JP6679702B2 - 真空システム、基板搬送システム、電子デバイスの製造装置及び電子デバイスの製造方法 - Google Patents

真空システム、基板搬送システム、電子デバイスの製造装置及び電子デバイスの製造方法 Download PDF

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JP6679702B2
JP6679702B2 JP2018222244A JP2018222244A JP6679702B2 JP 6679702 B2 JP6679702 B2 JP 6679702B2 JP 2018222244 A JP2018222244 A JP 2018222244A JP 2018222244 A JP2018222244 A JP 2018222244A JP 6679702 B2 JP6679702 B2 JP 6679702B2
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Prior art keywords
substrate
vacuum container
alignment
vacuum
transfer system
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JP2018222244A
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Japanese (ja)
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JP2019192899A (ja
Inventor
卓也 有坂
卓也 有坂
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Canon Tokki Corp
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Canon Tokki Corp
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B37/00—Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00
    • F04B37/06—Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00 for evacuating by thermal means
    • F04B37/08—Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00 for evacuating by thermal means by condensing or freezing, e.g. cryogenic pumps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B37/00—Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00
    • F04B37/10—Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00 for special use
    • F04B37/14—Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00 for special use to obtain high vacuum
    • F04B37/16—Means for nullifying unswept space
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Electroluminescent Light Sources (AREA)
  • Compressors, Vaccum Pumps And Other Relevant Systems (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
JP2018222244A 2018-04-26 2018-11-28 真空システム、基板搬送システム、電子デバイスの製造装置及び電子デバイスの製造方法 Active JP6679702B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2018-0048567 2018-04-26
KR1020180048567A KR101943268B1 (ko) 2018-04-26 2018-04-26 진공 시스템, 기판 반송 시스템, 전자 디바이스의 제조 장치 및 전자 디바이스의 제조 방법

Publications (2)

Publication Number Publication Date
JP2019192899A JP2019192899A (ja) 2019-10-31
JP6679702B2 true JP6679702B2 (ja) 2020-04-15

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JP2018222244A Active JP6679702B2 (ja) 2018-04-26 2018-11-28 真空システム、基板搬送システム、電子デバイスの製造装置及び電子デバイスの製造方法

Country Status (3)

Country Link
JP (1) JP6679702B2 (zh)
KR (1) KR101943268B1 (zh)
CN (1) CN110416136B (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2021079617A1 (zh) 2019-10-23 2021-04-29
JP7446169B2 (ja) 2020-06-26 2024-03-08 キヤノントッキ株式会社 基板搬送装置、基板処理システム、基板搬送方法、電子デバイスの製造方法、プログラム及び記憶媒体
JP2022007540A (ja) * 2020-06-26 2022-01-13 キヤノントッキ株式会社 アライメント装置、成膜装置、アライメント方法、電子デバイスの製造方法、プログラム及び記憶媒体
KR20220124343A (ko) * 2021-03-03 2022-09-14 주식회사 엘지에너지솔루션 롤투롤 상태 전극의 진공건조장치 및 그 진공건조방법
CN114561626B (zh) * 2022-02-18 2024-03-15 华虹半导体(无锡)有限公司 物理气相沉积装置及装置的降压方法

Family Cites Families (15)

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Publication number Priority date Publication date Assignee Title
JP4006101B2 (ja) * 1998-06-26 2007-11-14 住友重機械工業株式会社 真空ポンプの制御装置
JP4343480B2 (ja) 2001-02-08 2009-10-14 株式会社半導体エネルギー研究所 成膜装置及び発光装置の作製方法
CN1723741B (zh) * 2002-12-12 2012-09-05 株式会社半导体能源研究所 发光装置、制造装置、成膜方法及清洁方法
JP4463492B2 (ja) * 2003-04-10 2010-05-19 株式会社半導体エネルギー研究所 製造装置
JP2006007149A (ja) * 2004-06-29 2006-01-12 Shin Meiwa Ind Co Ltd 真空成膜装置用コールドトラップ及び真空成膜装置用排気システム
JP4592021B2 (ja) * 2006-06-29 2010-12-01 トッキ株式会社 アライメント装置及び方法
JP4413953B2 (ja) * 2007-07-10 2010-02-10 株式会社アルバック 欠落部分を有する欠落被搬送体の検出方法
JP2009270139A (ja) 2008-05-01 2009-11-19 Seiko Epson Corp スパッタ装置
JP2010013715A (ja) 2008-07-07 2010-01-21 Seiko Epson Corp 成膜方法、および成膜装置
KR101279184B1 (ko) * 2008-09-30 2013-06-26 캐논 아네르바 가부시키가이샤 진공 배기 시스템, 진공 배기 시스템의 운전 방법, 냉동기, 진공 배기 펌프, 냉동기의 운전 방법, 2단식 냉동기의 운전 제어 방법, 크라이오 펌프의 운전 제어 방법, 2단식 냉동기, 크라이오 펌프, 기판 처리 장치, 전자 디바이스의 제조 방법
JP2010121215A (ja) * 2010-01-14 2010-06-03 Semiconductor Energy Lab Co Ltd 蒸着装置および蒸着方法
JP2013060853A (ja) * 2011-09-13 2013-04-04 Hitachi High-Technologies Corp 真空処理装置及び真空処理方法
KR102185752B1 (ko) * 2011-10-26 2020-12-02 브룩스 오토메이션 인코퍼레이티드 반도체 웨이퍼 취급 및 이송
JP6185498B2 (ja) * 2015-02-12 2017-08-23 株式会社半導体エネルギー研究所 蒸着用マスク
JP6705810B2 (ja) * 2015-04-13 2020-06-03 株式会社半導体エネルギー研究所 半導体装置

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Publication number Publication date
JP2019192899A (ja) 2019-10-31
CN110416136B (zh) 2023-05-30
KR101943268B1 (ko) 2019-01-28
CN110416136A (zh) 2019-11-05

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