WO2018093195A1

WO2018093195A1 - Dc-dc converter

Info

Publication number: WO2018093195A1
Application number: PCT/KR2017/013090
Authority: WO
Inventors: 김지훈; 김근호; 나현민; 정재후; 배석; 염재훈
Original assignee: 엘지이노텍 주식회사
Priority date: 2016-11-17
Filing date: 2017-11-17
Publication date: 2018-05-24

Abstract

The present embodiment relates to a DC-DC converter comprising: a housing; a plurality of electronic components disposed inside the housing; and a flow path disposed on a lower substrate of the housing. The flow path comprises an expanding portion. The horizontal width of the expanding portion is greater than the horizontal width of a flow path on the front end of the expanding portion, and the vertical width of the expanding portion is less than the vertical width of the flow path on the front end of the expanding portion. The differential between the part in which the surface area of the vertical cross section of the flow path is the biggest and the part in which the surface area of the vertical cross section of the flow path is the smallest is 10% or less.

Description

DC-DC converter

This embodiment relates to a DC-DC converter.

The contents described below provide background information on the present embodiment, but do not describe the prior art.

Along with the emergence of eco-friendly vehicles using electric power, it is required to reduce the weight and size of automotive electronic components. A vehicle DC-DC converter is a device for controlling a DC voltage in a vehicle.

In particular, the electric vehicle serves to change the voltage of the current produced by the battery to supply the motor. In addition, when the electric vehicle goes down the slope, the motor becomes a generator to charge the battery. In this case, it changes the voltage of the current produced by the motor and supplies the battery.

Various electronic components are disposed in the DC-DC converter, and the cooling efficiency of the heating module needs to be improved for various reasons such as the light weight of the DC-DC converter and the implementation of a compact structure.

On the other hand, the main configuration of the DC-DC converter, the primary coil through which the current supplied from the outside flows, the secondary coil and the secondary coil in which the induced current is generated by the current flowing through the primary coil and the current converted by being electrically connected The inductor coil controls the frequency of More specifically, the conversion of the current is made by the electromagnetic interaction of the primary and secondary coils, and the converted current is filtered through the inductor coil and the noise frequency is filtered out to the external device via a busbar. Supplied. In general, secondary coils, inductor coils, and busbars are made of each single member through complex processes such as sheet press cutting, bolt hole punching, bending, forging, and the like, and are coupled and electrically connected by bolts. However, such a manufacturing process is too complicated, and furthermore, there is a problem that the gap may be caused by the fastening of the bolts or the warping of the material. In particular, the gap between the secondary coil-inductor coil and the inductor coil-bus bar causes problems such as heat generation due to an increase in contact resistance as well as a decrease in electrical characteristics. In addition, since the secondary coil, the inductor coil, and the bus bar are made of a single member, there is a problem in that the size and weight of the DC-DC converter increase.

Meanwhile, the DC-DC converter may include a cooling plate disposed in the housing and the horizontal partition wall to partition the housing into the first region and the second region. In addition, a cooling flow path is formed in the first region, and cooling water flows, and an electronic component (for example, a substrate on which various elements are mounted) is disposed in the second region. That is, the first region performs the function of cooling the electronic component by the cooling unit, and the second region performs the electronic control function of converting the voltage of the external power source into the electronic component. Recently, due to the request of a vehicle manufacturer and the arrival of smart and hybrid vehicles, research on reducing the size of the DC-DC converter and increasing the cooling efficiency of the electronic component part is being conducted.

In the first embodiment, to provide a DC-DC converter with improved cooling efficiency of the heat generating module.

In the second embodiment, the secondary coil, the inductor coil, and the bus bar are integrally formed to simplify the manufacturing process, improve conversion efficiency, and include a DC module including a coil module having a compact structure. To provide a DC converter.

In the third embodiment, it is possible to reduce the size and to provide a DC-DC converter having high cooling efficiency.

The DC-DC converter of the first embodiment includes a housing; A plurality of electronic components disposed in the housing; A flow path disposed on the lower plate of the housing, wherein the flow path includes an expansion part, a width of the expansion part is greater than a width of the flow path of the front end of the expansion part, and a vertical width of the expansion part is a flow path of the front end of the expansion part The difference between the largest portion and the smallest portion of the cross section smaller than the vertical width of the cross section perpendicular to the moving direction of the cooling material of the flow path may be within 10%.

The plurality of electronic components may include a plurality of heat generating elements, and one of the plurality of heat generating elements may be disposed to correspond to the extension part.

One of the plurality of heat generating elements may overlap the expansion part in a vertical direction.

An area overlapping with one of the plurality of heating elements in a vertical direction in a maximum horizontal cross section of the extension may be 30% or more.

The maximum horizontal cross section of the extension may be 90% or more of the maximum horizontal cross section of one of the plurality of heating elements.

A protrusion protruding in the lower plate direction may be located on the bottom surface of the extension part.

The protruding height of the protrusion may increase and decrease along the moving direction of the cooling material.

The protrusion may have a vertical cross section, and the area of the vertical cross section of the protrusion may increase and decrease along a moving direction of the cooling material.

The horizontal cross section of the protrusion may have a convex curvature toward the lower plate, and the area of the horizontal cross section of the protrusion may decrease from the center of the horizontal width of the flow path toward the edge.

The area of the vertical cross section of the flow path may be the same along the direction of movement of the cooling material.

The plurality of electronic components may include a plurality of heat generating elements, the plurality of the heat generating elements may include a diode module, and the diode module may be disposed to correspond to the extension in a vertical direction.

The flow passage further includes an inlet portion through which the cooling material moves sequentially, a first curve portion, a second curve portion, and a discharge portion, wherein the inflow portion and the discharge portion are spaced apart in the horizontal width direction of the flow passage, The first curve portion and the expansion portion may be spaced apart in the horizontal width direction of the flow path.

The inlet portion and the discharge portion are disposed in parallel to each other, the first curve portion is formed convexly convex in the direction in which the expansion portion is located, the second curve portion is the space between the first curve portion and the expansion portion is located The curvature may be formed convexly in the opposite direction.

The plurality of electronic components includes a heating element, wherein the heating element includes an inductor, a transformer, a Zero-Voltage-Switching (ZVS) inductor, a switching module, and a diode module. The transformer is disposed to correspond to the first curve portion in a vertical direction, and the Zero-Voltage-Switching (ZVS) inductor is to correspond to the front end of the second curve portion in a vertical direction. The switching module may be disposed to correspond to the second curve portion in a vertical direction, and the diode module may be disposed to correspond to the expansion portion in a vertical direction.

The inductor continuously controls the flow of current, the transformer changes the voltage of the current to control power, and the zero-voltage-switching (ZVS) inductor controls light load The switching module controls the on / off of the current, and the diode module controls the direction of the current.

The housing may include a side plate extending upward from the lower plate, and an upper cover disposed on the side plate, and the plurality of electronic components may be disposed in a space formed by the lower plate, the side plate, and the upper cover.

And a connector electrically connected to an external electronic device, an inlet port through which cooling material flows into the flow path, and an outlet port through which cooling material is discharged from the flow path, wherein the connector is disposed on the side plate. The outlet may be located opposite the connector and disposed on the side plate.

The housing includes a first side wall extending downward from the lower plate, a second side wall extending downward from the lower plate and spaced apart from the first side wall, and a lower cover disposed below the first side wall and the second side wall. The flow path may be formed by the lower plate, the first side wall, the second side wall, and the lower cover.

The ceiling surface of the flow path may be located on the lower plate, the bottom surface of the flow path may be located on the lower cover, and the side surfaces of the flow path may be located on the first side wall and the second side wall.

The vertical width of the flow path may be defined by the vertical shortest distance between the lower plate and the lower cover, and the horizontal width of the flow path may be defined by the horizontal shortest distance between the first side wall and the second side wall. .

The DC-DC converter of the second embodiment includes a primary coil; A secondary coil in which an induced current is generated by the primary coil; A first terminal and a second terminal extending from the secondary coil; An inductor coil connected to the second terminal to rectify a current; And a third terminal extending from the inductor coil, wherein the first terminal, the primary coil, the second terminal, the inductor coil, and the third terminal may be integrally formed.

The secondary coil has a form in which a plate including an upper surface and a lower surface is formed to have an open ring, one end of which is connected to the first terminal, and the other end of which may be connected to the second terminal.

The inductor coil may have a shape in which a plate including an upper surface and a lower surface is grown in three-dimensional spiral.

The inductor coil may have an angular solid spiral shape including a plurality of corner parts.

At least one or more of the first terminal, the second terminal, and the third terminal may include at least one of a bent portion and a curved portion.

A current may flow in the first terminal, the secondary coil, the second terminal, the inductor coil, and the third terminal in both directions.

The method may further include a first magnetic core in which the secondary coil is disposed and a second magnetic core in which the inductor coil is disposed.

Further comprising a bus bar extending from the third terminal, wherein the first terminal, the secondary coil, the second terminal, the inductor coil, the third terminal and the bus bar (bus bar) It can be formed integrally.

The DC-DC converter of the second embodiment includes a primary coil; A secondary coil and a tertiary coil in which induced current is generated by the primary coil; A first terminal and a second terminal extending from the secondary coil; A third terminal and a fourth terminal extending from the tertiary coil; A fifth terminal connected to the second terminal and the fourth terminal; An inductor coil extending from the fifth terminal to rectify current; A sixth terminal extending from the inductor coil; And a bus bar extending from the sixth terminal, wherein the secondary coil, the first terminal, and the second terminal are integrally formed, and the tertiary coil, the third terminal, and the fourth terminal are integrally formed. The fifth terminal, the inductor coil, the sixth terminal, and the bus bar may be integrally formed.

The secondary coil is disposed above the primary coil, the tertiary coil is disposed below the primary coil, the secondary coil is electrically connected to the diode module by the first terminal, The car coil may be electrically connected to the diode module by the third terminal.

The DC-DC converter of the third embodiment includes a housing including a cooling plate; A cooling passage disposed on one surface of the cooling plate; An insulation layer disposed on the other surface of the cooling plate; A pattern layer disposed on the insulating layer; An electric element disposed on the pattern layer; The substrate may be spaced apart from the cooling plate and electrically connected to the pattern layer.

The electrical device may include an upper surface and a lower surface, and the lower surface of the electrical element may be soldered to the pattern layer to face the cooling plate.

The cooling plate may be integrally formed with the housing.

A plurality of heat dissipation fins are formed on one surface of the cooling plate, and the heat dissipation fins may have a protrusion shape extending to one side.

The first substrate and the second substrate may be electrically connected by soldering a signal leg or by a press fit method.

The signal bridge may include a first conductive member forming part of the pattern layer; It may include a second conductive member which is bent or bent from the first conductive member and electrically connected to the substrate.

The signal bridge may include a first conductive member electrically connected to the pattern layer; It may include a second conductive member which is bent or bent from the first conductive member and electrically connected to the substrate.

The signal leg is electrically connected to the pattern layer and has a plate-shaped first conductive member; A second conductive member may extend from the center of the first conductive member to the second substrate and electrically connected to the substrate.

The signal leg may include a first conductive member which forms a part of the pattern layer and has a groove formed at the center in the form of a plate; The protrusion may be formed in the groove of the first conductive member, and may include a second conductive member extending from the protrusion toward the substrate to be electrically connected to the substrate.

One end and the other end of the housing is opened, the housing, the first cover for covering the opening of the one end; It may further include a second cover for covering the opening of the other end.

The insulating layer may be coated on the other surface of the cooling plate.

The DC-DC converter of the third embodiment includes a first region in which a flow path of a cooling fluid is formed, and a cooling region disposed between the first region and the second region in which the electronic component is disposed separately from the first region. A housing; A main substrate spaced apart from the cooling plate and disposed in the second region; An insulation layer disposed on the cooling plate; A pattern layer disposed on the insulating layer; It may include an electrical device disposed on the pattern layer.

In the DC-DC converter of the first embodiment, since the difference in the area of the vertical cross section in all parts of the flow path is within 10%, the flow rate of the cooling material is increased and the pressure drop width is reduced to improve the cooling efficiency. Can be. Furthermore, an electronic component (eg, a diode module) having a large amount of heat generation and a large area can be matched with an expansion part (a large width and a small vertical width) of the flow path, thereby intensively cooling.

According to the second embodiment of the present invention, a secondary coil, an inductor coil, and a bus bar are integrally formed by a casting process to increase conversion efficiency, and provide a DC-DC converter including a lightweight coil module having a compact structure. .

According to the third embodiment, the size of the electronic component assembly and the converter can be reduced by increasing the mounting rate of the devices in the same space by using the stacked main substrate and the auxiliary substrate. Furthermore, the cooling efficiency can be improved by mounting an active element having a high heat generation amount on an auxiliary substrate directly contacting the cooling plate.

1 is a perspective view from above of the DC-DC converter of the first embodiment.

2 is an exploded perspective view of the upper cover in the DC-DC converter of the first embodiment.

3 is an exploded perspective view of the upper cover and the protective plate in the DC-DC converter of the first embodiment.

4 is a cross-sectional view of the DC-DC converter of the first embodiment with reference to the A-A 'line.

5 is a perspective view from below of a lower cover removed from the DC-DC converter of the first embodiment.

6 is a plan view of the lower plate removed in the DC-DC converter of the first embodiment.

7 is a plan view of the lower cover removed from the DC-DC converter of the first embodiment.

8 is a plan view and a side view showing the lower cover of the first embodiment.

FIG. 9 (1) shows the "vertical cross section" of the expansion part of this 1st Example, and FIG. 9 (2) shows the "vertical cross section" of the other part of a flow path.

10 is a perspective view showing a DC-DC converter of a comparative example of the second embodiment.

Fig. 11 is a perspective view showing the DC-DC converter of the second embodiment.

12 is a perspective view showing a state in which the coil module of the second embodiment is mounted on the first and second magnetic cores (primary coil omitted).

Fig. 13 is a perspective view showing the coil module of the second embodiment (primary coil omitted).

14 is a perspective view showing a state in which the coil module of the modification of the second embodiment is mounted on the first and second magnetic cores.

15 is an exploded perspective view showing a coil module of a modification of the second embodiment.

Fig. 16 is a perspective view showing the DC-DC converter of the third embodiment with the first cover removed.

Fig. 17 is a cutaway perspective view of the DC-DC converter of the third embodiment.

18 is a cross-sectional conceptual view showing a main board, an auxiliary board, and a cooling plate of the DC-DC converter of the third embodiment.

19 is a conceptual diagram showing the signal legs of the DC-DC converter of the third embodiment.

20 is a cross-sectional conceptual view showing a main board, an auxiliary board, and a cooling plate of a DC-DC converter according to a modification of the third embodiment.

Hereinafter, some embodiments of the present invention will be described by way of example. In describing the reference numerals in the components of each drawing, the same components are denoted by the same reference numerals as much as possible even though they are shown in different drawings. In addition, in describing the embodiments of the present invention, when it is determined that a detailed description of a related well-known configuration or function interferes with the understanding of the embodiments of the present invention, the detailed description thereof will be omitted.

In addition, in describing the components of the embodiments of the present disclosure, terms such as first, second, A, B, (a), and (b) may be used. These terms are only for distinguishing the components from other components, and the nature, order or order of the components are not limited by the terms. When a component is described as being "connected", "coupled" or "connected" to another component, the component may be directly connected, coupled or connected to the other component, but the component and its other components It is to be understood that another component may be "connected", "coupled" or "connected" between the elements.

First Embodiment

Hereinafter, "vertical direction" may mean an upper direction and / or a lower direction, and "horizontal direction" may mean one of any direction on a plane perpendicular to the "vertical direction". In addition, the "vertical direction" may be the vertical width direction of the flow path 200, and the "horizontal direction" may be the horizontal width direction of the flow path 200. Further, "vertical cross section" may mean a cross section perpendicular to the moving direction of the cooling material, and "horizontal cross section" may be a cross section perpendicular to the "vertical cross section".

Hereinafter, the DC-DC converter 1 of the first embodiment will be described with reference to the drawings. 1 is a perspective view from above of the DC-DC converter of the first embodiment, FIG. 2 is an exploded perspective view of the DC-DC converter of the first embodiment, and FIG. 3 is a DC-DC of the first embodiment. 4 is an exploded perspective view illustrating an upper cover and a protective plate of the converter, and FIG. 4 is a cross-sectional view of the DC-DC converter of the first embodiment with reference to the line A-A ', and FIG. FIG. 6 is a plan view of the lower plate removed from the DC-DC converter of the first embodiment, and FIG. 7 is a plan view from which the lower cover is removed from the DC-DC converter of the first embodiment. FIG. 8 is a plan view and a side view showing the lower cover of the first embodiment, FIG. 9 (1) shows the "vertical cross section" of the extension of the first embodiment, and FIG. 9 (2) shows another part of the flow path. The "vertical cross section" of is shown.

The DC-DC converter 1000 may be used in a vehicle. For example, the DC-DC converter 1000 receives an electric current from an external power supply device (such as a lithium ion battery) and boosts or lowers a voltage to supply an external electronic device (motor, etc.) to supply a motor. It can play a role to control the rotation speed.

The DC-DC converter 1000 includes a housing 100, a flow path 200, a plurality of electronic components 300, an inlet 400, an outlet 500, a terminal 600, and one or more connectors 700. can do.

The housing 100 may be an exterior member of the DC-DC converter 1000. The flow path 200 may be formed in the housing 100. The plurality of electronic components 300 may be accommodated in the housing 100. A plurality of electronic components 300 may be disposed therein with the lower plate 110 of the housing 100 interposed therebetween, and a flow path 200 may be disposed below. The plurality of electronic components 300 may be cooled by the cooling material flowing along the flow path 200. The housing 100 may be connected to the inlet 400, the outlet 500, the terminal 600, and one or more connectors 700. The material of the housing 100 may include a plastic material and / or a metal material.

The housing 100 may include a lower plate 110, a side plate 120, a protective plate 121, an upper cover 130, a lower cover 140, a first side wall 150, and a second side wall 160. .

The lower plate 110 may form a lower surface of the inner space of the housing 100. The lower plate 110 may have a substantially rectangular plate shape. The side plate 120 may form a side surface of the inner space of the housing 100. The side plate 120 may have a form extending upward from the edge of the lower plate 110. The housing 100 may be provided with an inner space in which the upper surface is opened by the lower plate 110 and the side plate 120. A plurality of electronic components 300 may be accommodated in the internal space of the housing 100.

One side of the side plate 120 may be located inlet 400, outlet 500 and the terminal 600. One or more connectors 700 may be located at the other side of the side plate 120. In this case, the inlet 400, the outlet 500, and the terminal 600 may be located at opposite sides of the one or more connectors 700.

The protection plate 121 may be located in an inner space of the housing 100. The protective plate 121 may be spaced apart from the main substrate 310 upwardly. The protection plate 121 may overlap at least a portion of the main substrate 310 in a vertical direction. That is, some of the upper surface of the main substrate 310 may be covered by the protective plate 121. The protection plate 121 may be a cover member for protecting a specific portion of the main substrate 310.

The upper cover 130 may be disposed on the side plate 120. The upper cover 130 and the side plate 120 may be fastened by a screw. The top cover 130 may be in the form of a substantially square plate. The inner cover of the housing 100 may be closed by the upper cover 130. The upper cover 130 may include a pattern portion 131 protruding upwardly in a grid pattern in the center thereof. The pattern unit 131 may increase the strength of the upper cover 130 to perform a function of protecting the plurality of electronic components 300 accommodated in the internal space of the housing 100. The upper cover 130 may include a flange portion 132 protruding in the horizontal direction from the edge. The flange portion 132 may have a hole in which a screw is inserted in the form of a plate.

The lower plate 110 may have a flow path 200 formed therein. The flow path 200 may be located on the bottom surface of the lower plate 110. The first side wall 150 and the second side wall 160 may be spaced apart from each other in the horizontal direction, and may extend downward from the bottom surface of the lower plate 110. The first side wall 150 and the second side wall 160 may be connected to each other at the point where the flow path 200 is connected to the inlet 400 and the outlet 500. A flow path 200 having a lower surface opened by the lower plate 110, the first side wall 150, and the second side wall 160 may be formed. The lower cover 140 may be disposed under the first side wall 150 and the second side wall 160 to close the opened lower surface.

That is, the flow path 200 may be formed by the lower surface of the lower plate 110, the inner surface of the first side wall 150, the inner surface of the second side wall 160, and the upper surface of the lower cover 140. In this case, the ceiling surface of the flow path 200 may be located on the bottom surface of the lower plate 110, and both side surfaces of the flow path 200 may be formed on the inner surface of the first side wall 150 and the inner surface of the second side wall 160. Each may be positioned, and the bottom surface of the flow path 200 may be positioned on the upper surface of the lower cover 140.

The horizontal widths a and a 'of the flow path 200 may be the "horizontal direction" shortest distance between the inner side surface of the first side wall 150 and the inner side surface of the second side wall 160. The vertical widths b and b ′ of the flow path 200 may be the “vertical direction” shortest distance between the lower surface of the lower plate 110 and the upper surface of the lower cover 140. The vertical widths a and a 'of the flow path 200 and the horizontal widths b and b' of the flow path 200 may be the vertical and horizontal sides of the “

vertical cross-sections

40 and 50” of the flow path 200. .

The cooling material flowing in the flow path 200 may absorb heat emitted from the plurality of electronic components 300. In this case, heat transfer occurs through the lower plate 110, and the plurality of electronic components 300 may be cooled.

The lower cover 140 may be in the form of a plate. The lower cover 140 may be spaced apart from the lower plate 110. The upper surface of the lower cover 140 and the lower surface of the lower plate 110 may be connected by the first side wall 150 and the second side wall 160. The lower cover 140 may include a protrusion 141 protruding upward from the upper surface (the direction in which the lower plate of the housing is located). The protrusion 141 may be positioned to correspond to the expansion part 240 of the flow path 200 in a vertical direction. Although the width a is larger on the "vertical cross-section 40" of the extension 240, the width b may be smaller. Therefore, the area of the "vertical cross section 50" at the extension 240, the front end (upstream) of the extension 240, and the rear end (downstream) of the extension 250 can be kept constant (10%). Within, see FIG. 9). As a result, it is possible to prevent the pressure difference between the cooling materials from becoming larger and the flow rate to be lowered to lower the cooling efficiency.

The lower cover 140 may be in the form of a plate. The lower cover 140 may include a first sealing part 142 and a second sealing part 143. The material of the first sealing part 142 and the second sealing part 143 may include a sealing material such as rubber. The first sealing part 142 and the second sealing part 143 may be formed to protrude downward from the lower surface of the lower cover 140. The first sealing part 142 and the second sealing part 143 may be spaced apart from each other in the "horizontal direction" (the transverse direction of the flow path).

The first sealing part 142 may overlap the first side wall 150 in the "vertical direction". The first sealing part 142 may contact the bottom surface of the first side wall 150. The first sealing part 142 may have a shape corresponding to the first side wall 150.

The second sealing part 143 may overlap the second side wall 160 in the "vertical direction". The second sealing part 143 may contact the bottom surface of the second side wall 160. The second sealing part 143 may have a shape corresponding to the second side wall 160.

The first sealing part 142 may function to close the gap between the lower cover 140 and the first side wall 150, and the second sealing part 143 may serve as the lower cover 140 and the second side wall. The function of closing the gap between the 160 may be performed.

Like the first side wall 150 and the second side wall 160, the first sealing part 142 and the second sealing part 143 are formed at the point where the flow path 200 is connected to the inlet 400 and the outlet 500. It may be connected to each other.

The lower cover 140 may be fastened to the first side wall 150 and the second side wall 160 by a screw. The lower cover 140 may include a guide hole 144. The guide protrusion 111 protruding downward from the lower plate 110 may be inserted into the guide hole 144 to guide the lower cover 140. The lower cover 140 may include a flange portion 145. A hole into which a screw is inserted may be formed in the flange portion 145 of the lower cover 140.

The flow path 200 may be formed in the housing 100. The flow path 200 may be located at one side of the housing 100. The flow path 200 may be located under the lower plate 110 of the housing 100. Therefore, the lower plate 110 of the housing 100 may be a "cooling plate". The flow path 200 may be connected to the inlet 400. The flow path 200 may be connected to the outlet 500. The most upstream of the flow path 200 may be connected to the inlet 400 to receive a cooling material. The most downstream of the flow path 200 may be connected to the outlet 500 to discharge the cooling material. The cooling material flows along the flow path 200 and cools the heat generated by the plurality of electronic components 300. Various types of heat exchange fluids (eg, cooling water) may be used for the cooling material.

The flow path 200 may be formed by the lower plate 110, the first side wall 150, the second side wall 160, and the lower cover 140. The bottom surface of the flow path 200 may be located on the top surface of the lower cover 140. That is, the upper surface of the lower cover 140 may be the bottom surface of the flow path 200. The ceiling surface of the flow path 200 may be located on the bottom surface of the lower plate 110. That is, the lower surface of the lower plate 110 may be the ceiling surface of the flow path 200. Both side surfaces of the flow path 200 may be located on inner surfaces of the first side wall 150 and the second side wall 160, respectively. That is, inner surfaces of the first side wall 150 and the second side wall 160 may be both side surfaces of the flow path 200.

The horizontal widths a and a 'of the flow path 200 may be defined by the "horizontal" shortest distance between the inner side surface of the first side wall 150 and the inner side surface of the second side wall 160. The vertical widths b and b 'of 200 may be defined by the "vertical direction" shortest distance between the lower surface of the lower plate 110 and the upper surface of the lower cover 140. The horizontal widths a and a 'of the flow path 200 and the vertical widths b and b' of the flow path 200 may vary according to the moving direction of the cooling material. For example, the horizontal width a of the flow path 200 in the expansion part 240 is the horizontal width a 'of the front end (upstream side of the extension part) or the rear end (downstream side of the extension part) of the expansion part 240. Can be greater than In addition, the vertical width b of the flow path 200 in the expansion part 240 is larger than the vertical width b 'of the front end (upstream side of the expansion part) or the rear end (downstream side of the expansion part) of the expansion part 240. Can be small.

The flow path 200 may include an inlet part 210, a first curve part 220, a second curve part 230, an expansion part 240, and an outlet part 250. Upstream of the inlet 210 may be connected to the inlet 400. The downstream of the outlet 250 may be connected to the outlet 500. Downstream of the inlet 210 may be connected to the upstream of the first curve portion 220, downstream of the first curve portion 220 may be connected to the upstream of the second curve portion 230, the second curve portion Downstream of 230 may be connected upstream of extension 240, and downstream of extension 240 may be connected upstream of outlet 250. Therefore, the cooling material introduced from the inlet 400 moves sequentially through the inlet 210, the first curve 220, the second curve 230, the expansion 240 and the discharge 250. It may be discharged through the outlet 500.

The inlet part 210 and the outlet part 250 may be disposed adjacent to each other. The inlet 210 and the outlet 250 may be arranged in parallel to each other. The inlet 210 and the outlet 250 may be spaced apart in the "horizontal direction" (the horizontal width direction of the flow path). The first curve part 220 and the expansion part 240 may be disposed adjacent to each other. The first curve portion 220 and the expansion portion 240 may be spaced apart in the "horizontal direction" (the horizontal width direction of the flow path). The second curve portion 230 may be a point at which the advancing direction of the coolant in the flow path 200 becomes completely turn-up or U-turn. The second curve part 230 may be formed in a “U” shape. One end of the second curve portion 230 may be connected to the first curve portion 220. The other end of the second curve part 230 may be connected to the expansion part 240. The second curve portion 230 may connect the first curve portion 220 and the expansion portion 240. By the second curve part 230, the moving direction of the cooling material in the inlet part 210 and the outlet part 250 arranged in parallel may be reversed.

A curvature may be formed in the first curve portion 220 convexly in the direction in which the expansion portion 240 is located. Therefore, the shortest "horizontal direction" distance between the first curve part 220 and the expansion part 240 may be shorter than the shortest "horizontal direction" distance between the inlet part 210 and the outlet part 250. The second curve portion 230 may have a curvature formed convexly in the opposite direction in which the inlet 210 and the outlet 250 are positioned (U-shaped). The extension 240 may have a curvature formed convexly in the "horizontal direction". Therefore, the horizontal width a of the flow path 200 in the expansion part 240 may be larger than the horizontal width a 'of another portion of the flow path 200 (for example, the front end or the rear end of the expansion part 240). ).

In the first embodiment, the inlet part 210, the first curve part 220, the second curve part 230, the expansion part 240, and the discharge part 250 are formed in the flow path 200. This is to efficiently cool the 320.

The plurality of heating elements 320 includes an inductor 321, a transformer 322, a zero-voltage-switching (ZVS) inductor 323, a switching module 324, a diode module 325, and the like. The 210 may be disposed to correspond to the inductor 210 in a vertical direction (the vertical width direction of the flow path), and the first curve part 220 may be disposed to correspond to the transformer 220 in a vertical direction. The front end of the second curve portion 230 (upstream of the second curve portion) may be disposed to correspond to the ZVS inductor 323 in a vertical direction, and the second curve portion 230 may be perpendicular to the switching module 324. Direction, and the extension 240 may be disposed to correspond to the diode module 240 in a vertical direction (see FIG. 7).

In this case, the first curve portion 220 is positioned in the direction in which the expansion portion 240 is positioned to efficiently cool the transformer 322 having a larger "horizontal area" than the inductor 321 (cooling the center of the transformer). The convex curvature is formed.

In addition, the expansion unit 240 has a larger "horizontal area" than other portions of the flow path 200 in order to efficiently cool the diode module 325 having a high heat generation amount. In addition, the expansion unit 240 is disposed between the transformer 322 and the diode module 325 as well as the diode module 325 by a large "horizontal area", so that the conductive member 326 electrically connects the two. ) Can also be cooled. To this end, the maximum "horizontal area" of the extension 240 (10, the largest area of the horizontal area of the extension) is the maximum "horizontal area" of the diode module 325 (20, the largest area of the horizontal area of the diode module). 90% or more). In addition, the area 30 overlapping the diode module 325 in the "vertical direction" at the maximum "horizontal area" 10 of the expansion unit 240 may be 30% or more.

On the other hand, the flow path 200 of the first embodiment is characterized in that the "vertical cross section 50" is equal along the moving direction of the cooling material. The difference between the largest area and the smallest area of the “vertical cross section 50” of the flow path 200 may be within 10% (hereinafter). The area of the "vertical cross section 50" of the flow path 200 may be the same along the direction of movement of the cooling material. As a result, the flow rate of the cooling material can be increased and the pressure drop width can be reduced to improve the cooling efficiency.

In the expansion unit 240, the width width a of the flow path 200 increases to efficiently cool the diode module 325. As a result, the area of the "vertical cross section 40" in the extension 240 may be larger than the area of the "vertical cross section 50" of the other portion of the flow path 200. This may be arranged with the intention of this first embodiment to equalize the " vertical cross section 50 "

In order to solve this problem in the first embodiment, the vertical width b of the "vertical cross section 40" in the extension 240 is changed to the "vertical cross section of another part of the flow path 200 (for example, the front end of the extension). It was made smaller than the vertical width b 'of (50). As a result, the area of "vertical cross-section 40" of extension 240 may be the same or similar to the area of "vertical cross-section 50" of another portion of flow path 200 (see FIG. 9).

To this end, the protrusion 141 may be located on the bottom surface of the extension 240. That is, the protrusion 141 may be positioned at a position corresponding to the extension 240 in the “vertical direction” of the lower cover 140. As a result, while maintaining the height of the first side wall 150 and the second side wall 160, it is possible to increase the vertical width b of the expansion part 240.

The protrusion 141 may protrude in a direction in which the lower plate 110 is located at the bottom surface of the extension 240. The protrusion height of the protrusion 141 may increase and decrease along the moving direction of the cooling material. The “vertical cross section” of the protrusion 141 may be rectangular (see FIG. 8A). The area of the “vertical cross section” of the protrusion 141 may increase and decrease along the direction of movement of the cooling material. The “horizontal cross section” of the protrusion 141 may have a shape in which a curvature is formed convexly in the direction in which the lower plate 110 is located (see FIG. 8B). The area of the “horizontal cross section” of the protrusion 141 may decrease from the center of the horizontal width a of the extension 240 to the edge.

The discharge part 250 may include an inclined part 251. The inclined portion 251 may be located between the discharge part 250 and the discharge port 500. The inclined portion 251 may be located at the most downstream of the discharge portion 250. In the inclined portion 251, the bottom surface of the flow path 200 may be inclined upwardly toward the downstream side.

The plurality of electronic components 300 may be located in the internal space of the housing 100. The plurality of electronic components 300 may be disposed on the lower plate 110 (cooling plate). A flow path 200 through which a cooling material flows is formed under the lower plate 110 (cooling plate) to cool the heat generated by the plurality of electronic components 300.

The plurality of electronic components 300 may include a main substrate 310, a plurality of heat generating elements 320, a first auxiliary substrate 330, and a second auxiliary substrate 340.

The main substrate 320 may be disposed on the lower plate 110. The main substrate 320 may be spaced apart from the lower plate 110. Various electronic component chips may be mounted on the main substrate 320. A circuit for connecting various electronic component chips may be formed on the main substrate 320. The main substrate 320 may be electrically connected to the first auxiliary substrate 330 and the second auxiliary substrate 340.

One of the plurality of heating elements 320 may overlap the expansion unit 240 in the "vertical direction". The maximum "horizontal area" 10 of the extension 240 may be 90% or more of the maximum "horizontal area" 20 of one of the plurality of heating elements 320 overlapping in the "vertical direction". The area 30 overlapping one of the plurality of heating elements 320 overlapping in the “vertical direction” at the maximum “horizontal area” 10 of the expansion unit 240 may be 30% or more. In this case, the heating element overlapping the expansion part 240 in the "vertical direction" of the plurality of heating elements 320 may be a diode module 325.

The plurality of heating elements 320 may include an inductor 321, a transformer 322, a zero-voltage-switching (ZVS) inductor 323, a switching module 324, a diode module 325, and a conductive member 326. It may include.

The inductor 321, the transformer 322, and the zero-voltage-switching (ZVS) inductor 323 may be disposed on an upper surface of the lower plate 110. The switching module 324 may be mounted on the first auxiliary substrate 330. The diode module 325 may be mounted on the second auxiliary substrate 340. The conductive member 326 may be a member that electrically connects the transformer 322 and the diode module 325.

The inductor 321, the transformer 322, and the zero-voltage-switching (ZVS) inductor 323 may be electrically connected to the main substrate 320 by a conductive member. The main substrate 320 may not be disposed in the lower plate 110 where the inductor 321, the transformer 322, and the zero-voltage-switching (ZVS) inductor 323 are disposed.

The inductor 321 may perform a function of smoothing current and reducing ripple current. Furthermore, the current flow can be made continuously. That is, the inductor 321 may perform a rectifying function. The inductor 321 may be disposed to correspond to the inlet portion 210 of the flow path 200 in the "vertical direction".

The transformer 322 may perform a function of boosting or depressurizing a current. The transformer 322 may perform a function of converting power. The transformer 322 may be disposed to correspond to the first curve portion 220 of the flow path 200 in the "vertical direction".

Zero-Voltage-Switching (ZVS) inductor 323 may control light load. That is, it may be an auxiliary inductor for improving light load efficiency. Zero-Voltage-Switching (ZVS) inductor 323 may be disposed to correspond to the front end of the second curve portion 230 in the "vertical direction".

The switching module 324 may control on / off of the current. Furthermore, the switching module 324 may be integrated with the transformer 322 to reduce and output the input DC. The switching module 324 may be disposed to correspond to the second curve portion 230 in the "vertical direction".

The diode module 325 may control the direction of the current. That is, the diode module 325 may perform a function of moving a current in a specific direction. The diode module 325 may be disposed to correspond to the extension 240 in the "vertical direction".

The conductive member 326 may electrically connect the transformer 322 and the diode module 325.

The first auxiliary substrate 330 and the second auxiliary substrate 340 may be positioned below the main substrate 310. The first auxiliary substrate 330 and the second auxiliary substrate 340 may be spaced apart from the main substrate 310. The first auxiliary substrate 330 and the second auxiliary substrate 340 may be disposed between the lower plate 110 and the main substrate 310. The first auxiliary substrate 330 and the second auxiliary substrate 340 may be electrically connected to the main substrate 310 by separate conductive members. The switching module 324 may be mounted on the first auxiliary substrate 330. The diode module 325 may be mounted on the second auxiliary substrate 340.

The inlet 400 and the outlet 500 may be located at one side of the side plate 120 of the housing 100. External cooling material may be introduced into the flow path 200 through the inlet 400. Cooling material may be discharged from the flow path 200 through the outlet 500.

The terminal 600 may be located at one side of the side plate 120 of the housing 100. The terminal 600 may be located between the inlet 400 and the outlet 500. An external power supply device may be electrically connected to the terminal 600. That is, external current may be supplied to the plurality of electronic components 300 through the terminal 600.

One or more connectors 700 may be located at the other side of the side plate 120 of the housing 100. One or more connectors 700 may be located opposite the inlets 400 and outlets 500. External electronic components (eg, electric motors) may be electrically connected to one or more connectors 700.

Second Embodiment

The DC-DC converter 2001 of the comparative example of the second embodiment will be described below with reference to the drawings. 10 is a perspective view showing a DC-DC converter of a comparative example of the second embodiment.

The DC-DC converter 2001 of the present comparative example may be a DC-DC converter used in a vehicle. As an example of an electric vehicle, the DC-DC converter 2001 receives current from an external power supply device (such as a lithium ion battery) and boosts or lowers a voltage to supply an external electronic device (motor, etc.) to supply a motor. It can play a role to control the rotation speed. The DC-DC converter 2001 may include a case 2010, a converter 2020, an inductor 2030, a bus bar (not shown) and an external terminal 2050.

The case 2010 may be an exterior member of the DC-DC converter 2001. An internal space is formed in the case 2001 to accommodate the converter 2020, the inductor 2030, and a bus bar (not shown). In addition, the case 2010 may include first, second, third, fourth, and

fifth case terminals

2010a, 2010b, 2010c, 2010d, and 2010e and external terminals 2050.

The converter 2020 may include a primary coil 2021 and a secondary coil 2022 disposed to be spaced apart from the primary coil 2021. The primary coil 2021 may flow a current supplied from an external power supply device, and the secondary coil 2022 may output the converted current by electromagnetic interaction with the primary coil 2021. The primary coil 2021 may be electrically connected to the first and

second case terminals

2010a and 2010b to receive current from an external power supply device. The secondary coil 2022 may be electrically connected to the third, fourth and

fifth case terminals

2010c, 2010d and 2010e. In this case, the third case terminal 2010c and the fourth case terminal 2010d may be electrically connected to the diode module. Therefore, the secondary coil 2022 may be electrically connected to the diode module. In addition, the fifth case terminal 2010e may be electrically connected to the inductor unit 2030.

The inductor unit 2030 may include an inductor coil 2031. The inductor coil 2031 may have a three-dimensional spiral shape. Such solid spirals are sometimes referred to as "screw spirals". The start of the inductor coil 2031 may be electrically connected to the fifth case terminal 2010e. In addition, a start portion of the inductor coil 2031 may be electrically connected to the secondary coil 2022 at the fifth case terminal 2010e. An end portion of the inductor coil 2031 may be electrically connected to the external terminal 2050 through a bus bar (not shown). The converted current output from the secondary coil 2022 may flow in the inductor coil 2031. Furthermore, the inductor coil 2031 may rectify the converted current output from the secondary coil 2022. In addition, the current rectified by the inductor coil 2031 may be supplied to the external terminal 2050.

In summary, when the current is supplied from the external power device to the primary coil 2021, the secondary coil 2022 may output a boosted or lowered converted current. The conversion current output from the secondary coil 2022 may be rectified in the inductor coil 2031. The rectified current may be supplied to an external electronic device (eg, a motor) through the external terminal 2050. In this case, the secondary coil 2022 may be electrically connected to one side of the external terminal 2050 through the third case terminal 2010c. In addition, the secondary coil 2022 may be electrically connected to the other side of the external terminal 2050 through the fifth case terminal 2010e, the inductor coil 2031, and the bus bar 2040. Accordingly, a circuit in which the current generated by the secondary coil 2022 is rectified by the inductor coil 2031 and supplied to an external electronic device may be formed. As a result, the external electronic device connected to the external terminal 2050 may be converted in the secondary coil 2022 and supplied with rectified electricity in the inductor coil 2031.

In the comparative example of the second embodiment, the secondary coil 2022, the inductor coil 2031, and the bus bar (not shown) are electrically connected to each other, but are made of each single member. Thereafter, the secondary coil 2022 and the inductor coil 2031 may be electrically connected by being bolted to the fifth case terminal 2010e. In addition, the inductor coil 2031 and the bus bar (not shown) may also be bolted and electrically connected. In this fastening process, a gap may occur, which may lead to an increase in contact resistance as well as a decrease in electrical characteristics, thereby lowering the conversion efficiency of the DC-DC converter 2001. In addition, in order to manufacture each of the secondary coil 2022 and the inductor coil 2031, a complicated manufacturing process such as sheet press cutting, bolt hole punching, bending, forging, or the like is required. As a result, there is a problem in terms of production efficiency.

Hereinafter, the DC-DC converter 2100 of the second embodiment will be described with reference to the drawings. FIG. 11 is a perspective view showing the DC-DC converter of the second embodiment, and FIG. 12 is a perspective view showing a state in which the coil module of the second embodiment is mounted on the first and second magnetic cores (primary coil omitted). 13 is a perspective view showing the coil module of the second embodiment (primary coil omitted).

The DC-DC converter 2100 of the second embodiment may include a case 2110, a converter 2120, an inductor 2130, a bus bar 2140, and a first external terminal 2150. Can be. Among these, the secondary coil 2122 of the converter 2120, the first and

second terminals

2123 and 2124, the inductor coil 2131 of the inductor unit 2130, the third terminal 2132, and the busbar 2140. ) May be referred to as a "coil module". Among the “coil modules”, the first, second, and

third terminals

2123, 2124, and 2132 and the busbars 2140 may be omitted by design request as a conductive member for electrical connection. Among the "coil modules", the secondary coils 2122, the first and

second terminals

2123 and 2124, the inductor coils 2131, the third terminal 2132 and the busbars 2140 may be integrally manufactured by casting. Can be. That is, among the “coil modules”, the secondary coils 2122, the first and

second terminals

2123 and 2124, the inductor coils 2131, the third terminal 2132, and the busbars 2140 may be integrally formed. have.

In summary, the DC-DC converter 2100 of the second embodiment has a secondary coil 2122, an inductor coil 2131, and a bus bar 2140 compared with the DC-DC converter 2010 of the comparative example. There may be a difference that is integrally manufactured by "casting". That is, the secondary coil 2122, the inductor coil 2131, and the bus bar 2140 may be integrally formed. Therefore, a complicated process such as sheet press cutting, bolt hole punching, bending, forging, etc. for manufacturing the secondary coil 2122 and the inductor coil 2131 can be omitted. In addition, bolt fastening for connecting the secondary coil 2122 and the inductor coil 2131 may be omitted. In addition, bolt fastening for connecting the inductor coil 2131 and the bus bar 2140 may be omitted (as a result, the fifth case terminal 2010e of the comparative example for bolt fastening may also be omitted). Since the integrated coil module does not need bolt fastening, there is no gap that may be caused by bolt fastening. As a result, the above-described problem of bolting does not occur, and the conversion efficiency of the DC-DC converter 2100 can be improved.

The case 2110 may be an exterior member of the DC-DC converter 2100. An internal space is formed in the case 2110 to accommodate the converter 2120, the inductor 2130, and the bus bar 2140. In addition, first and second case terminals 2110a, 2110b, and 2110c and first external terminals 2150 may be formed in the case 2110.

The converter 2120 may receive a current from an external power device. In addition, the converter 2120 may convert an external current and output the converted current. The converter 2120 may include a primary coil 2121, a secondary coil 2122, a first terminal 2123, a second terminal 2124, and a first magnetic core 2125.

The primary coil 2121 may receive a current from an external power device. The primary coil 2121 may have a three-dimensional spiral shape, and the start of spiral growth may be electrically connected to the first case terminal 2100a by the conductive member. The end of the spiral growth of the primary coil 2121 may be electrically connected to the second case terminal 2100b by a conductive line. External power devices may be electrically connected to the first and

second case terminals

2100a and 2100b. As a result, the current supplied from the external power device may flow in the primary coil 2121. In the present exemplary embodiment, the primary coil 2121 has a three-dimensional spiral shape having a curve, but the three-dimensional spiral shape of the primary coil 2121 is not limited thereto.

Secondary coil 2122 may be a component of a "coil module". The secondary coil 2122 may be spaced apart from the primary coil 2121. The secondary coil 2122 may be disposed above the primary coil 2121. The secondary coil 2122 may have electromagnetic interaction with the primary coil 2121. In the secondary coil 2122, current may be induced by the current of the primary coil 2121 to generate an induced current. The induced current generated in the secondary coil 2122 may be a current in which the current flowing through the primary coil 2121 is stepped up or down.

The secondary coil 2122 may have a form in which a ring including an upper surface and a lower surface is opened. The beginning portion (one end) of the secondary coil 2122 may extend from the first terminal 2123. In addition, an end portion (the other end) of the secondary coil 2122 may be connected to the second terminal 2124. That is, one end of the secondary coil 2122 may be electrically connected to the first terminal 2123, and the other end of the secondary coil 2122 may be electrically connected to the second terminal 2124. The secondary coils 2122 and the first and

second terminals

2123 and 2124 may be integrally formed. However, the shape of the secondary coil 2122 is not limited to the above-described ring shape. For example, the secondary coil 2122 may be disposed in a three-dimensional spiral shape and spaced vertically or horizontally from the primary coil 2121. In addition, the secondary coil 2122 may be interleaved in a three-dimensional spiral form and spaced apart from the primary coil 2121. In this case, the primary and

secondary coils

2121 and 2122 may form one double solid helix.

The first terminal 2123 may be a component of the "coil module". The first terminal 2123 may be a member for electrically connecting the secondary coil 2122 to an external terminal. The first terminal 2123 may be a conductive member in the form of a plate. The first terminal 2123 may extend from top to bottom (vertical direction). One end of the first terminal 2123 may be located above. The other end of the first terminal 2123 may be located below. One end of the first terminal 123 may be bent or bent to extend in a vertical direction at the beginning of the secondary coil 2122. The other end of the first terminal 2123 may be bent or bent to extend in the horizontal direction and then divided into first and second

terminal parts

2123a and 2123b to be described later. As described above, the first terminal 2123 may include at least one of the bent portion and the curved portion. In this case, the bent or curved angle of the bent portion or the curved portion may be perpendicular.

One end of the first terminal 2123 may be electrically connected to the start of the secondary coil 2122. The other end of the first terminal 2123 may be divided into a first terminal portion 2123a and a second terminal portion 2123b. The first terminal portion 2123a may be electrically connected to the third case terminal 2100c by bolting. Therefore, a hole for fastening the bolt may be formed in the first terminal portion 2123a. The second terminal portion 2123b may be electrically connected to the fourth case terminal 2110d by bolting. Therefore, a hole for fastening the bolt may be formed in the second terminal portion 2123b. The third case terminal 2110c and the fourth case terminal 2100c may be electrically connected to a diode module (not shown). Therefore, the secondary coil 2122 may be electrically connected to the diode module through the first terminal 2123.

The second terminal 2124 may be a component of the "coil module". The second terminal 2124 may extend from the secondary coil 2122. The second terminal 2124 may be a member for electrically connecting the secondary coil 2122 and the inductor coil 2131. The second terminal 2124 may be a conductive member in the form of a plate. The second terminal 2124 may extend from the top to the bottom (vertical direction) and then extend in the direction of the inductor coil 2131 (horizontal direction). One end of the second terminal 2124 may be bent or bent in a vertical direction to extend from the end of the secondary coil 2122. The middle portion of the second terminal 2124 may be bent or bent to extend in the inductor coil 2131 direction (horizontal direction). The other end of the second terminal 2124 may be connected to the start of the inductor coil 2131. As described above, the second terminal 2124 may include at least one of the bent portion and the curved portion. In this case, the bent or curved angle of the bent portion or the curved portion may be perpendicular.

One end of the second terminal 2124 may be electrically connected to an end of the secondary coil 2122. The other end of the second terminal 2124 may be electrically connected to the start of the inductor coil 2131. In summary, the current generated in the secondary coil 2122 may be supplied to the inductor coil 2131 through the second terminal 2124.

The primary coil 2121 and the secondary coil 2122 may be disposed on the first magnetic core 2125. The first magnetic core 2125 may be a ferromagnetic member that collects magnetic field lines of the primary coil 2121 and the secondary coil 2122 to increase the strength of the magnetic field. The first magnetic core 2125 may include a first bobbin portion 2125a and a first support portion 2125b. The first support portion 2125b has a block shape in which an inner space is formed in the center, and a first bobbin portion 2125a is formed in the inner space, and may support the primary coil 2121. The primary coil 2121 and the secondary coil 2122 may be wound around the first bobbin portion 2125a. The outer surface of the first magnetic core 2125 may be coated by an insulator. The first magnetic core 2125 may have various forms by design request.

The inductor 2130 may rectify the current generated by the converter 2120. The inductor unit 2130 may include an inductor coil 2131, a third terminal 2132, and a second magnetic core 2133.

Inductor coil 2131 may be a component of a "coil module". The inductor coil 2131 may receive a conversion current from the secondary coil 2122. The inductor coil 2131 may rectify the converted current. The inductor coil 2131 may be connected to the first external terminal 2150 to supply a rectified current.

The inductor coil 2131 may have a shape in which a plate including an upper surface and a lower surface is grown in three-dimensional spiral. That is, the inductor coil 2131 may have a three-dimensional spiral shape, and a start portion (lower portion) of the spiral growth may be electrically connected by the secondary coil 2122 and the second terminal 2124. That is, the inductor coil 2131 may extend from the other end of the second terminal 2124. An end portion (top) of the spiral growth of the inductor coil 2131 may be electrically connected to the first external terminal 2150 by the bus bar 2140. In the present embodiment, the inductor coil 2131 has a three-dimensional spiral shape having a curve, but the three-dimensional spiral shape of the inductor coil 2131 is not limited thereto.

The third terminal 2132 may be a component of the "coil module". The third terminal 2132 may be a member for electrically connecting the inductor coil 2131 to an external terminal. The third terminal 2132 may be a conductive member in the form of a plate. The third terminal 2132 may extend from top to bottom (vertical direction). One end of the third terminal 2132 may be located above. The other end of the third terminal 2132 may be located below. One end of the third terminal 2132 may be bent or bent in the horizontal direction (the direction opposite to the horizontal spiral growth direction) of the inductor coil 2131 at the end of the inductor coil 2131. Thereafter, one end of the third terminal 2132 may be curved or bent to extend in a vertical direction (from top to bottom). The other end of the third terminal 2132 may be bent or bent to extend in a horizontal direction (direction of the bus bar 2140) and then be connected to the bus bar 2140. As described above, the third terminal 2132 may include at least one of the bent portion and the curved portion. In this case, the bent or curved angle of the bent portion or the curved portion may be perpendicular.

One end of the third terminal 2132 may be electrically connected to an end of the inductor coil 2131. The other end of the third terminal 2132 may be electrically connected to the bus bar 2140. Therefore, the inductor coil 2131 may be electrically connected to the bus bar 2140 through the third terminal 2132. As will be described later, since the bus bar 2140 is electrically connected to the external terminal 2150, the inductor coil 2131 may be electrically connected to the external terminal 2150 through the third terminal 2132 and the bus bar 2140. have.

An inductor coil 2131 may be disposed on the second magnetic core 2133. The second magnetic core 2133 may be a ferromagnetic member that collects the magnetic field lines of the inductor coil 2131 to increase the strength of the magnetic field. The second magnetic core 2133 may include a second bobbin portion 2133a and a second support portion 2133b. The first support part 2133b has a block shape in which an internal space is formed in the center thereof, and a second bobbin part 2133a is formed in the internal space and may support the inductor coil 2131. The inductor coil 2131 may be wound around the second bobbin portion 2133a. The outer surface of the second magnetic core 2133 may be coated by an insulator. The second magnetic core 2133 may have various forms by design request.

The bus bar 2140 may be a component of a "coil module". The bus bar 2140 may be in the form of an elongated plate extending toward the external terminal 2150. One end of the bus bar 2140 may be electrically connected to the other end of the third terminal 2132. The other end of the bus bar 2140 may be electrically connected to the first external terminal 2150. In this case, the other end of the bus bar 2140 and the first external terminal 2150 may be bolted. To this end, a third terminal portion 2140a may be formed at the other end of the bus bar 2140. Furthermore, a bolt hole may be formed in the third terminal portion 2140a. Therefore, the rectified current of the inductor coil 2131 may be supplied to the external terminal 2150 through the third terminal 2132 and the bus bar 2140.

The external terminal 2150 may be connected to an external electronic device (eg, a motor for a vehicle). An external electronic device may be connected to the external terminal 2150 to receive a current. Accordingly, the external electronic device may be converted by the secondary coil 2122 and receive the rectified current from the inductor coil 2131. That is, the rectified conversion current in which the external electronic device is converted to the rated voltage through the secondary coil 2122 and the noise is filtered through the inductor coil 2131 may be supplied.

The current may flow in both directions of the first terminal 2123, the secondary coil 2122, the second terminal 2124, the inductor coil 2131, the third terminal 2132, and the bus bar 2140. Thus, for example, when an electric vehicle travels downhill and an external electronic device (motor) generates a current like a generator, the first terminal 2123, the second terminal 2124, the inductor coil 2131, and the third It may be supplied to the secondary coil 122 through the terminal 2132 and the bus bar 2140. In this case, an induction current may be generated in the primary coil 2121 to charge the external power device (lithium ion battery).

As described above, the "coil module" of the second embodiment includes at least one or more of the first or

second terminals

2123, 2124, and 3132, which includes at least one of bends and bends. can do. The "coil module" is to have a compact and stable support structure.

On the other hand, the plate constituting the "coil module" for a vehicle is a flat and long plate including an upper surface and a lower surface. This is because it is necessary to have a large resistance value to cover the electric shock capacity supplied to various electronic components of the vehicle. However, when forming the bent portion or the bent portion by bending molding as in the comparative example, the bent portion or the curved portion is inevitably worn, lost or crushed due to the shape of the plate and the characteristics of the forming process. This is undesirable due to reduced electrical properties and reduced durability of the "coil module".

However, in the "coil module" of the second embodiment, the first terminal 2123, the second terminal 2124, and the third terminal 2132 are molded by "casting". The bent portion or the curved portion can be formed. Therefore, the "coil module" of the second embodiment may have a compact and stable support structure and at the same time improve electrical characteristics and durability.

Hereinafter, modifications of the second embodiment will be described with reference to the drawings. FIG. 14 is a perspective view showing a state in which the coil module of the modification of the second embodiment is mounted on the first and second magnetic cores, and FIG. 15 is an exploded perspective view showing the coil module of the modification of the second embodiment.

The modification of the second embodiment differs from the second embodiment in the "coil module". The modification of the second embodiment has the same technical spirit as that of the second embodiment except for the above difference. Therefore, the second embodiment can be analogically applied to the modification of the second embodiment. Hereinafter, parts having the same technical spirit as those of the second embodiment will be omitted.

The "coil module" in the modification of the second embodiment may include a converter, an inductor, and a bus bar. In this case, the conversion unit may be a primary coil 2121-1, a secondary coil 2122-1, a tertiary coil 2122-2, a first terminal 2123-1, a second terminal 2124-1, It may include a third terminal 2124-2 and a fourth terminal 2123-2. The inductor unit may include an inductor coil 211-1-1, a fifth terminal 2133-1, and a sixth terminal 2132-1. In the modified example of the second embodiment, the biggest characteristic point is that the coil in which the induced current flows by the primary coil has two coils, a secondary coil and a tertiary coil.

The primary coil 212-1 may receive current from an external power supply device. The primary coil 212-1 may have a three-dimensional spiral shape, and a start of spiral growth may be electrically connected to the first case terminal 2100a by the conductive member. The end of the spiral growth of the primary coil 212-1 may be electrically connected to the second case terminal 2100b by a conductive line.

The secondary coil 2122-1 may be spaced apart from the primary coil 212-1. The secondary coil 2122-1 may be positioned above the primary coil 212-1. The secondary coil 2122-1 may have electromagnetic interaction with the primary coil 212-1. In the secondary coil 2122-1, current may be induced by the current of the primary coil 212-11 to generate an induced current. The induced current generated in the secondary coil 2122-1 may be a current in which the current flowing through the primary coil 212-1 is boosted or stepped down.

The secondary coil 2122-1 may have a form in which a plate including an upper surface and a lower surface is opened. The beginning portion (one end) of the secondary coil 2122-1 may be extended from the first terminal 2123-1. In addition, an end portion (the other end) of the secondary coil 2122-1 may be connected to the second terminal 2124-1. That is, one end of the secondary coil 2122-1 may be electrically connected to the first terminal 2123-1, and the other end of the secondary coil 2122-1 is electrically connected to the second terminal 2124-1. Can be connected. The secondary coils 2122-1 and the first and second terminals 2123-1 and 2124-1 may be integrally formed. However, the shape of the secondary coil 2122-1 is not limited to the above-described ring shape. For example, the secondary coil 2122-1 may be disposed in a three-dimensional spiral shape and spaced vertically or horizontally from the primary coil 212-1. In addition, the secondary coil 2122-1 may be interleaved with a three-dimensional spiral shape and spaced apart from the primary coil 212-1. In this case, the primary and secondary coils 2121-1 and 2122-1 may form one double solid helix.

The first terminal 2123-1 may be a member for electrically connecting the secondary coil 2122-1 to the terminal. The first terminal 2123-1 may be a conductive member having a plate shape. The first terminal 2123-1 may have a shape extending from top to bottom (vertical direction). One end of the first terminal 2123-1 may be positioned at an upper portion thereof. The other end of the first terminal 2123-1 may be located below. One end of the first terminal 123-1 may be bent or bent to extend in a vertical direction at the beginning of the secondary coil 2122-1. The other end of the first terminal 2123-1 may be bent or bent to extend in the horizontal direction and then divided into first and second terminal parts 2123-1a and 2123-1b to be described later. As described above, the first terminal 2123-1 may include at least one of the bent portion and the curved portion. In this case, the bent or curved angle of the bent portion or the curved portion may be perpendicular.

One end of the first terminal 2123-1 may be electrically connected to a start portion of the secondary coil 2122-1. The other end of the first terminal 2123-1 may be divided into a first terminal portion 2123-1a and a second terminal portion 2123-1b. The first terminal portion 2123-1a may be electrically connected to the third case terminal 2100c by bolting. Therefore, a hole for fastening the bolt may be formed in the first terminal portion 2123-1a. The second terminal portion 2123-1b may be electrically connected to the fourth case terminal 2110d by bolting. Therefore, a hole for fastening the bolt may be formed in the second terminal portion 2123-1b. The third case terminal 2110c and the fourth case terminal 2100c may be electrically connected to a diode module (not shown). Accordingly, the secondary coil 2122-1 may be electrically connected to the diode module through the first terminal 2123-1.

The second terminal 2124-1 may extend from the secondary coil 2122-1. The second terminal 2124-1 may be a member for electrically connecting the secondary coil 2122-1 and the inductor coil 2213-1. The second terminal 2124-1 may be a conductive member having a plate shape. The second terminal 2124-1 may extend from top to bottom (vertical direction) and then extend in a horizontal direction. One end of the second terminal 2124-1 may be bent or bent to extend in a vertical direction at the end of the secondary coil 2122-1. The middle portion of the second terminal 2124-1 may extend downward. The other end of the second terminal 2124-1 may be in the form of a plate that is bent or curved in the horizontal direction in the middle portion of the second terminal 2124-1. A third terminal portion 2124-1a may be formed at the other end of the second terminal 2124-1. The third terminal portion 2124-1a may be electrically connected to the seventh terminal portion 2133-1a by bolting. A hole for fastening the bolt may be formed in the third terminal portion 2124-1a. As a result, the second terminal 2124-1 and the fifth terminal 2133-1 may be electrically connected, and ultimately, the secondary coil 2122-1 and the inductor coil 2131-1 may be electrically connected to each other. Can be. As described above, the second terminal 2124-1 may include at least one of the bent portion and the curved portion. In this case, the bent or curved angle of the bent portion or the curved portion may be perpendicular.

The tertiary coil 2122-2 may be spaced apart from the primary coil 212-1. The tertiary coil 2122-2 may be located below the primary coil 212-1. The tertiary coil 2122-2 may have electromagnetic interaction with the primary coil 212-1. In the tertiary coil 2122-2, current may be induced by the current of the primary coil 212-11 to generate an induced current. The induced current generated in the tertiary coil 2122-2 may be a current in which the current flowing through the primary coil 212-1 is boosted or stepped down.

The tertiary coil 2122-2 may have a form in which a plate including an upper side and a lower side is opened. The start portion (one end) of the tertiary coil 2122-2 may extend from the third terminal 2123-2. In addition, an end portion (the other end) of the tertiary coil 2122-2 may be connected to the fourth terminal 2124-2. That is, one end of the tertiary coil 2122-2 may be electrically connected to the fourth terminal 2123-2, and the other end of the tertiary coil 2122-2 is electrically connected to the third terminal 2124-2. Can be connected. The tertiary coil 2122-2 and the third and fourth terminals 2123-2 and 2124-2 may be integrally formed. However, the shape of the tertiary coil 2122-2 is not limited to the above-described ring shape. For example, the tertiary coil 2122-2 may be disposed in a three-dimensional spiral form and spaced vertically or horizontally from the primary coil 212-1. In addition, the tertiary coil 2122-2 may be interleaved in a three-dimensional spiral form and spaced apart from the primary coil 212-1. In this case, the primary and secondary coils 2121-1 and 2122-2 may form one double solid helix.

The third terminal 2123-2 may be a member for electrically connecting the tertiary coil 2122-2 to the diode module. The third terminal 2123-2 may be a conductive member having a plate shape. The third terminal 2123-2 may extend in a horizontal direction from one end (start portion) of the tertiary coil 2122-2. The other end of the third terminal 2123-2 may be divided into fourth and fifth terminal portions 2123-2a and 2123-2b which will be described later.

One end of the third terminal 2123-2 may be electrically connected to the start of the tertiary coil 2122-2. The other end of the third terminal 2123-2 may be divided into a fourth terminal portion 2123-2a and a fifth terminal portion 2123-2b. The fourth terminal portion 2123-2a and the fifth terminal portion 2123-2b may be electrically connected to the diode module by bolting. Accordingly, holes for fastening bolts may be formed in the fourth terminal portion 2123-1a and the fifth terminal portion 2123-2b. Accordingly, the tertiary coil 2122-2 may be electrically connected to the diode module through the third terminal 2123-2.

The fourth terminal 2124-2 may extend from the tertiary coil 2122-2. The fourth terminal 2124-2 may be a member for electrically connecting the tertiary coil 2122-2 and the inductor coil 2213-1. The fourth terminal 2124-2 may be a conductive member having a plate shape. The fourth terminal 2124-2 may extend in the horizontal direction from the other end of the tertiary coil 2122-2. One end of the fourth terminal 2124-2 may be located at the end of the tertiary coil 2122-2. A sixth terminal portion 2124-2a may be formed at the other end of the fourth terminal 2124-2. The sixth terminal portion 2124-2a may be electrically connected to the seventh terminal portion 2133-1a by bolting. In this case, the third terminal portion 2124-1a, the sixth terminal portion 2124-2a, and the seventh terminal portion 2133-1a may overlap each other in the vertical direction. A hole for fastening the bolt may be formed in the sixth terminal portion 2124-2a. As a result, the fourth terminal 2124-2 and the fifth terminal 2133-1 may be electrically connected, and ultimately, the tertiary coil 2122-2 and the inductor coil 2131-1 may be electrically connected to each other. Can be.

The inductor coil 2131-1 may receive a conversion current from the secondary coil 2122-1 and the tertiary coil 2122-2. The inductor coil 211-1 may rectify the converted current. The inductor coil 211-1 may be connected to the external terminal 2150 to supply a rectified current.

The inductor coil 211-1 may have a form in which a plate including an upper surface and a lower surface is grown in three-dimensional spiral. That is, the inductor coils 211-1 may have a three-dimensional spiral shape. The start portion (lower portion) of the spiral growth of the inductor coil 2131-1 may extend from the fifth terminal 2133-1. The sixth terminal 2132-1 may be connected to the spiral growth end portion (top) of the inductor coil 211-11-1. The bus bar 2140-1 may extend from the sixth terminal 2132-1. The inductor coil 211-1-1, the fifth terminal 2133-1, the sixth terminal 2132-1, and the bus bar 2140-1 may be integrally formed.

A seventh terminal portion 2133-1a may be formed at one end of the fifth terminal 2133-1. As described above, the seventh terminal portion 2133-1a may be electrically connected to the third terminal portion 2124-1a by bolting. In addition, the seventh terminal portion 2133-1a may be electrically connected to the sixth terminal portion 2124-2a by bolting. Therefore, the inductor coil 2131-1 may be electrically connected to the secondary coil 2122-1 and the tertiary coil 2122-2. Induced currents generated in the secondary coil 2122-1 and the tertiary coil 2122-2 may be rectified in the inductor coil 2131-2. The other end of the fifth terminal 2133-1 extends from one end of the fifth terminal 2133-1 in the horizontal direction (the direction in which the inductor coil is located), so as to start the spiral growth of the inductor coil 2131-2. Can be connected.

One end of the sixth terminal 2132-1 may be connected to the end of the spiral growth of the inductor coil 2131-2. The other end of the sixth terminal 2132-1 may be connected to one end of the bus bar 2140-1. The other end of the bus bar 2140-1 may be electrically connected to the external terminal 2150. At the other end of the bus bar 2140-1, an eighth terminal portion 2140-1a may be formed to be electrically connected to the external terminal 2150. Bolting holes for fixing and electrical connection may be formed in the eighth terminal portion 2140-1a. The inductor coil 2131-2 may be electrically connected to the external terminal 2150 through the bus bar 2140-1. As a result, the induced current generated in the secondary coil 2122-1 and the tertiary coil 2122-2 is rectified in the inductor coil 2131-2, and then external electronic device through the bus bar 2140-1. Can be delivered.

Third Embodiment

Hereinafter, the DC-DC converter 3001 of the third embodiment will be described with reference to the drawings. FIG. 16 is a perspective view showing the DC-DC converter of the third embodiment with the first cover removed, FIG. 17 is a cutaway perspective view of the DC-DC converter of the third embodiment, and FIG. 18 is the third embodiment. Fig. 19 is a schematic cross-sectional view showing a main board, an auxiliary board, and a cooling plate of a DC-DC converter.

The DC-DC converter 3001 of the third embodiment may be a DC-DC converter used in a vehicle. As an example of an electric vehicle, the DC-DC converter 3001 receives a current from an external power supply device (such as a lithium ion battery) and boosts or lowers a voltage to supply an external electronic device (motor, etc.) to supply a motor. It can play a role to control the rotation speed. As shown in FIG. 17, the DC-DC converter 3001 includes a housing 3010, a first substrate 3020, a second substrate 3030, a connection member 3040, a coil unit 3050, and a bus bar 3060. ) May be included. The DC-DC converter 3001 may be referred to as an "electronic component assembly." In this case, auxiliary components such as the coil unit 3050 and the bus bar 3060 may be omitted. In this case, the "electronic component assembly" of the third embodiment may have a range of rights not only in the DC-DC converter 3001 but also in various electronic component assemblies. In addition, the first substrate 3020 may be referred to as an "auxiliary substrate" as a substrate provided to cool an element having a high heat generation amount. Since the first substrate 3020 has a configuration completely different from that of the general substrate (the cooling plate replaces the role of the base of the general substrate), the name of the substrate may be omitted. The second substrate 3030 may be referred to as a “main substrate” as a substrate provided to cool an element having a low heat generation amount. When the name of the first substrate 3020 is omitted, the second substrate 3030 may be referred to as a "substrate".

Hereinafter, the housing 3010 will be described with reference to FIGS. 16 and 17. The housing 3010 may be a hollow block shape as an exterior member of the DC-DC converter 3001. The housing 3010 includes a main body 3011, a cooling plate 3012, a first cover 3013, a second cover 3014, an inlet port 3015, an outlet port 3016, a cooling channel guide 3017, and a cooling channel ( 3018 and heat dissipation fins 3019. The interior of the housing 3010 may be separated into a first region 3002 positioned below and a second region 3003 positioned above by the cooling plate 3012. The first region 3002 may be a cooling unit through which a cooling fluid flows, and the second region 3003 may be an electronic component unit in which electronic components are disposed. Cooling plate 3012 of housing 3010, first cover 3013, second cover 3014, inlet port 3015, outlet port 3016, cooling channel guide 3017, cooling channel 3018 and heat dissipation fins ( 3019 may be integrally formed. The material of the housing 3010 may be metal (eg, aluminum).

The main body 3011 may be formed by a side surface, and may have a hollow shape in which lower and upper ends are opened. The first cover 3013 may be disposed at the lower end of the main body 3011. In this case, the first cover 3013 may cover the opening of the lower end of the main body 3011 to close. The second cover 3014 may be disposed at an upper end of the main body 3011. In this case, the second cover 3013 may cover the opening of the upper end of the main body 3011 to close. As a result, the interior space of the housing 3010 may be formed by the main body 3011 and the first and

second covers

3012 and 3013. Furthermore, the cooling plate 3012 may be disposed in the body 3011 in the form of a horizontal partition wall. That is, the cooling plate 3012 may be formed over the entire surface of the horizontal cross section of the interior of the body 3011. The cooling plate 3012 may partition or separate the inside of the main body 3011 into the first region 3002 and the second region 3003. In this case, the first area 3002 and the second area 3003 may be separate areas that are blocked from each other. The first region 3002 may be disposed below the cooling plate 3012, and the second region 3003 may be disposed above the cooling plate 3012.

An inlet 3015 for introducing a cooling fluid and an outlet 3016 for discharging the cooling fluid flowing along the first region 3002 may be formed at a portion corresponding to the first region 3002 on the side of the main body 3011. Can be.

The first region 3002 may serve as a region through which a cooling fluid flows. The cooling channel guide 3017 may be disposed on the lower surface of the cooling plate 3012. In this case, the cooling flow path guide 3017 may have various shapes, and the cooling flow path 3018 may be formed by the cooling flow path guide 3017. In order to increase cooling efficiency, a plurality of heat dissipation fins 3019 may be formed in the cooling passage 3018. In this case, the plurality of heat dissipation fins 3019 may have a protrusion shape extending downward from the lower surface of the cooling plate 3012.

The second area 3003 is a place where the electronic component is disposed, and may perform an electronic control function. To this end, a first substrate 3020, a second substrate 3030, a connection member 3040, a coil unit 3050, and a bus bar 3060 may be disposed in the second region 3003.

Hereinafter, the first substrate 3020 will be described with reference to FIG. 18. The first substrate 3020 may be a metal printed circuit board (MPCB) having high thermal conductivity. The first substrate 3020 may be referred to as an "auxiliary substrate" as a substrate for mounting an element having a high heat generation amount. That is, the element mounted on the first substrate 3020 has a higher heat generation amount than the element mounted on the second substrate 3030 described later. The device mounted on the first substrate 3020 may also be referred to as an “active device”. Here, the "active device" may be a device having an ability to generate electrical energy. For example, the transistor and the IC controller may correspond to this.

The first substrate 3020 may be disposed on an upper surface of the cooling plate 3012. In this case, the bottom surface of the first substrate 3020 may contact the top surface of the cooling plate 3012. As a result, the first substrate 3020 may have a higher cooling efficiency than the second substrate 3030 described later. Since the bottom surface of the first substrate 3020 is in direct contact with the cooling plate 3012, the device may be mounted only on the top surface of the first substrate 3020. The first substrate 3020 may be spaced apart from the second substrate 3030. That is, the first substrate 3020 may be stacked spaced apart from the second substrate 3030. As a result, in the third embodiment, the mounting rate of the device can be increased in the same space. The area of the first substrate 3020 may be smaller than the area of the second substrate 3030. The first substrate 3020 may be electrically connected to the second substrate 3030. The first substrate 3020 may be electrically connected to the second substrate 3030 by the connecting member 3040.

The first substrate 3020 may include an adhesive layer 3021, a metal layer 3022, an insulating layer 3023, and a pattern layer 3024. The first substrate 3020 may have a form in which an adhesive layer 3021, a metal layer 3022, an insulating layer 3023, and a pattern layer 3024 are sequentially stacked. The first substrate 3020 may be composed of only an adhesive layer 3021, a metal layer 3022, an insulating layer 3023, and a pattern layer 3024.

The adhesive layer 3021 may be disposed on the cooling plate 3012 with a thermally conductive adhesive. In this case, the adhesive layer 3021 may be directly coated on the upper surface of the cooling plate 3012. That is, the adhesive layer 3021 may adhere to the top surface of the cooling plate 3012. For example, the adhesive layer 3021 may be a thermal grease having high thermal conductivity. As a result, it is possible to efficiently cool the heat generated by the element having a high heat generation amount mounted on the first substrate 3020. Furthermore, the adhesive layer 3021 may perform a function of bonding the metal layer 3022 and the cooling plate 3012.

The metal layer 3022 may be disposed on the adhesive layer 3021. That is, the metal layer 3022 may be disposed on the adhesive layer 3021. The metal layer 3022 may be in the form of a metal plate. The bottom surface of the metal layer 3022 may be combined with the top surface of the adhesive layer 3021. The material of the metal layer 3022 may include copper or aluminum having high thermal conductivity. The first substrate 3020 may be referred to as a "metal printed circuit board" by the metal layer 3022. The cooling efficiency of the first substrate 3020 may be increased by the metal layer 3022. In addition, the metal layer 3022 may serve as a support part in the first substrate 3020. The insulating layer 3023 and the pattern layer 3024 may be supported by the metal layer 3022.

The insulating layer 3023 may be disposed on the metal layer 3022. That is, the insulating layer 3023 may be disposed on the metal layer 3022. The insulating layer 3023 may be in the form of a plate of an insulating material. The insulating layer 3023 may be a layer for forming the pattern layer 3024.

The pattern layer 3024 may be disposed on the insulating layer 3023. The pattern layer 3024 may be coated on the insulating layer 3023. The pattern layer 3024 may be a layer forming a circuit of the first substrate 3020. Accordingly, the pattern layer 3024 may be various circuit patterns made of an electrically conductive material. An "active element" may be disposed in the pattern layer 3024. In this case, the "active element" may include an upper surface and a lower surface. The lower surface of the "active element" may be soldered to the pattern layer 3024. Accordingly, the bottom surface of the "active element" may be opposite to the cooling plate 3012. In addition, the "active element" may be electrically connected to the pattern layer 3024 by surface mount theory (SMT). For example, the "active element" may be electrically connected to the pattern layer 3024 by a plurality of wires.

As described above, the first substrate 3020 is completely different from the general substrate in that the first substrate 3020 is made of materials directly coated on the cooling plate 3012 based on the cooling plate 3012. Therefore, the first substrate 3020 may be omitted. In this case, the first substrate 3020 may be referred to as an "adhesive layer 3021, a metal layer 3022, an insulating layer 3023, and a pattern layer 3024."

Hereinafter, the second substrate 3030 will be described with reference to FIG. 18. The second substrate 3030 may be a printed circuit board (PCB). The second substrate 3030 may be referred to as a “main substrate” as a substrate for mounting a device having a low heat generation amount. That is, the element mounted on the second substrate 3030 has a lower heat generation amount than the element mounted on the first substrate 3020. The device mounted on the second substrate 3030 may also be referred to as a "passive device". Here, the "passive element" may be a device that does not have an active function, such as only to transfer or absorb electrical energy, or to convert electrical energy.

The second substrate 3030 may be spaced apart from the cooling plate 3012 upwardly. To this end, a member (not shown) for supporting the second substrate 3030 may be disposed on an inner side surface of the second region 3003 of the main body 3011. The first substrate 3020 may be disposed between the second substrate 3030 and the cooling plate 3012. That is, the second substrate 3030 and the first substrate 3020 may be spaced apart and overlap. As a result, the second substrate 3030 may have a lower cooling efficiency than the first substrate 3020. That is, the second substrate 3030 may be stacked spaced apart from the first substrate 3020. In this case, an area of the second substrate 3030 may be larger than that of the first substrate 3020. The second substrate 3030 may be electrically connected to the first substrate 3020. The second substrate 3030 may be electrically connected to the first substrate 3020 by the connecting member 3040. The second substrate 3030 may be spaced apart from the coil unit 3050 to be described later. In this case, the coil unit 3050 may penetrate the first substrate 3020. The coil part 3050 is supported and disposed on the cooling plate 3012, and since the first substrate 3020 is disposed to be spaced apart from the cooling plate 3012, the first substrate 3020 and the coil part 3050 overlap each other. A hole may be formed in the first substrate 3020 to allow the coil unit 3050 to pass therethrough. (See FIG. 16.) The passive substrate may be mounted on both the top and bottom surfaces of the first substrate 3020. have. As a result, in the third embodiment, the mounting rate of the device can be increased in the same space.

The connection member 3040 may electrically connect the first substrate 3020 and the second substrate 3030. The connection member 3040 may be a fastening member by a press fit method. In addition, the connection member 3040 may be a signal leg. In addition, the connection member 3040 may be a flexible printed circuit board (FPCB). That is, the connection member 3040 may have various forms. Hereinafter, a case in which the connecting member 3040 is a signal leg will be described with reference to FIG. 20.

As shown in FIG. 19A, the connection member 3040 is bent or bent by the first conductive member 3041 and the first conductive member 3041 to form part of the pattern layer 3024 to form a second substrate. The second conductive member 3052 may be electrically connected to the 3030. In this case, the first conductive member 3041 may be a pattern of the pattern layer 3024. In addition, the second conductive member 3042 may extend upward from the first conductive member 3041 to be electrically connected to the second substrate 3030. In this case, the upper end of the second conductive member 3042 may be soldered to the second substrate 3030, or may be joined by pin bonding or the like.

As shown in FIG. 19B, the connection member 3040 is bent or bent from the first conductive member 3041 and the first conductive member 3041 to be electrically connected to the pattern layer 3024 to form a second substrate. The second conductive member 3052 may be electrically connected to the 3030. In this case, the bottom surface of the first conductive member 3041 may be electrically connected to the pattern layer 3024. The bottom surface of the first conductive member 3041 may be soldered to the pattern layer 3024 or may be bonded by pin bonding or the like. In addition, the second conductive member 3042 may extend upward from the first conductive member 3041 to be electrically connected to the second substrate 3030. The upper end of the second conductive member 3042 may be soldered to the second substrate 3030 or may be coupled by pin bonding or the like.

As shown in FIG. 19C, the connection member 3040 is electrically connected to the pattern layer 3024, and is formed at the center of the plate-shaped first conductive member 3041 and the first conductive member 3041. It may include a second conductive member (3042) extending toward the second substrate 3030 and electrically connected to the second substrate (3030). In this case, the bottom surface of the first conductive member 3041 may be electrically connected to the pattern layer 3024. The bottom surface of the first conductive member 3041 may be soldered to the pattern layer 3024 or may be bonded by pin bonding or the like. In addition, the second conductive member 3042 may extend upward from the first conductive member 3041 to be electrically connected to the second substrate 3030. The upper end of the second conductive member 3042 may be soldered to the second substrate 3030 or may be coupled by pin bonding or the like.

As shown in FIG. 19D, the connecting member 3040 forms part of the pattern layer 3024 and has a first conductive member 3041 and a first conductive member having a groove formed at the center in the form of a plate. A protrusion accommodated in the groove of the 3041 is formed, and may include a second conductive member 3042 extending from the protrusion toward the second substrate 3030 and electrically connected to the second substrate 3030. In this case, the first conductive member 3041 may be a pattern of the pattern layer 3024. In addition, a protrusion corresponding to the groove of the first conductive member 3041 may be formed at the lower end of the second conductive member 3042 to be soldered. As a result, the second conductive member 3042 can be electrically connected to the first conductive member 3041 and supported by the first conductive member 3041 at the same time. In addition, the second conductive member 3042 may extend upward from the first conductive member 3041 to be electrically connected to the second substrate 3030. The upper end of the second conductive member 3042 may be soldered to the second substrate 3030 or may be coupled by pin bonding or the like.

As described above, the "active element" is disposed on the first substrate 3020 and the "passive element" is disposed on the second substrate 3030. However, the third embodiment is not limited thereto. The "active element" and the "passive element" may be collectively referred to as an "electronic element", and the "electronic element" may be a first substrate 3020 and a second substrate 3030 without being divided into "active element" and a passive element. It may be arranged in.

Hereinafter, the coil unit 3050 and the bus bar 3060 will be described with reference to FIG. 16. The coil unit 3050 may be supported by the cooling plate 3012. In this case, the lower portion of the coil unit 3050 may be coupled to the upper surface of the cooling plate 3012. In addition, the coil unit 3050 may be spaced apart from the second substrate 3030. In addition, the coil unit 3050 may be disposed to overlap the second substrate 3030. In this case, the coil unit 3050 may pass through the second substrate 3030. There may be a plurality of coil units 3050. The coil unit 3050 may be a transcoil unit or an inductor coil unit. When the coil unit 3050 is a transcoil unit, the coil unit 3050 may convert the voltage of the power supplied from the outside. When the coil unit 3050 is an inductor coil unit, the coil unit 3050 may rectify the converted power. The bus bar 3050 may be electrically connected to the coil unit 3050 to output the converted and / or rectified power to the outside.

The DC-DC converter 1 of the modification of the third embodiment will be described below with reference to the drawings. 20 is a cross-sectional conceptual view showing a main board, an auxiliary board, and a cooling plate of a DC-DC converter according to a modification of the third embodiment. The modification of the third embodiment has the same technical spirit as the third embodiment except for the first substrate 3020. Hereinafter, the description of the technical idea that is substantially the same as in the third embodiment will be omitted.

The first substrate of the modification of the third embodiment may include an insulating layer 3023 and a pattern layer 3024. The first substrate may have a form in which the insulating layer 3023 and the pattern layer 3024 are sequentially stacked. The first substrate may be composed of only the insulating layer 3023 and the pattern layer 3024.

That is, in the modification of the third embodiment, the adhesive layer 3021 and the metal layer 3022 may be omitted. Instead, the cold plate 3012 may perform the function of the metal layer 3022. Therefore, the adhesive layer 3021 for bonding the metal layer 3022 and the cooling plate 3012 may also be omitted.

More specifically, the insulating layer 3023 of the first substrate may be directly coated on the upper surface of the cooling plate 3012. That is, the insulating layer 3023 and the upper surface of the cooling plate 3012 may contact. In this case, the cooling plate 3012 may be a metal material to perform the supporting function of the metal layer 3022 of the third embodiment. That is, the first substrate of the modified example of the third embodiment may have the same effect as compared with the first substrate 3020 of the third embodiment. At the same time, by removing the adhesive layer 3021 and the metal layer 3022, the cooling efficiency can be increased, the size is reduced in the vertical direction to secure the space in the vertical direction caused by mounting the element on the lower surface of the second substrate 3030 It can also be solved, there is an advantage in the manufacturing process and cost due to the simplification of the member.

In the above description, all elements constituting the embodiments of the present invention are described as being combined or operating in combination, but the present invention is not necessarily limited to the embodiments. In other words, within the scope of the present invention, all of the components may be selectively operated in combination with one or more. In addition, the terms "comprise", "comprise" or "having" described above mean that the corresponding component may be inherent unless specifically stated otherwise, and thus excludes other components. It should be construed that it may further include other components instead. All terms, including technical and scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art unless otherwise defined. Terms used generally, such as terms defined in a dictionary, should be interpreted to coincide with the contextual meaning of the related art, and shall not be interpreted in an ideal or excessively formal sense unless explicitly defined in the present invention.

The above description is merely illustrative of the technical idea of the present invention, and those skilled in the art to which the present invention pertains may make various modifications and changes without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention but to describe the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. The protection scope of the present invention should be interpreted by the following claims, and all technical ideas within the equivalent scope should be interpreted as being included in the scope of the present invention.

Claims

housing;

A plurality of electronic components disposed in the housing; And

It includes a flow path disposed on the lower plate of the housing,

The flow path includes an extension, wherein the width of the extension is greater than the width of the flow path of the front end of the extension, the vertical width of the extension is less than the length of the flow path of the front end of the expansion, the vertical cross section of the flow path The difference between the largest area and the smallest area is within 10%.
The method of claim 1,

The plurality of electronic components includes a plurality of heat generating elements, and one of the plurality of heat generating elements is disposed to correspond to the extension part.
The method of claim 2,

And one of the plurality of heat generating elements overlaps the extension part in a vertical direction.
The method of claim 3,

DC-DC converter in the maximum horizontal cross-sectional area of the expansion portion overlapping with the one of the plurality of heat generating element in the vertical direction is 30% or more.
The method of claim 2,

And the maximum horizontal cross section of the extension is 90% or more of the maximum horizontal cross section of the one of the plurality of heat generating elements.
The method of claim 1,

DC-DC converter is located on the bottom surface of the expansion portion protruding portion protruding in the lower plate direction.
The method of claim 6,

The protrusion height of the protrusion increases and decreases along the direction of movement of the cooling material.
The method of claim 6,

The protrusion has a vertical cross section and the area of the vertical cross section of the protrusion increases and decreases along the direction of movement of the cooling material.
The method of claim 6,

The horizontal cross section of the protrusion has a form in which the curvature is formed convexly toward the lower plate, and the area of the horizontal cross section of the protrusion decreases from the center of the horizontal width of the flow path toward the edge.
The method of claim 1,

DC-DC converter, the area of the vertical cross section of the flow path is the same along the direction of movement of the cooling material.