JP6640848B2 - 流体をスプレー本体の下方へ且つ入口ポートへ向けて誘導するように方向付けられた流体出口を採用する研磨パッド洗浄システム、及びそれに関連する方法 - Google Patents

流体をスプレー本体の下方へ且つ入口ポートへ向けて誘導するように方向付けられた流体出口を採用する研磨パッド洗浄システム、及びそれに関連する方法 Download PDF

Info

Publication number
JP6640848B2
JP6640848B2 JP2017522156A JP2017522156A JP6640848B2 JP 6640848 B2 JP6640848 B2 JP 6640848B2 JP 2017522156 A JP2017522156 A JP 2017522156A JP 2017522156 A JP2017522156 A JP 2017522156A JP 6640848 B2 JP6640848 B2 JP 6640848B2
Authority
JP
Japan
Prior art keywords
fluid
inlet port
group
spray
spray body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2017522156A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017532790A5 (OSRAM
JP2017532790A (ja
Inventor
ポール ディー． バターフィールド，
ポール ディー． バターフィールド，
ショウ−サン チャン，
ショウ−サン チャン，
ボム ジク キム，
ボム ジク キム，
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of JP2017532790A publication Critical patent/JP2017532790A/ja
Publication of JP2017532790A5 publication Critical patent/JP2017532790A5/ja
Application granted granted Critical
Publication of JP6640848B2 publication Critical patent/JP6640848B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/02—Devices or means for dressing or conditioning abrasive surfaces of plane surfaces on abrasive tools
    • H10P52/402—

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
JP2017522156A 2014-10-24 2015-08-13 流体をスプレー本体の下方へ且つ入口ポートへ向けて誘導するように方向付けられた流体出口を採用する研磨パッド洗浄システム、及びそれに関連する方法 Active JP6640848B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/523,482 2014-10-24
US14/523,482 US9687960B2 (en) 2014-10-24 2014-10-24 Polishing pad cleaning systems employing fluid outlets oriented to direct fluid under spray bodies and towards inlet ports, and related methods
PCT/US2015/044970 WO2016064467A1 (en) 2014-10-24 2015-08-13 Polishing pad cleaning systems employing fluid outlets oriented to direct fluid under spray bodies and towards inlet ports, and related methods

Publications (3)

Publication Number Publication Date
JP2017532790A JP2017532790A (ja) 2017-11-02
JP2017532790A5 JP2017532790A5 (OSRAM) 2018-09-20
JP6640848B2 true JP6640848B2 (ja) 2020-02-05

Family

ID=55761295

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017522156A Active JP6640848B2 (ja) 2014-10-24 2015-08-13 流体をスプレー本体の下方へ且つ入口ポートへ向けて誘導するように方向付けられた流体出口を採用する研磨パッド洗浄システム、及びそれに関連する方法

Country Status (6)

Country Link
US (1) US9687960B2 (OSRAM)
JP (1) JP6640848B2 (OSRAM)
KR (1) KR102399846B1 (OSRAM)
CN (1) CN107078045B (OSRAM)
TW (1) TWI698305B (OSRAM)
WO (1) WO2016064467A1 (OSRAM)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102447790B1 (ko) * 2014-12-12 2022-09-27 어플라이드 머티어리얼스, 인코포레이티드 Cmp 동안의 인 시튜 부산물 제거 및 플래튼 냉각을 위한 시스템 및 프로세스
KR102401388B1 (ko) 2016-06-24 2022-05-24 어플라이드 머티어리얼스, 인코포레이티드 화학적 기계적 연마를 위한 슬러리 분배 디바이스
JP7083722B2 (ja) * 2018-08-06 2022-06-13 株式会社荏原製作所 研磨装置、及び、研磨方法
JP7162465B2 (ja) * 2018-08-06 2022-10-28 株式会社荏原製作所 研磨装置、及び、研磨方法
JP7492854B2 (ja) * 2020-05-11 2024-05-30 株式会社荏原製作所 研磨装置及び研磨方法
US12240078B2 (en) * 2020-06-24 2025-03-04 Applied Materials, Inc. Cleaning system for polishing liquid delivery arm
US11577358B2 (en) * 2020-06-30 2023-02-14 Applied Materials, Inc. Gas entrainment during jetting of fluid for temperature control in chemical mechanical polishing
US11724355B2 (en) 2020-09-30 2023-08-15 Applied Materials, Inc. Substrate polish edge uniformity control with secondary fluid dispense
KR20220073192A (ko) * 2020-11-26 2022-06-03 에스케이실트론 주식회사 연마 패드 세정 장치 및 연마 장치
JP7592362B2 (ja) * 2021-02-02 2024-12-02 株式会社ディスコ 研削方法
CN113977458B (zh) * 2021-11-25 2022-12-02 中国计量科学研究院 抛光液注入装置及抛光系统
CN114888722B (zh) * 2022-05-17 2024-11-22 华海清科股份有限公司 一种化学机械抛光方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5616069A (en) * 1995-12-19 1997-04-01 Micron Technology, Inc. Directional spray pad scrubber
JP3511442B2 (ja) * 1996-12-18 2004-03-29 忠弘 大見 洗浄やエッチング、現像、剥離等を含むウエット処理に用いる省液型の液体供給ノズル、省液型の液体供給ノズル装置及びウエット処理装置
US5916010A (en) * 1997-10-30 1999-06-29 International Business Machines Corporation CMP pad maintenance apparatus and method
JPH11291155A (ja) * 1998-04-10 1999-10-26 Hitachi Cable Ltd 脆性材料研磨用定盤の掃除方法及びその装置並びに研磨装置
JP2001277095A (ja) * 2000-03-31 2001-10-09 Mitsubishi Materials Corp パッドコンディショニング装置及びパッドコンディショニング方法
JP2001237204A (ja) * 2000-02-22 2001-08-31 Hitachi Ltd 半導体装置の製造方法
US6669538B2 (en) * 2000-02-24 2003-12-30 Applied Materials Inc Pad cleaning for a CMP system
US6626743B1 (en) * 2000-03-31 2003-09-30 Lam Research Corporation Method and apparatus for conditioning a polishing pad
US6824448B1 (en) 2001-05-31 2004-11-30 Koninklijke Philips Electronics N.V. CMP polisher substrate removal control mechanism and method
KR100500517B1 (ko) 2002-10-22 2005-07-12 삼성전자주식회사 반도체 웨이퍼용 ｃｍｐ 설비
JP2004228301A (ja) * 2003-01-22 2004-08-12 Sharp Corp 基板処理装置および基板処理方法
US6884152B2 (en) * 2003-02-11 2005-04-26 Micron Technology, Inc. Apparatuses and methods for conditioning polishing pads used in polishing micro-device workpieces
US7004820B1 (en) 2005-05-26 2006-02-28 United Microelectronics Corp. CMP method and device capable of avoiding slurry residues
KR20070121146A (ko) * 2006-06-21 2007-12-27 삼성전자주식회사 화학적 기계적 연마설비의 슬러리 공급장치
KR20100034618A (ko) 2008-09-24 2010-04-01 주식회사 하이닉스반도체 연마 패드의 세정방법
KR101130888B1 (ko) 2010-05-10 2012-03-28 주식회사 케이씨텍 화학 기계적 연마 장치의 캐리어 헤드의 세정 유닛 및 이를 이용한 이동식 화학 기계적 연마 시스템
CN102553849B (zh) * 2010-12-29 2015-04-29 中芯国际集成电路制造(上海)有限公司 一种固定研磨粒抛光垫清洗装置及清洗方法
US20140148822A1 (en) * 2012-11-26 2014-05-29 Nahayan Ameen Abdulla Ibrahim Al Mahza Method and apparatus for polishing human skin

Also Published As

Publication number Publication date
KR102399846B1 (ko) 2022-05-20
WO2016064467A1 (en) 2016-04-28
TW201617171A (zh) 2016-05-16
US20160114459A1 (en) 2016-04-28
KR20170073689A (ko) 2017-06-28
TWI698305B (zh) 2020-07-11
CN107078045A (zh) 2017-08-18
US9687960B2 (en) 2017-06-27
CN107078045B (zh) 2020-11-20
JP2017532790A (ja) 2017-11-02

Similar Documents

Publication Publication Date Title
JP6640848B2 (ja) 流体をスプレー本体の下方へ且つ入口ポートへ向けて誘導するように方向付けられた流体出口を採用する研磨パッド洗浄システム、及びそれに関連する方法
US20160167195A1 (en) System and process for in situ byproduct removal and platen cooling during cmp
CN105382677B (zh) 抛光处理组件、基板处理装置及抛光垫清洗方法
US10192757B2 (en) Substrate cleaning apparatus and substrate cleaning method
US9824903B2 (en) Substrate cleaning apparatus
CN105390417A (zh) 抛光组件及基板处理装置
JP6872903B2 (ja) ガラス処理装置およびガラス処理方法
JP2020024996A (ja) 研磨装置、及び、研磨方法
US20160101498A1 (en) Buffing apparatus and substrate processing apparatus
JP2017195416A (ja) 基板処理装置
US20190039203A1 (en) Substrate processing apparatus
TW201615819A (zh) 使用經設計的黏性流體之高效率後ｃｍｐ清洗的方法與設備
KR100615100B1 (ko) 연마 패드 클리너 및 이를 갖는 화학기계적 연마 장치
US6813796B2 (en) Apparatus and methods to clean copper contamination on wafer edge
KR102675417B1 (ko) 세정 장치 및 기판 처리 장치
CN116130334A (zh) 一种晶圆清洗方法
CN115697632A (zh) 用于抛光液体传输臂的清洁系统
JP2025126581A (ja) Ｃｍｐ装置、及び、ｃｍｐ方法
KR100799079B1 (ko) 폴리싱 패드 컨디셔너

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20180808

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20180808

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20190805

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20190813

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20191113

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20191203

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20191226

R150 Certificate of patent or registration of utility model

Ref document number: 6640848

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250