CN115101343B - Film capacitor structure with Boost function and application method thereof - Google Patents
Film capacitor structure with Boost function and application method thereof Download PDFInfo
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- CN115101343B CN115101343B CN202210763716.1A CN202210763716A CN115101343B CN 115101343 B CN115101343 B CN 115101343B CN 202210763716 A CN202210763716 A CN 202210763716A CN 115101343 B CN115101343 B CN 115101343B
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- 239000003990 capacitor Substances 0.000 title claims abstract description 37
- 238000000034 method Methods 0.000 title claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 185
- 229910052802 copper Inorganic materials 0.000 claims abstract description 139
- 239000010949 copper Substances 0.000 claims abstract description 139
- 239000010408 film Substances 0.000 claims abstract description 56
- 239000010409 thin film Substances 0.000 claims abstract description 25
- 238000007599 discharging Methods 0.000 claims abstract description 20
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 17
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 17
- 230000017525 heat dissipation Effects 0.000 claims abstract description 17
- 239000000565 sealant Substances 0.000 claims description 15
- 238000002955 isolation Methods 0.000 claims description 6
- 239000003292 glue Substances 0.000 claims description 4
- 238000009413 insulation Methods 0.000 claims description 4
- 238000005192 partition Methods 0.000 claims description 4
- 238000011161 development Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004146 energy storage Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/33—Thin- or thick-film capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/08—Cooling arrangements; Heating arrangements; Ventilating arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/22—Electrostatic or magnetic shielding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/224—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The invention discloses a film capacitor structure with a Boost function, which comprises a shell, wherein a film core and positive and negative copper bars are arranged in the shell, the positive and negative copper bars are fixedly arranged on the film core, the positive and negative copper bars comprise an input end, a Boost negative copper bar and an output end, a magnetic ring is fixedly arranged on the shell, and the input end far away from one end of the shell penetrates through the magnetic ring. The thin film capacitor which can work in a discharging mode and a charging mode is achieved, meanwhile, the 800V voltage platform is met, the Boost function is achieved, and the heat dissipation structure of the thin film capacitor is optimized through the arrangement of the heat dissipation aluminum plate, the heat conduction pad and the like.
Description
Technical Field
The invention relates to the technical field of thin film capacitors, in particular to a thin film capacitor structure with a Boost function and a use method thereof.
Background
With the increasing development of new energy automobile industry, a motor controller is used as a key part of a new energy automobile driving system, in order to meet the requirement of faster and faster charging of the whole automobile, a motor controller of an 800V platform is gradually required by the market, and since the existing charging piles of the 800V platform on the market are not popularized, in order to enable the charging piles of the 400V platform on the market to charge the whole automobile of the 800V platform, a boosting charging module (boost) in the whole automobile is required to boost 400V voltage to 800V; and under the consideration of cost reduction, integrating a boost negative wire harness into a motor controller of an 800V platform, and connecting a boost positive wire harness to a motor three-phase star connection winding central point or a U-phase of a motor three-phase winding.
The film capacitor is used as a critical part in the controller for the driving motor and plays roles of energy storage, buffering, filtering and connecting a battery and an IGBT module. The structure of the thin film capacitor plays a key role in the layout of the overall controller. At present, a typical film capacitor in an automobile controller only works in a discharging mode, and current flows from a battery to the IGBT module after flowing through the film capacitor, and the film capacitor consists of an anode copper bar, a cathode copper bar, a film core, a plastic shell, pouring sealant and insulating paper. Therefore, a thin film capacitor with a Boost function, a compact structure and a good heat dissipation performance is needed to meet the development trend of integration and customization.
Disclosure of Invention
The invention aims to provide a film capacitor structure with a Boost function and a use method thereof, which can work in a discharging mode or a charging mode, simultaneously meet a 800V voltage platform and have the Boost function, and improve the heat dissipation capacity of the film capacitor.
In order to achieve the above purpose, the present invention provides a thin film capacitor structure with Boost function:
the novel solar cell comprises a shell, a film core and positive and negative copper bars are arranged in the shell, the positive and negative copper bars are fixedly arranged on the film core, each positive and negative copper bar comprises an input end, a boost negative copper bar and an output end, a magnetic ring is fixedly arranged on the shell, and the input end far away from one end of the shell penetrates through the magnetic ring.
Further, the input end comprises a positive input copper bar and a negative input copper bar, the output end comprises a positive output copper bar and a negative output copper bar,
The positive electrode input copper bar and the positive electrode output copper bar are the same positive electrode, the positive electrode input copper bar, the positive electrode output copper bar and the film core are physically connected,
The negative electrode input copper bar, the boost negative electrode copper bar and the negative electrode output copper bar are of the same negative polarity, and the negative electrode input copper bar, the negative electrode output copper bar, the boost negative electrode copper bar and the film core are in physical connection.
Furthermore, insulating paper I is arranged between the positive-polarity copper bar and the negative-polarity copper bar for high-voltage isolation.
Further, after the positive and negative electrode copper bars are welded with the film core, pouring sealant I is poured into the film core to fix the film core in the shell, and the film core is sealed by the pouring sealant I.
Further, the magnetic ring is fixed on the shell through a second pouring sealant.
Further, the magnetic ring is in a runway type or EI type or EE type.
Furthermore, a gap is reserved between the magnetic ring and the shell, or the heat insulation is performed by installing a plastic partition plate.
Further, the upper surface of the shell is provided with a heat dissipation aluminum plate fixed through pouring sealant three.
Further, a heat conducting pad or a heat conducting joint filling adhesive is arranged on the surface of the heat radiating aluminum plate.
Furthermore, insulating paper II is arranged between the heat dissipation aluminum plate and the anode and cathode copper bars for high-voltage isolation.
The invention also provides a use method of the thin film capacitor structure with the Boost function, which comprises the following steps:
in a discharging mode, after current flows into the film core in the shell through the input ends of the anode and cathode copper bars, the current flows out from the output ends of the anode and cathode copper bars;
in a charging mode, after current flows into a film core in the shell through the output end of the anode and cathode copper bars and the boost anode copper bar, the current flows out from the input end of the anode and cathode copper bar;
the shell is fixedly provided with a magnetic ring, and an input end far away from one end of the shell penetrates through the magnetic ring.
Further, in the discharging mode, after the current flows into the film core inside the shell through the positive electrode input copper bar and the negative electrode input copper bar, the current flows out from the positive electrode output copper bar and the negative electrode output copper bar;
In the charging mode, current flows into the film core in the shell through the positive electrode output copper bar and the boost negative electrode copper bar, and then flows out from the positive electrode input copper bar and the negative electrode input copper bar.
The invention has the technical effects and advantages that: the film capacitor can work in a discharging mode or a charging mode (the discharging mode refers to discharging of a battery, current flows through the controller and then controls the motor to drive the whole vehicle, the charging mode refers to discharging of a charging pile or a power grid, and current flows through the boost and then the controller to charge the battery). In a charging mode, the film capacitor supports a Boost function to raise a charging voltage; in order to restrain the influence of EMC electromagnetic interference in the charging and discharging working modes, the thin film capacitor integrates the magnetic ring, simultaneously meets the 800V voltage platform and has a Boost function, and optimizes the heat dissipation structure of the thin film capacitor through the arrangement of the heat dissipation aluminum plate, the heat conduction pad and the like.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention may be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
Drawings
The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate the invention and together with the embodiments of the invention, serve to explain the invention. In the drawings:
FIG. 1 is a schematic diagram of a thin film capacitor with Boost function according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a positive and negative electrode copper bar and a thin film core in an embodiment of the invention;
FIG. 3 is a cross-sectional view of a thin film capacitor with Boost function according to an embodiment of the present invention;
In the figure, 1, a shell; 2. a film core; 3. positive and negative copper bars; 31. an input end; 311. the anode inputs copper bars; 312. the negative electrode is input into a copper bar; 32. inputting a copper bar into a boost cathode; 33. an output end; 331. the anode outputs copper bars; 332. a negative electrode outputs copper bars; 4. a magnetic ring; 5. insulating paper I; 6. pouring sealant I; 7. and a heat dissipation aluminum plate.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In order to solve the defects in the prior art, the invention discloses a film capacitor structure with a Boost function, which is shown in fig. 1, and comprises a shell 1, wherein the shell 1 is generally made of plastic materials, mounting blocks for mounting are arranged at two ends of the shell, and mounting holes for mounting and fixing bolts are formed in the mounting blocks; the shell 1 is internally provided with a film core 2 and positive and negative electrode copper bars 3, the positive and negative electrode copper bars 3 are welded and fixed with the film core 2, and the positive and negative electrode copper bars 3 are positioned above the film core 2. The anode and cathode copper bar 3 comprises an input end 31, a boost anode copper bar 32 and an output end 33, wherein the boost anode copper bar 32 can be used for current input and current output; the input end 31 and the boost negative copper bar 32 are fixed on the positive and negative copper bar 3 at one end, and the other end passes through the shell 1 and is positioned outside the shell 1.
The input terminal 31 includes a positive input copper bar 311 and a negative input copper bar 312, and the output terminal 33 includes a positive output copper bar 331 and a negative output copper bar 332. An insulating paper I5 is arranged on the edge of one side of the anode and cathode copper bar 3, an input end 31 and a boost cathode copper bar 32 are arranged on one side of the anode and cathode copper bar 3, and the input end 31 and the boost cathode copper bar 32 are L-shaped, wherein an anode input copper bar 311 is positioned between a cathode input copper bar 312 and the boost cathode copper bar 32; the output end 33 is in an inverted L shape, one end of the output end 33 is fixed on the other side of the anode and cathode copper bar 3, and the other end of the output end 33 is bent and attached to the insulating paper I5; therefore, the positive-polarity copper bar and the negative-polarity copper bar are isolated by the insulating paper 5 at high voltage.
The positive input copper bar 311 and the positive output copper bar 331 are the same positive polarity, the positive input copper bar 311, the positive output copper bar 331 and the film core 2 are physically connected, the negative input copper bar 32, the boost negative copper bar 32 and the negative output copper bar 332 are the same negative polarity, and the negative input copper bar 32, the negative output copper bar 332, the boost negative copper bar 32 and the film core 2 are physically connected.
The shell 1 is also provided with a magnetic ring 4, the magnetic ring 4 is fixed on the shell 1 through a second pouring sealant, one end, far away from the input end 31 of the shell 1, of the magnetic ring 4 penetrates through the magnetic ring 4, the shape of the magnetic ring 4 can be of a runway type, an EI type or an EE type, the magnetic ring 4 in fig. 1 is of a runway type similar ellipse shape, and the magnetic ring 4 is adjacent to the boost negative electrode copper bar 32. In the charging mode, the frequency of the AC current converted DC current is very high, the charging frequency of an 800V voltage platform is about 30KHz, the loss of the magnetic ring 4 is higher than that of the discharging mode, the heating value is higher, and the service life and the reliability of the film core 2 are influenced in order to prevent the heat transfer of the magnetic ring 4 to the film core 2; so that a gap is left between the magnetic ring 4 and the shell 1 or a plastic partition board is adopted for heat insulation design.
As shown in fig. 2, the positive input copper bar 311 and the negative input copper bar 312 of the input terminal 31 are disposed on the same side of the positive and negative copper bars 3 as the boost negative copper bar 32, and the positive output copper bar 331 and the negative output copper bar 332 of the output terminal 33 are disposed on the other side of the positive and negative copper bars 3. Three groups of parallel output ends 33 are arranged on the positive and negative electrode copper bars 3, each group of output ends 33 comprises two positive electrode output copper bars 331 and one negative electrode output copper bar 332, and the negative electrode output copper bar 332 is positioned between the two positive electrode output copper bars 331; and insulating paper I5 is arranged between the negative electrode output copper bar 332 and the positive electrode output copper bar 331 for high-voltage isolation.
The thin film capacitor structure has two working modes, one is a discharging mode, and current flows out from the positive electrode input copper bar 311 and the negative electrode input copper bar 312, then passes through the internal thin film core 2, and then reaches the positive electrode output copper bar 331 and the negative electrode output copper bar 332. In the other charging mode, current flows from the positive output copper bar 331 and the boost negative copper bar 32, through the inner film core 2, and to the positive input copper bar 311 and the negative input copper bar 312.
As shown in fig. 3, the anode and cathode copper bars 3 and the film core 2 are integrally arranged in the shell 1 after being welded, and then are fixed in the shell 1 by filling with pouring sealant I6, and the film core 2 is sealed in the shell 1 by the pouring sealant I6; the upper surface of the shell 1 is provided with square mounting slots, the square mounting slots are used for mounting a heat-dissipating aluminum plate 7, the heat-dissipating aluminum plate 7 and the shell 1 are fixed together through filling and sealing glue three, the heat-dissipating aluminum plate 7 structure can reduce the heat resistance from the film core 2 to the outer surface, and meanwhile, the heat-conducting pad or heat-conducting caulking glue can be arranged on the surface of the heat-dissipating aluminum plate 7, so that the heat resistance is further reduced; and insulating paper II is arranged between the heat dissipation aluminum plate 7 and the positive and negative electrode copper bars 3 for high-voltage isolation.
The invention also discloses a using method of the thin film capacitor structure with the Boost function, which comprises the following steps: in the discharging mode, after current flows into the film core 2 in the shell 1 through the input end 31 of the anode and cathode copper bar 3, the current flows out from the output end 33 of the anode and cathode copper bar 3; in the charging mode, current flows into the film core 2 in the shell 1 through the output end 33 of the anode and cathode copper bar 3 and the boost anode copper bar 32, and then flows out from the input end 31 of the anode and cathode copper bar 3; the magnetic ring 4 is fixedly installed on the housing 1, and the input end 31 far away from one end of the housing 1 passes through the magnetic ring 4.
Specifically, in the discharge mode, after the current flows into the film core 2 inside the casing through the positive electrode input copper bar 311 and the negative electrode input copper bar 312, the current flows out from the positive electrode output copper bar 331 and the negative electrode output copper bar 332; in the charging mode, current flows into the film core in the case through the positive electrode output copper bar 331 and the boost negative electrode copper bar 32, and then flows out from the positive electrode input copper bar 311 and the negative electrode input copper bar 312.
According to the thin film capacitor structure with the Boost function, the thin film capacitor structure can work in a discharging mode and a charging mode (the discharging mode refers to discharging of a battery, current flows through a controller and then controls a motor to drive the whole vehicle, the charging mode refers to discharging of a charging pile or a power grid, and current flows through the Boost and then charges the battery to the controller). In a charging mode, the film capacitor supports a Boost function to raise a charging voltage; in order to restrain the influence of EMC electromagnetic interference in the charging and discharging working modes, the thin film capacitor integrates the magnetic ring, simultaneously meets the 800V voltage platform and has a Boost function, and optimizes the heat dissipation structure of the thin film capacitor through the arrangement of the heat dissipation aluminum plate, the heat conduction pad and the like.
Finally, it should be noted that: the foregoing description is only illustrative of the preferred embodiments of the present invention, and although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described, or equivalents may be substituted for elements thereof, and any modifications, equivalents, improvements or changes may be made without departing from the spirit and principles of the present invention.
Claims (7)
1. The utility model provides a take film capacitor structure of Boost function, its characterized in that includes casing (1), be equipped with film core (2) and positive negative pole copper bar (3) in casing (1), positive negative pole copper bar (3) fixed mounting in on film core (2), positive negative pole copper bar (3) include input (31), boost negative pole copper bar (32) and output (33), fixed mounting has magnetic ring (4) on casing (1), keep away from input (31) of casing (1) one end pass magnetic ring (4);
Wherein the input end (31) comprises a positive electrode input copper bar (311) and a negative electrode input copper bar (312), the output end (33) comprises a positive electrode output copper bar (331) and a negative electrode output copper bar (332),
The positive electrode input copper bar (311) and the positive electrode output copper bar (331) are of the same positive polarity, the positive electrode input copper bar (311), the positive electrode output copper bar (331) and the film core (2) are physically connected,
The negative electrode input copper bar (312), the boost negative electrode copper bar (32) and the negative electrode output copper bar (332) are of the same negative polarity, and the negative electrode input copper bar (312), the negative electrode output copper bar (332) and the boost negative electrode copper bar (32) are in physical connection with the film core (2);
the magnetic ring (4) is fixed on the shell (1) through a second pouring sealant; a gap is reserved between the magnetic ring (4) and the shell (1) or a plastic partition plate is arranged for heat insulation;
A heat dissipation aluminum plate (7) fixed through pouring sealant III is arranged on the upper surface of the shell (1); and a heat conduction pad or heat conduction joint filling glue is arranged on the surface of the heat dissipation aluminum plate (7).
2. The thin film capacitor structure with Boost function according to claim 1, wherein,
An insulating paper I (5) is arranged between the positive-polarity copper bar and the negative-polarity copper bar for high-voltage isolation.
3. The thin film capacitor structure with Boost function according to claim 1, wherein,
The positive and negative copper bars (3) are fixed inside the shell (1) by injecting pouring sealant I (6) after being welded with the film core (2), and the pouring sealant I (6) seals the inside of the film core (2).
4. A thin film capacitor structure with Boost function according to claim 2 or 3,
The shape of the magnetic ring (4) is a runway type, an EI type or an EE type.
5. A thin film capacitor structure with Boost function according to claim 2 or 3,
And insulating paper II is arranged between the heat dissipation aluminum plate (7) and the positive and negative copper bars (3) for high-voltage isolation.
6. A method for using a thin film capacitor structure with a Boost function is characterized by comprising the steps of,
In a discharging mode, after current flows into the film core (2) in the shell (1) through the input end (31) of the anode and cathode copper bar (3), the current flows out from the output end (33) of the anode and cathode copper bar (3);
In a charging mode, after current flows into the film core (2) in the shell (1) through the output end (33) of the anode and cathode copper bar (3) and the boost anode copper bar (32), the current flows out from the input end (31) of the anode and cathode copper bar (3);
Wherein, a magnetic ring (4) is fixedly arranged on the shell (1), and an input end (31) far away from one end of the shell (1) passes through the magnetic ring (4);
the input end (31) comprises a positive electrode input copper bar (311) and a negative electrode input copper bar (312), the output end (33) comprises a positive electrode output copper bar (331) and a negative electrode output copper bar (332),
The positive electrode input copper bar (311) and the positive electrode output copper bar (331) are of the same positive polarity, the positive electrode input copper bar (311), the positive electrode output copper bar (331) and the film core (2) are physically connected,
The negative electrode input copper bar (312), the boost negative electrode copper bar (32) and the negative electrode output copper bar (332) are of the same negative polarity, and the negative electrode input copper bar (312), the negative electrode output copper bar (332) and the boost negative electrode copper bar (32) are in physical connection with the film core (2);
the magnetic ring (4) is fixed on the shell (1) through a second pouring sealant; a gap is reserved between the magnetic ring (4) and the shell (1) or a plastic partition plate is arranged for heat insulation;
A heat dissipation aluminum plate (7) fixed through pouring sealant III is arranged on the upper surface of the shell (1); and a heat conduction pad or heat conduction joint filling glue is arranged on the surface of the heat dissipation aluminum plate (7).
7. The method of claim 6, wherein,
In a discharging mode, after current flows into the film core (2) in the shell through the positive electrode input copper bar (311) and the negative electrode input copper bar (312), the current flows out of the positive electrode output copper bar (331) and the negative electrode output copper bar (332);
in the charging mode, current flows into the film core in the shell through the positive electrode output copper bar (331) and the boost negative electrode copper bar (32), and then flows out of the positive electrode input copper bar (311) and the negative electrode input copper bar (312).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210763716.1A CN115101343B (en) | 2022-06-29 | 2022-06-29 | Film capacitor structure with Boost function and application method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210763716.1A CN115101343B (en) | 2022-06-29 | 2022-06-29 | Film capacitor structure with Boost function and application method thereof |
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| Publication Number | Publication Date |
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| CN115101343A CN115101343A (en) | 2022-09-23 |
| CN115101343B true CN115101343B (en) | 2024-05-10 |
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| JP4859443B2 (en) * | 2005-11-17 | 2012-01-25 | 日立オートモティブシステムズ株式会社 | Power converter |
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| CN114597064A (en) * | 2022-03-09 | 2022-06-07 | 深圳市汇北川电子技术有限公司 | Power film capacitor integrating EMC BOOST assembly and direct current supporting function |
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| CN115101343A (en) | 2022-09-23 |
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