JP6646799B1 - 巻取式成膜装置及び巻取式成膜方法 - Google Patents
巻取式成膜装置及び巻取式成膜方法 Download PDFInfo
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- JP6646799B1 JP6646799B1 JP2019556727A JP2019556727A JP6646799B1 JP 6646799 B1 JP6646799 B1 JP 6646799B1 JP 2019556727 A JP2019556727 A JP 2019556727A JP 2019556727 A JP2019556727 A JP 2019556727A JP 6646799 B1 JP6646799 B1 JP 6646799B1
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- 238000004804 winding Methods 0.000 title claims abstract description 86
- 238000000034 method Methods 0.000 title claims description 16
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 claims abstract description 206
- 229910052744 lithium Inorganic materials 0.000 claims abstract description 206
- 238000012546 transfer Methods 0.000 claims abstract description 42
- 238000001704 evaporation Methods 0.000 claims abstract description 9
- 239000010410 layer Substances 0.000 claims description 52
- 239000011241 protective layer Substances 0.000 claims description 41
- 238000007740 vapor deposition Methods 0.000 claims description 41
- 230000008021 deposition Effects 0.000 claims description 13
- 238000007781 pre-processing Methods 0.000 claims description 8
- 238000004140 cleaning Methods 0.000 claims description 3
- 238000011144 upstream manufacturing Methods 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 description 22
- 239000007789 gas Substances 0.000 description 21
- 230000001681 protective effect Effects 0.000 description 16
- 229910052751 metal Inorganic materials 0.000 description 15
- 239000002184 metal Substances 0.000 description 15
- 238000000151 deposition Methods 0.000 description 13
- 238000002844 melting Methods 0.000 description 11
- 230000008018 melting Effects 0.000 description 11
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 9
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 8
- 238000010586 diagram Methods 0.000 description 8
- 230000003685 thermal hair damage Effects 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 230000008020 evaporation Effects 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- -1 polypropylene Polymers 0.000 description 5
- 230000009257 reactivity Effects 0.000 description 5
- 229910002092 carbon dioxide Inorganic materials 0.000 description 4
- 239000001569 carbon dioxide Substances 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 239000011261 inert gas Substances 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 239000007790 solid phase Substances 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 239000012071 phase Substances 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 238000001771 vacuum deposition Methods 0.000 description 3
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910002091 carbon monoxide Inorganic materials 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007791 liquid phase Substances 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910001868 water Inorganic materials 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 229910018068 Li 2 O Inorganic materials 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000007774 anilox coating Methods 0.000 description 1
- 229910000963 austenitic stainless steel Inorganic materials 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- XUCJHNOBJLKZNU-UHFFFAOYSA-M dilithium;hydroxide Chemical compound [Li+].[Li+].[OH-] XUCJHNOBJLKZNU-UHFFFAOYSA-M 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- XGZVUEUWXADBQD-UHFFFAOYSA-L lithium carbonate Chemical compound [Li+].[Li+].[O-]C([O-])=O XGZVUEUWXADBQD-UHFFFAOYSA-L 0.000 description 1
- 229910052808 lithium carbonate Inorganic materials 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000001883 metal evaporation Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
- BHZCMUVGYXEBMY-UHFFFAOYSA-N trilithium;azanide Chemical compound [Li+].[Li+].[Li+].[NH2-] BHZCMUVGYXEBMY-UHFFFAOYSA-N 0.000 description 1
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- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
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- B41M1/30—Printing on other surfaces than ordinary paper on organic plastics, horn or similar materials
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- B65H20/00—Advancing webs
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Abstract
Description
上記真空容器は、減圧状態を維持することができる。
上記フィルム走行機構は、上記真空容器内でフィルムを走行させることができる。
上記リチウム源は、上記真空容器内でリチウムを蒸発させることができる。
上記第1ローラは、上記フィルムの成膜面と上記リチウム源との間に配置されている。上記第1ローラは、上記リチウム源から蒸発した上記リチウムを受容する転写パターンを有する。上記第1ローラは、上記転写パターンに対応するリチウム層のパターンを上記成膜面に回転しながら転写する。
このような巻取式成膜装置によれば、上記第1ローラに上記フィルムを介して上記第2ローラが接する。これにより、上記第1ローラから上記フィルムの上記成膜面により鮮明にリチウム層のパターンが転写される。
このような巻取式成膜装置によれば、上記蒸着容器から上記第1ローラに供給された上記リチウムの厚さが上記ドクターブレードによって確実に制御される。
このような巻取式成膜装置によれば、上記蒸着容器から上記第1ローラに供給された上記リチウムの厚さが上記ドクターブレード及び上記第3ローラによってより確実に制御される。
このような巻取式成膜装置によれば、上記蒸着容器から上記第1ローラに供給された上記リチウムの厚さが上記第3ローラ及び上記第4ローラによってより確実に制御される。また、上記第4ローラを介在させることによって、上記フィルムへの熱損傷がさらに抑制される。
このような巻取式成膜装置によれば、上記リチウム層の上記パターンが上記第1ローラから上記フィルムの上記成膜面に転写される前に、上記フィルムの上記成膜面がクリーニングされる。これにより、上記リチウム層と上記フィルムとの密着力が増加する。
このような巻取式成膜装置によれば、上記リチウム層の上記パターンが上記第1ローラから上記フィルムの上記成膜面に転写された後に、上記リチウム層が上記保護層により保護される。
このような巻取式成膜装置によれば、上記保護層形成機構が上記隔離板によって隔離され、上記リチウム層内に保護層の成分が混入しにくくなる。
このような巻取式成膜方法によれば、蒸着した上記リチウムが上記転写パターンを有する上記第1ローラに供給され、上記リチウム層の上記パターンが上記第1ローラから上記フィルムの上記成膜面に間接的に転写される。つまり、真空蒸着および塗布によって上記フィルムの上記成膜面にリチウム層がパターニングされる。これにより、上記フィルムへの熱損傷が抑制される。
図1は、第1実施形態に係る巻取式成膜装置の概略構成図である。
これにより、蒸着容器21から蒸発したリチウム25のローラ面23rへの付着、および、第3ローラ23において溶融したリチウム25の第1ローラ11Aへの供給が実現される。
蒸着容器21は例えば、オーステナイト系ステンレス鋼から成る。
図2は、第1実施形態に係る巻取式成膜方法を示す概略フロー図である。
第1実施形態に係る巻取式成膜方法では、例えば、減圧状態が維持可能な真空容器70内で、フィルム走行機構30によってフィルム60を走行させる(ステップS10)。
次に、第3ローラ23に、リチウム源20(蒸着容器21)から蒸発したリチウム25が付着する(ステップS20)。第3ローラ23の温調機構により、第3ローラ23に付着したリチウム25は溶融状態に維持される。
その次に、第1ローラ11Aを回転させつつ、フィルム60の成膜面60dに転写パターンに対応するリチウム層のパターンを接触させて、転写パターンに対応するリチウム層のパターンが成膜面60dに転写される(ステップS40)。
真空蒸着および塗布によってフィルム60の成膜面60dにリチウム層がパターニングされる。これにより、フィルム60への熱損傷が抑制される。
図3は、第1実施形態に係る巻取式成膜装置の動作を示す概略構成図である。
この後、リチウム層のパターン25pが第1ローラ11Aからフィルム60の成膜面60dに転写される。
図4は、第2実施形態に係る巻取式成膜装置の概略構成図である。
図5は、第3実施形態に係る巻取式成膜装置の概略構成図である。
図7は、第4実施形態に係る巻取式成膜装置の一部の概略構成図である。図7には、巻取りローラ32の周辺が示されている。
11A、11B…第1ローラ
11r…ローラ面
11p…転写パターン
12…第2ローラ
12r…ローラ面
20…リチウム源
21…蒸着容器
22…ドクターブレード
23…第3ローラ
23r…ローラ面
24…第4ローラ
24r…ローラ面
25…リチウム
25p…パターン
30…フィルム走行機構
31…巻出しローラ
32…巻取りローラ
33a、33b、33c、33d、33e、33f、33g…ガイドローラ
40…前処理機構
50…保護層形成機構
51A…保護層形成部
51B…保護層形成部
52…保護フィルム形成部
53…巻出しローラ
54…保護フィルム
55、56…ガイドローラ
57…ガス供給機構
58…隔離板
60…フィルム
60d…成膜面
70…真空容器
70s…空間
71…排気機構
72…ガス供給機構
Claims (9)
- 減圧状態を維持することが可能な真空容器と、
前記真空容器内でフィルムを走行させることが可能なフィルム走行機構と、
前記真空容器内でリチウムを蒸発させることが可能なリチウム源と、
前記フィルムの成膜面と前記リチウム源との間に配置され、前記リチウム源から蒸発した前記リチウムを受容する転写パターンを有し、前記転写パターンに対応するリチウム層のパターンを前記成膜面に回転しながら転写する第1ローラと
を具備する巻取式成膜装置。 - 請求項1に記載の巻取式成膜装置であって、
前記第1ローラに前記フィルムを介して対向する第2ローラをさらに具備する
巻取式成膜装置。 - 請求項1または2に記載された巻取式成膜装置であって、
前記リチウム源は、
前記リチウムを収容し、前記リチウムが前記第1ローラに蒸着されるように配置された蒸着容器と、
前記蒸着容器から前記第1ローラに供給された前記リチウムの厚さを制御するドクターブレードと、を有する
巻取式成膜装置。 - 請求項1または2に記載の巻取式成膜装置であって、
前記リチウム源は、
前記第1ローラに対向する第3ローラと、
前記リチウムを収容し、前記リチウムが前記第3ローラに蒸着されるように配置された蒸着容器と、
前記蒸着容器から前記第3ローラに供給された前記リチウムの厚さを制御するドクターブレードと、を有する
巻取式成膜装置。 - 請求項1または2に記載の巻取式成膜装置であって、
前記リチウム源は、
前記第1ローラに対向する第3ローラと、
前記第3ローラに対向する第4ローラと、
前記リチウムを収容し、前記リチウムが前記第4ローラに蒸着されるように配置された蒸着容器と、を有する
巻取式成膜装置。 - 請求項1〜5のいずれか1つに記載の巻取式成膜装置であって、
前記第1ローラの上流に、前記フィルムの前記成膜面のクリーニングを行う前処理機構をさらに具備する
巻取式成膜装置。 - 請求項1〜6のいずれか1つに記載の巻取式成膜装置であって、
前記第1ローラの下流に、前記リチウム層の表面に保護層を形成する保護層形成機構をさらに具備する
巻取式成膜装置。 - 請求項7に記載の巻取式成膜装置であって、
前記真空容器内において、前記保護層形成機構が隔離される隔離板をさらに具備する
巻取式成膜装置。 - 減圧状態が維持可能な真空容器内でフィルムを走行させ、
転写パターンが形成された第1ローラに、蒸発したリチウムを供給し、
前記第1ローラを回転させつつ、前記フィルムの成膜面に前記転写パターンに対応するリチウム層のパターンを接触させて、前記リチウム層のパターンを前記成膜面に転写する
巻取式成膜方法。
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JP2004091805A (ja) * | 2002-08-29 | 2004-03-25 | Matsushita Electric Ind Co Ltd | 真空蒸着装置 |
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