JP6639529B2 - ポリアミド成形組成物及びその製造方法 - Google Patents
ポリアミド成形組成物及びその製造方法 Download PDFInfo
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- JP6639529B2 JP6639529B2 JP2017566012A JP2017566012A JP6639529B2 JP 6639529 B2 JP6639529 B2 JP 6639529B2 JP 2017566012 A JP2017566012 A JP 2017566012A JP 2017566012 A JP2017566012 A JP 2017566012A JP 6639529 B2 JP6639529 B2 JP 6639529B2
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- molding composition
- fiber
- terephthalic acid
- reinforcing filler
- semi
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- 238000000465 moulding Methods 0.000 title claims description 32
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- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 229920001519 homopolymer Polymers 0.000 claims description 49
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 claims description 42
- 229920006111 poly(hexamethylene terephthalamide) Polymers 0.000 claims description 30
- 239000012763 reinforcing filler Substances 0.000 claims description 30
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- 238000002844 melting Methods 0.000 claims description 20
- 230000008018 melting Effects 0.000 claims description 20
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 19
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- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 description 4
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- 125000003118 aryl group Chemical group 0.000 description 4
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- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 description 4
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- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
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- 238000002347 injection Methods 0.000 description 2
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- YCDWDGJOBAYTDW-UHFFFAOYSA-L magnesium;methyl(phenyl)phosphinate Chemical compound [Mg+2].CP([O-])(=O)C1=CC=CC=C1.CP([O-])(=O)C1=CC=CC=C1 YCDWDGJOBAYTDW-UHFFFAOYSA-L 0.000 description 1
- SSJHRSPSQJENCV-UHFFFAOYSA-L magnesium;methyl(propyl)phosphinate Chemical compound [Mg+2].CCCP(C)([O-])=O.CCCP(C)([O-])=O SSJHRSPSQJENCV-UHFFFAOYSA-L 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920001179 medium density polyethylene Polymers 0.000 description 1
- 239000004701 medium-density polyethylene Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002074 melt spinning Methods 0.000 description 1
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 1
- XJRBAMWJDBPFIM-UHFFFAOYSA-N methyl vinyl ether Chemical compound COC=C XJRBAMWJDBPFIM-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- SJYNFBVQFBRSIB-UHFFFAOYSA-N norbornadiene Chemical compound C1=CC2C=CC1C2 SJYNFBVQFBRSIB-UHFFFAOYSA-N 0.000 description 1
- 229910017059 organic montmorillonite Inorganic materials 0.000 description 1
- 125000005968 oxazolinyl group Chemical group 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 1
- 239000013034 phenoxy resin Substances 0.000 description 1
- 229920006287 phenoxy resin Polymers 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- AQSJGOWTSHOLKH-UHFFFAOYSA-N phosphite(3-) Chemical class [O-]P([O-])[O-] AQSJGOWTSHOLKH-UHFFFAOYSA-N 0.000 description 1
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 1
- 229920000767 polyaniline Polymers 0.000 description 1
- 229920001748 polybutylene Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 239000001818 polyoxyethylene sorbitan monostearate Substances 0.000 description 1
- 235000010989 polyoxyethylene sorbitan monostearate Nutrition 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000009700 powder processing Methods 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 229910052903 pyrophyllite Inorganic materials 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 238000007348 radical reaction Methods 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- YGSDEFSMJLZEOE-UHFFFAOYSA-M salicylate Chemical compound OC1=CC=CC=C1C([O-])=O YGSDEFSMJLZEOE-UHFFFAOYSA-M 0.000 description 1
- 229960001860 salicylate Drugs 0.000 description 1
- 125000005372 silanol group Chemical group 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 238000012719 thermal polymerization Methods 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- GTZCVFVGUGFEME-UHFFFAOYSA-N trans-aconitic acid Natural products OC(=O)CC(C(O)=O)=CC(O)=O GTZCVFVGUGFEME-UHFFFAOYSA-N 0.000 description 1
- 229920000428 triblock copolymer Polymers 0.000 description 1
- DDBUVUBWJVIGFH-UHFFFAOYSA-N trichloro(3-isocyanatopropyl)silane Chemical compound Cl[Si](Cl)(Cl)CCCN=C=O DDBUVUBWJVIGFH-UHFFFAOYSA-N 0.000 description 1
- FRGPKMWIYVTFIQ-UHFFFAOYSA-N triethoxy(3-isocyanatopropyl)silane Chemical compound CCO[Si](OCC)(OCC)CCCN=C=O FRGPKMWIYVTFIQ-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- LFRDHGNFBLIJIY-UHFFFAOYSA-N trimethoxy(prop-2-enyl)silane Chemical compound CO[Si](OC)(OC)CC=C LFRDHGNFBLIJIY-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
- 229920001866 very low density polyethylene Polymers 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
- 239000010457 zeolite Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- PJEUXMXPJGWZOZ-UHFFFAOYSA-L zinc;diphenylphosphinate Chemical compound [Zn+2].C=1C=CC=CC=1P(=O)([O-])C1=CC=CC=C1.C=1C=CC=CC=1P(=O)([O-])C1=CC=CC=C1 PJEUXMXPJGWZOZ-UHFFFAOYSA-L 0.000 description 1
- WMLXDIOQDFWKAO-UHFFFAOYSA-L zinc;methyl(phenyl)phosphinate Chemical compound [Zn+2].CP([O-])(=O)C1=CC=CC=C1.CP([O-])(=O)C1=CC=CC=C1 WMLXDIOQDFWKAO-UHFFFAOYSA-L 0.000 description 1
- GLDFMLDAWXHNQU-UHFFFAOYSA-L zinc;methyl(propyl)phosphinate Chemical compound [Zn+2].CCCP(C)([O-])=O.CCCP(C)([O-])=O GLDFMLDAWXHNQU-UHFFFAOYSA-L 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
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- C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
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- C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
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- C08K5/51—Phosphorus bound to oxygen
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- C08K5/5313—Phosphinic compounds, e.g. R2=P(:O)OR'
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Description
(A)1,10−デカンジアミンとテレフタル酸から誘導されるPA10Tホモポリマー20−95wt%と、
(B)1,6−ヘキサンジアミンとテレフタル酸から誘導されるPA6Tホモポリマー5−80wt%とからなり、
(A)+(B)=100wt%である。
(A)1,10−デカンジアミンとテレフタル酸から誘導されるPA10Tホモポリマー30−85wt%と、
(B)1,6−ヘキサンジアミンとテレフタル酸から誘導されるPA 6Tホモポリマー15−70wt%とからなり、
(A)+(B)=100wt%である。
(A)1,10−デカンジアミンとテレフタル酸から誘導されるPA10Tホモポリマー40−70wt%と、
(B)1,6−ヘキサンジアミンとテレフタル酸から誘導されるPA6Tホモポリマー30−60wt%とからなり、
(A)+(B)=100wt%である。
半芳香族ポリアミド樹脂30−100重量部と、
補強フィラー0−70重量部と、
添加剤0−50重量部とを含み、
ポリアミド成形組成物の全重量に対して、前記補強フィラーの含有量は好ましくは10−50部、より好ましくは15−40部である上記半芳香族ポリアミド樹脂を含むポリアミド成形組成物を開示し、補強フィラーの含有量が低すぎる場合、ポリアミド成形組成物の力学的性質を劣化させ、補強フィラーの含有量が高すぎる場合、ポリアミド成形組成物の製品の表面に繊維露出が深刻になり、製品の外観に悪影響を及ぼす。
前記無機補強フィラーは、ガラス繊維、チタン酸カリウム繊維、金属を被覆したガラス繊維、セラミック繊維、珪灰石繊維、金属炭化物繊維、金属硬化物繊維、ロックウール繊維、アルミナ繊維、炭化ケイ素繊維、石膏繊維又はホウ素繊維から選ばれる1種又は複数種であり、好ましくはガラス繊維であり、
ガラス繊維を使用することによって、ポリアミド成形組成物の成形性を向上させるだけでなく、たとえば引張強さ、曲げ強さ及び曲げ弾性率等の力学的性質を向上させ、さらにたとえば熱可塑性樹脂組成物による成形時の熱変形温度等の耐熱性を向上させる。
前記オルガノシラン系化合物は、エポキシ基含有アルコキシシラン化合物、メルカプト含有アルコキシシラン化合物、ウレイド基含有アルコキシシラン化合物、イソシアナト基含有アルコキシシラン化合物、末端アミノ基含有アルコキシシラン化合物、ヒドロキシ基含有アルコキシシラン化合物、炭素−炭素不飽和基含有アルコキシシラン化合物、酸無水物基含有アルコキシシラン化合物から選ばれる1種又は複数種である。
前記メルカプト含有アルコキシシラン化合物は、γ−メルカプトプロピルトリメトキシシラン及び/又はγ−メルカプトプロピルトリエトキシシランから選ばれ、
前記ウレイド基含有アルコキシシラン化合物は、γ−ウレイドプロピルトリエトキシシラン、γ−ウレイドプロピルトリメトキシシラン、γ−(2−ウレイドエチル)アミノプロピルトリメトキシシランから選ばれる1種又は複数種であり、
前記イソシアナト基含有アルコキシシラン化合物は、γ−イソシアナトプロピルトリエトキシシラン、γ−イソシアナトプロピルトリメトキシシラン、γ−イソシアナトプロピルメチルジメトキシシラン、γ−イソシアナトプロピルメチルジエトキシシラン、γ−イソシアナトプロピルエチルジメトキシシラン、γ−イソシアナトプロピルエチルジエトキシシラン、γ−イソシアナトプロピルトリクロロシランから選ばれる1種又は複数種であり、
前記末端アミノ基含有アルコキシシラン化合物は、γ−(2−アミノエチル)アミノプロピルメチルジメトキシシラン、γ−(2−アミノエチル)アミノプロピルトリメトキシシラン、γ−アミノプロピルトリメトキシシランから選ばれる1種又は複数種であり、
前記ヒドロキシ基含有アルコキシシラン化合物は、γ−ヒドロキシプロピルトリメトキシシラン及び/又はγ−ヒドロキシプロピルトリエトキシシランから選ばれ、
前記炭素−炭素不飽和基含有アルコキシシラン化合物は、γ−メタクリロイルオキシプロピルトリメトキシシラン、ビニルトリメトキシシラン、N−β−(N−ビニルベンジルアミノエチル)−γ−アミノプロピルトリメトキシシラン・塩酸塩から選ばれる1種又は複数種であり、
前記酸無水物基含有アルコキシシラン化合物は、3−トリメトキシシリルプロピルコハク酸無水物であり、
前記オルガノシラン系化合物は、好ましくはγ−メタクリロイルオキシプロピルトリメトキシシラン、γ−(2−アミノエチル)アミノプロピルメチルジメトキシシラン、γ−(2−アミノエチル)アミノプロピルトリメトキシシラン、γ−アミノプロピルトリメトキシシラン又は3−トリメトキシシリルプロピルコハク酸無水物である。
前記したほかのポリマーは、脂肪族ポリアミド、ポリオレフィンホモポリマー、エチレン−α−オレフィン共重合体、エチレン−アクリレート共重合体から選ばれる1種又は複数種であり、
前記加工助剤は、抗酸化剤、耐熱安定剤、耐候剤、離型剤、潤滑剤、顔料、染料、可塑剤、帯電防止剤から選ばれる1種又は複数種である。
前記ハロゲン系難燃剤は、臭素化ポリスチレン、臭素化ポリフェニレンエーテル、臭素化ビスフェノールAエポキシ樹脂、臭素化スチレン−無水マレイン酸共重合体、臭素化エポキシ樹脂、臭素化フェノキシ樹脂、デカブロモジフェニルエーテル、デカブロモビフェニル、臭素化ポリカーボネート、パーブロモトリシクロペンタデカン又は臭素化芳香族架橋ポリマーから選ばれる1種又は複数種であり、好ましくは臭素化ポリスチレンであり、
前記ノンハロゲン難燃剤は、窒素含有難燃剤、リン含有難燃剤又は窒素とリンを含有する難燃剤から選ばれる1種又は複数種であり、好ましくはリン含有難燃剤である。
ホスフィン酸塩化合物は、たとえば下記式I及び/又はIIに示される化合物を代表とする。
TAFMER MC201:g−MA(−0.6%)67%EP共重合体(20mol%プロピレン)+33%EB共重合体(15mol%1−ブテン))の混合物:Mitsui Chemicals、日本。
TAFMER MH5010:g−MA(−0.6%)エチレン−ブテン共重合体;Mitsui。
TAFMER MH7010:g−MA(−0.7%)エチレン−ブテン共重合体;Mitsui。
TAFMER MH7020:g−MA(−0.7%)EP共重合体;Mitsui。
EXXELOR VA1801:g−MA(−0.7%)EP共重合体;Exxon Mobile Chemicals、US。
EXXELOR VA1803:g−MA(0.5−0.9%)EP共重合体、アモルファス、Exxon。
EXXELOR VA1810:g−MA(−0.5%)EP共重合体、Exxon。
EXXELOR MDEX 941l:g−MA(0.7%)EPDM、Exxon。
FUSABOND MN493D:g−MA(−0.5%)エチレン−オクテン共重合体、DuPont、US。
FUSABOND A EB560D:(g−MA)エチレン−n−ブチルアクリレート共重合体、DuPont ELVALOY、DuPont。
磁気カップリングミキサー、凝縮配管、ガス口、投入口、圧力防爆口を備えた圧力釜に、ヘキサンジアミン400g(3.44mol)、テレフタル酸548g(3.30mol)、安息香酸11.3g(0.09mol)、次亜リン酸ナトリウム1.0g及び水410gを投入した。真空化して高純度窒素ガスを保護ガスとして導入し、撹拌しながら2時間かけて220℃に昇温し、反応混合物を220℃で1時間撹拌して、次に撹拌しながら反応物の温度を250℃に上昇した。250℃の恒温と3.6MPaの定圧で2時間反応させ続け、生成した水を除去することで圧力を一定に維持した。反応終了後、取り出して、プレポリマーを80℃で24時間真空乾燥させて、予備重合生成物を得た。前記予備重合生成物を290℃、50Paの真空条件下で固相増粘して、PA6Tホモポリマーを得た。その融点は370℃、相対粘度は2.33であった。
磁気カップリングミキサー、凝縮配管、ガス口、投入口、圧力防爆口を備えた圧力釜に、デカンジアミン400g(2.32mol)、テレフタル酸370.5g(2.23mol)、安息香酸10.3g(0.08mol)、次亜リン酸ナトリウム1.0g及び水340gを投入した。真空化して高純度窒素ガスを保護ガスとして導入し、撹拌しながら2時間かけて220℃に昇温し、反応混合物を220℃で1時間撹拌して、次に撹拌しながら反応物の温度を240℃に上昇した。240℃の恒温と3.0MPaの定圧で2時間反応させ続け、生成した水を除去することで圧力を一定に維持した。反応終了後、取り出して、プレポリマーを80℃で24時間真空乾燥させて、予備重合生成物を得た。前記予備重合生成物を250℃、50Paの真空条件下で固相増粘して、PA10Tホモポリマーを得た。その融点は316℃、相対粘度は2.35であった。
半芳香族ポリアミド樹脂の融点のテスト方法:ASTM D3418−2003参照。
具体的なテスト方法:Perkin Elmer Dimond DSC分析装置を用いてサンプルの融点をテストする。窒素ガス雰囲気で、流速を40mL/minとし、テスト時に、まず10℃/minで340℃に昇温して、340℃で2min保温し、次に10℃/minで50℃に冷却させ、さらに10℃/minで340℃に昇温し、このときの吸熱ピーク温度を融点Tmとする。
ポリアミド成形組成物成形品の表面特性については、表面粗さRaでキャラクタリゼーションし、そのテストは中華人民共和国国家標準GB10610−89『触針式機器による表面粗さの測定規則及び方法』に従って行う。具体的には、サンプルを射出成形して100mm×100mm×2mmの成形品を得るステップと、広州市広測定計器有限公司製のJB−6C触針式粗さ計を用いて表面粗さの数値Raをテストするステップとを含む。Raは大きいほど、表面は粗い。
吸水率のテスト方法:サンプルを射出成形して20mm×20mm×2mmの成形品を得て、重量をa0とする。次に95℃の水に入れて240h放置した後、重量を秤量してa1とする。吸水率=(a1−a0)/a0*100%とする。
PA10TホモポリマーとPA6Tホモポリマーを、表1の比率で高速混合機において均一に混合した後、イ坊市精華粉末工程装置有限公司製のAB10型ジェット粉砕装置に投入して5−10umの粉末に粉砕し、該粉末を主投入口から二軸押出機に加えて、押出して、冷却水で冷却させ、造粒して乾燥させて半芳香族ポリアミド樹脂を得た。得られた半芳香族ポリアミド樹脂の融点は表1に示される。
表2の処方に従って、半芳香族ポリアミド樹脂、補強フィラー、添加剤を高速混合機において均一に混合した後、主投入口から二軸押出機に投入して、補強フィラーをサイド供給秤からサイド供給した。押出して、冷却水で冷却させ、造粒して乾燥させて前記ポリアミド組成物を得た。各特性結果は表2に示される。
Claims (6)
- (A)1,10−デカンジアミンとテレフタル酸から誘導されるPA10Tホモポリマー20−95wt%と、(B)1,6−ヘキサンジアミンとテレフタル酸から誘導されるPA6Tホモポリマー5−80wt%とからなり、(A)+(B)=100wt%であり、また、ASTM D3418−2003に準じて融点が290℃−310℃である半芳香族ポリアミド樹脂のポリアミド成形組成物であって、
成分として、
半芳香族ポリアミド樹脂30−100重量部と、
補強フィラー15−40重量部と、
添加剤0−50重量部とを含み、
前記補強フィラーは、繊維状で、平均長さが0.1mm−6mm、アスペクト比が30:1−600:1である
ことを特徴とするポリアミド成形組成物。 - 前記半芳香族ポリアミド樹脂が、
(A)1,10−デカンジアミンとテレフタル酸から誘導されるPA10Tホモポリマー30−85wt%と、
(B)1,6−ヘキサンジアミンとテレフタル酸から誘導されるPA 6Tホモポリマー15−70wt%とからなり、
(A)+(B)=100wt%である
請求項1に記載のポリアミド成形組成物。 - 前記半芳香族ポリアミド樹脂が、
(A)1,10−デカンジアミンとテレフタル酸から誘導されるPA10Tホモポリマー40−70wt%と、
(B)1,6−ヘキサンジアミンとテレフタル酸から誘導されるPA6Tホモポリマー30−60wt%とからなり、
(A)+(B)=100wt%である
請求項2に記載のポリアミド成形組成物。 - 請求項1ないし3のいずれかに記載のポリアミド成形組成物の製造方法であって、
前記半芳香族ポリアミド樹脂の製造には、
1,6−ヘキサンジアミンとテレフタル酸から誘導されるPA6Tホモポリマーと1,10−デカンジアミンとテレフタル酸から誘導されるPA10Tホモポリマーを所定の比率で高速混合機において均一に混合した後、粉砕機に投入して5−10umの粉末に粉砕し、粉末を主投入口から二軸押出機に投入して、押出して、冷却水で冷却させ、造粒して乾燥させて半芳香族ポリアミド樹脂を得る
ことを特徴とするポリアミド成形組成物の製造方法。 - 前記補強フィラーは無機補強フィラー又は有機補強フィラーであり、
前記無機補強フィラーは、ガラス繊維、チタン酸カリウム繊維、金属を被覆したガラス繊維、セラミック繊維、珪灰石繊維、金属炭化物繊維、金属硬化物繊維、ロックウール繊維、アルミナ繊維、炭化ケイ素繊維、石膏繊維又はホウ素繊維から選ばれる1種又は複数種であり、
前記有機補強フィラーは芳香族ポリアミド繊維及び/又は炭素繊維から選ばれる
請求項1ないし3のいずれかに記載のポリアミド成形組成物。 - 前記添加剤は、難燃剤、耐衝撃性改良剤、ほかのポリマー、加工助剤から選ばれる1種又は複数種であり、
前記難燃剤は、ハロゲン系難燃剤又はノンハロゲン難燃剤であり、
前記したほかのポリマーは、脂肪族ポリアミド、ポリオレフィンホモポリマー、エチレン−α−オレフィン共重合体又はエチレン−アクリレート共重合体から選ばれる1種又は複数種である
請求項1ないし3のいずれかに記載のポリアミド成形組成物。
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