JP6638578B2 - Manufacturing method of sheet molding and manufacturing method of light emitting device using the same - Google Patents

Description

  The present invention relates to a method for manufacturing a sheet molding and a method for manufacturing a light emitting device using the same.

  A light emitting device in which a wavelength conversion layer containing a phosphor is mounted on a light emitting element such as an LED is known. For example, Patent Literature 1 includes a light-emitting element and a color conversion plate mounted on the light-emitting element and containing at least first and second phosphors. In the color conversion plate of Patent Document 1, a plurality of first regions including a first phosphor are arranged at predetermined intervals on a surface on a light emitting element side, and a second region including a second phosphor is disposed on an opposite surface. The regions are arranged at predetermined intervals, and the other regions do not contain the phosphor. When such a color conversion plate is used, light emitted from each phosphor is hardly absorbed by other phosphors, and light from a light emitting element can efficiently reach each phosphor.

  As described in Patent Document 1, for example, a color conversion plate as described above uses a mold and a resin to form a substrate having a concave portion of a desired shape on both surfaces, and a predetermined phosphor is placed in the concave portion. It can be formed by providing a contained resin by a printing method or a dropping method.

JP-A-2005-122485

  However, as described in Patent Literature 1, when a resin containing a phosphor is provided in a recess by a printing method or a dropping method, the phosphor precipitates in a liquid resin, and depending on the degree of the precipitation, the phosphor is emitted from a light emitting device. There is a possibility that color unevenness may occur in the emitted light.

  Therefore, an object of the present invention is to easily form a sheet molded body having a phosphor-containing region of a desired shape containing a phosphor substantially uniformly. Still another object of the present invention is to manufacture a light-emitting device with less color unevenness by using the sheet molded body.

  In the method for manufacturing a sheet molded body according to the embodiment of the present invention, the first sheet in a semi-cured state in which the phosphor is substantially uniformly contained in the resin is die-cut with a mold having a plurality of through holes or concave portions, A step of forming a plurality of small pieces separated from each other; a step of curing the plurality of small pieces; and a step of covering a part of the surface of the plurality of hardened small pieces with a second sheet in a semi-cured state made of at least resin. And curing the second sheet to form a sheet molded body.

  The method for manufacturing a light-emitting device according to an embodiment of the present invention includes, on the sheet compact, a light-emitting element having a first main surface having a pair of electrodes and a second main surface opposite thereto on the small piece. Placing the second main surface so as to be disposed, and a light reflecting member so as to cover a part and a side surface of the first main surface of the light emitting element and an upper surface of the sheet molded body. And forming a.

  Further, in the method for manufacturing a light emitting device according to the embodiment of the present invention, the sheet molded body may include a first main surface having a pair of electrodes and a second main surface opposite to the first main surface. A step of placing the small pieces on the light emitting element placed so that the first main surface side is disposed, such that the small pieces are disposed on the light emitting element; and a part of the first main surface of the light emitting element and Forming a light-reflecting member so as to cover the side surface and the lower surface and the side surface of the sheet molded body.

  According to the manufacturing method according to the embodiment of the present invention, it is possible to easily form a sheet molded body having a phosphor-containing region of a desired shape containing a phosphor substantially uniformly. Furthermore, a light emitting device with less color unevenness can be manufactured using the sheet molded body.

FIG. 1A is a schematic cross-sectional view showing a small piece forming step in the method for manufacturing a sheet molded body according to Embodiment 1. FIG. 1B is a schematic cross-sectional view showing a small piece forming step in the method for manufacturing a sheet molded body according to Embodiment 1. FIG. 1C is a schematic sectional view showing a small piece forming step in the method for manufacturing a sheet molded body according to Embodiment 1. FIG. 1D is a schematic plan view illustrating a small piece forming step in the method for manufacturing a sheet molded body according to Embodiment 1. FIG. 2A is a schematic cross-sectional view showing a small piece covering step in the method for manufacturing a sheet molded body according to Embodiment 1. FIG. 2B is a schematic cross-sectional view illustrating a small piece covering step in the method for manufacturing a sheet molded body according to Embodiment 1. FIG. 3 is a schematic cross-sectional view of a sheet molded body manufactured by the manufacturing method according to the first embodiment. FIG. 4 is a schematic cross-sectional view illustrating an individualizing step in the method for manufacturing a sheet molded body according to the first embodiment. FIG. 5A is a schematic cross-sectional view showing a small piece forming step in the method for manufacturing a sheet molded body according to Embodiment 2. FIG. 5B is a schematic cross-sectional view illustrating a step of partially removing the second sheet in the method for manufacturing a sheet molded body according to Embodiment 2. FIG. 5C is a schematic cross-sectional view of a sheet molded body manufactured by the manufacturing method according to the second embodiment. FIG. 6 is a schematic cross-sectional view showing a light emitting element mounting step in the method for manufacturing a light emitting device according to the third embodiment. FIG. 7 is a schematic cross-sectional view showing a light reflecting member forming step in the method for manufacturing a light emitting device according to the third embodiment. FIG. 8 is a schematic cross-sectional view illustrating an individualization step in the method for manufacturing a light emitting device according to the third embodiment. FIG. 9A is a schematic cross-sectional view of a light emitting device manufactured by the manufacturing method according to the third embodiment using the sheet molded body formed in the first embodiment. FIG. 9B is a schematic cross-sectional view of another light emitting device manufactured by the manufacturing method according to the third embodiment using the sheet molded body formed in the first embodiment. FIG. 9C is a schematic cross-sectional view of a light emitting device manufactured by the manufacturing method according to Embodiment 3 using the sheet molded body formed in Embodiment 2. FIG. 9D is a schematic sectional view of the light emitting device manufactured by the manufacturing method according to the third embodiment. FIG. 9E is a schematic sectional view of a sheet molded body used in the light emitting device shown in FIG. 9C. FIG. 10 is a schematic cross-sectional view illustrating a sheet molded body mounting step in the method for manufacturing a light emitting device according to the fourth embodiment. FIG. 11 is a schematic cross-sectional view illustrating a light-reflective member forming step in the method for manufacturing a light-emitting device according to Embodiment 4. FIG. 12 is a schematic cross-sectional view illustrating an individualization step in the method for manufacturing a light emitting device according to the fourth embodiment. FIG. 13 is a schematic cross-sectional view of a light emitting device manufactured by the manufacturing method according to the fourth embodiment.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings as appropriate. However, the manufacturing method and configuration of the sheet molded body and the light emitting device described below are for embodying the technical idea of the embodiment, and are not limited to the following. In particular, dimensions, materials, shapes, relative arrangements, and the like of the components are not intended to limit the scope of the present invention unless otherwise specified. In addition, the size, positional relationship, and the like of members illustrated in each drawing may be exaggerated for clarity of description. The embodiments described below can be applied by appropriately combining the configurations and the like.

<First embodiment>
(Production method of sheet molding)
In the method for manufacturing a sheet molded body according to the first embodiment, the first sheet in a semi-cured state in which the phosphor is substantially uniformly contained in the resin is die-cut with a mold having a plurality of through holes or concave portions, and is separated from each other. Forming a plurality of small pieces, hardening the plurality of small pieces, and covering a part of the surface of the hardened plurality of small pieces with a second sheet of at least a resin in a semi-cured state. The method includes a coating step and a second sheet curing step of curing the second sheet to form a sheet molded body. The sheet molded body may be divided into individual pieces by appropriately cutting the cured second sheet between a plurality of small pieces. In addition, the sheet molded body is placed on the light emitting element in the light emitting device, and plays a role of a wavelength conversion layer that converts the light of the light emitting element into desired light.
Hereinafter, each step of the method for manufacturing the sheet molded body 100 according to the first embodiment will be described in detail.

(Small piece forming process)
1A to 1D are schematic sectional views showing a small piece forming step in the method for manufacturing a sheet molded body according to the first embodiment. In the small piece forming step, the first sheet is die-cut with a die to form a plurality of small pieces that are separated from each other.

In the small piece forming step, first, the first sheet 10 and the mold 30 for cutting the first sheet 10 are prepared. The first sheet 10 is a semi-cured phosphor sheet that is translucent and has a phosphor substantially uniformly contained in a resin as a base material. Note that the state in which the phosphor is substantially uniformly contained refers to a state in which the phosphor is contained in the resin as the base material at a substantially uniform concentration. In addition, the semi-cured state of the first sheet 10 refers to a state in which the mold can be cut out with a mold or the like, and for example, the resin used for the first sheet 10 has about half the hardness in the fully cured state. For example, when a silicone resin is used, the Shore D hardness is preferably 10 to 30 or the Shore A hardness is preferably 10 to 30. By using the semi-cured first sheet 10 as described above, the die can be easily removed by using a mold as compared with the case where the first sheet 10 having a relatively high hardness is used.
The first sheet may contain a plurality of different phosphors, or may contain, for example, a diffusing agent, a colorant, or the like in addition to the resin and the phosphor. The first sheet 10 is preferably placed on a base such as a film.

As shown in FIGS. 1A and 1B, the mold 30 has a plurality of through holes or recesses 31 through which the first sheet 10 can be punched. In the case where the mold 30 having the concave portion 31 is used, it is preferable that the height (depth) of the concave portion 31 be smaller than the thickness of the prepared first sheet 10. It is possible to die-cut into the shape of 31.
In the first embodiment, a mold having a plurality of semicircular concave portions 31 is used. It is preferable that the through-hole or the concave portion 31 has a tapered shape, since the cut small piece easily comes off the mold. The shape of the concave portion 31 is not limited to a semicircular sphere, but may be a polygonal prism such as a triangular prism and a quadrangular prism, a polygonal pyramid such as a triangular pyramid and a quadrangular pyramid, a cylinder, a cone, a semi-elliptical sphere, a semicircular column, and the like. It can be selected as appropriate. Similarly, the shape of the through-hole can be appropriately selected depending on the shape of the small piece to be formed, such as a vertical surface, an inclined surface, a curved surface, an uneven surface, or the like. It is preferable that the shape of the small piece is appropriately selected depending on the planar shape of the light emitting element of the light emitting device using the sheet molded body, and the details will be described later.
Also, if the inner surface of the through-hole or the concave portion 31 has a small friction, for example, the die 30 is processed with polytetrafluoroethylene (PTFE) or the like, the cut small piece easily comes off the die. preferable.

  Here, although the term "mold" is used in this specification, the material is not limited to metal, and the structure is not particularly limited as long as the first sheet can be die-cut. In particular, when the mold is released while the first sheet is heated, the first sheet is easily deformed and the mold can be easily removed. Therefore, a mold that can be released while heating can be preferably used.

  Next, as shown in FIG. 1A, the first sheet 10 is set so as to face the through hole or the concave portion 31 of the mold 30. Then, as shown in FIG. 1B, the first sheet 10 is die-cut by lowering the mold 30. Then, by raising the mold 30, a plurality of small pieces 40 can be obtained as shown in FIG. 1C. When the semi-cured first sheet 10 is die-cut with the mold 30 having the concave portion 31 as described above, a mold having through holes or a first sheet having relatively high hardness is used. As compared with the above, a small piece having a desired shape can be easily formed up to the upper portion.

  The plurality of small pieces 40 formed in the small piece forming step contain a phosphor at a substantially uniform concentration in the resin. Further, as shown in FIGS. 1C and 1D, the plurality of small pieces 40 formed in the first embodiment are semicircular spheres, and are provided separately from each other. It is preferable that the separation distance is such that the dicing blade does not come into contact with the small pieces when the sheet molded body is cut in the subsequent singulation step, that is, at least larger than the width of the blade used. Note that the thickness (height) of the small piece is preferably 10 μm or more, more preferably 50 μm or more. Thereby, when the small piece is provided on the light emitting element as a sheet molded body, it is possible to wavelength-convert the light of the light emitting element. The thickness (height) of the small piece 40 is preferably 500 μm or less, more preferably 200 μm or less. This makes it easier for the second sheet to cover the plurality of small pieces without gaps in the subsequent small piece covering step. The interval between the plurality of small pieces 40 is preferably 200 μm or more, more preferably 1000 μm or more. This makes it possible to form a sheet molded body in which the second sheet between the plurality of small pieces is easily cut and the small pieces are not exposed from the side surface in the subsequent individualizing step.

  As described above, by using the first sheet 10 in a semi-cured state in which the phosphor is substantially uniformly contained, for example, a liquid resin containing the phosphor is used such as an injection molding, a printing method, and a dropping method. Compared to the case, the sedimentation and bias of the phosphor can be suppressed, and a plurality of small pieces 40 containing the phosphor substantially uniformly can be formed. Furthermore, by using the first sheet 10 in a semi-cured state, it is easier to remove the mold with the mold 30 than in the case of using the first sheet 10 having a relatively high hardness. In particular, if the first sheet 10 in the semi-cured state is die-cut using the mold 30 having the concave portion 31 instead of the through-hole, a desired shape up to the upper portion is obtained as compared with the case where the mold 30 having the through-hole is used. This is preferable because the small pieces 40 can be formed.

  When a plurality of small pieces are formed by injection molding or the like, the plurality of small pieces are formed as an integral body in which some of the small pieces are connected by a connecting portion by a mold runner. As described above, since the plurality of small pieces are connected by the connecting portion, the connecting portion containing the phosphor is exposed on the cut surface when the sheet molded body is divided into individual pieces later. However, depending on the light required of the light emitting device, it may be preferable that the connecting portion containing the phosphor is not exposed on the side surface of the sheet molded body. Further, some phosphors are weak to moisture. If the first sheet contains such a weak phosphor, moisture during dicing may deteriorate the phosphor. Therefore, in the case described above, it is necessary to perform a step of removing the connecting portion. However, as in the first embodiment, the semi-cured first sheet 10 is die-cut with a die, so that the plurality of small pieces 40 separated from each other can be easily formed without performing the step of removing the connecting portion. It is possible.

  In particular, in the first embodiment, by punching out the first sheet with the film interposed between the mold 30 and the first sheet 10, it becomes easier to form a plurality of small pieces 40 separated from each other. The film can be disposed on one or both of the upper and lower sides of the first sheet 10, and is preferably disposed on both the upper and lower sides. In the first embodiment, when the connecting portion is formed, the connecting portion is removed, and a plurality of small pieces separated from each other are formed.

(Small piece curing process)
Next, the plurality of small pieces 40 are cured in the small piece curing step. For example, heating can be performed at 120 ° C. to 170 ° C. for 15 minutes to 4 hours using an oven, reflow, or the like. The hardening is preferably performed in a state where the lower surface of the small piece 40 is horizontal in order to prevent the small piece 40 from being deformed.

(Small piece coating process)
2A and 2B are schematic cross-sectional views illustrating a small-piece covering step in the method for manufacturing a sheet molded body according to the first embodiment. In the small piece covering step, the plurality of cured small pieces are covered with the second sheet.
In the small piece covering step, first, the second sheet 20 for covering the plurality of small pieces 40 is prepared. The second sheet 20 is a semi-cured sheet made of at least a resin. Note that the semi-cured state of the second sheet 20 refers to a state in which when the second sheet 20 is arranged on the plurality of small pieces 40, the second sheet 20 deforms along the small pieces and can partially cover the surfaces of the plurality of small pieces. Refers to Therefore, depending on the height and the interval between the plurality of small pieces 40, the second sheet 20 is preferably about half as hard as the fully cured state of the resin used. For example, when a silicone resin is used, It is preferable that the D hardness is 10 to 30 or the Shore A hardness is 10 to 30.

  The prepared second sheet 20 may have a light transmitting property or a light reflecting property, and can be appropriately selected depending on desired light of a light emitting device using the sheet molded body. For example, as the second sheet 20, a light-transmitting sheet made of only a resin (hereinafter, referred to as a clear sheet), a phosphor sheet containing a phosphor in a resin, and a light-reflective material contained in a resin Reflective sheet and the like. The second sheet 20 may contain, for example, a diffusing agent or a coloring agent in the resin in addition to the phosphor and the light-reflective material.

  When a clear sheet is used as the second sheet 20, it is possible to form a sheet molded body in which small pieces containing a phosphor substantially uniformly are covered with a translucent resin not containing a phosphor. The sheet molded body having such a configuration can protect the phosphor from heat, moisture, and the like. In addition, by mounting the light-emitting element on the light-emitting element, part of the light from the light-emitting element can be emitted without wavelength conversion by the phosphor, so that light absorption by the phosphor can be reduced and light extraction can be improved. be able to. In addition, if a phosphor sheet is used as the second sheet 20, it is possible to form a sheet molding in which small pieces containing the phosphor substantially uniformly are covered with a translucent resin containing the phosphor. For example, by forming a sheet molded body using the second sheet 20 containing a phosphor that does not absorb the emission color of the phosphor contained in the first sheet 10 and mounting it on the light emitting element, light absorption by the phosphor is achieved. It is possible to form a light-emitting device with high luminous efficiency which can suppress light emission. Further, by using the phosphor sheet in which the phosphor is substantially uniformly contained in the resin, a light emitting device with less color unevenness can be obtained. In addition, if a reflective sheet is used as the second sheet 20, it is possible to form a sheet molded body in which the small pieces containing the phosphor substantially uniformly are covered with the light-reflective resin. Such a sheet molded body has good parting properties (that is, the light emitting device) by removing a part of the second sheet covering the surfaces of the plurality of small pieces to expose the small pieces and mounting the small pieces on the light emitting element. The boundary between the light-emitting portion and the light-reflective member surrounding the light-emitting portion is relatively clear.) A light-emitting device can be formed. In the first embodiment, a clear sheet containing no phosphor is used as the second sheet 20.

  The thickness of the prepared second sheet 20 depends on the thickness (height) of the plurality of small pieces 40 and the arrangement interval, but is preferably at least thicker than the plurality of small pieces 40. Accordingly, the second sheet 20 can be provided so that the second sheet 20 covers a part of the surface of the plurality of small pieces 40 and the upper surface is substantially flat. In the first embodiment, for example, the second sheet 20 of 50 μm to 200 μm can be prepared.

  Next, as shown in FIG. 2A, the prepared second sheet 20 is placed on the plurality of cured small pieces 40. Then, by appropriately pressing the second sheet 20 from above and applying pressure, the semi-cured second sheet 20 is deformed along the plurality of small pieces 40, and as shown in FIG. Partly covered. Since the second sheet 20 is in a semi-cured state, it can be deformed so as to cover a part of the surface of the plurality of small pieces 40 by its own weight by leaving it after placing it on the plurality of small pieces 40. By applying pressure, a part of the surface of the plurality of small pieces 40 can be more reliably covered with the second sheet 20. The upper surface of the second sheet 20 can be formed into a desired shape by changing the shape of the pressing surface of the member that presses the second sheet 20. For example, when the second sheet 20 is pressed by a member having a flat pressing surface, the upper surface of the second sheet 20 can be made substantially flat as shown in FIG. 2B. Note that the pressing force can be appropriately adjusted depending on how thick the second sheet is to be finally formed.

  Here, a part of the surface refers to a surface other than the surface of the plurality of small pieces 40 on the substrate side (the lower surface in FIGS. 2A and 2B). Therefore, when the shape of the plurality of small pieces 40 is a hemisphere as in the first embodiment, the curved surfaces of the small pieces are covered with the second sheet 20 as a part of the surface. When the plurality of small pieces are quadrangular prisms, the upper surface and side surfaces are covered with the second sheet as a part of the surface.

  At this time, by pressing the second sheet 20 while heating it, the second sheet 20 is more likely to be deformed, and the gaps between the plurality of small pieces 40 are easily covered without gaps. Further, heating is preferable because the plurality of small pieces 40 and the second sheet 20 are easily bonded. A mold that can apply pressure while heating is preferably a mold or the like. For example, in the first embodiment, the second sheet 20 placed on the plurality of small pieces 40 can be pressed at 1 kPa to 5 kPa while heating at about 40 ° C. to 60 ° C.

  By using the semi-cured second sheet 20 in this way, the surface of the small piece 40 can be easily covered with the resin. Also, when coating a plurality of small pieces with resin by injection molding or the like, if the resin is not sufficiently filled in the mold, the thickness of the sheet molded body differs between the center and the end of the sheet or becomes thinner as a whole. In some cases, the surface of the small piece cannot be covered. However, by using the semi-cured second sheet 20, it is possible to cover the plurality of small pieces 40 more reliably. Further, when the semi-cured second sheet 20 containing the phosphor substantially uniformly in the resin is used, compared to the case where the liquid resin containing the phosphor is used by injection molding or the like, the amount of the resin that covers the small pieces 40 can be reduced. In this case, the phosphor can be contained substantially uniformly, and by mounting the sheet molded body on the light emitting element, a light emitting device with less color unevenness can be formed.

(Second sheet curing step)
Next, in the second sheet curing step, the sheet molded body 100 can be formed by curing the second sheet 20 covering a part of the surface of the plurality of small pieces 40. For example, heating can be performed at 150 ° C. for 4 hours using a method such as an oven that can maintain a constant temperature for a fixed time. The curing is preferably performed in a state where the small pieces 40 and the second sheet 20 are horizontal. Thereby, a sheet molded body having a substantially uniform thickness can be formed. In the first embodiment, as shown in FIG. 3, a semicircular small piece 40 containing a phosphor substantially uniformly has a surface excluding its plane (the lower surface in FIG. 3) excluding a phosphor. The sheet molding 100 covered with the resin (the second sheet 20) can be formed.

(Individualization process)
In addition, after the 2nd sheet hardening process, you may have the individualization process of individualizing the sheet molded object 100 which has the some small piece 40 shown in FIG. 3 into a desired magnitude | size and shape. FIG. 4 is a schematic cross-sectional view illustrating an individualizing step in the method for manufacturing a sheet molded body according to the first embodiment. In the singulation process, the cured second sheet 20 between the plurality of small pieces 40 of the sheet molded body 100 is cut so that at least one small piece 40 is included. Thus, a sheet molded body 100a having a desired size and shape can be obtained. In the first embodiment, as shown in FIG. 4, a sheet molded body 100a including one small piece 40 can be formed.

  As described above, in the first embodiment, since the second sheet 20 between the plurality of small pieces 40 is cut, the sheet molded body 100a in which the resin (small piece 40) containing the phosphor is not exposed on the side surface can be formed. Further, since the small piece is not exposed to the cut surface, even if the small piece 40 contains a fluorescent substance weak in moisture, the fluorescent substance does not deteriorate due to moisture during dicing. Therefore, the sheet molded body 100a can be formed using a desired phosphor without deterioration of the material. Preferably, the substrate is removed before the singulation step.

  As described above, according to the manufacturing method of the first embodiment, a sheet molded body having a phosphor-containing region (small piece) having a desired shape and containing phosphors substantially uniformly can be easily formed. . More specifically, by using the first sheet 10 containing the phosphor substantially uniformly, compared to the case where a liquid resin containing the phosphor is used such as an injection molding, a printing method, and a dropping method, the use of the first sheet 10 is more efficient. The sedimentation of the body can be suppressed, and a plurality of small pieces 40 containing the phosphor substantially uniformly can be formed. Furthermore, by using the first sheet 10 in a semi-cured state, the die 30 can be used for punching, and a small piece 40 having a desired shape can be easily formed. In addition, by punching out the first sheet 10 with the mold 30, it is possible to form the plurality of small pieces 40 apart from each other without performing a step of removing the connection portion, and the like. In the above, the sheet molded body 100 can be divided into individual pieces without cutting the small pieces. Therefore, the sheet molded bodies 100 and 100a can be easily formed using the first sheet 10 containing the desired phosphor. Further, by using the semi-cured second sheet 20, it is possible to cover a part of the surface of the plurality of small pieces 40 with resin without using a mold or the like and at a reduced cost.

<Embodiment 2>
(Production method of sheet molding)
The manufacturing method of the sheet molded body 200 according to the second embodiment is different from the first embodiment in the form of the first sheet and the second sheet to be used. In addition to the steps of the manufacturing method described in the first embodiment, the second sheet It has a partial removal step. Other manufacturing methods can be substantially the same as those in the first embodiment, and thus detailed description is omitted.

FIG. 5A is a schematic cross-sectional view showing a small piece forming step in the method for manufacturing a sheet molded body according to Embodiment 2. FIG. 5B is a schematic cross-sectional view illustrating a step of partially removing the second sheet in the method for manufacturing a sheet molded body according to Embodiment 2. FIG. 5C is a schematic cross-sectional view of a sheet molded body manufactured by the manufacturing method according to the second embodiment.
In the second embodiment, as shown in FIG. 5A, a first sheet 10a in a semi-cured state laminated in two layers is prepared. The first sheet 10a has a light-transmitting property. If at least one layer of the laminated sheets contains a phosphor substantially uniformly in a resin, a layer containing no phosphor is used. The sheets may be laminated, or three or more sheets may be laminated. In the second embodiment, a first sheet 10a is prepared in which a clear sheet Y made of a resin not containing a phosphor is laminated on a phosphor sheet X containing a phosphor substantially uniformly in a resin.

  Then, similarly to the first embodiment, the first sheet 10a is die-cut with the prepared mold 30, and a plurality of small pieces 40a are formed and cured. In the second embodiment, it is a semicircular shape, has a resin (phosphor sheet X) containing a phosphor substantially uniformly on the lower surface side (flat surface side), and has a resin containing no phosphor on the upper surface side (clear sheet). A plurality of small pieces 40a having Y) are formed. In addition, by appropriately adjusting the hardness of the phosphor sheet X and the clear sheet Y in the semi-cured state, it is possible to prevent the boundary between the phosphor sheet X and the clear sheet Y from being distorted or deformed due to die cutting. Thus, as shown in FIG. 5B, it is possible to form the small piece 40a while maintaining the boundary between the sheets on a substantially flat surface. 5A and 5B, the through-hole or concave portion 31 and the plurality of small pieces 40a of the mold 30 are semicircular, but are not limited thereto, and can be appropriately selected.

Next, in the second embodiment, in the small piece covering step, a semi-cured reflecting sheet is used as the second sheet 20a. Then, the reflection sheet, which is the second sheet 20a, is placed on the plurality of small pieces 40a, pressed and deformed, and a part of the surface of the plurality of small pieces 40a is covered and cured. Here, in the second embodiment, in the second sheet partial removing step, a part of the cured second sheet 20a covering the plurality of small pieces 40a is removed by grinding or the like. In the second embodiment, as shown by the broken line in FIG. 5B, a part of the resin (clear sheet Y) that does not include the phosphor of the second sheet 20a and the plurality of small pieces 40a is removed. Thereby, as shown in FIG. 5C, a sheet molded body 200 in which the small pieces 40a are exposed from the upper surface and the lower surface of the light-reflective resin (the second sheet 20a) can be formed. More specifically, in the second embodiment, the upper part of the semi-circular sphere has a shape in which the upper part is removed (that is, the side surface is substantially a truncated cone), and the upper surface side is made of resin (clear sheet Y) containing no phosphor. The sheet molded body 200 has a small piece 40a on the lower surface side made of a resin (phosphor sheet X) containing a phosphor substantially uniformly, and the side surface thereof is covered with a light-reflective resin (second sheet 20a). Can be formed.
Note that a second sheet having a through-hole at a position corresponding to the plurality of small pieces 40a is prepared, and the second sheet is provided so that the small piece 40a is located in the through-hole, thereby eliminating the second sheet partial removing step. It is possible to Further, a second sheet having a lower hardness and thinner than the thickness (height) of the plurality of small pieces 40a is prepared, and is placed on the plurality of small pieces 40a, whereby the second sheet is pierced by the plurality of small pieces 40a. Alternatively, a part of the upper surface of the small piece 40a may be exposed, and the step of partially removing the second sheet may be omitted.

  After that, similarly to the first embodiment, the sheet molded body 200 may be cut into a plurality of small pieces 40a to be singulated into a desired size and shape. When performing the singulation step, it is preferable to remove the substrate before singulation.

As described above, by using the first sheet 10a in which the clear sheet Y is laminated on the phosphor sheet X, the resin containing no phosphor is laminated on the resin containing the phosphor substantially uniformly. The sheet molding 200 can be formed. Therefore, it is possible to prevent the phosphor sheet X from being ground in the above-described removal, and to protect the phosphor from external moisture and heat.
Further, by using a reflection sheet as the second sheet 20a and removing a part of the surface of the second sheet 20a so that the small pieces are exposed, the small pieces 40a are made of a light-reflective resin (the second sheet 20a) in plan view. The sheet molded body 200 surrounded by is formed. By mounting such a sheet molded body 200 on a light emitting element, a light emitting device with good parting performance can be formed.

  Further, in the manufacturing method according to the second embodiment, in the second sheet partial removing step, only a part of the resin (clear sheet Y) that does not include the phosphor of the second sheet 20a and the plurality of small pieces 40a is removed. . Further, in the singulation process, the second sheet 20a between the plurality of small pieces 40a is cut. Therefore, since the resin containing the phosphor (the phosphor sheet X) is not exposed on the ground surface and the cut surface, even if the phosphor sheet X contains the phosphor that is weak against moisture, the phosphor is not affected by moisture during dicing. Does not deteriorate. Therefore, the sheet molded body 200 can be formed using a desired phosphor without deterioration of the material.

  In the second embodiment, a first sheet composed of a single-layer sheet containing a phosphor substantially uniformly or a first sheet in which two or more layers each containing a different phosphor are laminated is prepared and die-cut. A plurality of small pieces may be formed, and can be appropriately selected according to desired light of a light emitting device using a sheet molded body.

<Embodiment 3>
(Method of manufacturing light emitting device)
In the third embodiment, a light emitting device is manufactured using the sheet molded bodies formed in the first and second embodiments. In the method for manufacturing a light emitting device according to the third embodiment, the first main surface 51 having a pair of electrodes and the second main surface 52 on the opposite side are formed on the sheet molded body 100 before singulation shown in FIG. Light-emitting element mounting step of mounting the light-emitting element 50 having the second main surface 52 on the small piece 40 of the sheet molded body 100, and a part and a side surface of the first main surface 51 of the light-emitting element 50 And a light reflecting member forming step of forming the light reflecting member 60 so as to cover the upper surface of the sheet molded body. In addition, after forming the light reflecting member 60, a singulation step of cutting the light reflecting member 60 between the plurality of light emitting elements 50 and the second sheet 20 between the plurality of small pieces 40 of the sheet molded body 100 is included. May be.
Hereinafter, each step of the method for manufacturing the light emitting device according to the third embodiment will be described in detail.

(Light emitting element mounting process)
FIG. 6 is a schematic cross-sectional view showing a light emitting element mounting step in the method for manufacturing a light emitting device according to the third embodiment. In the light emitting element mounting step, the light emitting elements are mounted on the sheet molded body as shown in the right end of FIG. 6, and the light emitting elements are fixed to the sheet molded body as shown in the left three figures.
In the light emitting element mounting step, first, the light emitting element 50 is prepared. One or a plurality of light emitting elements 50 may be prepared. In the third embodiment, a plurality of light emitting elements 50 are prepared. The prepared light emitting element 50 has a first main surface 51, a second main surface 52 on the opposite side, and a side surface connecting the first main surface 51 and the second main surface 52. 51 has a pair of electrodes.

Further, a sheet molded body 100 for mounting the light emitting element 50 is prepared. In the third embodiment, the sheet molded body 100 having a plurality of small pieces 40 shown in FIG. 3 is used, and the small piece 40 is arranged so that the surface where the small pieces 40 are exposed faces upward. Here, it is preferable that the shape of the small piece 40 of the sheet molded body 100 to be prepared is appropriately selected according to the planar shape of the light emitting element 50 (the shape of the surface in contact with the sheet molded body). For example, the planar shape of the light emitting element 50 is such that the distance from the center to the outer edge is substantially equal (for example, a circle) or the shape in which the difference in the distance from the center to the outer edge is relatively small (for example, a regular polygon such as a square or a regular hexagon) In this case, the shape of the small piece 40 is preferably a semicircular sphere. In addition, for example, when the planar shape of the light emitting element is a rectangle or an ellipse, the shape of the small piece is preferably a semi-elliptical sphere. By selecting the shape of the small piece 40 in this manner, the light emitted from the light emitting element 50 can be easily converted to a substantially uniform wavelength.
In addition, as shown in FIG. 6, it is preferable that an adhesive Z for fixing the light emitting element 50 is disposed on the sheet molded body 100. As the adhesive Z, for example, a translucent resin can be used, and can be appropriately arranged by a desired method such as a dropping method, a drawing method, and a printing method.

Next, the prepared light emitting element 50 is mounted on the sheet molded body 100 on which the adhesive Z is disposed. Here, the light emitting element 50 is mounted on the sheet molded body 100 such that the second main surface 52 is arranged on the small piece 40. In the third embodiment, as shown in FIG. 6, a plurality of light emitting elements 50 are placed on the sheet molding 100 so as to be arranged on the plurality of small pieces 40, respectively. Note that one light-emitting element may be mounted so as to straddle a plurality of small pieces, or a plurality of light-emitting elements may be mounted on one small piece, and may be appropriately selected depending on light required for the light-emitting device. Can be.
After that, by curing the adhesive material Z, the light emitting element 50 can be fixed on the sheet molded body 100.

(Light reflective member forming step)
FIG. 7 is a schematic cross-sectional view showing a light reflecting member forming step in the method for manufacturing a light emitting device according to the third embodiment. In the third embodiment, after the light emitting element mounting step, a part and the side surface of the first main surface 51 of the light emitting element 50 and the upper surface (the surface on the light emitting element 50 side) of the sheet molded body 100 are covered. The light reflective member 60 is formed by injection molding, compression molding, transfer molding, printing, or the like. In the third embodiment, as shown in FIG. 7, the surface of the first main surface 51 of the light emitting element 50 except for a part of the pair of electrodes, the adhesive Z covering the side surfaces of the light emitting element 50, and the sheet molded body 100. The light reflecting member 60 is formed so as to cover the upper surface of the substrate, and is cured. When the light reflecting member 60 is provided so as to cover the pair of electrodes of the light emitting element 50, a part of the light reflecting member 60 is ground by grinding or the like so that a part of the pair of electrodes is exposed. Is removed.

(Individualization process)
FIG. 8 is a schematic cross-sectional view illustrating an individualization step in the method for manufacturing a light emitting device according to the third embodiment. In the third embodiment, after the light reflecting member is formed, the light reflecting member 60 between the plurality of light emitting elements 50 and the plurality of small pieces (the second sheet 20) of the sheet molded body 100 are cut by dicing, scribing, or the like. . By cutting in this manner, the light emitting device 1000A can be formed.
In the third embodiment, as shown in FIG. 8, the light reflective member 60 and the sheet molded body 100 are cut so that the light emitting device 1000 includes one light emitting element 50 and one small piece 40. However, the invention is not limited thereto, and the light reflecting member and the sheet molded body may be cut so that the light emitting device has a plurality of light emitting elements, or the light reflecting member and the sheet may be cut so that the light emitting device has a plurality of small pieces. The compact may be cut.

(Configuration of Light Emitting Devices 1000A and 1000B)
FIG. 9A is a schematic cross-sectional view of a light emitting device 1000A manufactured by the manufacturing method according to the third embodiment using the sheet molded body 100 formed in the first embodiment. FIG. 9B is a schematic sectional view of another light emitting device 1000B manufactured by the manufacturing method according to the third embodiment using the sheet molded body 100 formed in the first embodiment. The light emitting device 1000A includes a light emitting element 50 having a first main surface 51 having a pair of electrodes, a second main surface 52 on the opposite side, and a side surface connecting the first main surface 5 and the second main surface 52. A light reflecting member 60 covering a part and a side surface of the first main surface 51 of the light emitting element 50; and a sheet molding 100 provided on the second main surface 52 and the light reflecting member 60 of the light emitting element 50. And

The light-reflective member 60 of the light-emitting device 1000A is configured such that the light-emitting element 50 and the sheet molding 100 Is coated.
In the sheet molded body 100, a semicircular small piece 40 made of a resin containing a phosphor substantially uniformly is covered with a translucent resin (second sheet 20) not containing a phosphor. Is exposed from a light-transmitting resin (second sheet 20) containing no phosphor. The sheet molded body 100 of the light emitting device 1000A has the small piece 40 exposed from the translucent resin (the second sheet 20) such that the surface side faces the light emitting element 50 and the light reflective member 60, and the light emitting element 50 Are provided so that the small pieces 40 are arranged on the second main surface 52.

  Note that the light emitting device 1000A has a translucent adhesive Z that bonds the sheet molded body 100 and the light emitting element 50. For example, as shown in FIG. 9A, the adhesive Z is formed on the side surface of the light emitting element 50, a part of the surface of the sheet molded body 100 on the light emitting element 50 side (the lower surface in FIG. 9A), and the light emitting element 50 and the sheet molded body 100 are provided. As shown in FIG. 6, when the light emitting element 50 is placed on the sheet molded body 100 as shown in FIG. It is provided by crawling up to the first main surface 51 side. Therefore, the adhesive Z covering the side surface of the light emitting element 50 can be provided in a tapered shape from the second main surface 52 side of the light emitting element 50 to the first main surface 51 side. Accordingly, as shown in FIG. 9A, the inner side surface of the light reflective member 60 that covers the adhesive Z is inclined outward from the first main surface 51 side of the light emitting element 50 toward the second main surface 52 side. The light emitted from the side surface of the light emitting element 50 can be efficiently reflected toward the sheet molded body 100.

  In the light emitting device 1000A of Embodiment 3 shown in FIG. 9A, the sheet molded body 100 is larger than the light emitting element 50 and the small piece 40 of the sheet molded body 100 is larger than the light emitting element 50 in plan view. More specifically, the small piece 40, the light emitting element 50, and the side surface of the light emitting element 50 are covered on the surface where the sheet molded body 100 and the light emitting element 50 and the adhesive Z that covers the side surface of the light emitting element 50 face each other. The adhesive material Z has substantially the same size. Further, in the third embodiment, the planar shape of the light emitting element 50 is a square, and the small pieces 40 are semicircular. Further, in the third embodiment, the side surface of the sheet molded body 100 and the side surface of the light reflective member 60 are provided on substantially the same plane.

In the light emitting device 1000A as described above, the light of the light emitting element 50 is transmitted through the small piece 40 of the sheet molded body 100, wavelength-converted, and emitted to the outside of the light emitting device 1000A. In the third embodiment, since the translucent sheet molded body 100 is provided on the light emitting element 50 and the light reflecting member 60, a light emitting device with a wide light distribution can be formed.
Further, the small piece 40 of the sheet molded body 100 contains the phosphor substantially uniformly, so that the sheet molded body 100 and the adhesive Z covering the side surfaces of the light emitting element 50 and the light emitting element 50 are opposed to each other. Since the small pieces 40 are larger than the light emitting element 50 and the adhesive Z covering the side surfaces of the light emitting element 50, the light emitting device 1000A with less color unevenness can be obtained. Further, it is preferable that the planar shape of the light emitting element 50 is a square and the small piece 40 is a semicircular sphere, so that light emitted from the light emitting element 50 can be substantially uniformly converted in wavelength.

  Note that, as in a light emitting device 1000B shown in FIG. 9B, the small piece 40 of the sheet molded body 100 may be configured to be smaller than the light emitting element 50. More specifically, in the light emitting device 1000B, on the surface where the sheet molded body 100 and the light emitting element 50 and the adhesive Z covering the side surface of the light emitting element 50 face each other, the small piece 40 is formed by the light emitting element 50 and the light emitting element 50. Is smaller than the adhesive material Z that covers the side surface of the second member. Therefore, in the light emitting device 1000B, a part of the light of the light emitting element 50 passes through the translucent resin (the second sheet 20) containing no phosphor and is emitted to the outside of the light emitting device 1000B. As described above, since part of the light of the light emitting element 50 is emitted without passing through the small piece 40, the loss due to the light absorption of the phosphor is reduced, and the light extraction of the light emitting device 1000B can be improved. .

  In addition, the shape of the small piece 40 of the sheet molded body 100 of the light emitting devices 1000A and 1000B is not limited to a semicircular shape, and the light emitting device that emits desired light can be appropriately selected according to the planar shape of the light emitting element 50 or the like. Can be. Further, the small piece 40 of the sheet molded body 100 may have substantially the same size as the light emitting element 50 in a plan view. Further, the side surfaces of the sheet molded body 100 and the light reflective member 60 of the light emitting device 1000B may not be provided on substantially the same plane.

(Configuration of Light Emitting Device 2000)
Further, the light emitting device 2000 can be formed using the sheet molded body 200 shown in FIG. 5C formed in Embodiment 2. FIG. 9C is a schematic cross-sectional view of a light emitting device 2000 manufactured by the manufacturing method according to the third embodiment using the sheet molded body 200 formed in the second embodiment.
The small piece 40a of the sheet molded body 200 of the light emitting device 2000 is a substantially truncated cone having a curved side surface (shown by a tapered shape in the cross-sectional view of FIG. 9C), and a resin (clear sheet Y) containing no phosphor on the upper surface side ), A resin (phosphor sheet X) containing a phosphor substantially uniformly on the lower surface side, and the side surfaces thereof are covered with a light-reflective resin (second sheet 20a). Therefore, the inner surface of the light-reflective resin (the second sheet 20a) that covers the small piece 40a is inclined inward from the lower surface to the upper surface. Then, the sheet molded body 200 is configured such that the resin (phosphor sheet X) side of the small piece 40a containing the phosphor substantially uniformly faces the light emitting element 50 and the light reflective member 60, and the light emitting element 50 The resin (phosphor sheet X) containing the phosphor substantially uniformly is provided on the second main surface 52. Other configurations can be the same as those of the light emitting device 1000B illustrated in FIG. 9B, and thus detailed description is omitted.

  By using such a sheet molded body 200, a light emitting device 2000 having good parting performance can be obtained. Further, since the inner surface of the light-reflective resin (the second sheet 20a) covering the small piece 40a is inclined inward from the light emitting element 50 side to the light emitting side of the light emitting device 2000, the light of the light emitting element 50 is reduced. Is reflected on the inner surface of the light-reflective resin (the second sheet 20a), and the small pieces 40a easily propagate in the phosphor sheet X. This makes it possible to obtain a desired color with a smaller amount of phosphor. Further, the area surrounded by the inner surface of the light-reflective resin (the second sheet 20a) is smaller on the upper surface side (light emitting surface side of the light emitting device) than on the lower surface side (light emitting element 50 side). Thus, the light from the light emitting element 50 can be narrowed down.

Further, on the surface where the sheet molded body 200 and the light emitting element 50 and the adhesive Z covering the side surface of the light emitting element 50 are opposed to each other, the small piece 40a has the adhesive Z covering the light emitting element 50 and the side surface of the light emitting element 50. With the above size, the light of the light emitting element 50 can be prevented from being reflected on the lower surface of the light-reflective resin (the second sheet 20a) of the sheet molding 200, and the light of the light emitting device 2000 can be extracted. Can be improved. Note that, in the light emitting device 2000, the small piece 40a faces the light emitting element 50 and the side surface of the light emitting element 50 on the surface where the sheet molded body 200 faces the light emitting element 50 and the adhesive Z covering the side surface of the light emitting element 50. The configuration may be smaller than the adhesive material Z to be coated.
The shape of the small piece 40a of the sheet molded body 200 of the light emitting device 2000 is substantially a truncated cone, but is not limited thereto, and can be appropriately selected depending on light required for the light emitting device. Further, the side surfaces of the sheet molded body 200 and the light reflecting member 60 of the light emitting device 2000 are provided on substantially the same plane, but need not be provided on substantially the same plane.

(Configuration of Light Emitting Device 3000)
FIG. 9D is a schematic sectional view of the light emitting device 3000 manufactured by the manufacturing method according to the third embodiment. FIG. 9E is a schematic sectional view of a sheet molded body 300 used in the light emitting device 3000 shown in FIG. 9D. The light emitting device 3000 shown in FIG. 9D differs from the sheet molded body 200 of the light emitting device 2000 shown in FIG. Other configurations can be the same as those of the light emitting device 2000, and thus detailed description is omitted.

  More specifically, the small piece 40b of the sheet molded body 300 of the light emitting device 3000 has a substantially inverted truncated conical shape having a curved side surface (in the cross-sectional view of FIG. 9D, an inverted tapered shape, that is, a shape that is widened upward). , A resin containing no phosphor (clear sheet Y) on the upper surface side, and a resin (phosphor sheet X) containing the phosphor substantially uniformly on the lower surface side, and the side surfaces thereof are light-reflective. It is covered with resin (second sheet 20b). Therefore, the inner surface of the light-reflective resin (the second sheet 20b) that covers the small piece 40b is inclined outward from the lower surface to the upper surface. Then, the sheet molded body 300 is configured such that the resin (phosphor sheet X) side of the small piece 40b containing the phosphor substantially uniformly faces the light emitting element 50 and the light reflective member 60, and the light emitting element 50 The resin (phosphor sheet X) containing the phosphor substantially uniformly is provided on the second main surface 52. As described above, the inner surface of the light-reflective resin (the second sheet 20b) that covers the small piece 40b is inclined outward from the light emitting element 50 side to the light emitting side of the light emitting device 3000, so that the light emitting element 50 Is reflected on the inner surface of the light-reflective resin (the second sheet 20b), and is efficiently emitted to the outside of the light emitting device 3000.

  Such a sheet molded body 300 can be formed by reversing the stacking order of the sheets constituting the first sheet to be prepared as in the second embodiment. That is, a first sheet in which the phosphor sheet Y is laminated on the clear sheet Y is prepared, and is die-cut with a mold 30 having a semicircular through hole or a concave portion 31 and cured to form a plurality of small pieces 40b. . Then, the plurality of small pieces 40b are covered with the second sheet 20b and cured, and a part of the phosphor sheet X of the second sheet 20b and the plurality of small pieces 40b is removed, thereby forming the sheet molded body 300 shown in FIG. 9E. Can be formed. Then, the light emitting element 50 is placed on the surface of the sheet molded body 300 on the side where the phosphor sheet X is exposed, such that the second main surface 52 is disposed, and a part of the first main surface 51 of the light emitting element 50 is provided. The light-emitting device 3000 shown in FIG. 9D is formed by forming the light-reflective member 60c so as to cover the side surface and the surface of the sheet molded body 300 on the light-emitting element 50 side, and by dividing the light-reflective member 60c. Can be.

<Embodiment 4>
(Method of Manufacturing Light Emitting Device 4000)
In the fourth embodiment, the light emitting device 4000 is manufactured using the individualized sheet molded body 100a shown in FIG. 4 in the first embodiment. In the method for manufacturing a light emitting device of Embodiment 4, a light emitting element 50 having a first main surface 51 having a pair of electrodes and a second main surface 52 on the opposite side is prepared, and the first main surface 51 side is provided on a base. The light emitting element 50 is placed on a base so as to be arranged. Then, a sheet molded body placing step of placing the sheet molded body 100 a on the light emitting element 50 is performed so that the small piece 40 is provided on the light emitting element 50. A light reflecting member forming step of forming the light reflecting member 60c so as to cover the portion and the side surface and the lower surface and the side surface of the sheet molded body 100a is performed. After the formation of the light reflecting member 60c, a singulation step of cutting the light reflecting member 60c between the plurality of light emitting elements 50 may be performed.
Hereinafter, each step of the method for manufacturing the light emitting device 4000 according to the fourth embodiment will be described in detail.

(Sheet molded body mounting process)
FIG. 10 is a schematic cross-sectional view illustrating a sheet molded body mounting step in the method for manufacturing a light emitting device according to the fourth embodiment. In the sheet molded body placing step, as shown in the right end of FIG. 10, the sheet molded body is placed on the light emitting element placed on the base, thereby emitting light as shown on the left three. A sheet molded body is fixed on the element.
In the sheet molded body mounting step, first, the light emitting element 50 for mounting the sheet molded body 100a is prepared. One or more light emitting elements 50 may be prepared. In the fourth embodiment, a plurality of light emitting elements 50 are prepared. The light emitting element 50 has a first main surface 51, a second main surface 52 on the opposite side, and a side surface connecting the first main surface 51 and the second main surface 52. It has a pair of electrodes. In the fourth embodiment, the plurality of light emitting elements 50 are placed on the base such that the first main surface 51 side is disposed on the upper surface of the base, that is, the second main surface 52 of the light emitting element 50 faces upward. Keep it. In addition, the planar shape of the light emitting element 50 can be appropriately selected from polygons such as a square and a hexagon, a circle, an ellipse, and the like.
Note that it is preferable that an adhesive Z for fixing the sheet molded body 100a be disposed on the second main surface 52 of the light emitting element 50. As the adhesive Z, for example, a translucent resin can be used, and can be appropriately arranged by a desired method such as a dropping method, a drawing method, and a printing method.

  Next, the sheet molded body 100a is placed on the light emitting element 50 on which the adhesive Z is disposed. Here, the sheet molded body 100a is arranged such that the surface on the side where the small piece 40 is exposed faces the second main surface 52 of the light emitting element 50, and the small piece 40 is placed on the second main surface 52 of the light emitting element 50. It is mounted on the light emitting element 50 so as to be arranged. In the fourth embodiment, as shown in FIG. 10, the sheet molded body 100a is mounted on each of the plurality of light emitting elements 50. Note that one sheet molded body may be placed so as to straddle a plurality of light-emitting elements, or a plurality of sheet molded bodies may be arranged on one light-emitting element, and are appropriately selected according to light required for a light-emitting device. be able to. Here, the shape of the small piece 40 of the sheet molded body 100a to be prepared is appropriately selected according to the planar shape of the light emitting element 50 (the shape of the surface in contact with the sheet molded body) as described above. It is possible to manufacture a light emitting device capable of converting the emitted light into a substantially uniform wavelength.

After that, the sheet material 100a can be fixed on the light emitting element 50 by curing the adhesive Z. The adhesive Z may be provided on the side surface of the light emitting element 50, the lower surface (the surface on the light emitting element 50 side) and the side surface of the sheet molded body 100a, but the adhesive Z provided on the side surface of the sheet molded body 100a is removed. Is preferred. Thereby, the light of the light emitting element can be transmitted to the outside through the sheet molded body.
In the fourth embodiment, as shown in FIG. 10, a sheet molded body 100a larger than the light emitting element 50 is placed. Thereby, the tapered adhesive material Z is easily provided on the side surface of the light emitting element 50 from the second main surface 52 side to the first main surface 51 side, and the inner surface of the light reflecting member covering the adhesive material Z allows light to be transmitted. This is preferable because a light-emitting device with good extraction can be formed. Further, it is preferable to use a sheet molded body having a size equal to or smaller than the light emitting element in a plan view because the sheet molded body can be easily mounted on the light emitting element.

(Light reflective member forming step)
FIG. 11 is a schematic cross-sectional view illustrating a light-reflective member forming step in the method for manufacturing a light-emitting device according to Embodiment 4. In the fourth embodiment, after the sheet molded body mounting step, a part and a side surface of the first main surface 51 of the light emitting element 50 (the adhesive Z covering the side surface of the light emitting element 50 in the fourth embodiment) and the sheet molding are performed. The light reflective member 60c is formed by injection molding, compression molding, transfer molding, printing, or the like so as to cover the lower surface (the surface on the light emitting element 50 side) and side surfaces of the body 100a, and is cured. Note that a part of the first main surface 51 of the light emitting element 50 is a surface excluding a part of a pair of electrodes of the first main surface 51. Therefore, in the fourth embodiment, the light reflecting element 60c and the light emitting element 50 (and the adhesive Z) and the sheet molded body 100a are exposed so that a part of the pair of electrodes of the light emitting element 50 and the upper surface of the sheet molded body are exposed. And When the light reflecting member 60c is provided so as to cover the upper surface of the sheet molded body 100a, a part of the light reflecting member 60c is removed by grinding or the like so that the upper surface of the sheet molded body 100a is exposed. In the fourth embodiment, as shown in FIG. 11, after the light reflecting member 60c is formed and cured, the base is removed.

(Individualization process)
FIG. 12 is a schematic cross-sectional view illustrating an individualization step in the method for manufacturing a light emitting device according to the fourth embodiment. In the singulation step, after forming the light-reflective member, the light-reflective member 60c between the plurality of light-emitting elements 50 is cut by dicing, scribing, or the like to singulate to form the light-emitting device 4000. In the fourth embodiment, as shown in FIG. 12, the light reflective member 60c is cut so that the light emitting device 4000 includes one light emitting element 50 and one sheet molded body 100a. However, the invention is not limited thereto, and the light-reflecting member may be cut so that the light-emitting device has a plurality of light-emitting elements, or the light-reflecting member may be cut so that the light-emitting device has a plurality of sheet moldings. Is also good.
In the singulation step of the fourth embodiment, the light reflecting member 60c is cut, so that it is easier to singulate than in the case of cutting the light reflecting member and the sheet molded body as in the second and third embodiments, which is preferable. .

(Configuration of Light Emitting Device 4000)
FIG. 13 is a schematic sectional view of a light emitting device 4000 manufactured by the manufacturing method according to the fourth embodiment. The light emitting device 4000 includes a light emitting element 50 having a first main surface 51 having a pair of electrodes, a second main surface on the opposite side, and a side surface connecting the first main surface 51 and the second main surface 52. A sheet molded body 100a provided on the second main surface 52 of the light emitting element 50, a part and a side surface of the first main surface 51 of the light emitting element 50, a lower surface of the sheet molded body (a surface on the light emitting element 50 side), and It has a light reflective member 60c that covers the side surface. The light reflective member 60c covers the light emitting element 50 and the sheet molded body 100a so as to expose a part of the pair of electrodes on the first main surface 51 of the light emitting element 50 and the upper surface of the sheet molded body 100a.

In the sheet molded body 100a according to the fourth embodiment, a small semicircular piece 40 made of a resin containing a phosphor substantially uniformly is covered with a translucent resin not containing a phosphor (the second sheet 20). As a result, the plane of the small piece 40 is exposed from the resin (second sheet 20) not containing the phosphor. The surface of the sheet molded body 100 a where the small pieces 40 are exposed is provided so as to face the second main surface 52 of the light emitting element 50.
Further, in the light emitting device 4000 of the fourth embodiment, in plan view, the sheet molded body 100a is larger than the light emitting element 50, and the small piece 40 of the sheet molded body 100a is larger than the light emitting element 50. In the fourth embodiment, the planar shape of the light emitting element 50 is a square, and the small piece 40 is a hemisphere.

  In the light emitting device 4000, as shown in FIG. 13, the side surface of the light emitting element 50, the surface of the sheet molded body 100a on the light emitting element 50 side (the lower surface in FIG. 13), and the gap between the sheet molded body 100a and the light emitting element 50 Is provided with an adhesive Z. The adhesive Z covering the side surface of the light emitting element 50 is such that when the sheet molded body 100a is placed on the light emitting element 50, the adhesive Z moves from the sheet molded body 100a side to the first main surface 51 side of the light emitting element 50. It is provided by climbing up. Therefore, as shown in FIG. 13, the adhesive Z covering the side surface of the light emitting element 50 is provided in a tapered shape from the second main surface 52 side of the light emitting element 50 to the first main surface 51 side. Thus, the inner surface of the light reflective member 60c that covers the adhesive Z on the side surface of the light emitting element 50 is formed into a slope that is inclined outward from the first main surface 51 side to the second main surface 52 side of the light emitting element 50. Accordingly, light emitted from the side surface of the light emitting element 50 can be efficiently reflected in the direction of the sheet molded body 100a.

  In the light emitting device 4000 as described above, the light of the light emitting element 50 passes through the sheet molded body 100a and is emitted to the outside of the light emitting device 4000. In the fourth embodiment, since the side surface of the light-transmitting sheet molded body 100a is covered with the light-reflective member 60c, a light-emitting device with good parting performance can be obtained.

In the light emitting device 4000 according to the fourth embodiment, since the light emitting element 50 has a square planar shape and the small pieces 40 of the sheet molded body 100a are semicircular, the light emitted from the light emitting element 50 has a substantially uniform wavelength. It is preferable because it is easily converted.
Further, in the light emitting device 4000 of the fourth embodiment, on the surface where the sheet molded body 100a faces the light emitting element 50 and the adhesive Z covering the side surface of the light emitting element 50, the sheet molded body 100a is Since the size is larger than the adhesive material Z covering the side surface of the light emitting element 50, a part of the light of the light emitting element 50 transmits a light-transmitting resin (the second sheet 20 ) Is emitted to the outside of the light emitting device 4000. As described above, since part of the light is emitted without passing through the small piece 40, loss due to light absorption of the phosphor is suppressed, and light extraction of the light emitting device 4000 can be improved.

  Furthermore, in the fourth embodiment, the light-reflective member (the light-reflective member 60c) of the light-emitting device 4000 is integrally formed. A translucent member such as the adhesive Z is not provided between the members (the second sheet of the sheet molded body and the light reflective member). Therefore, a configuration in which light from the light-emitting element hardly leaks from a region other than the sheet molded body can be obtained.

  Note that in the light emitting device 4000, the shape of the small pieces 50 is not limited to a semicircular sphere, and the light emitting device 4000 that emits desired light can be obtained by appropriately changing the planar shape of the light emitting element 50 or the like. Further, the sheet molded body 100a may be smaller than the light emitting element 50 in a plan view. Further, in the fourth embodiment, the small piece 40 of the sheet molded body 100a is larger than the light emitting element 50 in plan view, and smaller than the light emitting element 50 and the adhesive Z covering the side surface of the light emitting element 50. It may be smaller, or may be larger than the light emitting element 50 and the adhesive Z covering the side surfaces of the light emitting element 50.

  Hereinafter, members constituting the sheet molded body and the light emitting device of Embodiments 1 to 4 will be described in detail.

(1st sheet)
The first sheet is a semi-cured sheet in which the phosphor is substantially uniformly contained in the resin. As the resin of the first sheet, a thermosetting resin can be used, for example, a silicone resin, a modified silicone resin, an epoxy resin, a modified epoxy resin, a urea resin, a phenol resin, or a hybrid containing two or more of these resins. Resins. In particular, it is preferable to use a silicone resin from the viewpoint of maintaining a semi-cured state.
Examples of the phosphor include a yellow phosphor such as YAG (Y ₃ Al ₅ O ₁₂ : Ce) or a silicate, or a red phosphor such as CASN (CaAlSiN ₃ : Eu) or KSF (K ₂ SiF ₆ : Mn). In addition, a light-emitting substance called a nanocrystal or a quantum dot may be used.

  In the manufacturing method of the embodiment, it is possible to form a sheet molded body without cutting the phosphor-containing portion of the small piece by dicing or the like, and expose the phosphor-containing portion only to the surface in contact with the light emitting element. can do. Therefore, even if the first sheet contains a non-sintered phosphor (for example, KSF or quantum dot) which is weak to moisture and heat, it is possible to form the sheet molded body while suppressing the deterioration of the phosphor. it can. The resin of the first sheet may contain a diffusing agent, a coloring agent, and the like in addition to the phosphor.

(2nd sheet)
The second sheet is a semi-cured sheet made of at least a resin. As the resin, those listed as the resin used as the material of the first sheet can be used. It is preferable to use the same resin as the resin used for the first sheet because the adhesion between the plurality of small pieces and the second sheet is improved.
As the second sheet, one of a clear sheet made of only a resin as described above, a phosphor sheet containing a phosphor substantially uniformly in a resin, and a reflection sheet containing a light-reflective material in a resin is selected. be able to. As the phosphor, those listed as the phosphor contained in the first sheet can be used. Examples of the light reflective material include TiO ₂ , Al ₂ O ₃ , ZnO ₂ , SiO ₂ , BaSO ₄ , Y ₂ O ₃ , Nb ₂ O _{5 and the} like. The resin of the second sheet may contain a diffusing agent, a coloring agent, and the like.

(Light emitting element)
As the light-emitting element, a light-emitting diode or the like generally used in the field can be used. For example, a nitride-based semiconductor (In _X Al _Y Ga _1-XY N, 0 ≦ X, 0 ≦ Y, X + Y ≦ Various semiconductors such as 1), III-V group compound semiconductors such as GaP and GaAs, ZnSe, II-VI group compound semiconductors and the like can be used. The light-emitting element has at least a semiconductor layer including a light-emitting layer and a pair of positive and negative electrodes. As a material of the electrode, for example, a metal such as Au, Ag, Cu, Pt, Al, Rh, W, Ti, Ni, or Pd can be used. Good.

  In addition, the light emitting element may have a substrate for growing a semiconductor layer. Examples of the substrate include an insulating substrate such as sapphire and an oxide substrate such as SiC and Si. In particular, the substrate is preferably transparent. Note that the substrate may be removed by using a laser lift-off method or the like.

(Light reflective member)
The light reflecting member preferably has a light reflectance of the light emitting element of about 60% or more, more preferably about 70 to 90% or more. As a material of the light reflecting member, for example, a material in which a base material contains a light reflecting material can be used. Examples of the base material include resin, ceramic, glass, and a composite material containing two or more of these. In particular, a resin that can be easily formed into a desired shape is preferable. As the resin, those listed as the resin for the first sheet and the second sheet can be used. It is preferable to use the same resin as the second sheet because the adhesion between the sheet molded body and the light reflective member is improved. As the light reflecting material, those listed as the light reflecting material of the second sheet can be used. In addition, the light reflecting member may contain a diffusing agent, a coloring agent, and the like.

1000A, 1000B, 2000, 3000, 4000 Light emitting device 100, 100a, 200, 300 Sheet molded body 10, 10a First sheet X Phosphor sheet Y Clear sheet 20, 20a, 20b Second sheet 21 Resin 30 Mold 31 Through hole Or concave portions 40, 40a, 40b Plural small pieces 50 Light emitting element 51 First main surface 52 Second main surface 60, 60c Light reflective member Z adhesive

Claims (13)

A step of cutting the first sheet in a semi-cured state in which the phosphor is substantially uniformly contained in the resin with a mold having a plurality of through holes or recesses, and forming a plurality of small pieces separated from each other;
Curing the plurality of small pieces;
A step of coating a part of the surface of the plurality of cured small pieces with a second sheet in a semi-cured state made of at least resin;
Curing the second sheet to form a sheet molded body.   The method for manufacturing a sheet molded body according to claim 1, further comprising a step of cutting between the plurality of small pieces after curing the second sheet.   3. The method for manufacturing a sheet molded body according to claim 1, wherein the first sheet is formed by laminating a sheet containing no phosphor on a sheet containing a phosphor. 4.   The method according to any one of claims 1 to 3, wherein the first sheet is formed by stacking two or more sheets each containing a different phosphor. The second sheet contains a light-reflective material,
The method of manufacturing a sheet molded body according to any one of claims 1 to 4, further comprising a step of removing a part of the surface of the second sheet after curing the second sheet to expose the plurality of small pieces.   The method according to any one of claims 1 to 5, wherein the first sheet in the semi-cured state has a Shore D hardness of 10 to 30.   The method according to any one of claims 1 to 6, wherein the semi-cured second sheet has a Shore D hardness of 10 to 30.   The method according to any one of claims 1 to 7, wherein an inner surface of the through hole or the concave portion of the mold is an inclined surface or a curved surface.   9. The method according to claim 8, wherein the concave portion of the mold has a semi-spherical shape. A light-emitting element having a first main surface having a pair of electrodes and a second main surface opposite to the first main surface having a pair of electrodes on the sheet molded body manufactured by the method according to any one of claims 1 to 9. Placing the second main surface on a piece so that the second main surface is arranged;
Forming a light-reflective member so as to cover a part and a side surface of the first main surface of the light-emitting element and an upper surface of the sheet molded body. A plurality of the light emitting elements are placed on the sheet molded body,
The method for manufacturing a light emitting device according to claim 10, further comprising a step of cutting the light reflecting member between the plurality of light emitting elements and the plurality of small pieces of the sheet molding after forming the light reflecting member. . The sheet molded body produced by the method according to any one of claims 1 to 9, comprising a first main surface having a pair of electrodes and a second main surface opposite to the first main surface, and the first A step of placing the small piece on the light emitting element placed so that the main surface side is disposed, so that the small piece is disposed on the light emitting element.
Forming a light reflecting member so as to cover a part and a side surface of the first main surface of the light emitting element and a lower surface and a side surface of the sheet molded body. A plurality of the light emitting elements are placed on the sheet molded body,
The method for manufacturing a light emitting device according to claim 12, further comprising a step of cutting the light reflecting member between the plurality of light emitting elements after forming the light reflecting member.

Images