JP6640192B2 - 光硬化性熱硬化性樹脂組成物、ドライフィルム、硬化物、及びプリント配線板 - Google Patents

光硬化性熱硬化性樹脂組成物、ドライフィルム、硬化物、及びプリント配線板 Download PDF

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Publication number
JP6640192B2
JP6640192B2 JP2017510666A JP2017510666A JP6640192B2 JP 6640192 B2 JP6640192 B2 JP 6640192B2 JP 2017510666 A JP2017510666 A JP 2017510666A JP 2017510666 A JP2017510666 A JP 2017510666A JP 6640192 B2 JP6640192 B2 JP 6640192B2
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group
resin
carboxyl group
compound
resin composition
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JP2018501497A (ja
Inventor
昇平 槇田
昇平 槇田
山本　修一
修一 山本
辰一 山田
辰一 山田
崇夫 三輪
崇夫 三輪
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Taiyo Ink Suzhou Co Ltd
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Taiyo Ink Suzhou Co Ltd
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/10—Epoxy resins modified by unsaturated compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04—Polyurethanes
    • C08L75/14—Polyurethanes having carbon-to-carbon unsaturated bonds
    • C08L75/16—Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Polymerisation Methods In General (AREA)
  • Graft Or Block Polymers (AREA)
JP2017510666A 2014-12-10 2015-04-15 光硬化性熱硬化性樹脂組成物、ドライフィルム、硬化物、及びプリント配線板 Active JP6640192B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN201410756918.9A CN105739239B (zh) 2014-12-10 2014-12-10 光固化性热固化性树脂组合物、干膜、固化物、及印刷电路板
CN201410756918.9 2014-12-10
PCT/CN2015/076613 WO2016090794A1 (zh) 2014-12-10 2015-04-15 光固化性热固化性树脂组合物、干膜、固化物、及印刷电路板

Publications (2)

Publication Number Publication Date
JP2018501497A JP2018501497A (ja) 2018-01-18
JP6640192B2 true JP6640192B2 (ja) 2020-02-05

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JP2017510666A Active JP6640192B2 (ja) 2014-12-10 2015-04-15 光硬化性熱硬化性樹脂組成物、ドライフィルム、硬化物、及びプリント配線板

Country Status (5)

Country Link
JP (1) JP6640192B2 (zh)
KR (1) KR102389119B1 (zh)
CN (1) CN105739239B (zh)
TW (1) TWI665515B (zh)
WO (1) WO2016090794A1 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7076262B2 (ja) * 2018-03-30 2022-05-27 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物及びプリント配線板
KR102683127B1 (ko) * 2018-08-09 2024-07-10 도레이 카부시키가이샤 감광성 수지 조성물, 감광성 시트, 그리고 그들의 경화막 및 그의 제조 방법, 전자 부품
CN109679037B (zh) * 2019-01-09 2021-03-26 深圳市星河环境技术有限公司 一种适用于pcb废膜渣减量化与资源化利用的方法
CN109868005A (zh) * 2019-02-25 2019-06-11 江苏艾森半导体材料股份有限公司 具有高附着力的光热双固化阻焊油墨及其使用方法
CN118259540A (zh) * 2022-12-28 2024-06-28 太阳油墨（苏州）有限公司 碱性显影型树脂组合物、其干膜及其固化物以及使用其而形成的印刷电路板

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4657955B2 (ja) * 2006-03-14 2011-03-23 富士フイルム株式会社 感光性組成物、感光性フィルム、永久パターン形成方法、及びプリント基板
KR100930670B1 (ko) * 2007-12-31 2009-12-09 제일모직주식회사 컬러필터용 감광성 수지 조성물 및 이를 이용한 컬러필터
KR101552371B1 (ko) * 2008-03-31 2015-09-10 다이니폰 인사츠 가부시키가이샤 염기 발생제, 감광성 수지 조성물, 당해 감광성 수지 조성물을 포함하는 패턴 형성용 재료, 당해 감광성 수지 조성물을 사용한 패턴 형성 방법 및 물품
CN102171612B (zh) * 2008-10-02 2014-07-23 大日本印刷株式会社 感光性树脂组合物、使用其的物品以及负型图案形成方法
JP5261242B2 (ja) * 2009-03-23 2013-08-14 太陽ホールディングス株式会社 硬化性樹脂組成物、それを用いたドライフィルム及びプリント配線板
JP5183540B2 (ja) * 2009-03-23 2013-04-17 太陽ホールディングス株式会社 硬化性樹脂組成物、それを用いたドライフィルム及びプリント配線板
JP5377021B2 (ja) * 2009-03-23 2013-12-25 太陽ホールディングス株式会社 硬化性樹脂組成物、それを用いたドライフィルム及びプリント配線板
CN102365341B (zh) * 2009-03-31 2014-12-31 大日本印刷株式会社 碱产生剂、感光性树脂组合物、含有该感光性树脂组合物的图案形成用材料、使用该感光性树脂组合物的图案形成方法以及物品
KR101392539B1 (ko) * 2009-11-16 2014-05-07 아사히 가세이 이-매터리얼즈 가부시키가이샤 폴리이미드 전구체 및 이 폴리이미드 전구체를 포함하는 감광성 수지 조성물
TWI481657B (zh) * 2010-09-15 2015-04-21 Asahi Kasei E Materials Corp A phenol resin composition and a hardened embossed pattern, and a method for manufacturing the semiconductor
EP2799928B1 (en) * 2011-12-26 2019-05-22 Toray Industries, Inc. Photosensitive resin composition and process for producing semiconductor element
JP2013171101A (ja) * 2012-02-20 2013-09-02 Fujifilm Corp ポジ型感光性樹脂組成物、硬化膜の製造方法、硬化膜、有機ｅｌ表示装置および液晶表示装置
JP5795748B2 (ja) * 2012-04-16 2015-10-14 富士フイルム株式会社 感光性樹脂組成物、硬化膜の製造方法、硬化膜、有機ｅｌ表示装置および液晶表示装置
JP2014218547A (ja) * 2013-05-01 2014-11-20 Jsr株式会社 重合体、重合体を含む硬化性樹脂組成物
JP2015166840A (ja) * 2013-10-02 2015-09-24 Jsr株式会社 硬化性組成物、硬化膜及びその形成方法、並びに化合物
JP6237084B2 (ja) * 2013-10-07 2017-11-29 Jsr株式会社 硬化性組成物、硬化膜及びその形成方法、並びに塩基発生剤

Also Published As

Publication number Publication date
JP2018501497A (ja) 2018-01-18
TWI665515B (zh) 2019-07-11
CN105739239A (zh) 2016-07-06
TW201621461A (zh) 2016-06-16
CN105739239B (zh) 2020-04-03
WO2016090794A1 (zh) 2016-06-16
KR20170093782A (ko) 2017-08-16
KR102389119B1 (ko) 2022-04-20

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