JP6677873B2 - 錫又は錫合金めっき液及び該液を用いたバンプの形成方法 - Google Patents

錫又は錫合金めっき液及び該液を用いたバンプの形成方法 Download PDF

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Publication number
JP6677873B2
JP6677873B2 JP2019040216A JP2019040216A JP6677873B2 JP 6677873 B2 JP6677873 B2 JP 6677873B2 JP 2019040216 A JP2019040216 A JP 2019040216A JP 2019040216 A JP2019040216 A JP 2019040216A JP 6677873 B2 JP6677873 B2 JP 6677873B2
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JP
Japan
Prior art keywords
tin
plating solution
acid
benzalacetone
bump
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Active
Application number
JP2019040216A
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English (en)
Japanese (ja)
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JP2019173162A (ja
JP2019173162A5 (https=
Inventor
康司 巽
康司 巽
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Materials Corp
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Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Priority to KR1020207024682A priority Critical patent/KR20200133330A/ko
Priority to PCT/JP2019/011348 priority patent/WO2019181905A1/ja
Priority to US16/979,717 priority patent/US20210040636A1/en
Priority to EP19772301.8A priority patent/EP3770305A4/en
Priority to US16/768,921 priority patent/US11053600B2/en
Priority to TW108109401A priority patent/TWI754135B/zh
Priority to CN201980015474.4A priority patent/CN111788337A/zh
Priority to PCT/JP2019/011349 priority patent/WO2019181906A1/ja
Priority to TW108109402A priority patent/TWI703239B/zh
Publication of JP2019173162A publication Critical patent/JP2019173162A/ja
Publication of JP2019173162A5 publication Critical patent/JP2019173162A5/ja
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Publication of JP6677873B2 publication Critical patent/JP6677873B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/221—Structures or relative sizes
    • H10W72/227—Multiple bumps having different sizes

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  • Electroplating And Plating Baths Therefor (AREA)
JP2019040216A 2018-03-20 2019-03-06 錫又は錫合金めっき液及び該液を用いたバンプの形成方法 Active JP6677873B2 (ja)

Priority Applications (9)

Application Number Priority Date Filing Date Title
CN201980015474.4A CN111788337A (zh) 2018-03-20 2019-03-19 锡或锡合金电镀液、凸点的形成方法及电路基板的制造方法
US16/979,717 US20210040636A1 (en) 2018-03-20 2019-03-19 Tin or tin-alloy plating liquid, bump forming method, and circuit board production method
EP19772301.8A EP3770305A4 (en) 2018-03-20 2019-03-19 TIN OR TIN ALLOY PLATING LIQUID, BUMPER MOLDING DEVICE AND METHOD OF MANUFACTURING A CIRCUIT BOARD
US16/768,921 US11053600B2 (en) 2018-03-20 2019-03-19 Tin or tin alloy plating solution and bump forming method
TW108109401A TWI754135B (zh) 2018-03-20 2019-03-19 錫或錫合金的鍍敷液、凸塊的形成方法、電路基板的製造方法
TW108109402A TWI703239B (zh) 2018-03-20 2019-03-19 錫或錫合金鍍敷液及凸塊的形成方法
KR1020207024682A KR20200133330A (ko) 2018-03-20 2019-03-19 주석 또는 주석 합금의 도금액, 범프의 형성 방법, 회로 기판의 제조 방법
PCT/JP2019/011349 WO2019181906A1 (ja) 2018-03-20 2019-03-19 錫又は錫合金めっき液、及びバンプの形成方法
PCT/JP2019/011348 WO2019181905A1 (ja) 2018-03-20 2019-03-19 錫又は錫合金のめっき液、バンプの形成方法、回路基板の製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018057551 2018-03-26
JP2018057551 2018-03-26

Publications (3)

Publication Number Publication Date
JP2019173162A JP2019173162A (ja) 2019-10-10
JP2019173162A5 JP2019173162A5 (https=) 2019-11-21
JP6677873B2 true JP6677873B2 (ja) 2020-04-08

Family

ID=68169564

Family Applications (1)

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JP2019040216A Active JP6677873B2 (ja) 2018-03-20 2019-03-06 錫又は錫合金めっき液及び該液を用いたバンプの形成方法

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JP (1) JP6677873B2 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7455675B2 (ja) * 2020-06-04 2024-03-26 上村工業株式会社 錫または錫合金めっき浴
CN113652719B (zh) * 2021-08-13 2024-01-19 广西隆林利通线缆科技有限公司 用于铜线镀锡的电镀液及铜线电镀锡的方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006348347A (ja) * 2005-06-16 2006-12-28 Nippon Mektron Ltd 電子部品の表面処理方法
JP5658442B2 (ja) * 2009-06-02 2015-01-28 株式会社東芝 電子部品とその製造方法
EP2405468A1 (en) * 2010-07-05 2012-01-11 ATOTECH Deutschland GmbH Method to form solder deposits on substrates
JP5033979B1 (ja) * 2011-09-29 2012-09-26 ユケン工業株式会社 スズからなるめっき用酸性水系組成物
JP6834070B2 (ja) * 2016-06-13 2021-02-24 石原ケミカル株式会社 電気スズ及びスズ合金メッキ浴、当該メッキ浴を用いて電着物を形成した電子部品の製造方法

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JP2019173162A (ja) 2019-10-10

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