CN111403174B - Thin film capacitor integrating EMC (electro magnetic compatibility) and discharge functions and motor controller thereof - Google Patents
Thin film capacitor integrating EMC (electro magnetic compatibility) and discharge functions and motor controller thereof Download PDFInfo
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- CN111403174B CN111403174B CN202010220631.XA CN202010220631A CN111403174B CN 111403174 B CN111403174 B CN 111403174B CN 202010220631 A CN202010220631 A CN 202010220631A CN 111403174 B CN111403174 B CN 111403174B
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- 239000003990 capacitor Substances 0.000 title claims abstract description 150
- 239000010409 thin film Substances 0.000 title claims abstract description 31
- 238000001816 cooling Methods 0.000 claims abstract description 38
- 230000017525 heat dissipation Effects 0.000 claims abstract description 23
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 46
- 229910052802 copper Inorganic materials 0.000 claims description 46
- 239000010949 copper Substances 0.000 claims description 46
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 9
- 239000000498 cooling water Substances 0.000 claims description 8
- 238000007789 sealing Methods 0.000 claims description 8
- 239000004593 Epoxy Substances 0.000 claims description 7
- 238000003466 welding Methods 0.000 claims description 5
- 238000004806 packaging method and process Methods 0.000 claims description 4
- 230000000740 bleeding effect Effects 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 239000010408 film Substances 0.000 abstract description 21
- 239000004033 plastic Substances 0.000 description 8
- 238000005538 encapsulation Methods 0.000 description 7
- HDULUCZRGGWTMZ-UHFFFAOYSA-N 1,3-dichloro-2-(3,5-dichlorophenyl)benzene Chemical compound ClC1=CC(Cl)=CC(C=2C(=CC=CC=2Cl)Cl)=C1 HDULUCZRGGWTMZ-UHFFFAOYSA-N 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- 239000000110 cooling liquid Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000004512 die casting Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000000956 alloy Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/224—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/236—Terminals leading through the housing, i.e. lead-through
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/32—Wound capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/33—Thin- or thick-film capacitors
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
- H02K11/0094—Structural association with other electrical or electronic devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/08—Cooling arrangements; Heating arrangements; Ventilating arrangements
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Inverter Devices (AREA)
- Motor Or Generator Cooling System (AREA)
- Electric Propulsion And Braking For Vehicles (AREA)
Abstract
The invention discloses a thin film capacitor integrating EMC and bleeder functions and a motor controller thereof. When the film capacitor is installed in the motor controller shell, the top and the bottom of the film capacitor are both provided with cooling designs, and double-sided cooling can be simultaneously carried out by using the water channel heat dissipation surface of the motor controller shell and the air cooling heat dissipation surface of the upper cover of the controller.
Description
Technical Field
The invention relates to a film capacitor for a motor controller, in particular to a double-sided water-cooled film capacitor integrating EMC and a release function and a motor controller thereof.
Background
The motor power and the power density of present new energy automobile constantly promote, and the capacity demand of X electric capacity also constantly increases in the machine controller, can bring the electric capacity inside serious that generates heat thereupon, the problem of whole volume increase for be unfavorable for improving machine controller's power density on the one hand, on the other hand also brings the risk for machine controller's reliability. The traditional heat dissipation mode can not meet the reliability requirement of the capacitor for the high-power motor controller. In addition, along with the improvement of the requirements on electromagnetic compatibility of the electric automobile and the discharge rate of the capacitor at present, the EMC performance and the capacitance discharge capacity of the motor controller are very important, the traditional film capacitor for the motor controller only has an X capacitor for inhibiting differential mode interference, and an EMC module and a discharge module for capacitance discharge are additionally arranged at other positions in the motor controller, so that space waste is caused, a signal conduction loop is prolonged and deteriorated, the EMC performance and the discharge rate are reduced, and meanwhile, the devices are difficult to fix well and have failure risks when being vibrated. In the aspect of installation mode, the current film capacitor only utilizes the shell of the motor controller as a heat exchange surface, but the upper cover of the motor controller is difficult to utilize.
Chinese patent CN110335755A discloses a water-cooled film capacitor and a motor controller integrated with an ampere-standard filter capacitor, which has the following defects: 1. relevant EMC devices and water cooling functions are integrated, but a discharge module is not arranged, so that rapid discharge cannot be realized; the EMC module and the circuit board are arranged outside the capacitor shell, so that collision and damage are easily caused, and the firmness and the insulation performance are poor; 3. the ferrite common mode inductor (belonging to one type of magnetic ring) is encapsulated in the capacitor shell, and the high temperature of epoxy resin can damage magnetic materials during encapsulation; 4. vertical cooling water pipes are arranged on the two sides in the capacitor shell, so that the heat dissipation area is small, the copper bars and the core coils are not covered, the capacitor shell is communicated with a water cooling cavity of an external IGBT module, and the risk of leakage of cooling liquid is avoided; the capacitor shell and the IGBT module form a heat exchange surface only at the top, and the heat dissipation surface is not fully utilized; 5. due to the leading-out of the copper bar, the plastic shell needs to be provided with holes on three sides of the shell, so that the feasibility of the epoxy potting process is poor.
Therefore, it is necessary to develop a water-cooled thin film capacitor and a motor controller thereof, which have simple structure and convenient packaging, integrate EMC and bleeder modules inside the capacitor case, and can dissipate heat from the top and bottom surfaces of the capacitor case.
Disclosure of Invention
The invention aims to solve the defects of the background technology and provide a water-cooled film capacitor and a motor controller thereof, wherein the water-cooled film capacitor has a simple structure and is convenient to package, an EMC and leakage module is integrated in a capacitor shell, and the top surface and the bottom surface of the capacitor shell can radiate heat.
The technical scheme of the invention is as follows: the utility model provides an integrated EMC and thin film capacitor of function of releasing, its characterized in that, includes top seal, bottom open-ended electric capacity casing and sets up heat dissipation upper cover and the water-cooling bottom plate of lower extreme on the electric capacity casing, the electric capacity casing is inside from supreme heat conduction insulating pad, the female row of stromatolite, X electric capacity core book of being equipped with in proper order down, the stromatolite is female to be equipped with the EMC module including Y electric capacity, bleeder resistor, PCB board, the electric capacity casing intussuseption is filled with epoxy encapsulation and is glued X electric capacity core book, EMC module encapsulation, electric capacity casing surface is equipped with the magnetic ring confession the.
Preferably, female arranging of stromatolite includes from supreme negative pole generating line copper bar, insulating paper, the anodal generating line copper bar that stacks in proper order down, negative pole generating line copper bar, anodal generating line copper bar edge all are equipped with the welding end and roll up with X electric capacity core and are connected.
Further, negative pole generating line copper bar is equipped with a negative pole input terminal and a plurality of negative pole output terminal, anodal generating line copper bar is equipped with a anodal input terminal and a plurality of anodal output terminal, the electric capacity casing bottom is equipped with a plurality of recesses and supplies negative pole input terminal, negative pole output terminal, anodal input terminal, anodal output terminal to wear out.
Furthermore, the positive input terminal and the negative input terminal penetrate out from one end of the capacitor shell along the length direction and then penetrate through the magnetic ring, and the negative output terminal and the positive output terminal both penetrate out from the same side of the capacitor shell. The X capacitor cores are wound in a plurality and are arranged at intervals along the length direction of the capacitor shell,
further, its characterized in that, the EMC module includes two sets of Y electric capacity, two sets of bleeder resistor, a PCB board, a ground copper bar, the PCB board parallel arrangement is arranged in the female top of arranging of stromatolite, female negative pole generating line copper bar of arranging of stromatolite is equipped with the negative pole and draws forth the foot female anodal generating line copper bar of arranging of stromatolite is equipped with anodal pin of drawing forth and supports the connection with the PCB board.
Furthermore, the Y capacitor, the discharge resistor, the grounding copper bar, the negative lead-out pin and the positive lead-out pin are all welded on the PCB, the positive lead-out pin is connected with one group of discharge resistor, one group of Y capacitor and the grounding copper bar in series, and the negative lead-out pin is connected with the other group of discharge resistor, the other group of Y capacitor and the grounding copper bar in series.
Preferably, a plurality of turbulence columns arranged at intervals are arranged on the bottom surface of the water-cooling bottom plate downwards.
Preferably, the X capacitor core roll is provided with a temperature sensor, and the temperature sensor is provided with a lead-out wire led out from the bottom of the capacitor shell.
Preferably, the concave mounting groove that forms in electric capacity casing top, the heat dissipation upper cover is laminated in the mounting groove, the top surface laminating is rolled up with X electric capacity core to the bottom outer wall of mounting groove, electric capacity casing bottom links firmly with the water-cooling bottom plate.
The invention also provides the motor controller of the thin film capacitor integrating the EMC and the discharge function, which comprises a motor controller shell with an upper cover, and the thin film capacitor integrating the EMC and the discharge function, wherein the thin film capacitor is positioned in the motor controller shell, the bottom of the motor controller shell is concave downwards to form a cooling water channel matched with the water-cooling bottom plate, the motor controller shell and the water-cooling bottom plate are provided with sealing rings around the water channel to form sealed and fixed connection, and a heat conducting pad is arranged between the heat dissipation upper cover and the upper cover of the thin film capacitor for bonding.
The invention has the beneficial effects that:
1. the laminated busbar in the capacitor adopts a large-area overlapping mode, so that stray inductance is effectively reduced. The positive electrode and the negative electrode of the laminated busbar are provided with leading-out pins which are specially used for connecting a Y capacitor and a bleeder resistor, the pins of the Y capacitor and the bleeder resistor and the leading-out pins of the positive electrode and the negative electrode of the laminated busbar and the grounding copper bar are welded on a PCB board printed with a loop together, so that the positive electrode and the negative electrode of the laminated busbar are respectively connected with a group of Y capacitors and a group of bleeder resistors in series to form an RC circuit, and then all the RC circuits are plastically packaged in a capacitor shell, thereby effectively protecting the EMC module and improving the insulation reliability and the reliability when the EM.
2. The magnetic rings are sleeved outside the positive and negative input terminals of the laminated busbar and are independently installed outside the shell, so that the assembly and disassembly are convenient, and the magnetic rings need to be replaced to compare the influence of the magnetic rings made of different materials on the EMC performance in use. In addition, in the aspect of EMC, differential mode and common mode signals can be effectively reduced, the discharge rate of the X capacitor is increased, and the overall EMC performance and safety of the motor controller are improved.
3. When the capacitor works, the laminated busbar and the X capacitor core roll are main heat sources, the X capacitor core roll and the EMC module are plastically packaged in the shell through epoxy resin, the overlapped part of the laminated busbar is not plastically packaged, the X capacitor core roll and the EMC module are insulated from the water-cooling bottom plate through the heat conducting pad and directly and tightly mounted, heat media are reduced to the maximum extent, the heat conductivity coefficient is increased, the heat radiating surface is fully covered, the water-cooling bottom plate is hermetically mounted in a water channel space of the controller shell through the sealing ring, and a water channel passes through a turbulence column of the water-cooling bottom plate and can effectively take away heat; meanwhile, the heat dissipation upper cover embedded into the top is attached to the shell of the motor controller through the heat conduction silicone grease or the heat conduction pad, so that the temperature of the X capacitor core coil can be effectively taken away, and the effect of double-sided cooling is achieved.
And 4. the X capacitor core roll is pasted with a surface-mounted temperature sensor, and a lead-out wire is led out from the bottom of the shell, so that a temperature signal can be acquired. The side face of the capacitor shell is not provided with the opening, the laminated busbar, the X capacitor and the EMC module are integrally arranged in the shell after being externally installed, the shell is reversely injected with epoxy for plastic package, and manufacturability is good.
5. The design of separating the capacitor shell from the water-cooling bottom plate can only replace the thin-film capacitor without disassembling the water-cooling plate and the sealing ring after the capacitor fails. Meanwhile, the invention can be used as a single module to be installed on the motor controller shell, and can also be used for power module integration in consideration of modular design.
6. When the film capacitor is installed in the motor controller shell, the top and the bottom of the film capacitor are both designed to be cooled, the water channel heat dissipation surface of the motor controller shell and the air cooling heat dissipation surface of the upper cover of the controller can be simultaneously utilized, the film capacitor provides a supporting point for the upper cover with relatively weak strength of the motor controller shell, and the rigidity of the upper cover and the overall strength of the motor controller are improved.
Drawings
FIG. 1 is a schematic view of a thin film capacitor according to the present invention (a perspective view)
FIG. 2 is a schematic bottom structure of a thin film capacitor of the present invention
FIG. 3 is an exploded view of a thin film capacitor structure according to the present invention
FIG. 4 is a schematic diagram of a laminated busbar and an EMC module according to the present invention
FIG. 5 is a schematic diagram of an EMC module structure of the present invention
FIG. 6 is a schematic diagram of a PCB structure
FIG. 7 is an EMC schematic diagram
FIG. 8 is a schematic view of the structure of the thin film capacitor of the present invention mounted to the housing of the motor controller
Wherein: 1-capacitor shell 2-heat dissipation upper cover 3-water cooling bottom plate 4-heat conduction insulating pad 5-laminated busbar 6-X capacitor core coil 7-EMC module 8-epoxy packaging glue 9-magnetic ring 10-film capacitor 11-groove 12-mounting groove 20-controller shell 21-upper cover 22-water channel 23-sealing ring 31-spoiler column 51-negative busbar copper bar (51.1-negative input terminal 51.2-negative output terminal) 52-insulating paper 53-positive busbar copper bar (53.1-positive input terminal 53.2-positive output terminal) 54-welding terminal 71-Y capacitor 72-bleeder resistor 73-PCB board 74-grounding copper bar 61-temperature sensor 62-outgoing line.
Detailed Description
The invention is described in further detail below with reference to the figures and the specific embodiments.
As shown in fig. 1-5, the invention provides a thin film capacitor integrating EMC and leakage functions, which includes a capacitor case 1 with a top sealed and a bottom opened, and a heat dissipation upper cover 2 and a water cooling bottom plate 3 respectively disposed at the upper and lower ends of the capacitor case 1, wherein a heat conduction insulating pad 4, a laminated bus bar 5, and an X capacitor core roll 6 are sequentially disposed inside the capacitor case 1 from bottom to top, an EMC module 7 including a Y capacitor 71, a leakage resistor 72, and a PCB 73 is disposed on the laminated bus bar 5, an epoxy encapsulation adhesive 8 is filled in the capacitor case 1 to encapsulate the X capacitor core roll 6 and the EMC module 7, and a magnetic ring 9 is disposed on the surface of the capacitor case 1 for an input terminal of the laminated bus bar 5 to.
In this embodiment, the bottom surface of the water-cooling bottom plate 3 is provided with a plurality of turbulence columns 31 arranged at intervals downward. The edge of the water-cooling bottom plate 3 is provided with a bolt hole for fixing, and the film capacitor 10 can be integrally fixed on the shell of the motor controller. The capacitor shell 1 is integrally formed through die casting, and the heat dissipation upper cover 2 is a thin flat plate made of an aluminum alloy material and is connected in the mounting groove 12 of the capacitor shell 1 through glue. The water-cooling bottom plate 3 is also a plate made of aluminum alloy.
The laminated busbar 5 comprises a negative bus copper bar 51, insulating paper 52 and a positive bus copper bar 53 which are sequentially stacked from bottom to top, and the edges of the negative bus copper bar 51 and the positive bus copper bar 53 are provided with welding ends 54 which are connected with the X capacitor core coil 6. The negative bus copper bar 51 and the positive bus copper bar 53 are overlapped in large area to form a laminated bus bar so as to reduce inductance, and the two are insulated by insulating paper 52.
The negative bus bar copper bar 51 is provided with a negative input terminal 51.1 and a plurality of negative output terminals 51.2, the positive bus bar copper bar 53 is provided with a positive input terminal 53.1 and a plurality of positive output terminals 53.2, and the bottom of the capacitor shell is provided with a plurality of grooves 11 for the negative input terminal 51.1, the negative output terminal 51.2, the positive input terminal 53.1 and the positive output terminal 53.2 to penetrate out.
In this embodiment, the negative input terminal 51.1 and the positive input terminal 53.1 penetrate through the magnetic ring 9 after penetrating through one end (left end in fig. 1) of the capacitor case 1 along the length direction, and 3 negative output terminals 51.2 and 3 positive output terminals 53.2 respectively penetrate through the same side (lower side in fig. 1) of the capacitor case 1 along the width direction. X electric capacity core is rolled up 6 and is 3, sets up along electric capacity casing 1 length direction interval, is equipped with temperature sensor 61 on the X electric capacity core is rolled up 6, and temperature sensor 61 is equipped with the recess 11 of leading-out wire 62 follow capacitor case 1 bottom and is drawn out. The concave mounting groove 12 that forms in 1 top of electric capacity casing, the heat dissipation upper cover 2 laminates in mounting groove 12, and 6 top surfaces of the bottom outer wall of 1 mounting groove 12 of electric capacity casing and X electric capacity core book are laminated, and 1 bottom of electric capacity casing links firmly with water-cooling bottom plate 3.
The EMC module 7 comprises two groups of Y capacitors 71, two groups of bleeder resistors 72, a PCB 73 and a grounding copper bar 74, wherein the PCB 73 is arranged above the laminated busbar 5 in parallel, a negative electrode bus copper bar 51 of the laminated busbar 5 is provided with a negative electrode lead-out pin 51.3, and a positive electrode bus copper bar 53 of the laminated busbar 5 is provided with a positive electrode lead-out pin 53.3 to support and connect the PCB 73. The Y capacitor 71, the bleeder resistor 72, the grounding copper bar 74, the negative leading-out pin 51.3 and the positive leading-out pin 53.3 are all welded on the PCB 73, the positive leading-out pin 53.3 is connected with one group of bleeder resistors 72, one group of Y capacitor 71 and the grounding copper bar 74 in series, and the negative leading-out pin 51.3 is connected with the other group of bleeder resistors 72, the other group of Y capacitor 71 and the grounding copper bar 74 in series.
As shown in fig. 6, the circuit for connecting the bleeder resistor 72, the Y capacitor 71, the laminated busbar 5 and the ground copper bar 74 has been printed on the PCB board, as shown in fig. 7, which is an EMC principle circuit, wherein the dashed box represents the magnetic ring 9.
As shown in fig. 8, the present invention further provides a motor controller, which includes the above-mentioned thin film capacitor 10 integrating EMC and bleeding functions and a motor controller housing 20 having an upper cover 21, the thin film capacitor 10 is located in the motor controller housing 20, and the bottom of the motor controller housing 20 is recessed to form a cooling water channel 22 matching with the water-cooled bottom plate 3, and a spoiler 31 of the thin film capacitor 10 is embedded in the cooling water channel 22 of the motor controller housing 20. The motor controller shell 20 and the water-cooling bottom plate 3 are provided with a sealing ring 23 around a cooling water channel 22 to form sealed connection, and a heat conducting pad is arranged between the heat dissipation upper cover 2 and the upper cover 21 of the film capacitor 10 to be attached.
The structure of motor controller is convenient for change film capacitor 10 in this embodiment, if film capacitor 10 became invalid, can directly change the device of capacitor case 1 and plastic envelope inside, and need not to dismantle water-cooling bottom plate 3 and change sealing washer 23, avoided the sealing washer 23 inefficacy because of dismantling the result in.
The assembly process of the thin film capacitor comprises the following steps:
the EMC module 7 is fixed with the laminated busbar 5 to form a component through welding, and then is welded with the X capacitor core coil 6 placed in parallel to form a loop. At this time, the EMC module 7, the X capacitor core roll 6, and the laminated busbar 5 form an integral component, which is put into the capacitor case 1, the heat dissipation upper cover 2 is glued, the capacitor case 1 is inverted and then the epoxy encapsulation glue 8 is injected, and the plastic encapsulation is performed from the mounting groove 12 of the capacitor case 1 to the positive busbar copper bar 53 of the laminated busbar 5, that is, the plastic encapsulation is not performed in the overlapping area inside the laminated busbar 5. After plastic packaging is finished, the capacitor shell 1 is normally placed, the heat conduction insulating pad 4 is attached to the lower surface of the laminated busbar 5, the water-cooling bottom plate 3 is installed, the capacitor shell 1 and the water-cooling bottom plate 3 are fixed together to form a whole, and finally the magnetic ring 9 is installed on the capacitor shell 1 to obtain the thin film capacitor.
The heat dissipation principle of the thin film capacitor is as follows:
the heat of the X capacitor core roll 6 is transmitted to the motor controller shell 20 through the heat-radiating upper cover 2 to be radiated, the heat of the laminated busbar 5 and part of the heat of the X capacitor core roll 6 are transmitted to the water-cooling bottom plate 3 through the heat-conducting insulating pad 4, and then the heat is taken away through cooling liquid, so that the function of double-sided cooling is realized.
The thin film capacitor has the advantages that: the laminated busbar 5 has large overlapping area, small stray inductance and direct heat conduction, and heat is easily transferred to the water-cooling bottom plate 3 from the laminated busbar. The EMC module 7 is directly connected with the laminated busbar 5 inside the thin-film capacitor, an EMC loop is shortened, the EMC module 7 can be integrally plastically packaged in the capacitor shell 1, reliability is improved, and insulation risk is reduced. The temperature rise problem and the EMC problem of current film capacitor for the motor controller have fully been considered, have designed two-sided refrigerated structure, the EMC module of integrated form and the module of bleeding specially for the condenser, make two big heat sources X electric capacity core rolls up 6 and the female heat that arranges 5 of stromatolite in the electric capacity can transmit and dispel the heat with the most efficient mode to improve the speed that the electric capacity discharges, improved film capacitor's operational environment, promoted electric capacity's temperature resistant ability, increase of service life. A temperature sensor 61, designed at the X capacitor core roll 6, can be used to monitor the capacitor temperature, providing a high performance EMC solution and a capacitor cooling solution for high power motor controllers. The aluminum radiating upper cover 2 and the water-cooling bottom plate 3 can bring the highest heat conductivity coefficient, the side surface of the capacitor shell 1 made of plastic has no opening, and the capacitor shell is easy to be integrally formed by die casting, low in cost and light in weight, and meets the requirements of high power density and low cost of the current motor controller. The integrated plastic package can protect components to the maximum extent, improves reliability, has small process difficulty and convenient production, and can realize mass production. The motor controller of the present invention makes full use of the heat exchange surface of the motor controller housing 20, and improves the utilization rate of the heat dissipation surface. The top and the bottom of the film capacitor 10 are both provided with cooling designs, and the mounting mode of the matched design can simultaneously utilize the water channel heat dissipation surface of the cooling water channel 22 of the motor controller shell and the air cooling heat dissipation surface of the upper cover 21, so that the heat dissipation efficiency is improved, and in the mounting mode, the film capacitor 10 provides support for the upper cover 21, so that the rigidity of the upper cover 21 and the integral strength of the motor controller are improved.
Claims (6)
1. The thin film capacitor is characterized by comprising a capacitor shell (1) with a top seal and a bottom opening, and a heat dissipation upper cover (2) and a water cooling bottom plate (3) which are arranged at the upper end and the lower end of the capacitor shell (1), wherein a heat conduction insulating pad (4), a laminated busbar (5) and an X capacitor core coil (6) are sequentially arranged in the capacitor shell (1) from bottom to top, an EMC module (7) comprising a Y capacitor (71), a bleeder resistor (72) and a PCB (73) is arranged on the laminated busbar (5), an epoxy packaging adhesive (8) is filled in the capacitor shell (1) to package the X capacitor core coil (6) and the EMC module (7), and a magnetic ring (9) is arranged on the surface of the capacitor shell (1) and used for an input terminal of the laminated busbar (5) to pass through;
the laminated busbar (5) comprises a negative bus copper bar (51), insulating paper (52) and a positive bus copper bar (53) which are sequentially stacked from bottom to top, wherein welding ends (54) are arranged at the edges of the negative bus copper bar (51) and the positive bus copper bar (53) and connected with the X capacitor core coil (6);
the negative electrode bus bar copper bar (51) is provided with a negative electrode input terminal (51.1) and a plurality of negative electrode output terminals (51.2), the positive electrode bus bar copper bar (53) is provided with a positive electrode input terminal (53.1) and a plurality of positive electrode output terminals (53.2), and the bottom of the capacitor shell (1) is provided with a plurality of grooves (11) for the negative electrode input terminal (51.1), the negative electrode output terminal (51.2), the positive electrode input terminal (53.1) and the positive electrode output terminal (53.2) to penetrate out;
the positive input terminal (51.1) and the negative input terminal (53.1) penetrate out from one end of the capacitor shell (1) along the length direction and then penetrate through the magnetic ring (9), and the negative output terminal (51.2) and the positive output terminal (53.2) both penetrate out from the same side of the capacitor shell (1);
EMC module (7) include two sets of Y electric capacity (71), two sets of bleeder resistance (72), a PCB board (73), a ground copper bar (74), PCB board (73) parallel arrangement is arranged in female (5) top of arranging of stromatolite, female negative bar copper bar (51) of arranging (5) of stromatolite are equipped with the negative pole and draw forth foot (51.3), female anodal bar copper bar (53) of arranging (5) of stromatolite are equipped with anodal pin (53.3) of drawing forth and support PCB board (73) and connect.
2. The thin film capacitor integrating EMC and bleeder functions as claimed in claim 1, wherein said Y capacitor (71), bleeder resistor (72), ground copper bar (74) and negative pin (51.3) and positive pin (53.3) are soldered on the PCB (73), said positive pin (53.3) is connected in series with one set of bleeder resistor (72), one set of Y capacitor (71) and ground copper bar (74), and said negative pin (51.3) is connected in series with the other set of bleeder resistor (72), the other set of Y capacitor (71) and ground copper bar (74).
3. The thin film capacitor with integrated EMC and bleeder functions of claim 1, wherein the water-cooled bottom plate (3) has a plurality of turbulence columns (31) spaced downward from a bottom surface thereof.
4. The thin-film capacitor with integrated EMC and bleeder functions of claim 1, wherein a temperature sensor (61) is arranged on the X capacitor core roll (6), and the temperature sensor (61) is provided with an outgoing line (62) leading out from the bottom of the capacitor case (1).
5. The thin film capacitor integrating EMC and bleeder functions as claimed in claim 1, wherein said capacitor case (1) is recessed at the top to form a mounting groove (12), said heat dissipating upper cover (2) is attached to the inside of the mounting groove (12), the outer wall of the bottom of said mounting groove (12) is attached to the top surface of the X capacitor core roll (6), and the bottom of said capacitor case (1) is fixedly connected to the water cooling bottom plate (3).
6. A motor controller, comprising a motor controller housing (20) provided with an upper cover (21) and the thin film capacitor (10) integrating EMC and bleeding functions as claimed in any one of claims 1 to 5, wherein the thin film capacitor (10) is located in the motor controller housing (20) and the bottom of the motor controller housing (20) is recessed to form a cooling water channel (22) matched with the water cooling bottom plate (3), the motor controller housing (20) and the water cooling bottom plate (3) are provided with a sealing ring (23) around the cooling water channel (22) to form a seal and fixedly connected, and a heat conducting pad is arranged between the heat dissipation upper cover (2) and the upper cover (21) of the thin film capacitor (10) for attachment.
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