JP2019096713A - Capacitor - Google Patents

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JP2019096713A
JP2019096713A JP2017224268A JP2017224268A JP2019096713A JP 2019096713 A JP2019096713 A JP 2019096713A JP 2017224268 A JP2017224268 A JP 2017224268A JP 2017224268 A JP2017224268 A JP 2017224268A JP 2019096713 A JP2019096713 A JP 2019096713A
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capacitor
capacitor element
electrode plate
resin
substrate portion
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JP6964336B2 (en
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明 藤井
Akira Fujii
明 藤井
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Shizuki Electric Co Inc
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Shizuki Electric Co Inc
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Abstract

To provide a capacitor capable of efficiently cooling an electrode plate.SOLUTION: The capacitor in which a capacitor element 2 is housed in a case 5 and filled with a resin 6, has an electrode plate 3 connected to the capacitor element 2. The electrode plate 3 includes: a substrate portion 3a which covers the capacitor element 2 from above; and a leg portion 3b in contact with the capacitor element 2 for floating the substrate portion 3a from the capacitor element 2. At least an upper surface of the substrate portion 3a is exposed to an outside of a resin 6.SELECTED DRAWING: Figure 3

Description

この発明は、コンデンサ素子と電極板とをケースに収容し樹脂を充填したコンデンサに関する。   The present invention relates to a capacitor in which a capacitor element and an electrode plate are housed in a case and filled with resin.

電極板をコンデンサ素子に重ねるようにして配置するとともに、これらコンデンサ素子と電極板とをケースに収容し樹脂を充填してなるコンデンサは、例えば特許文献１に示すように、従来から知られている。   A capacitor formed by stacking an electrode plate on a capacitor element and accommodating the capacitor element and the electrode plate in a case and filling a resin is conventionally known as shown in, for example, Patent Document 1. .

特開２０１７−１９５２８５号公報JP, 2017-195285, A

ところで、電極板を直接冷却すれば電流容量を大きく引き上げることができる。そのため、例えば大きなリップル電流が加わるＤＣリンクキャパシタとして使用することも可能となる。   By directly cooling the electrode plate, the current capacity can be greatly increased. Therefore, for example, it can be used as a DC link capacitor to which a large ripple current is added.

しかし、特許文献１に示すような構成のコンデンサの場合、電極板の大部分が樹脂に埋没しているため、電極板を効率良く冷却することが困難である。   However, in the case of the capacitor as shown in Patent Document 1, most of the electrode plate is buried in the resin, so it is difficult to efficiently cool the electrode plate.

そこで本発明は、電極板を効率良く冷却することができるコンデンサの提供を目的とする。   Then, an object of this invention is to provide the capacitor | condenser which can cool an electrode plate efficiently.

本発明のコンデンサは、コンデンサ素子２をケース５に収容し樹脂６を充填したコンデンサであって、該コンデンサが、コンデンサ素子２と接続される電極板３を有し、この電極板３が、コンデンサ素子２を上から覆う基板部３ａと、コンデンサ素子２と当接し、基板部３ａをコンデンサ素子２から浮かせる脚部３ｂとを備え、基板部３ａの少なくとも上面が樹脂６外に露出していることを特徴としている。   The capacitor of the present invention is a capacitor in which the capacitor element 2 is accommodated in the case 5 and filled with the resin 6, and the capacitor has the electrode plate 3 connected to the capacitor element 2, and the electrode plate 3 is a capacitor A substrate portion 3a covering the element 2 from above and a leg portion 3b which abuts the capacitor element 2 and floats the substrate portion 3a from the capacitor element 2 and at least the upper surface of the substrate portion 3a is exposed outside the resin 6 It is characterized by

また、脚部３ｂが、基板部３ａに設けられた開口３ｄ及び／又は切欠き３ｅの縁から延設されていることが好ましい。   Further, preferably, the leg portion 3b is extended from the edge of the opening 3d and / or the notch 3e provided in the substrate portion 3a.

本発明のコンデンサは、脚部によって基板部の少なくとも上面が樹脂外に露出しているため、電極板を効率良く冷却することができる。   In the capacitor of the present invention, at least the upper surface of the substrate portion is exposed to the outside of the resin by the leg portion, so that the electrode plate can be efficiently cooled.

開口や切欠きの縁から脚部を延設すれば、基板部の外周の縁にだけ脚部を設ける場合に比べて、基板部を安定して浮かせる（支持する）ことができ、面積の広い基板部を採用することができる。   By extending the legs from the edge of the opening or notch, the substrate can be stably floated (supported) as compared with the case where the legs are provided only on the outer peripheral edge of the substrate, and the area is large. A substrate part can be adopted.

この発明の一実施形態に係るコンデンサを示す分解斜視図である。It is an exploded perspective view showing a capacitor concerning one embodiment of this invention. 同じくそのコンデンサの斜視図である。Similarly, it is a perspective view of the capacitor. 同じくそのコンデンサの端面図である。It is an end elevation of the capacitor similarly. この発明の異なる実施形態に係るコンデンサの端面図である。FIG. 7 is an end view of a capacitor according to a different embodiment of the present invention. 切欠きを設けた電極板を示す斜視図である。It is a perspective view which shows the electrode plate which provided the notch.

次に、この発明のコンデンサ１の一実施形態を図面に基づいて詳細に説明する。この発明のコンデンサ１は、図１〜図３に示すように、複数のコンデンサ素子２と、これら複数のコンデンサ素子２を共通接続する一対の電極板３、４と、コンデンサ素子２を収容するケース５と、ケース５内に充填され、コンデンサ素子２を封止する樹脂６とを備えている。なお、以下、各構成部品について説明していくが、説明における「上下」の概念は、製造時、より具体的には樹脂充填時におけるものであって、必ずしも使用時の上下を規定するものではない。   Next, one embodiment of the capacitor 1 of the present invention will be described in detail based on the drawings. The capacitor 1 according to the present invention is, as shown in FIGS. 1 to 3, a case for housing a plurality of capacitor elements 2, a pair of electrode plates 3 and 4 commonly connecting the plurality of capacitor elements 2, and the capacitor element 2. And a resin 6 filled in the case 5 and sealing the capacitor element 2. Although each component will be described below, the concept of “upper and lower” in the description is at the time of manufacture, more specifically at the time of resin filling, and it is not necessarily defined at the time of use. Absent.

コンデンサ素子２は、例えば絶縁性のフィルムの表面に金属を蒸着した金属化フィルムを巻回することでなるフィルムコンデンサであって、図１に示すように、軸方向両端面に金属を溶射してなる電極部２ａ、２ｂがそれぞれ形成されている。このコンデンサ素子２は、軸方向から見ると扁平状、具体的には略トラック状（２本の平行線とその両端を半円でつないだ形状）であり、軸方向外周に平坦部２ｃと曲面部２ｄとを有している。   The capacitor element 2 is, for example, a film capacitor formed by winding a metallized film in which a metal is vapor-deposited on the surface of an insulating film, and as shown in FIG. The electrode portions 2a and 2b are formed respectively. The capacitor element 2 has a flat shape as viewed from the axial direction, specifically, a substantially track shape (a shape in which two parallel lines and both ends are connected by a semicircle), and the flat portion 2c and the curved surface And 2d.

上記構成のコンデンサ素子２は、電極部２ａ、２ｂを上下方向に向けた状態で複数並べられている。具体的には、平坦部２ｃ、２ｃ同士を互いに対向させるようにして複数（３個）のコンデンサ素子２が並べられることでコンデンサ素子列が形成されているとともに、曲面部２ｄ、２ｄ同士を互いに対向させるようにして複数（３個）のコンデンサ素子列が並べられることでコンデンサ素子群が形成されている。   A plurality of capacitor elements 2 of the above configuration are arranged in a state where the electrode parts 2a and 2b are directed in the vertical direction. Specifically, the capacitor element array is formed by arranging a plurality of (three) capacitor elements 2 so that flat portions 2c and 2c face each other, and the curved surface portions 2d and 2d are mutually different. A plurality of (three) capacitor element arrays are arranged to face each other to form a capacitor element group.

正負一対の電極板３、４は、例えば銅板やアルミニウム板等の導電性の板材（金属板）からなり、コンデンサ素子群を上下方向から挟むようにして配置されている。なお、以下、コンデンサ素子群の上側に位置する電極板を第１電極板３と称し、コンデンサ素子群の下側に位置する電極板を第２電極板４と称す。   The pair of positive and negative electrode plates 3 and 4 is made of, for example, a conductive plate material (metal plate) such as a copper plate or an aluminum plate, and is disposed so as to sandwich the capacitor element group in the vertical direction. Hereinafter, the electrode plate positioned on the upper side of the capacitor element group is referred to as the first electrode plate 3, and the electrode plate positioned on the lower side of the capacitor element group is referred to as the second electrode plate 4.

第１電極板３は、平面視、コンデンサ素子群を構成するコンデンサ素子２の全ての電極部２ａと対向することができる大きさを有している。この第１電極板３は、基板部３ａと、コンデンサ素子２と接続するための素子接続部３ｂと、コンデンサ素子２と外部機器（図示せず）とを接続するための外部接続部３ｃとを備えている。   The first electrode plate 3 has a size capable of facing all the electrode portions 2 a of the capacitor element 2 constituting the capacitor element group in plan view. The first electrode plate 3 includes a substrate portion 3a, an element connection portion 3b for connecting to the capacitor element 2, and an external connection portion 3c for connecting the capacitor element 2 to an external device (not shown). Have.

基板部３ａは平面視略矩形状であって、基板部３ａ単体で、平面視、コンデンサ素子群を構成するコンデンサ素子２の全ての電極部２ａと対向することができる大きさを有している。但し、素子接続部３ｂと合わせて全ての電極部２ａと対向できれば良い。この基板部３ａには、コンデンサ素子２の電極部２ａと対向する位置に開口３ｄが設けられている。具体的には、コンデンサ素子群を構成する９個のコンデンサ素子２のうち、６個のコンデンサ素子２の電極板と対向する位置に開口３ｄが設けられている。   The substrate portion 3a has a substantially rectangular shape in plan view, and the substrate portion 3a alone has a size that can face all the electrode portions 2a of the capacitor element 2 constituting the capacitor element group in plan view. . However, it suffices to be able to face all the electrode parts 2 a in combination with the element connection part 3 b. An opening 3 d is provided in the substrate portion 3 a at a position facing the electrode portion 2 a of the capacitor element 2. Specifically, an opening 3 d is provided at a position facing the electrode plate of six capacitor elements 2 among the nine capacitor elements 2 constituting the capacitor element group.

基板部３ａからは下方に向かって素子接続部３ｂが延設されている。具体的には、開口３ｄの縁から６個、コンデンサ素子２の電極部２ａと対向する基板部３ａの縁から３個それぞれ延設されている。この素子接続部３ｂは、図３に示すように、基板部３ａに対して略直交する垂直部３ｂ１と、垂直部３ｂ１の下端から水平方向に延設された水平部３ｂ２とを備えている。水平部３ｂ２は、コンデンサ素子２の電極部２ａとの接続に供される部分であって、はんだ付け等がし易いよう、舌状の小片３ｂ３が２つ設けられている（図１参照）。   An element connection portion 3b is extended downward from the substrate portion 3a. Specifically, six pieces extend from the edge of the opening 3 d and three pieces extend from the edge of the substrate portion 3 a facing the electrode portion 2 a of the capacitor element 2. As shown in FIG. 3, the element connection portion 3b includes a vertical portion 3b1 substantially orthogonal to the substrate portion 3a, and a horizontal portion 3b2 horizontally extended from a lower end of the vertical portion 3b1. The horizontal portion 3b2 is a portion provided for connection with the electrode portion 2a of the capacitor element 2, and two tongue-like small pieces 3b3 are provided for easy soldering and the like (see FIG. 1).

ところで、図３に示すように、基板部３ａの上面から素子接続部３ｂの下端にかけての垂直方向の長さＬ１は、コンデンサ素子２を覆う樹脂６の厚み（耐湿性を確保するために必要な樹脂厚）ｔ１よりも長い。そのため、コンデンサ素子２上に第１電極板３を載置すれば、少なくとも基板部３ａの上面は樹脂６外に露出することになる。すなわち素子接続部３ｂが、基板部３ａをコンデンサ素子２から浮かせる「脚部」として機能する。   By the way, as shown in FIG. 3, the length L1 in the vertical direction from the upper surface of the substrate portion 3a to the lower end of the element connection portion 3b is the thickness of the resin 6 covering the capacitor element 2 (necessary for securing moisture resistance Resin thickness) longer than t1. Therefore, when the first electrode plate 3 is placed on the capacitor element 2, at least the upper surface of the substrate portion 3 a is exposed to the outside of the resin 6. That is, the element connection portion 3 b functions as a “leg portion” for floating the substrate portion 3 a from the capacitor element 2.

外部接続部３ｃは、基板部３ａの、素子接続部３ｂが延設されている縁の反対側の縁から上方に向かって延設されている。なお、図１においては単なる平板状であるが、外部機器との接続を容易にするため、接続孔や接続片などを適宜設けても良い。   The external connection portion 3c is extended upward from the edge of the substrate portion 3a opposite to the edge where the element connection portion 3b is extended. In addition, although it is only flat form in FIG. 1, in order to make the connection with an external apparatus easy, you may provide a connection hole, a connection piece, etc. suitably.

第２電極板４についても、平面視、コンデンサ素子群を構成するコンデンサ素子２の全ての電極部２ｂと対向することができる大きさを有している。また、第１電極板３と同様に、基板部４ａと、コンデンサ素子２と接続するための素子接続部４ｂと、コンデンサ素子２と外部機器（図示せず）とを接続するための外部接続部４ｃとを備えている。素子接続部４ｂが垂直部を有していない点及び外部接続部４ｃの垂直方向の長さが長い点で第１電極板３と相違しているが、その他の構成については第１電極板３と略同様の構成であることから、同添え字を付し、詳細な説明は省略する。   The second electrode plate 4 also has a size that can face all the electrode portions 2 b of the capacitor element 2 constituting the capacitor element group in plan view. Further, similarly to the first electrode plate 3, the substrate portion 4a, an element connection portion 4b for connecting to the capacitor element 2, and an external connection portion for connecting the capacitor element 2 to an external device (not shown) And 4c. It differs from the first electrode plate 3 in that the element connection portion 4b does not have a vertical portion and the length in the vertical direction of the external connection portion 4c is long, but the other configurations are the first electrode plate 3 Since the configuration is substantially the same as that of the above, the same suffix is attached and the detailed description is omitted.

上記構成の電極板３、４は、１枚の金属板に対して適宜、打ち抜き加工や折り曲げ加工を施すことにより製造される。例えば、第１電極板３では、基板部３ａに開口３ｄを設ける際に、素子接続部３ｂとなる部分を残しておき、この残した部分を下方に向かって折り曲げることで素子接続部３ｂを形成している。但し、各部位を別々に製造し、それらを溶接等で一体化させても良い。例えば、素子接続部３ｂを硬質のリード線で作成しても良い。   The electrode plates 3 and 4 configured as described above are manufactured by appropriately performing punching and bending on a single metal plate. For example, in the first electrode plate 3, when the opening 3d is provided in the substrate portion 3a, a portion to be the element connection portion 3b is left, and the remaining portion is bent downward to form the element connection portion 3b. doing. However, each part may be separately manufactured and integrated by welding or the like. For example, the element connection portion 3b may be made of a hard lead wire.

ケース５は中空直方体状であって、平面視矩形状のケース底部５ａと、このケース底部５ａの四辺からそれぞれ立設されたケース側壁部５ｂとから構成されている。なお、ケース底部５ａと対向する面（上面側）には開口部５ｃが設けられている。このようなケース５は、例えば合成樹脂を一体成型することで製造される。ただ、金属板を加工して製造しても良い。ケース５内に充填される樹脂６は、例えばエポキシ樹脂である。ただ、これに限らず、ウレタン樹脂等、公知の種々の樹脂を使用しても良い。   The case 5 has a hollow rectangular parallelepiped shape, and includes a case bottom 5a having a rectangular shape in a plan view and a case side wall 5b erected from four sides of the case bottom 5a. An opening 5c is provided on the surface (upper surface side) facing the case bottom 5a. Such case 5 is manufactured, for example, by integrally molding a synthetic resin. However, it may be manufactured by processing a metal plate. The resin 6 filled in the case 5 is, for example, an epoxy resin. However, you may use not only this but urethane resin etc. well-known various resin.

次に、コンデンサ１の製造方法について説明する。まず、上記の通り、コンデンサ素子２を複数並べて、コンデンサ素子群を構成する。   Next, a method of manufacturing the capacitor 1 will be described. First, as described above, a plurality of capacitor elements 2 are arranged to form a capacitor element group.

次に、各電極板３、４とコンデンサ素子２とを接続する。この際、素子接続部３ｂが下になるようにして、第１電極板３をコンデンサ素子群の上側に配置し、第１電極板３の素子接続部３ｂとコンデンサ素子２の上側の電極部２ａとをはんだ付け等で接続する。また、外部接続部４ｃが上になるように、第２電極板４をコンデンサ素子群の下側に配置し、第２電極板４の素子接続部４ｂとコンデンサ素子２の下側の電極部２ｂとをはんだ付け等で接続する。   Next, the electrode plates 3 and 4 and the capacitor element 2 are connected. At this time, the first electrode plate 3 is disposed on the upper side of the capacitor element group so that the element connection portion 3b is on the lower side, and the element connection portion 3b of the first electrode plate 3 and the upper electrode portion 2a of the capacitor element 2 are arranged. Connect with by soldering etc. Further, the second electrode plate 4 is disposed below the capacitor element group so that the external connection portion 4c is on the upper side, and the element connection portion 4b of the second electrode plate 4 and the electrode portion 2b below the capacitor element 2 are provided. Connect with by soldering etc.

そして、一体となったコンデンサ素子２と電極板とをケース５内に収容する。この際、コンデンサ素子２の一方の電極部２ａと第１電極板３とがケース開口部５ｃ側に位置し、コンデンサ素子２の他方の電極部２ｂと第２電極板４とがケース底部５ａ側に位置するようにする。外部接続部３ｃ、４ｃについては、いずれもケース開口部５ｃからケース５外へと延出させる。そして、ケース５内に樹脂６を充填することでコンデンサ１の製造を完了する。樹脂６は、図２や図３に示すように、コンデンサ素子２や第２電極板４の大部分（外部接続部４ｃの上端側を除く部分）を埋没させる。一方で、第１電極板３は、素子接続部３ｂによって基板部３ａが浮かされているため、素子接続部３ｂの下端側を除いて樹脂６外に露出する。   Then, the integrated capacitor element 2 and the electrode plate are accommodated in the case 5. At this time, one electrode portion 2a of the capacitor element 2 and the first electrode plate 3 are located on the case opening 5c side, and the other electrode portion 2b of the capacitor element 2 and the second electrode plate 4 are on the case bottom 5a side To be located in The external connection portions 3c and 4c both extend out of the case 5 from the case opening 5c. Then, the resin 5 is filled in the case 5 to complete the manufacture of the capacitor 1. The resin 6 burys most of the capacitor element 2 and the second electrode plate 4 (a part excluding the upper end side of the external connection portion 4c) as shown in FIG. 2 and FIG. On the other hand, the first electrode plate 3 is exposed to the outside of the resin 6 except for the lower end side of the element connection portion 3b because the substrate portion 3a is floated by the element connection portion 3b.

このように、本発明のコンデンサ１では、第１電極板３の大部分を占める基板部３ａが樹脂６外に露出しているため、第１電極板３を効率良く冷却することができる。なお、冷却の方法としては、空冷の他、基板部３ａにヒートシンク等の冷却体を当接させるようにしても良い。   As described above, in the capacitor 1 of the present invention, since the substrate portion 3a that occupies most of the first electrode plate 3 is exposed outside the resin 6, the first electrode plate 3 can be cooled efficiently. In addition, as a method of cooling, in addition to air cooling, a cooling body such as a heat sink may be brought into contact with the substrate portion 3a.

以上に、この発明の実施形態について説明したが、この発明は上記実施形態に限定されるものではなく、この発明の範囲内で種々変更して実施することが可能である。例えば、上記実施形態では、第１電極板３の基板部３ａ全体が樹脂６外に露出しており、基板部３ａの下面と樹脂面との間に隙間が形成されていた（図３参照）が、図４に示すように、基板部３ａの上面のみを樹脂６外に露出させ、下面を樹脂６に埋没させても良い。すなわち、基板部３ａの下面と樹脂面との間に隙間を形成しなくても良い。第１電極板３の発熱が大きい場合には、コンデンサ素子２側への伝熱を避けるために、図３の形態を採用することが好ましい。一方で、コンデンサ素子２の発熱を、第１電極板３を介して外部に放出させたい場合には、基板部３ａ側への伝熱を促進する上で、図４の形態を採用することが好ましい。   As mentioned above, although embodiment of this invention was described, this invention is not limited to the said embodiment, It is possible to change variously within the scope of this invention, and to implement. For example, in the above embodiment, the entire substrate portion 3a of the first electrode plate 3 is exposed to the outside of the resin 6, and a gap is formed between the lower surface of the substrate portion 3a and the resin surface (see FIG. 3) However, as shown in FIG. 4, only the upper surface of the substrate portion 3 a may be exposed to the outside of the resin 6, and the lower surface may be buried in the resin 6. That is, it is not necessary to form a gap between the lower surface of the substrate portion 3a and the resin surface. When heat generation of the first electrode plate 3 is large, it is preferable to adopt the form of FIG. 3 in order to avoid heat transfer to the capacitor element 2 side. On the other hand, when it is desired to release the heat generation of the capacitor element 2 to the outside through the first electrode plate 3, the form of FIG. 4 may be adopted to promote heat transfer to the substrate portion 3a side. preferable.

また、第１電極板３の基板部３ａに開口３ｄを設け、開口３ｄの縁から素子接続部３ｂを延設していたが、図５に示すように、開口３ｄの代わりに、または開口３ｄとともに略コ字状や略Ｕ字状などの切欠き３ｅを設け、切欠き３ｅの縁から素子接続部３ｂを延設しても良い。   Further, although the opening 3d is provided in the substrate portion 3a of the first electrode plate 3 and the element connection portion 3b is extended from the edge of the opening 3d, instead of the opening 3d or as shown in FIG. At the same time, a notch 3e having a substantially U-shape or a substantially U-shape may be provided, and the element connection portion 3b may be extended from the edge of the notch 3e.

また、上記実施形態では、素子接続部３ｂが脚部を兼ねていたが、素子接続部と脚部とを別々に設けても良い。例えば、コンデンサ素子２の電極部２ａ，２ｂが上下方向ではなく、横方向に向いている場合、コンデンサ素子２の上（平坦部２ｃや曲面部２ｄ）に脚部を当接させて基板部３ａを樹脂６外に浮かせつつ、リード線などを用いて、コンデンサ素子２と第１電極板３とを接続するようにしても良い。なお、脚部は、少なくとも３個設けることが好ましい。これにより、コンデンサ素子２上に第１電極板３を安定して載置することができる。   Moreover, in the said embodiment, although the element connection part 3b served as the leg part, you may provide an element connection part and a leg separately. For example, when the electrode portions 2a and 2b of the capacitor element 2 are not in the vertical direction but in the lateral direction, the leg portion is brought into contact with the upper portion (flat portion 2c or curved portion 2d) of the capacitor element 2 and the substrate portion 3a The capacitor element 2 and the first electrode plate 3 may be connected using a lead wire or the like while floating the resin 6 out of the resin 6. Preferably, at least three legs are provided. Thereby, the first electrode plate 3 can be stably mounted on the capacitor element 2.

第２電極板４については、必ずしも設ける必要は無く、リード線などで代用しても良い。コンデンサ素子群におけるコンデンサ素子２の数については適宜変更可能である。また、コンデンサ素子２としてはフィルムコンデンサに限らず、セラミックコンデンサなど種々のコンデンサ素子２を用いても良い。形状についても、円柱状や角柱状など種々の形状を採用し得る。   The second electrode plate 4 is not necessarily provided, and may be substituted by a lead wire or the like. The number of capacitor elements 2 in the capacitor element group can be appropriately changed. The capacitor element 2 is not limited to a film capacitor, and various capacitor elements 2 such as a ceramic capacitor may be used. Also for the shape, various shapes such as a cylindrical shape and a prismatic shape can be adopted.

１ コンデンサ
２ コンデンサ素子
２ａ、２ｂ 電極部
２ｃ 平坦部
２ｄ 曲面部
３ 第１電極板
３ａ 基板部
３ｂ 素子接続部（脚部）
３ｂ１ 垂直部
３ｂ２ 水平部
３ｂ３ 小片
３ｃ 外部接続部
３ｄ 開口
３ｅ 切欠き
４ 第２電極板
４ａ 基板部
４ｂ 素子接続部
４ｃ 外部接続部
４ｄ 開口
５ ケース
５ａ ケース底部
５ｂ ケース側壁部
５ｃ 開口部
６ 充填樹脂
Ｌ１ 第１電極板の基板部の上面から素子接続部の下端までの長さ
ｔ１ 樹脂厚 DESCRIPTION OF SYMBOLS 1 capacitor 2 capacitor element 2a, 2b electrode part 2c flat part 2d curved part 3 1st electrode plate 3a board part 3b element connection part (leg part)
3b1 Vertical part 3b2 Horizontal part 3b3 Small piece 3c External connection part 3d Opening 3e Notch 4 Second electrode plate 4a Substrate part 4b Element connection part 4c External connection part 4d Opening 5 Case 5a Case bottom 5b Case side wall 5c Opening 6 Filled resin L1 Length t1 from the top surface of the substrate of the first electrode plate to the bottom of the element connection t1 Resin thickness

Claims (2)

コンデンサ素子（２）をケース（５）に収容し樹脂（６）を充填したコンデンサであって、
該コンデンサが、コンデンサ素子（２）と接続される電極板（３）を有し、
この電極板（３）が、コンデンサ素子（２）を上から覆う基板部（３ａ）と、コンデンサ素子（２）と当接し、基板部（３ａ）をコンデンサ素子（２）から浮かせる脚部（３ｂ）とを備え、
基板部（３ａ）の少なくとも上面が樹脂（６）外に露出していることを特徴とするコンデンサ。 A capacitor in which a capacitor element (2) is housed in a case (5) and filled with a resin (6),
The capacitor has an electrode plate (3) connected to the capacitor element (2);
The electrode plate (3) covers the capacitor element (2) from above, the substrate portion (3a), and the leg portion (3b) which abuts on the capacitor element (2) and floats the substrate portion (3a) from the capacitor element (2) And),
At least the upper surface of the substrate portion (3a) is exposed to the outside of the resin (6). 脚部（３ｂ）が、基板部（３ａ）に設けられた開口（３ｄ）及び／又は切欠き（３ｅ）の縁から延設されている、請求項１記載のコンデンサ。 The capacitor according to claim 1, wherein the leg (3b) extends from the edge of the opening (3d) and / or the notch (3e) provided in the base portion (3a).
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WO2022185803A1 (en) * 2021-03-02 2022-09-09 株式会社村田製作所 Capacitor module
EP4099352A4 (en) * 2020-02-27 2023-05-24 Nichicon Corporation Capacitor and method for manufacturing same
JP7508382B2 (en) 2021-02-03 2024-07-01 株式会社指月電機製作所 Capacitor

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Publication number Priority date Publication date Assignee Title
EP4099352A4 (en) * 2020-02-27 2023-05-24 Nichicon Corporation Capacitor and method for manufacturing same
US12100556B2 (en) 2020-02-27 2024-09-24 Nichicon Corporation Capacitor and method for manufacturing same
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