However, the shape of the secondary coil 2122 is not limited to the aforementioned ring shape. For example, the secondary coil 2122 may be vertically or horizontally spaced apart from the primary coil 2121 in a three-dimensional spiral shape. Also, the secondary coil 2122 may be interleaved with the primary coil 2121 spaced apart in a three-dimensional spiral shape. In this case, the primary and secondary coils 2121 and 2122 may form one double solid helix.

The first terminal 2123 may be a component of a “coil module”. The first terminal 2123 may be a member for electrically connecting the secondary coil 2122 to an external terminal. The first terminal 2123 may be a plate-shaped conductive member. The first terminal 2123 may extend from top to bottom (vertical direction). One end of the first terminal 2123 may be located at the top. The other end of the first terminal 2123 may be located at the bottom. One end of the first terminal 123 may be bent or bent in a vertical direction from the beginning of the secondary coil 2122 and extended. The other end of the first terminal 2123 may be extended by being bent or bent in a horizontal direction, and then divided into first and second terminal portions 2123a and 2123b to be described later. As described above, the first terminal 2123 may include at least one of a bent portion and a curved portion. In this case, the bent or curved angle of the bent portion or curved portion may be a right angle.

One end of the first terminal 2123 may be electrically connected to the beginning of the secondary coil 2122 . The other end of the first terminal 2123 may be divided into a first terminal part 2123a and a second terminal part 2123b. The first terminal unit 2123a may be electrically connected to the third case terminal 2100c by fastening with bolts. Accordingly, a hole for fastening a bolt may be formed in the first terminal portion 2123a. The second terminal unit 2123b may be electrically connected to the fourth case terminal 2110d by fastening with bolts. Accordingly, a hole for fastening a bolt may be formed in the second terminal portion 2123b. The third case terminal 2110c and the fourth case terminal 2100c may be electrically connected to a diode module (not shown). Accordingly, the secondary coil 2122 may be electrically connected to the diode module through the first terminal 2123.

The second terminal 2124 may be a component of a "coil module". The second terminal 2124 may extend from the secondary coil 2122 . The second terminal 2124 may be a member for electrically connecting the secondary coil 2122 and the inductor coil 2131 to each other. The second terminal 2124 may be a plate-shaped conductive member. The second terminal 2124 may extend from top to bottom (vertical direction) and then extend in the direction of the inductor coil 2131 (horizontal direction). One end of the second terminal 2124 may be bent or bent in a vertical direction from the end of the secondary coil 2122 and extended. A middle portion of the second terminal 2124 may be bent or bent in the direction of the inductor coil 2131 (horizontal direction) and extended. The other end of the second terminal 2124 may be connected to the beginning of the inductor coil 2131. As described above, the second terminal 2124 may include at least one of a bent portion and a curved portion. In this case, the bent or curved angle of the bent portion or curved portion may be a right angle.

One end of the second terminal 2124 may be electrically connected to an end of the secondary coil 2122 . The other end of the second terminal 2124 may be electrically connected to the beginning of the inductor coil 2131. In summary of the foregoing, current generated in the secondary coil 2122 may be supplied to the inductor coil 2131 through the second terminal 2124 .

A primary coil 2121 and a secondary coil 2122 may be disposed in the first magnetic core 2125 . The first magnetic core 2125 may be a ferromagnetic member that collects magnetic field lines of the primary coil 2121 and the secondary coil 2122 to increase the intensity of the magnetic field. The first magnetic core 2125 may include a first bobbin part 2125a and a first support part 2125b. The first support part 2125b has a block shape with an inner space formed in the center, a first bobbin part 2125a is formed in the inner space, and can support the primary coil 2121. A primary coil 2121 and a secondary coil 2122 may be wound around the first bobbin unit 2125a. An outer surface of the first magnetic core 2125 may be coated with an insulator. The first magnetic core 2125 may have various shapes according to design requirements.

The inductor unit 2130 may rectify the current generated by the conversion unit 2120 . The inductor unit 2130 may include an inductor coil 2131 , a third terminal 2132 and a second magnetic core 2133 .

The inductor coil 2131 may be a component of a "coil module". The inductor coil 2131 may receive conversion current from the secondary coil 2122 . The inductor coil 2131 may rectify the converted current. The inductor coil 2131 may be connected to the first external terminal 2150 to supply rectified current.

The inductor coil 2131 may have a shape in which a plate including upper and lower surfaces grows in a three-dimensional spiral. That is, the inductor coil 2131 has a three-dimensional spiral shape, and the beginning (lower portion) of the spiral growth may be electrically connected to the secondary coil 2122 through the second terminal 2124. That is, the inductor coil 2131 may extend from the other end of the second terminal 2124 . An end portion (upper portion) of the spiral growth of the inductor coil 2131 may be electrically connected to the first external terminal 2150 by the bus bar 2140 . In this embodiment, the inductor coil 2131 is described as having a three-dimensional spiral shape having a curve, but the three-dimensional spiral shape of the inductor coil 2131 is not limited thereto.

The third terminal 2132 may be a component of a "coil module". The third terminal 2132 may be a member for electrically connecting the inductor coil 2131 to an external terminal. The third terminal 2132 may be a plate-shaped conductive member. The third terminal 2132 may extend from top to bottom (vertical direction). One end of the third terminal 2132 may be located at the top. The other end of the third terminal 2132 may be located at the bottom. One end of the third terminal 2132 may be bent or bent in a horizontal direction of the inductor coil 2131 (a direction opposite to a horizontal spiral growth direction) at an end of the inductor coil 2131 . After that, one end of the third terminal 2132 may be bent or bent in a vertical direction (from top to bottom) to be extended. The other end of the third terminal 2132 may be extended by being bent or bent in a horizontal direction (towards the bus bar 2140), and then connected to the bus bar 2140. As described above, the third terminal 2132 may include at least one of a bent portion and a curved portion. In this case, the bent or curved angle of the bent portion or curved portion may be a right angle.

One end of the third terminal 2132 may be electrically connected to an end of the inductor coil 2131 . The other end of the third terminal 2132 may be electrically connected to the bus bar 2140. Accordingly, the inductor coil 2131 may be electrically connected to the bus bar 2140 through the third terminal 2132. Although described later, since the bus bar 2140 is electrically connected to the external terminal 2150, the inductor coil 2131 can be electrically connected to the external terminal 2150 through the third terminal 2132 and the bus bar 2140. there is.

An inductor coil 2131 may be disposed on the second magnetic core 2133 . The second magnetic core 2133 may be a ferromagnetic member that collects the magnetic field lines of the inductor coil 2131 and increases the strength of the magnetic field. The second magnetic core 2133 may include a second bobbin part 2133a and a second support part 2133b. The first support part 2133b has a block shape with an inner space formed in the center, a second bobbin part 2133a is formed in the inner space, and can support the inductor coil 2131. An inductor coil 2131 may be wound around the second bobbin unit 2133a. An outer surface of the second magnetic core 2133 may be coated with an insulator. The second magnetic core 2133 may have various shapes according to design requirements.

The bus bar 2140 may be a component of a "coil module". The bus bar 2140 may have a long plate shape extending toward the external terminal 2150 . One end of the bus bar 2140 may be electrically connected to the other end of the third terminal 2132 . The other end of the bus bar 2140 may be electrically connected to the first external terminal 2150 . In this case, the other end of the bus bar 2140 and the first external terminal 2150 may be bolted together. To this end, a third terminal portion 2140a may be formed at the other end of the bus bar 2140 . Furthermore, a bolt hole may be formed in the third terminal portion 2140a. Accordingly, the rectified current of the inductor coil 2131 may be supplied to the external terminal 2150 through the third terminal 2132 and the bus bar 2140.

The external terminal 2150 may be connected to an external electronic device (eg, a vehicle motor). An external electronic device may be connected to the external terminal 2150 to receive current. Therefore, the external electronic device can receive the current converted in the secondary coil 2122 and rectified in the inductor coil 2131. That is, a rectified conversion current converted to a rated voltage through the secondary coil 2122 and noise filtered through the inductor coil 2131 may be supplied to the external electronic device.

Current can flow in both directions through the first terminal 2123, the secondary coil 2122, the second terminal 2124, the inductor coil 2131, the third terminal 2132, and the bus bar 2140 described above. Therefore, for example, when an electric vehicle drives downhill and an external electronic device (motor) generates current like a generator, the first terminal 2123, the second terminal 2124, the inductor coil 2131, and the third It may be supplied to the secondary coil 122 through the terminal 2132 and the bus bar 2140. In this case, an induced current is generated in the primary coil 2121, and the external power supply device (lithium ion battery) can be charged.

As described above, in the "coil module" of the second embodiment, at least one of the first terminal 2123, the second terminal 2124, and the third terminal 2132 includes at least one of a bent portion or a bent portion. can do. This is so that the "coil module" has a compact and stable support structure.

On the other hand, the plate constituting the "coil module" for the vehicle is a flat and long plate including an upper surface and a lower surface. This is because it must have a large resistance value to cover the electric capacitance supplied to various electronic parts of the vehicle. However, in the case of forming the bent or curved part by bending and molding as in the comparative example, the bent or curved part is inevitably worn, lost, or distorted due to the shape of the plate and the nature of the molding process. This is undesirable because the electrical characteristics and durability of the "coil module" decrease.

However, since the first terminal 2123, the second terminal 2124, and the third terminal 2132 of the "coil module" of the second embodiment are formed by "casting", the shape set in the design stage due to the nature of the molding process A bent portion or a curved portion may be formed. Therefore, the "coil module" of the second embodiment can have a compact and stable support structure, and at the same time, electrical characteristics and durability can be improved.

Hereinafter, a modification of the second embodiment will be described with reference to the drawings. 14 is a perspective view showing a state in which coil modules of a modification of the second embodiment are mounted on first and second magnetic cores, and FIG. 15 is an exploded perspective view showing a coil module of a modification of the second embodiment.

The modification of this second embodiment has a difference from this second embodiment in "coil module". The modified example of the second embodiment has substantially the same technical idea as the second embodiment except for the above differences. Therefore, the second embodiment can be analogically applied to a modified example of the second embodiment. Hereinafter, descriptions of parts having substantially the same technical concept as the second embodiment are omitted.

The "coil module" in the modified example of the second embodiment may include a conversion unit, an inductor unit, and a bus bar. In this case, the conversion unit includes a primary coil (2121-1), a secondary coil (2122-1), a tertiary coil (2122-2), a first terminal (2123-1), a second terminal (2124-1), It may include a third terminal 2124-2 and a fourth terminal 2123-2. The inductor unit may include an inductor coil 2131-1, a fifth terminal 2133-1, and a sixth terminal 2132-1. In the modified example of the second embodiment, the biggest feature is that there are a total of two coils, a secondary coil and a tertiary coil, through which the induced current flows by the primary coil.

The primary coil 2121-1 may receive current from an external power supply. The primary coil 2121-1 has a three-dimensional spiral shape, and a start portion of the spiral growth may be electrically connected to the first case terminal 2100a by a conductive member. An end portion of the spiral growth of the primary coil 2121-1 may be electrically connected to the second case terminal 2100b through a conductive line.

The secondary coil 2122-1 may be spaced apart from the primary coil 2121-1. The secondary coil 2122-1 may be positioned above the primary coil 2121-1. The secondary coil 2122-1 may have electromagnetic interaction with the primary coil 2121-1. In the secondary coil 2122-1, a current is induced by the current of the primary coil 212-11, so that an induced current may be generated. The induced current generated in the secondary coil 2122-1 may be a current flowing through the primary coil 2121-1 that is boosted or stepped down.

The secondary coil 2122-1 may have a shape in which a plate including upper and lower surfaces forms an open ring. A start portion (one end) of the secondary coil 2122-1 may be extended from the first terminal 2123-1. Also, the end (other end) of the secondary coil 2122-1 may be connected to the second terminal 2124-1. That is, one end of the secondary coil 2122-1 may be electrically connected to the first terminal 2123-1, and the other end of the secondary coil 2122-1 may be electrically connected to the second terminal 2124-1. can be connected The secondary coil 2122-1 and the first and second terminals 2123-1 and 2124-1 may be integrally formed. However, the shape of the secondary coil 2122-1 is not limited to the aforementioned ring shape. For example, the secondary coil 2122-1 may be vertically or horizontally spaced apart from the primary coil 2121-1 in a three-dimensional spiral shape. In addition, the secondary coil 2122-1 may be interleaved in a three-dimensional spiral shape while being spaced apart from the primary coil 2121-1. In this case, the primary and secondary coils 2121-1 and 2122-1 may form one double-dimensional spiral.

The first terminal 2123-1 may be a member for electrically connecting the secondary coil 2122-1 to a terminal. The first terminal 2123-1 may be a plate-shaped conductive member. The first terminal 2123-1 may be extended from top to bottom (vertical direction). One end of the first terminal 2123-1 may be located at the top. The other end of the first terminal 2123-1 may be located at the bottom. One end of the first terminal 123-1 may be bent or bent in a vertical direction from the beginning of the secondary coil 2122-1 and extended. The other end of the first terminal 2123-1 may be extended by being bent or bent in a horizontal direction, and then divided into first and second terminal portions 2123-1a and 2123-1b to be described later. As described above, the first terminal 2123-1 may include at least one of a bent portion and a curved portion. In this case, the bent or curved angle of the bent portion or curved portion may be a right angle.

One end of the first terminal 2123-1 may be electrically connected to the beginning of the secondary coil 2122-1. The other end of the first terminal 2123-1 may be divided into a first terminal part 2123-1a and a second terminal part 2123-1b. The first terminal unit 2123-1a may be electrically connected to the third case terminal 2100c by fastening with bolts. Accordingly, a hole for fastening a bolt may be formed in the first terminal unit 2123-1a. The second terminal unit 2123-1b may be electrically connected to the fourth case terminal 2110d by fastening with bolts. Therefore, a hole for fastening a bolt may be formed in the second terminal portion 2123-1b. The third case terminal 2110c and the fourth case terminal 2100c may be electrically connected to a diode module (not shown). Accordingly, the secondary coil 2122-1 may be electrically connected to the diode module through the first terminal 2123-1.

The second terminal 2124-1 may extend from the secondary coil 2122-1. The second terminal 2124-1 may be a member for electrically connecting the secondary coil 2122-1 and the inductor coil 2131-1. The second terminal 2124-1 may be a plate-shaped conductive member. The second terminal 2124-1 may extend horizontally after extending from top to bottom (vertical direction). One end of the second terminal 2124-1 may be bent or bent in a vertical direction from the end of the secondary coil 2122-1 and extended. A middle portion of the second terminal 2124-1 may be extended downward. The other end of the second terminal 2124-1 may be in the form of a plate bent or curved in a horizontal direction at a middle portion of the second terminal 2124-1. A third terminal unit 2124-1a may be formed at the other end of the second terminal 2124-1. The third terminal unit 2124-1a may be electrically connected to the seventh terminal unit 2133-1a by fastening with bolts. A hole for fastening a bolt may be formed in the third terminal unit 2124-1a. Accordingly, the second terminal 2124-1 and the fifth terminal 2133-1 can be electrically connected, and eventually the secondary coil 2122-1 and the inductor coil 2131-1 are electrically connected. can As described above, the second terminal 2124-1 may include at least one of a bent portion and a curved portion. In this case, the bent or curved angle of the bent portion or curved portion may be a right angle.

The tertiary coil 2122-2 may be spaced apart from the primary coil 2121-1. The tertiary coil 2122-2 may be located below the primary coil 2121-1. The tertiary coil 2122-2 may have electromagnetic interaction with the primary coil 2121-1. In the tertiary coil 2122-2, a current is induced by the current of the primary coil 212-11, so that an induced current may be generated. The induced current generated in the tertiary coil 2122-2 may be a current flowing through the primary coil 2121-1 that is boosted or stepped down.

The tertiary coil 2122-2 may have a shape in which a plate including upper and lower surfaces forms an open ring. A starting portion (one end) of the tertiary coil 2122-2 may be extended from the third terminal 2123-2. Also, the end (other end) of the tertiary coil 2122-2 may be connected to the fourth terminal 2124-2. That is, one end of the tertiary coil 2122-2 may be electrically connected to the fourth terminal 2123-2, and the other end of the tertiary coil 2122-2 may be electrically connected to the third terminal 2124-2. can be connected The tertiary coil 2122-2 and the third and fourth terminals 2123-2 and 2124-2 may be integrally formed. However, the shape of the tertiary coil 2122-2 is not limited to the aforementioned ring shape. For example, the tertiary coil 2122-2 may be vertically or horizontally spaced apart from the primary coil 2121-1 in a three-dimensional spiral shape. In addition, the tertiary coil 2122-2 may be interleaved with the primary coil 2121-1 in a three-dimensional spiral form. In this case, the 1st and 3rd coils 2121-1 and 2122-2 may form one double dimensional helix.

The third terminal 2123-2 may be a member for electrically connecting the tertiary coil 2122-2 to the diode module. The third terminal 2123-2 may be a plate-shaped conductive member. The third terminal 2123-2 may be horizontally extended from one end (start portion) of the tertiary coil 2122-2. The other end of the third terminal 2123-2 may be divided into fourth and fifth terminal portions 2123-2a and 2123-2b to be described later.

One end of the third terminal 2123-2 may be electrically connected to the beginning of the tertiary coil 2122-2. The other end of the third terminal 2123-2 may be divided into a fourth terminal part 2123-2a and a fifth terminal part 2123-2b. The fourth terminal unit 2123-2a and the fifth terminal unit 2123-2b may be electrically connected to the diode module by bolt fastening. Accordingly, holes for fastening bolts may be formed in the fourth terminal unit 2123-1a and the fifth terminal unit 2123-2b. Accordingly, the tertiary coil 2122-2 may be electrically connected to the diode module through the third terminal 2123-2.

The fourth terminal 2124-2 may extend from the tertiary coil 2122-2. The fourth terminal 2124-2 may be a member for electrically connecting the tertiary coil 2122-2 and the inductor coil 2131-1. The fourth terminal 2124-2 may be a plate-shaped conductive member. The fourth terminal 2124-2 may extend horizontally from the other end of the tertiary coil 2122-2. One end of the fourth terminal 2124-2 may be located at an end of the tertiary coil 2122-2. A sixth terminal unit 2124-2a may be formed at the other end of the fourth terminal 2124-2. The sixth terminal unit 2124-2a may be electrically connected to the seventh terminal unit 2133-1a by fastening with bolts. In this case, the third terminal portion 2124-1a, the sixth terminal portion 2124-2a, and the seventh terminal portion 2133-1a may overlap each other in the vertical direction. A hole for fastening a bolt may be formed in the sixth terminal unit 2124-2a. Accordingly, the fourth terminal 2124-2 and the fifth terminal 2133-1 can be electrically connected, and eventually the tertiary coil 2122-2 and the inductor coil 2131-1 are electrically connected. can

The inductor coil 2131-1 may receive conversion current from the secondary coil 2122-1 and the tertiary coil 2122-2. The inductor coil 2131-1 may rectify the converted current. The inductor coil 2131-1 may be connected to the external terminal 2150 to supply rectified current.

The inductor coil 2131-1 may have a shape in which a plate including upper and lower surfaces grows in a three-dimensional spiral. That is, the inductor coil 2131-1 may have a three-dimensional spiral shape. The beginning (lower part) of the spiral growth of the inductor coil 2131-1 may extend from the fifth terminal 2133-1. A sixth terminal 2132-1 may be connected to a spiral growth end (upper portion) of the inductor coil 2131-1. The bus bar 2140-1 may extend from the sixth terminal 2132-1. The inductor coil 2131-1, the fifth terminal 2133-1, the sixth terminal 2132-1, and the bus bar 2140-1 may be integrally formed.

A seventh terminal unit 2133-1a may be formed at one end of the fifth terminal 2133-1. As described above, the seventh terminal unit 2133-1a may be electrically connected to the third terminal unit 2124-1a by bolt fastening. Also, the seventh terminal unit 2133-1a may be electrically connected to the sixth terminal unit 2124-2a by bolt fastening. Accordingly, the inductor coil 2131-1 may be electrically connected to the secondary coil 2122-1 and the tertiary coil 2122-2. The induced current generated in the secondary coil 2122-1 and the tertiary coil 2122-2 may be rectified in the inductor coil 2131-2. The other end of the fifth terminal 2133-1 extends from one end of the fifth terminal 2133-1 in a horizontal direction (the direction in which the inductor coil is located), and the beginning of the spiral growth of the inductor coil 2131-2. can be connected

One end of the sixth terminal 2132-1 may be connected to an end of the spiral growth of the inductor coil 2131-2. The other end of the sixth terminal 2132-1 may be connected to one end of the bus bar 2140-1. The other end of the bus bar 2140-1 may be electrically connected to the external terminal 2150. An eighth terminal portion 2140-1a to be electrically connected to the external terminal 2150 may be formed at the other end of the bus bar 2140-1. A bolt fastening hole for fixing and electrical connection may be formed in the eighth terminal unit 2140-1a. The inductor coil 2131-2 may be electrically connected to the external terminal 2150 through the bus bar 2140-1. As a result, the induced current generated in the secondary coil (2122-1) and the tertiary coil (2122-2) is rectified in the inductor coil (2131-2) and then passes through the bus bar (2140-1) to an external electronic device. can be forwarded to

<Third Embodiment>

Hereinafter, the DC-DC converter 3001 of the third embodiment will be described with reference to the drawings. 16 is a perspective view showing the DC-DC converter of the third embodiment with the first cover removed, FIG. 17 is a cut perspective view showing the DC-DC converter of the third embodiment, and FIG. 18 is the third embodiment. It is a cross-sectional conceptual diagram showing a main board, an auxiliary board, and a cooling plate of an example DC-DC converter, and FIG. 19 is a conceptual diagram showing a signal bridge of a DC-DC converter according to the third embodiment.

The DC-DC converter 3001 of the third embodiment may be a DC-DC converter used in vehicles. Taking an electric vehicle as an example, the DC-DC converter 3001 receives current from an external power supply device (lithium ion battery, etc.), boosts or lowers the voltage, and supplies it to an external electronic device (motor, etc.) It can play a role in controlling the number of revolutions. As shown in FIG. 17, a DC-DC converter 3001 includes a housing 3010, a first substrate 3020, a second substrate 3030, a connecting member 3040, a coil unit 3050, and a bus bar 3060. ) may be included. The DC-DC converter 3001 may be referred to as an “electronic parts assembly”. In this case, auxiliary components such as the coil unit 3050 and the bus bar 3060 may be omitted. In this case, the "electronic component assembly" of the third embodiment may extend the scope of rights not only to the DC-DC converter 3001 but also to various electronic component assemblies. In addition, the first substrate 3020 is a substrate provided to cool a device having a high calorific value and may be referred to as an “auxiliary substrate”. Since the first substrate 3020 has a structure completely different from that of a general substrate (a cooling plate replaces the role of a base of a general substrate), the term "substrate" may be omitted. The second substrate 3030 may be referred to as a "main substrate" as a substrate provided to cool a device having a low calorific value. If the name of the first substrate 3020 is omitted, the second substrate 3030 may be referred to as a "substrate".

Hereinafter, the housing 3010 will be described with reference to FIGS. 16 and 17 . The housing 3010 is an external member of the DC-DC converter 3001 and may have a hollow block shape. The housing 3010 includes a main body 3011, a cooling plate 3012, a first cover 3013, a second cover 3014, an inlet 3015, an outlet 3016, a cooling passage guide 3017, a cooling passage ( 3018) and heat dissipation fins 3019. The inside of the housing 3010 may be divided into a first region 3002 located at the bottom and a second region 3003 located at the top by the cooling plate 3012 . The first region 3002 may be a cooling unit through which cooling fluid flows, and the second region 3003 may be an electronic component unit where electronic components are disposed. The cooling plate 3012 of the housing 3010, the first cover 3013, the second cover 3014, the inlet 3015, the outlet 3016, the cooling passage guide 3017, the cooling passage 3018, and the radiating fins ( 3019) may be integrally formed. The material of the housing 3010 may be metal (eg, aluminum).

The main body 3011 may have a hollow shape formed by side surfaces and having open lower and upper ends. A first cover 3013 may be disposed at a lower end of the main body 3011 . In this case, the first cover 3013 may cover and close the opening of the lower end of the main body 3011 . A second cover 3014 may be disposed at an upper end of the main body 3011 . In this case, the second cover 3013 may cover and close the opening at the upper end of the main body 3011 . As a result, an inner space of the housing 3010 may be formed by the main body 3011 and the first and second covers 3012 and 3013 . Furthermore, a cooling plate 3012 may be disposed inside the main body 3011 in the form of a horizontal partition wall. That is, the cooling plate 3012 may be formed over the entire horizontal section of the inside of the body 3011 . The cooling plate 3012 may divide or divide the inside of the main body 3011 into a first region 3002 and a second region 3003 . In this case, the first area 3002 and the second area 3003 may be separate areas blocked from each other. A first region 3002 may be disposed below the cooling plate 3012 , and a second region 3003 may be disposed above the cooling plate 3012 .

An inlet 3015 for introducing the cooling fluid and an outlet 3016 for discharging the cooling fluid flowing along the first region 3002 are formed on the side of the main body 3011 corresponding to the first region 3002. can

The first region 3002 is a region through which cooling fluid flows, and may perform a cooling function. A cooling passage guide 3017 may be disposed on a lower surface of the cooling plate 3012 . In this case, the cooling passage guide 3017 may have various shapes, and the cooling passage 3018 may be formed by the cooling passage guide 3017 . A plurality of heat dissipation fins 3019 may be formed in the cooling passage 3018 to increase cooling efficiency. In this case, the plurality of heat dissipation fins 3019 may have a protrusion shape extending downward from the lower surface of the cooling plate 3012 .

The second region 3003 is a place where electronic components are disposed and can perform an electronic control function. To this end, the first substrate 3020, the second substrate 3030, the connection member 3040, the coil unit 3050, and the bus bar 3060 may be disposed in the second region 3003.

Hereinafter, the first substrate 3020 will be described with reference to FIG. 18 . The first substrate 3020 may be a metal printed circuit board (MPCB) having high thermal conductivity. The first substrate 3020 is a substrate for mounting a device having a high calorific value and may be referred to as an “auxiliary substrate”. That is, the element mounted on the first substrate 3020 has a higher calorific value than the element mounted on the second substrate 3030 described below. A device mounted on the first substrate 3020 may also be referred to as an "active device". Here, the "active element" may be an element having the ability to generate electrical energy. For example, a transistor or an IC controller may correspond to this.

The first substrate 3020 may be disposed on an upper surface of the cooling plate 3012 . In this case, the lower surface of the first substrate 3020 may contact the upper surface of the cooling plate 3012 . As a result, the cooling efficiency of the first substrate 3020 may be higher than that of the second substrate 3030 described later. Since the lower surface of the first substrate 3020 is in direct contact with the cooling plate 3012 , devices may be mounted only on the upper surface of the first substrate 3020 . The first substrate 3020 may be disposed to be spaced downward from the second substrate 3030 . That is, the first substrate 3020 may be spaced apart from the second substrate 3030 and stacked. As a result, in the third embodiment, it is possible to increase the mounting rate of elements in the same space. An area of the first substrate 3020 may be smaller than that of the second substrate 3030 . The first substrate 3020 may be electrically connected to the second substrate 3030 . The first substrate 3020 may be electrically connected to the second substrate 3030 through the connecting member 3040 .

The first substrate 3020 may include an adhesive layer 3021 , a metal layer 3022 , an insulating layer 3023 , and a pattern layer 3024 . The first substrate 3020 may have a form in which an adhesive layer 3021 , a metal layer 3022 , an insulating layer 3023 , and a pattern layer 3024 are sequentially stacked. The first substrate 3020 may include only the adhesive layer 3021 , the metal layer 3022 , the insulating layer 3023 , and the pattern layer 3024 .

The adhesive layer 3021 is a thermally conductive adhesive and may be disposed on the cooling plate 3012 . In this case, the adhesive layer 3021 may be directly coated on the upper surface of the cooling plate 3012 . That is, the adhesive layer 3021 may adhere to the upper surface of the cooling plate 3012 . For example, the adhesive layer 3021 may be thermal grease having high thermal conductivity. As a result, it is possible to efficiently cool the heat generated from the high calorific value element mounted on the first substrate 3020 . Furthermore, the adhesive layer 3021 may perform a function of combining the metal layer 3022 and the cooling plate 3012 .

A metal layer 3022 may be disposed on the adhesive layer 3021 . That is, the metal layer 3022 may be disposed on the adhesive layer 3021 . The metal layer 3022 may be in the form of a metal plate. A lower surface of the metal layer 3022 may be combined with an upper surface of the adhesive layer 3021 . The material of the metal layer 3022 may include copper or aluminum having high thermal conductivity. Due to the metal layer 3022, the first substrate 3020 may be referred to as a "metal printed circuit board". Cooling efficiency of the first substrate 3020 may be increased by the metal layer 3022 . In addition, the metal layer 3022 may serve as a support for the first substrate 3020 . The insulating layer 3023 and the pattern layer 3024 may be supported by the metal layer 3022 .

An insulating layer 3023 may be disposed on the metal layer 3022 . That is, the insulating layer 3023 may be disposed on the metal layer 3022 . The insulating layer 3023 may be in the form of a plate made of an insulating material. The insulating layer 3023 may be a layer for forming the pattern layer 3024 .

A pattern layer 3024 may be disposed on the insulating layer 3023 . The pattern layer 3024 may be coated on the insulating layer 3023 . The pattern layer 3024 may be a layer forming a circuit of the first substrate 3020 . Accordingly, the pattern layer 3024 may be various circuit patterns made of an electrically conductive material. An “active element” may be disposed on the pattern layer 3024 . In this case, the "active element" may include an upper surface and a lower surface. The lower surface of the “active element” may be soldered to the pattern layer 3024. Accordingly, the lower surface of the “active element” may face the cooling plate 3012. In addition, the “active element” may be electrically connected to the pattern layer 3024 by SMT (Surface Mount Technology). For example, the "active element" may be electrically connected to the pattern layer 3024 by a plurality of wires.

As described above, the first substrate 3020 is completely different from a general substrate in that it is composed of materials directly coated on the cooling plate 3012 using the cooling plate 3012 as a base. Therefore, the name of the first substrate 3020 may be omitted. In this case, the first substrate 3020 may be referred to as "adhesive layer 3021, metal layer 3022, insulating layer 3023, and pattern layer 3024".

Hereinafter, the second substrate 3030 will be described with reference to FIG. 18 . The second substrate 3030 may be a printed circuit board (PCB). The second substrate 3030 is a substrate for mounting a device having a low calorific value and may be referred to as a “main substrate”. That is, the element mounted on the second substrate 3030 generates less heat than the element mounted on the first substrate 3020 . Devices mounted on the second substrate 3030 may also be referred to as “passive devices”. Here, the "passive element" may be an element that transmits or absorbs electrical energy but does not have an active function such as conversion of electrical energy.

The second substrate 3030 may be spaced apart from the cooling plate 3012 upwardly. To this end, a member (not shown) for supporting the second substrate 3030 may be disposed on an inner surface of the second region 3003 of the main body 3011 . A first substrate 3020 may be disposed between the second substrate 3030 and the cooling plate 3012 . That is, the second substrate 3030 and the first substrate 3020 may be spaced apart and overlap each other. As a result, the cooling efficiency of the second substrate 3030 may be lower than that of the first substrate 3020 . That is, the second substrate 3030 may be spaced apart from the first substrate 3020 and stacked. In this case, the area of the second substrate 3030 may be larger than that of the first substrate 3020 . The second substrate 3030 may be electrically connected to the first substrate 3020 . The second substrate 3030 may be electrically connected to the first substrate 3020 through the connecting member 3040 . The second substrate 3030 may be spaced apart from the coil unit 3050 to be described later. In this case, the coil unit 3050 may pass through the first substrate 3020 . Since the coil unit 3050 is supported by the cooling plate 3012 and the first substrate 3020 is spaced apart from the cooling plate 3012, the first substrate 3020 and the coil unit 3050 overlap each other. A hole is formed in the first board 3020 to allow the coil unit 3050 to pass therethrough (see FIG. 16). "Passive elements" can be mounted on both the upper and lower surfaces of the first board 3020. there is. As a result, in the third embodiment, it is possible to increase the mounting rate of elements in the same space.

The connecting member 3040 may electrically connect the first substrate 3020 and the second substrate 3030 . The connecting member 3040 may be a fastening member using a press fit method. Also, the connecting member 3040 may be a signal bridge. In addition, the connecting member 3040 may be a flexible printed circuit board (FPCB). That is, the connection member 3040 may have various shapes. Hereinafter, a case in which the connecting member 3040 is a signal bridge will be described with reference to FIG. 20 .

As shown in (a) of FIG. 19, the connecting member 3040 is bent or bent by the first conducting member 3041 forming a part of the pattern layer 3024 and the first conducting member 3041 to form a second substrate. A second conductive member 3042 electrically connected to 3030 may be included. In this case, the first conductive member 3041 may be a pattern of the pattern layer 3024. In addition, the second conductive member 3042 may extend upward from the first conductive member 3041 and be electrically connected to the second substrate 3030 . In this case, the upper end of the second conductive member 3042 may be soldered or coupled to the second substrate 3030 by pin bonding.

As shown in (b) of FIG. 19, the connecting member 3040 is bent or bent by the first conductive member 3041 electrically connected to the pattern layer 3024 and the first conductive member 3041 to form a second substrate. A second conductive member 3042 electrically connected to 3030 may be included. In this case, the lower surface of the first conductive member 3041 may be electrically connected to the pattern layer 3024 . The lower surface of the first conductive member 3041 may be soldered to the pattern layer 3024 or coupled by pin bonding. In addition, the second conductive member 3042 may extend upward from the first conductive member 3041 and be electrically connected to the second substrate 3030 . The upper end of the second conductive member 3042 may be soldered or coupled to the second substrate 3030 by pin bonding.

As shown in (c) of FIG. 19, the connection member 3040 is electrically connected to the pattern layer 3024, and the first conductive member 3041 in the form of a plate and the first conductive member 3041 are located at the center of the first conductive member 3041. A second conductive member 3042 extending toward the second substrate 3030 and electrically connected to the second substrate 3030 may be included. In this case, the lower surface of the first conductive member 3041 may be electrically connected to the pattern layer 3024 . The lower surface of the first conductive member 3041 may be soldered to the pattern layer 3024 or coupled by pin bonding. In addition, the second conductive member 3042 may extend upward from the first conductive member 3041 and be electrically connected to the second substrate 3030 . The upper end of the second conductive member 3042 may be soldered or coupled to the second substrate 3030 by pin bonding.

As shown in (d) of FIG. 19, the connecting member 3040 forms a part of the pattern layer 3024, and includes the first conducting member 3041 and the first conducting member having a groove formed in the center in the form of a plate. A protrusion accommodated in the groove of 3041 may be formed, and a second conductive member 3042 extending from the protrusion toward the second substrate 3030 and electrically connected to the second substrate 3030 may be included. In this case, the first conductive member 3041 may be a pattern of the pattern layer 3024 . In addition, a protrusion corresponding to the groove of the first conductive member 3041 may be formed at the lower end of the second conductive member 3042 and soldered thereto. As a result, the second conductive member 3042 can be electrically connected to the first conductive member 3041 and supported by the first conductive member 3041 at the same time. In addition, the second conductive member 3042 may extend upward from the first conductive member 3041 and be electrically connected to the second substrate 3030 . The upper end of the second conductive member 3042 may be soldered or coupled to the second substrate 3030 by pin bonding.

It has been described above that the “active element” is disposed on the first substrate 3020 and the “passive element” is disposed on the second substrate 3030. However, the third embodiment is not limited thereto. "Active element" and "passive element" can be combined to be referred to as "electronic element", and "electronic element" is the first substrate 3020 and the second substrate 3030 without distinction between "active element" and "passive element". may be placed in

Hereinafter, the coil unit 3050 and the bus bar 3060 will be described with reference to FIG. 16 . The coil unit 3050 may be supported by the cooling plate 3012 . In this case, the lower portion of the coil unit 3050 may be coupled to the upper surface of the cooling plate 3012 . In addition, the coil unit 3050 may be disposed to be spaced apart from the second substrate 3030 . Also, the coil unit 3050 may be disposed overlapping with the second substrate 3030 . In this case, the coil unit 3050 may pass through the second substrate 3030 . The number of coil units 3050 may be plural. The coil unit 3050 may be a transcoil unit or an inductor coil unit. When the coil unit 3050 is a transcoil unit, the coil unit 3050 may convert a voltage of power supplied from the outside. When the coil unit 3050 is an inductor coil unit, the coil unit 3050 may rectify the converted power. The bus bar 3050 may be electrically connected to the coil unit 3050 to output converted and/or rectified power to the outside.

Hereinafter, a DC-DC converter 1 of a modification of the third embodiment will be described with reference to the drawings. 20 is a cross-sectional conceptual view showing a main substrate, an auxiliary substrate, and a cooling plate of a DC-DC converter according to a modified example of the third embodiment. A modified example of the third embodiment has the same technical idea as the third embodiment, except for the first substrate 3020. Hereinafter, descriptions of substantially the same technical ideas as those of the third embodiment will be omitted.

The first substrate of the modified example of the third embodiment may include an insulating layer 3023 and a pattern layer 3024 . The first substrate may have a form in which an insulating layer 3023 and a pattern layer 3024 are sequentially stacked. The first substrate may include only the insulating layer 3023 and the pattern layer 3024 .

That is, in the modified example of the third embodiment, the adhesive layer 3021 and the metal layer 3022 may be omitted. Instead, the cooling plate 3012 may perform the function of the metal layer 3022. Accordingly, the adhesive layer 3021 for bonding the metal layer 3022 and the cooling plate 3012 may also be omitted.

In more detail, the insulating layer 3023 of the first substrate may be directly coated on the upper surface of the cooling plate 3012 . That is, the insulating layer 3023 and the upper surface of the cooling plate 3012 may contact each other. In this case, the cooling plate 3012 is made of a metal material and may perform a function of supporting the metal layer 3022 according to the third embodiment. That is, the first substrate of the modified example of the third embodiment can produce the same effect compared to the first substrate 3020 of the third embodiment. At the same time, since the adhesive layer 3021 and the metal layer 3022 are removed, the cooling efficiency can be increased, and the size is reduced in the vertical direction, so there is a problem of securing space in the vertical direction caused by mounting the device on the lower surface of the second substrate 3030. It can also be solved, and there are advantages in terms of manufacturing process and cost due to the simplification of the member.

In the above, even though all the components constituting the embodiment of the present invention have been described as being combined or operated as one, the present invention is not necessarily limited to these embodiments. That is, within the scope of the object of the present invention, all of the components may be selectively combined with one or more to operate. In addition, terms such as "comprise", "comprise" or "having" described above mean that the corresponding component may be present unless otherwise stated, and thus exclude other components. It should be construed as being able to further include other components. All terms, including technical or scientific terms, have the same meaning as commonly understood by a person of ordinary skill in the art to which the present invention belongs, unless defined otherwise. Commonly used terms, such as terms defined in a dictionary, should be interpreted as being consistent with the contextual meaning of the related art, and unless explicitly defined in the present invention, they are not interpreted in an ideal or excessively formal meaning.

The above description is merely an example of the technical idea of the present invention, and various modifications and variations can be made to those skilled in the art without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are not intended to limit the technical spirit of the present invention, but to explain, and the scope of the technical spirit of the present invention is not limited by these embodiments. The protection scope of the present invention should be construed according to the claims below, and all technical ideas within the equivalent range should be construed as being included in the scope of the present invention.

Claims (14)

a housing containing a cooling plate;
a cooling passage disposed on one side of the cooling plate;
a first substrate disposed on the other side of the cooling plate;
a second substrate spaced apart from the first substrate; and
A signal bridge electrically connecting the first substrate and the second substrate,
The first substrate is a metal printed circuit board (MPCB),
The first substrate,
a metal layer disposed to face the cooling plate;
an insulating layer having one surface facing the other surface of the metal layer;
a pattern layer having one surface facing the other surface of the insulating layer; and
Including an electric element disposed on the pattern layer,
The lower end of the signal bridge is connected to the pattern layer,
The heating value of the element mounted on the first substrate is higher than the heating value of the element mounted on the second substrate.
According to claim 1,
The electrical element includes an upper surface and a lower surface,
The lower surface of the electric element is soldered to the pattern layer to face the cooling plate.
According to claim 1,
The cooling plate is integrally formed with the housing DC-DC converter.
According to claim 1,
A plurality of heat dissipation fins are formed on one surface of the cooling plate, and the heat dissipation fins have a protrusion shape extending to one side of the DC-DC converter.
According to claim 1,
The DC-DC converter wherein the first substrate and the second substrate are electrically connected by soldering of a signal bridge or by a press-fit method.
According to claim 5,
The signal bridge,
a first conducting member forming a part of the pattern layer; and
and a second conductive member bent or bent from the first conductive member and electrically connected to the second substrate.
According to claim 5,
The signal bridge,
a first conductive member electrically connected to the pattern layer; and
and a second conductive member bent or bent from the first conductive member and electrically connected to the second substrate.
According to claim 5,
The signal bridge,
a first conductive member electrically connected to the pattern layer and in the form of a plate; and
and a second conductive member extending from the center of the first conductive member toward the second substrate and electrically connected to the second substrate.
According to claim 5,
The signal bridge,
a first conducting member forming a part of the pattern layer and having a groove formed in the center in the form of a plate; and
A DC-DC converter comprising: a second conducting member having a protrusion received in the groove of the first conducting member, extending from the protruding part toward the second substrate and electrically connected to the second substrate.
According to claim 1,
One end and the other end of the housing are open,
the housing,
a first cover covering the opening of the one end; and
The DC-DC converter further comprises a second cover covering the opening of the other end.
According to claim 1,
The insulating layer is coated on the other surface of the cooling plate DC-DC converter.
a housing including a first area where a flow path of a cooling fluid is formed, a second area separated from the first area where electronic components are disposed, and a cooling plate disposed between the first and second areas;
a main substrate spaced apart from the cooling plate and disposed in the second region;
an auxiliary substrate in contact with the cooling plate and spaced apart from the main substrate; and
A signal bridge electrically connecting the main board and the auxiliary board,
The auxiliary board is a metal printed circuit board (MPCB, Metal Printed Circuit Board),
The auxiliary substrate,
a metal layer disposed to face the cooling plate;
an insulating layer having one surface facing the other surface of the metal layer;
a pattern layer having one surface facing the other surface of the insulating layer; and
Including an electric element disposed on the pattern layer,
The lower end of the signal bridge is connected to the pattern layer,
The heating value of the element mounted on the auxiliary board is higher than the heating value of the element mounted on the main board DC-DC converter.
According to claim 1,
The cross-sectional area of the first substrate is smaller than the cross-sectional area of the second substrate DC-DC converter.
According to claim 1,
An active element is mounted on the upper surface of the first substrate,
A DC-DC converter in which passive elements are mounted on the upper or lower surface of the second substrate.

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