JP6566016B2 - Method for manufacturing light emitting device - Google Patents

Description

  The present disclosure relates to a method for manufacturing a light emitting device.

  Conventionally, a light source device equipped with a light emitting element has been proposed so that it can be suitably used for backlights of mobile phones and digital cameras (for example, Patent Document 1). In the linear light source device described in Patent Document 1, a plurality of light-emitting elements are disposed at predetermined intervals along the longitudinal direction of an elongated rectangular bar-like wiring board and die-bonded. In addition, the reflectors are disposed so as to be alternately positioned with the respective light emitting elements, and the opposing surfaces of the two reflectors are inclined so that the opening area becomes larger toward the emission direction of the respective light emitting elements. As a result, the overall size and thickness can be reduced, and linear light with high luminance and less luminance unevenness can be obtained.

JP 2004-235139 A

However, the linear light source device as in Patent Document 1 becomes difficult to manufacture as it becomes smaller or thinner.
The present invention has been made in view of the above problems, and an object thereof is to provide a manufacturing method capable of easily manufacturing a small or thin light emitting device.

  Therefore, one embodiment of the present invention provides a light-emitting element having a base and a translucent member having a convex portion on the first surface side of the base, and having a main light emitting surface and an electrode forming surface opposite to the main light emitting surface. The light emitting element is mounted on the convex portion of the translucent member so that the main light emitting surface of the light emitting element and the upper surface of the convex portion of the translucent member face each other. It is a manufacturing method of the light-emitting device which forms the light reflective member which coat | covers the side surface of a convex part.

  In one embodiment of the present invention, a base material of a translucent member is prepared, and a light emitting element having a main light emitting surface and an electrode forming surface opposite to the main light emitting surface is prepared. The light-emitting element is mounted so that the first surface of the light-transmitting member faces, and a concave portion is formed in the light-transmitting member, whereby the light-emitting element on the base and the base is mounted on the light-transmitting member. It is a method for manufacturing a light-emitting device, in which a light-reflective member that forms a convex portion and covers the side surface of the light-emitting element and the side surface of the convex portion of the translucent member is formed.

  Thereby, a small or thin light emitting device can be easily manufactured.

It is a schematic plan view of the base material of the translucent member which concerns on 1st Embodiment. It is a schematic sectional drawing in the AA of FIG. 1A. It is a schematic plan view explaining 1 process of the manufacturing method of the light-emitting device which concerns on 1st Embodiment. It is a schematic sectional drawing in the BB line of FIG. 2A. It is sectional drawing which expands and shows a part of FIG. 2B. It is a schematic sectional drawing explaining 1 process of the manufacturing method of the light-emitting device which concerns on 1st Embodiment. It is a schematic sectional drawing explaining 1 process of the manufacturing method of the light-emitting device which concerns on 1st Embodiment. It is a schematic sectional drawing explaining 1 process of the manufacturing method of the light-emitting device which concerns on 1st Embodiment. It is a schematic sectional drawing explaining 1 process of the manufacturing method of the light-emitting device which concerns on 1st Embodiment. It is a schematic sectional drawing explaining 1 process of the manufacturing method of the light-emitting device which concerns on 1st Embodiment. It is a schematic plan view explaining 1 process of the manufacturing method of the light-emitting device which concerns on 1st Embodiment. It is a schematic sectional drawing in the CC line of FIG. 8A. It is a schematic sectional drawing explaining 1 process of the manufacturing method of the light-emitting device which concerns on 1st Embodiment. 1 is a schematic perspective view of a light emitting device according to a first embodiment. It is a schematic sectional drawing of the light-emitting device of FIG. 10A. It is a schematic sectional drawing explaining 1 process of the manufacturing method of the light-emitting device which concerns on 2nd Embodiment. It is a schematic sectional drawing explaining 1 process of the manufacturing method of the light-emitting device which concerns on 2nd Embodiment. It is a schematic sectional drawing explaining 1 process of the manufacturing method of the light-emitting device which concerns on 2nd Embodiment. It is a schematic sectional drawing explaining 1 process of the manufacturing method of the light-emitting device which concerns on 2nd Embodiment. It is a schematic perspective view of the light-emitting device concerning a 2nd embodiment. It is a schematic sectional drawing of the light-emitting device of FIG. 12A. 6 is a schematic perspective view of a light emitting device according to Example 3. FIG. 6 is a schematic perspective view of a light emitting device according to Example 3. FIG. 6 is a schematic plan view of a light emitting device according to Example 3. FIG. 6 is a schematic bottom view of a light emitting device according to Example 3. FIG. 6 is a schematic cross-sectional view of a light emitting device according to Example 3. FIG. It is a schematic sectional drawing of the illuminating device using the light-emitting device which concerns on Example 3. FIG. 6 is a schematic perspective view of a light emitting device according to Example 4. FIG. It is a schematic sectional drawing of the light-emitting device of FIG. 15A. It is a schematic plan view of the light emitting device according to the embodiment. It is a schematic bottom view of the light emitting device according to the embodiment. It is a schematic sectional drawing of the light emitting element which concerns on embodiment. 10 is a schematic plan view illustrating one step of a method for manufacturing a light emitting device according to Modification 1. FIG. It is a schematic sectional drawing in the DD line | wire of FIG. 17A. 11 is a schematic cross-sectional view illustrating one step of a method for manufacturing a light emitting device according to Modification 1. FIG. 11 is a schematic cross-sectional view illustrating one step of a method for manufacturing a light emitting device according to Modification 1. FIG. 11 is a schematic cross-sectional view illustrating one step of a method for manufacturing a light emitting device according to Modification 1. FIG. 11 is a schematic cross-sectional view illustrating one step of a method for manufacturing a light emitting device according to Modification 1. FIG. 11 is a schematic cross-sectional view illustrating one step of a method for manufacturing a light emitting device according to Modification 2. FIG.

  Hereinafter, embodiments of the invention will be described with reference to the drawings as appropriate. However, the light-emitting device described below is for embodying the technical idea of the present invention, and the present invention is not limited to the following unless otherwise specified. The contents described in one embodiment and example are applicable to other embodiments and examples. The size, aspect ratio, positional relationship, and the like of the members shown in the drawings may be exaggerated or omitted for clarity or ease of explanation.

In this specification, the term “thinning” refers to shortening the length in the short direction in a light emitting device in which the light emission side surface of the light emitting device has a longitudinal direction and a short direction. Refers to a light emitting device having a short length in the short direction.
In this specification, the surface on the light extraction side refers to a surface disposed on the surface side that emits light when the light emitting device is used in each member.

  In one embodiment of the present invention, a translucent member having a base and a convex portion on the first surface side of the base is prepared, and a light emitting element having a main light emitting surface and an electrode forming surface opposite to the main light emitting surface is prepared. The light emitting element is mounted on the convex portion of the translucent member so that the main light emitting surface of the light emitting element and the upper surface of the convex portion of the translucent member face each other. It is a manufacturing method of the light-emitting device which forms the light reflective member which coat | covers the side surface of a part.

  Thus, the accuracy of the position and shape of the light emitting surface can be improved by mounting the light emitting element on the convex portion of the translucent member having the base portion and the convex portion. In addition, by mounting the light emitting element on the convex portion of the translucent member, positioning with the light emitting element can be performed with high accuracy even if the width of the translucent member to be the light emitting surface is reduced later. Can do. In addition, by forming the light reflective member so as to cover the side surface of the convex portion, the light emitting surface of the light emitting device and the accuracy of the position and shape of the light reflective member surrounding the light emitting surface can be improved. Thereby, a small and thin light-emitting device can be manufactured.

  In another embodiment of the present invention, a light-transmitting member is prepared, a light-emitting element having a main light-emitting surface and an electrode forming surface opposite to the main light-emitting surface is prepared, and the main light-emitting surface of the light-emitting element is transparent. The light-emitting element is mounted so that the first surface of the light-transmitting member faces, and a concave portion is formed in the light-transmitting member, so that the light-transmitting member is a region where the light-emitting element is mounted on the base and the base. And forming a light reflecting member that covers the side surface of the light emitting element and the side surface of the convex portion of the light transmissive member.

  Thus, by forming a concave portion around the light emitting element mounted on the upper surface of the translucent member, forming a convex portion, and forming a light reflective member so as to cover the side surface of the convex portion, The accuracy of the position and shape of the light-reflecting member surrounding the light-emitting surface and the light-emitting surface of the light-emitting device can be increased. In addition, by forming a recess for determining the position of the light reflecting member after mounting the light emitting element on the light transmitting member, the light emitting element and the light reflecting property can be reduced while reducing the width of the light transmitting member serving as the light emitting surface. The alignment with the member can be performed with high accuracy. Thereby, a small and thin light-emitting device can be manufactured.

First Embodiment FIGS. 10A to 10B show a light emitting device 100 manufactured by the manufacturing method of the first embodiment. A light emitting element 2 having a longitudinal direction and a short direction in a plan view, a translucent sealing member 1 having a longitudinal direction and a transversal direction in a plan view, and the light emitting element 2 and the translucent sealing member 1 are bonded. A translucent adhesive 3, a light reflecting member 4 that covers the side surface of the light emitting element 2, the translucent adhesive 3, and the side surface of the translucent sealing member 1, It arrange | positions so that the longitudinal direction of the translucent sealing member 1 may correspond.

  Such a light emitting device can be obtained, for example, by a manufacturing method including the following steps.

  Hereinafter, a method for manufacturing the light emitting device 100 of this embodiment will be described in detail.

1. Preparation of Translucent Member First, as shown in FIGS. 2A, 2 </ b> B, and 2 </ b> C, a translucent member 10 having a base 13 and a convex portion 12 on the first surface side of the base 13 is prepared. 2C is a cross-sectional view showing a part of FIG. 2B in an enlarged manner in order to easily show the base portion 13 and the convex portion 12.
In the present embodiment, the surface of the convex portion 12 of the translucent member that is finally exposed from the light reflective member is used as the light emitting surface of the light emitting device 100. Therefore, the length in the longitudinal direction and the short side direction when the convex portion 12 of the translucent member is viewed in plan is equal to the length in the long side direction and the short side direction of the light emitting device 100, respectively. In this specification, that lengths are equivalent means that the difference in length is within about plus or minus 10%. That is, in the present embodiment, when the convex portion 12 of the translucent member is viewed in plan, the length in the longitudinal direction of the top surface of the convex portion 12 and the length in the longitudinal direction of the bottom surface of the convex portion 12 are both light emitting devices. The length in the longitudinal direction of the light emitting surface 100 is within about plus or minus 10%, and the length in the short direction of the top surface of the convex portion 12 and the length in the short direction of the bottom surface of the convex portion 12 are both. The length of the light emitting surface in the longitudinal direction and the lateral direction is within about plus or minus 10%. In the present embodiment, for example, the side surface of the convex portion 12 may be inclined so that the light emitting surface side of the light emitting device 100 is large or the light emitting surface side is small. The length in the longitudinal direction and the short direction when the convex portion 12 is viewed in plan may or may not be equal to the length in the longitudinal direction and the short direction of the light emitting surface of the light emitting device 100, respectively. . In the present embodiment, the length in the short direction of the light extraction surface side (the bottom surface of the convex portion 12) facing the support 50 is more preferably the length in the short direction of the light emitting surface of the light emitting device 100. It forms so that it may become substantially the same. In the present embodiment, the side surface of the convex portion 12 may have irregularities, and the length of the light emitting surface of the light emitting device 100, the upper surface and the bottom surface of the convex portion 12, or the length in the short direction is unified. Thus, the comparison may be made for any of the minimum length, the longest length, and the average length.

In the present embodiment, as described below, the preparation of a translucent member having a longitudinal direction and a transversal direction in a plan view and having a base portion and a convex portion is performed by preparing a base 11 of a sheet-like translucent member. Is mounted on the support 50, and a part of the base material is removed partway through the thickness of the base material to form a plurality of convex portions 12.
Hereinafter, the preparation process of the translucent member will be described in detail.

1-1. Molding of base material of translucent member First, the base material 11 of a sheet-like translucent member is formed. In the following drawings, the base member 11 of the translucent member has a first layer 11a that is a phosphor-containing layer containing a phosphor and a second layer that is a phosphor-free layer 11b that does not contain a phosphor. The structure of is illustrated. The base material 11 of the sheet-like translucent member is formed by, for example, compression molding, transfer molding, injection molding, spraying, printing, potting, electrophoresis using a material in which a liquid resin and a phosphor as necessary are mixed. It can be carried out by impregnating a phosphor into a substantially uniform thickness by deposition or the like.

1-2. Next, as shown in FIG. 1A and FIG. 1B, the base member 11 of the translucent member formed in a sheet shape is mounted on the support member 50. In the present embodiment, the light extraction side surface of the base material 11 of the translucent member is attached to a support having an adhesive layer 50a on the upper surface. As the support body 50, a single body or a composite body such as a resin film, a metal plate, a resin plate, and a ceramic plate can be used. Whichever material is used as the support, it is preferable to have an adhesive layer 50a on one surface of the support 50, and more preferable to have an adhesive layer that is cured by ultraviolet rays (UV). By using such an adhesive layer 50a, the base material 11 of the translucent member can be stably held on the support 50. Furthermore, since it undergoes a thermal history such as curing of the resin in the subsequent steps, it is more preferable to have heat resistance. In addition, you may make it perform mounting the base material 11 of the translucent member on the support body 50 by forming the base material 11 of a translucent member on the support body 50.

1-3. Next, as shown in FIGS. 2A and 2B, a part of the thickness of the base material 11 is formed in a groove shape in a state where the base material 11 of the translucent member is mounted on the support 50. As a result, a plurality of convex portions 12 having a longitudinal direction and a short direction in a plan view are formed. In the present embodiment, the plurality of convex portions 12 are formed in a matrix of 4 columns × 5 rows. Around these, the end material 11c when the base material 11 of the translucent member is cut is disposed. The plurality of convex portions 12 and the end material 11 c are connected by the base portion 13.

  For example, methods such as dicing, Thomson processing, ultrasonic processing, and laser processing can be used for forming the convex portions 12 of the base member 11 of the translucent member, that is, forming the grooves 14. In particular, it is preferable to form the grooves 14 by dicing that is excellent in rectilinearity in order to form the convex portions 12 of adjacent translucent members, which will be described later, apart from each other. In particular, when the light-transmitting member contains a phosphor that is sensitive to moisture (for example, KSF phosphor), it is preferable to use a construction method that does not use water. Thereby, deterioration of a translucent member can be reduced.

  Since the formation of the convex portion substantially defines the shape of the light emitting surface of the light emitting device 100, particularly the shape of the side in the longitudinal direction in plan view, the cutting is preferably performed by a method having excellent straightness. . The straightness of cutting at the time of forming the convex portion is also important for defining the shape of the side in the short direction. If such straightness cannot be ensured, the light emitting surface of the light emitting device 100 may not have a desired shape. Moreover, since the side surface of the translucent sealing member 1 is coat | covered with the light reflective member 4 mentioned later, control of the thickness of the light reflective member 4 by the dispersion | variation in the shape of the convex part 12 of such a translucent member. This makes it difficult to control the light emission direction by the light reflective member 4, and may deteriorate the characteristics of the light emitting device 100, such as the luminance and the light entrance efficiency to the light guide plate. The straightness in this cutting is defined by the length of the convex portion in the longitudinal direction when a plurality of light emitting elements 2 are mounted on one convex portion 12, as shown in Modification 1 described later. This is particularly important because the side in the longitudinal direction of the light emitting surface (the side corresponding to L4 in FIG. 13C) becomes long.

The degree of linearity of the longitudinal side of the convex portion 12 of the translucent member varies depending on the thickness of the light reflective member 4 that covers the side surface of the translucent sealing member 1. In particular, in order to obtain a thin light-emitting device 100 with high output, the light-transmitting sealing member 1 serving as a light-emitting surface on the light-emitting surface side surface composed of the light-emitting surface and the surface of the light-reflecting member 4 surrounding the light-emitting surface. Since the ratio of the length in the short direction (L5 side in FIG. 13C) needs to be large and the ratio of the light-reflecting member 4 needs to be small while securing the necessary thickness, the light emitting device 100 It is necessary to form the convex portion 12 of the translucent member by cutting in a state where high linearity is maintained over the entire length. Specifically, it is preferable that the light reflecting member 4 has a linearity that can be provided on the entire side surface of the light emitting device 100 in a range of about 10 μm to 100 μm, preferably about 20 to 50 μm.
In this specification, a certain member has high linearity means that, on a predetermined side of a member, an imaginary line passing through the innermost part of the member, parallel to the predetermined side, and the outermost periphery of the member This means that the distance to the part is small.
In the present specification, high straightness of cutting means that cutting can be performed with high linearity.
The convex portion can be provided in a rectangular shape, a square shape, a hexagonal shape, an octagonal shape, a circular shape, an elliptical shape, or a shape similar to this in a plan view.

  In the above description, the case where the protrusions 12 are formed by forming the grooves 14 in a lattice shape has been described as an example. However, in this embodiment, you may make it form the convex part 12 by forming the groove | channel 14 only to one direction. In other words, only two opposing side surfaces of the portion that becomes the translucent sealing member 1 may be formed by forming a groove. For example, the convex portions 12 may be formed by forming a plurality of grooves 14 in parallel to each other, for example, in a base member 11 of a translucent member provided in a plurality of separated strip shapes.

  Thus, by forming the plurality of convex portions 12 connected by the base portion 13, the possibility that the convex portions 12 are deformed can be reduced. Thereby, the handleability of the translucent member 10 in the manufacturing process can be improved, and the mass productivity of the light emitting device can be improved.

  Thus, by removing a part of the base material 11 of the translucent member, the groove 14 is formed and the convex portion 12 of the translucent member is formed, so that the side surface of the translucent sealing member 1 is formed. A space for forming the light reflective member 4 can be provided. When forming the convex part 12 of a translucent member, also when forming a groove | channel without leaving the base 13 in the bottom face of a groove | channel and separating the adjacent convex part 12, it is the light reflective member 4 A space for forming the film can be provided. As described above, by forming the convex portion 12 by forming the groove, the light reflective member 4 is formed without performing the transfer of the translucent member or the expansion of the sheet as will be described later. Space can be provided. This can be easily realized by a cutting method in which a cutting margin such as dicing is generated. The width of the separation may be a level suitable for the thickness of the light reflecting member 4 provided, the cutting method of the light reflecting member 4, and the like, and is preferably about 30 to 300 μm, and more preferably about 30 to 200 μm. Thereby, the light emitting device 100 can be made thin while ensuring the thickness of the light reflective member 4.

  In addition, the formation method of the convex part 12 of a translucent member is not restricted to the thing containing the above-mentioned cutting | disconnection, The shape which has the base 13 and the convex part 12 by compression molding, transfer molding, injection molding, screen printing, spraying, etc. It may be formed.

  In addition, the convex part 12 of a translucent member may differ in the shape of the 1st surface in which the light emitting element 2 is mounted, and the surface on the opposite side, ie, the 2nd surface used as the light emission surface of a light-emitting device. For example, the first surface on which the light emitting element 2 is mounted may be smaller or larger than the second surface serving as the light emitting surface. The translucent member having such a shape can be formed, for example, by changing the shape of the blade that cuts the base material 11 of the translucent member in this embodiment to a V shape or an inverted V shape. it can.

2. Mounting the light-emitting element on the convex portion of the light-transmitting member Next, the light-emitting element 2 is placed on the convex portion 12 of the light-transmitting member via the light-transmitting adhesive 3. Are mounted on the convex portion 12 of the translucent member so that the upper surfaces of the convex portions 12 face each other.

  In this specification, the surface on which the light emitting element 2 of the convex portion 12 of the translucent member is mounted may be referred to as the upper surface.

In the present embodiment, the translucent member 10 formed and prepared on the support 50 is held on the support 50, in other words, the translucent member 10 is transferred or transferred from the support 50. It is preferable to mount the light emitting element 2 on the convex part 12 of each translucent member 10 without mounting or the like. The translucent member 10 having a resin, particularly a silicone resin as a base material, is soft, and the light-transmitting member convex portion 12 serving as a light emitting surface is formed in a thin and long shape in order to realize a thin light emitting device 100. . It is generally difficult to transfer or transfer such a member. In particular, the convex portion 12 of the soft and slender translucent member may be twisted or bent when performing transfer or transfer. In such a case, it becomes very difficult to maintain the linearity of the convex part 12 of the above-mentioned translucent member. Therefore, the translucent member 10 is molded on the support 50 and is held on the same support 50 without being transferred or transferred from the support 50, and the convex portion of the translucent member. It is preferable that the light emitting element 2 is mounted on 12.
However, in this embodiment, since the convex part 12 of the translucent member is connected with the base part 13, the shape stability is relatively high. Therefore, the transfer from the support 50 to a different support may be performed after the formation of the convex portion 12 and before the light emitting element 2 is mounted.
Hereinafter, the process of mounting the light emitting element on the convex portion will be described in detail.

2-1. Application of Liquid Resin Material In the step of mounting the light-emitting element 2 of the present embodiment on the convex portion 12 of the translucent member, first, as shown in FIG. A liquid resin material 31 to be the translucent adhesive 3 is applied.
For the application, methods such as pin transfer, dispensing, and printing can be used. The liquid resin material 31 to be applied may be provided in a plurality of separated island shapes, a series of linear shapes, etc. on the convex portion 12 of one translucent member.

  The coating amount may be a coating amount sufficient to bond the light emitting element 2 and the translucent sealing member 1, and the size and number of the translucent sealing member 1 and the light emitting element 2 and the required adhesive strength. It can be adjusted appropriately according to In addition, it is preferable that the translucent adhesive 3 is arrange | positioned so that the side surface of the light emitting element 2 may be contact | connected other than between the light extraction side surface of the light emitting element 2, and the translucent sealing member 1. FIG. Thereby, light can be extracted from the side surface of the light emitting element 2 and the light extraction efficiency of the light emitting device 100 can be improved.

2-2. Next, as shown in FIG. 4, the light emitting element 2 having a main light emitting surface and an electrode forming surface opposite to the main light emitting surface on the liquid resin material 31 is transparent to the main light emitting surface. It arrange | positions so that it may face the sex member side. At this time, the light emitting elements are preferably arranged so that the longitudinal direction (L7 side in FIG. 16A) coincides with the longitudinal direction of the convex portion 12 of the translucent member.

When the light emitting element 2 is arranged, it is preferable that the liquid resin material 31 to be the light transmitting adhesive 3 and the light emitting element 2 are positioned at the end of the convex portion 12 of the light transmitting member in plan view. . For example, it is preferable that the end of the side in the longitudinal direction of the convex portion 12 of the translucent member coincides with the end of the translucent adhesive 3. In this way, by self-aligning the light emitting elements 2 along the longitudinal sides of the convex portions 12, the light emitting elements 2 can be easily and accurately mounted in rows on the narrow convex portions 12.
The length of the convex portion 12 in the short direction (L5 in FIG. 2A) is preferably about 1 to 2 times the length of the light emitting element 2 in the short direction (L8 in FIG. 16A). It is preferable to be about 1.5 times. Thereby, the thin light emitting device 100 can be obtained while obtaining the self-alignment effect.

2-3. Curing of the liquid resin material Next, the liquid resin material 31 is cured by heat, ultraviolet rays, or the like, and the convex portions 12 of the translucent member and the plurality of light emitting elements 2 are bonded. At this time, the translucent adhesive 3 is shaped to spread from the lower surface side, which is the surface opposite to the light extraction surface facing the convex portion 12 of the light transmissive member of the light emitting element 2, to the light extraction surface side. It is preferable to be formed. Thereby, the light emitting device 100 with high light extraction efficiency can be obtained.

3. Formation of Light Reflective Member Next, as shown in FIGS. 5 and 6, the light reflection that covers the side surfaces of the plurality of light emitting elements 2, the translucent adhesive 3, and the side surfaces of the convex portions 12 of the translucent member. The sex member 4 is formed. The formation of the light reflective member 4 is preferably performed on the same support 50 as the support 50 used for mounting the light emitting element 2 as described above. Thereby, deformation of the translucent member 10 is suppressed, and the light reflective member 4 can be formed with good accuracy even in the linear light emitting device 100 having a narrow width in the short direction. In this embodiment, the 1st surface of the base 13 of the some translucent member adhere | attached on the support body 50, the side surface of the some convex part 12, and the light emitting element 2 mounted in each convex part, The translucent adhesive 3 is collectively covered with a base 41 of a light reflecting member.

  The light reflective member 4 can be formed by methods such as mold forming such as compression molding, transfer molding, injection molding, printing, potting and the like. In particular, when the concentration of the filler contained in the resin of the light reflecting member 4 is increased, the fluidity is deteriorated, and therefore compression molding and transfer molding are most suitable.

  The light reflective member 4 may be provided so as to cover the side surface of the convex portion 12 of one translucent member, the side surface of the light emitting element 2 mounted on the convex portion 12, and the translucent adhesive 3. .

  The light reflective member 4 may be formed in a plurality of times. For example, before mounting the light emitting element 2, a base 41 of a light reflecting member that covers the side surface of the convex portion 12 of the translucent member is formed in advance, and the side surfaces of the plurality of light emitting elements are mounted after the light emitting element is mounted. You may make it form the light reflective member which coat | covers a translucent adhesive agent.

  The light reflective member 4 may cover the lower surfaces of the plurality of light emitting elements 2. Alternatively, the pair of electrodes 2a and 2b of the plurality of light emitting elements 2 may be formed in a shape that exposes them, and after forming the electrodes 2a and 2b so as to cover the electrodes 2a and 2b as shown in FIG. Thus, it may be formed into a shape exposed by grinding or the like.

  In the present embodiment, next, as shown in FIG. 7, the support 15 is removed.

5. Removal of Base of Translucent Member In this embodiment, next, as shown in FIGS. 8A and 8B, the base 13 of the translucent member is removed, and the convex portions 12 of the plurality of translucent members are exposed. . For this removal, polishing, grinding, cutting, Thomson machining, ultrasonic machining, laser machining, etc. can be used, but relatively wide surfaces can be removed at once, and the removal thickness can be managed with high accuracy. Or it is preferable to carry out by grinding.

In addition, since the convex part 12 of a translucent member is being fixed by the base material 41 of a light reflective member, the fall of the linearity by the deformation | transformation of the above-mentioned translucent member 10 does not become a problem easily. Therefore, at the time of this removal, transfer or transfer may be performed. For example, the base 13 can be removed after transferring the light-emitting surface of the translucent member 10 to a different support. Thereby, the light-emitting device 100 can be manufactured stably.
When removing the base 13 of the translucent member 10, a part of the convex part 12 of the translucent member and a part of the substrate 41 of the light reflective member may be removed. Thereby, the dispersion | variation in the thickness of a light-emitting device can be reduced, and the light-emitting device 100 can be manufactured stably.

6). In this embodiment, next, as shown in FIG. 9, the light reflective member is cut and separated between the plurality of convex portions to obtain a plurality of light emitting devices 100 that are separated into pieces. . Specifically, the light-reflective member base material 41 covering the light-emitting element 2 and the light-transmitting adhesive 3 mounted on each of the convex portions 12 of the plurality of light-transmissive members is cut. . For this cutting, methods such as dicing, Thomson processing, ultrasonic processing, and laser processing can be used.

  In the individualization step, the convex portion 12 of the translucent member may be cut in a direction along the short direction (that is, in a direction intersecting with the longitudinal direction). Thereby, the light-emitting device 100 of various length can be manufactured.

  In this way, the light emitting device 100 according to the present embodiment can be obtained.

Modification of the first embodiment (hereinafter referred to as Modification 1)
In the light emitting device 100 according to the first embodiment, one light emitting element 2 is mounted on one convex portion 12, but the light emitting device 100 a of Modification 1 includes a plurality of light emitting devices 100 on one convex portion 12. The light emitting element 2 is mounted.
Hereinafter, a light emitting device 100a according to a modification of the first embodiment will be described.
In the following description, a manufacturing method in the case where two light emitting elements 2 are mounted on one convex portion 12 will be mainly described with reference to FIGS. 17A to 17F, and more than two light emitting elements 2 are appropriately selected. The case of mounting on one convex portion 12 will also be described with reference to FIGS. 13A to 13E.

First, in the manufacturing method of Modification 1, as in the first embodiment, as shown in FIGS. 1A and 1B, a base member 11 of a translucent member formed in a sheet shape is mounted on a support 50. .
Next, as shown in FIGS. 17A and 17B, a plurality of convex portions 12 are formed by forming grooves 14 in the base material 11 in the same manner as in the first embodiment. Here, in Modification 1, for example, as shown in FIG. 17A, the convex portion 12 is formed to have a length approximately twice the length in the longitudinal direction of the convex portion 12 of the first embodiment. Moreover, in the modification 1, as shown to FIG. 17A, the some convex part 12 is formed in the matrix form of 2 columns x 5 rows. As in the first embodiment, the end material 11c is disposed around a region where the plurality of convex portions 12 are formed in a matrix of 2 columns × 5 rows. Moreover, between the adjacent convex parts 12, and between the convex part 12 and the end material 11c are connected by the base part 13. FIG.
In the first modification, since the length in the longitudinal direction of the convex portion 12 is longer than the length in the longitudinal direction of the convex portion 12 of the first embodiment, the groove 14 when forming the convex portion 12 is excellent in straightness. It is preferable to form by dicing. As shown in FIG. 13A to FIG. 13E and the like, when more than two light emitting elements are mounted on one convex portion, it is required to have excellent straightness. By forming a groove having excellent straightness, a light emitting device having a light emitting surface having a long length in the longitudinal direction (L4 in FIG. 13C) such as the light emitting surface shown in FIGS. 13A to 13E can be thinned. Become.

In order to reduce the thickness of the light emitting device, the length of the light emitting surface of the light emitting device as shown in FIGS. 13A to 13E is several times the light emitting surface of the light emitting element (an integer multiple greater than 2). It is preferable to make the thickness of the light reflective member 4 as thin as possible while ensuring the necessary minimum thickness. Specifically, preferably, the light reflecting member 4 is formed to a thickness of about 10 μm to 100 μm on the entire side surface of the light emitting device 100, and more preferably, the light reflecting member 4 has a thickness of about 20 to 50 μm. Form.
When manufacturing a light emitting device having a long length in the longitudinal direction of the light emitting surface as shown in FIGS. 13A to 13E, the groove 14 forming the convex portion 12 is formed only in one direction, A plurality of separated strip-shaped grooves 14 that are long in one direction may be formed.

Next, a liquid resin material for fixing the light emitting element 2 at a predetermined position is applied.
In Modification 1, for example, as shown in FIG. 17C, the liquid resin material 31 is applied to two surfaces in a longitudinally separated state on the upper surface of one convex portion 12.

  In the light emitting device 100a of Modification 1, as shown in FIG. 13E, it is preferable that the translucent adhesive 3 exists so as to be continuous between the plurality of adjacent light emitting elements 2. After mounting the light emitting element in this manner, the liquid resin material 31 is separated in the longitudinal direction in order to form a state in which the side surfaces of the adjacent light emitting elements 2 are connected by the translucent adhesive 3. In the case of applying to a plurality of places, the application amount is appropriately adjusted so that the light-transmitting adhesive 3 protruding between the side surfaces of the adjacent light-emitting elements 2 is connected by placing and pressing the light-emitting elements 2. In addition, the liquid resin material 31 is not separated into a plurality of locations on the upper surface of one convex portion 12 but formed in a continuous state in the longitudinal direction. A plurality of light emitting elements may be placed on the top at a predetermined interval. As described above, when the side surfaces of the adjacent light emitting elements 2 are connected to each other by the translucent adhesive 3, the light emitted from the plurality of light emitting elements 2 is uniformly distributed inside the translucent adhesive 3. It can be made. Therefore, unevenness of light emitted from the light emitting device 100 can be reduced.

Next, as shown in FIG. 17D, the light emitting elements 2 are mounted on the liquid resin material 31, respectively. The light emitting element 2 is placed so that the main light emitting surface thereof faces the translucent member. At this time, for example, the light emitting element is arranged so that the longitudinal center line thereof coincides with the longitudinal center line of the convex portion 12 of the translucent member.
When using the some light emitting element 2, the space | interval of light emitting elements can be about 10 micrometers-1000 micrometers, for example, it is preferable to set it as 200 micrometers-800 micrometers, and it is more preferable to set it as about 500 micrometers. In addition, the distance is preferably about 0.5 to 1 times the longitudinal length L7 of the light emitting element 2 shown in FIG. 16A. Thus, by setting the distance S1 between the light emitting elements to be about 0.5 to 1 times the longitudinal length L7 of the light emitting elements, the number of light emitting elements 2 mounted on one light emitting device can be reduced. . Accordingly, a long light emitting device as shown in FIG. 13 and the like can be easily manufactured, and the material cost can be reduced.

Next, after the liquid resin material is cured, a light reflective member is formed.
In Modified Example 1, as shown in FIG. 17E, a base 41 of a light reflecting member is formed between the adjacent light emitting elements 2 provided in the groove 14 and on one convex portion 12. The base 41 of the light reflecting member covers the side surface of the light emitting element 2 and the translucent adhesive 3 on the convex portion 12 between the adjacent light emitting elements 2 provided on one convex portion 12. In addition, in addition to the side surface of the light emitting element 2 and the translucent adhesive 3, the groove 14 is formed so as to cover the side surface of the convex portion 12.

  As shown in FIG. 17E, the light-reflecting member base 41 is formed so as to expose the pair of electrodes 2a and 2b of the plurality of light-emitting elements 2, but in the same manner as in the first embodiment, the electrode 2a, After forming so as to cover 2b, the electrodes 2a and 2b may be exposed by grinding or the like.

  Then, in the same manner as in the first embodiment, after removing the support 15, the base of the translucent member is further removed and separated into individual light emitting devices. As shown in FIG. 17F, the singulation is performed by cutting the light reflective member 4 in the groove 14 along the center line of the groove. In the above description, the light-reflective member is shown as the light-reflective member base material 41 before being singulated, and is denoted by reference numeral 4 after being singulated.

  In this way, the light emitting device 100a of Modification 1 having a plurality of light emitting elements 2 on one convex portion 12 is manufactured.

Second Embodiment In this embodiment, as shown in FIG. 11A, FIG. 11B, and FIG. 11C, after the light emitting element 202 is mounted on the base material 211 of the translucent member, as shown in FIG. The convex part 212 is formed by removing a part of the base material 211 of the translucent member so that the periphery of the concave part 214 becomes the concave part 214. Even using the translucent member 210 formed in this way, a thin light emitting device 200 as shown in FIGS. 12A and 12B can be manufactured. Other steps can be performed in the same manner as in the first embodiment.
The formation of the recess 214 can be performed by the same method as that for forming the protrusion 12 of the first embodiment. When the recess 214 is formed, a part of the end of the translucent adhesive 213 that bonds the light emitting element 202 and the base member 211 of the translucent member may be removed. Thereby, a small and thin light emitting device 200 can be obtained.

Modification of the second embodiment (hereinafter referred to as Modification 2)
In the light emitting device 200 of the second embodiment, one light emitting element 202 is mounted on one convex portion 212. However, in the light emitting device 200a of the second modification, a plurality of convex portions 212 are provided on one convex portion 212. The light emitting element 202 is mounted.
Specifically, in the light emitting device 200a of the second modification, as shown in FIG. 18, the concave portion 214 is formed on one convex portion 212 so as to include a plurality of light emitting elements 202 (two in FIG. 18). Except for the position where the recess 214 is formed, the light emitting device 200a of Modification 2 is formed in the same manner as in the second embodiment.

  Below, the material etc. which are suitable for each structural member of the light-emitting device 100,200 of embodiment are demonstrated.

Translucent member 10, 210
As a base material of the translucent members 10 and 210, translucent resin, glass or the like can be used. The light-emitting device 300 that is very thin and long as shown in FIG. 13 is assembled in the manufacturing process of the light-emitting device and the assembly process of the lighting device using the light-emitting device (for example, the backlight device 390 as shown in FIG. 14). In some cases, the strength against bending stress is very weak. Therefore, when a translucent member that is made of an inorganic material such as glass and is easily broken, there is a possibility that the light transmissible member 10 may be easily damaged by a force applied during the manufacturing process of the light emitting device 300. In order to prevent this problem, it is preferable to use an organic substance, particularly a resin having a certain degree of flexibility or flexibility as a base material.

  Examples of such resins include silicone resins, silicone-modified resins, silicone-modified resins, epoxy resins, phenol resins, polycarbonate resins, acrylic resins, TPX resins, polynorbornene resins, or hybrid resins containing one or more of these resins. Etc. Among these, a silicone resin or an epoxy resin is preferable, and a silicone resin excellent in light resistance and heat resistance is more preferable.

  In the case where a sintered body of glass or phosphor is used as the light transmissive member, deterioration of the light transmissive member can be reduced, so that a highly reliable light-emitting device can be obtained. Such a light emitting device can be preferably used for a light source for a headlight of a car, for example.

The translucent member preferably contains a phosphor. Thereby, the wavelength of the light from the light emitting element is converted, and light emitting devices that emit light of various colors, particularly white, can be obtained. As the phosphor, those known in the art can be used. For example, yttrium aluminum garnet (YAG) phosphor activated with cerium, lutetium aluminum garnet (LAG) phosphor activated with cerium, nitrogen-containing calcium aluminosilicate activated with europium and / or chromium (CaO—Al ₂ O ₃ —SiO ₂ ) -based phosphor, europium-activated silicate ((Sr, Ba) ₂ SiO ₄ ) -based phosphor, β sialon phosphor, KSF-based phosphor (K ₂ SiF ₆ : Mn), semiconductor fine particles called quantum dot phosphors, and the like. Accordingly, a light emitting device that emits mixed light (for example, white light) of primary light and secondary light having a visible wavelength, and a light emitting device that emits secondary light having a visible wavelength when excited by the primary light of ultraviolet light. it can. When the light-emitting device is used for a backlight of a liquid crystal display or the like, a phosphor that emits red light (for example, KSF-based phosphor) and a phosphor that emits green light (for example, β sialon fluorescence) are excited by blue light emitted from the light-emitting element. Body). Thereby, the color reproduction range of the display using the light emitting device 100 can be expanded. When the translucent member contains a phosphor that is weak against moisture or the external environment, a layer that does not contain the phosphor is provided at a position closer to the light emitting surface than a portion containing the phosphor that is weak against moisture or the external environment. It is possible to protect phosphors that are vulnerable to moisture and the like. Examples of the phosphor that is weak against moisture and the external environment include a KSF phosphor.

  The phosphor is not limited to being contained in the translucent members 10 and 210, and can be provided in various positions and members of the light emitting device. For example, the light-transmitting members 10 and 210 may be provided as a phosphor layer that is laminated on the phosphor-free layer that does not contain the phosphor by coating, bonding, or the like. Moreover, you may be provided in the translucent adhesive agent 3,

The translucent members 10 and 210 may further contain a filler (for example, a diffusing agent, a coloring agent, etc.). For example, silica, titanium oxide, zirconium oxide, magnesium oxide, magnesium carbonate, magnesium hydroxide, calcium carbonate, calcium hydroxide, calcium silicate, zinc oxide, barium titanate, aluminum oxide, iron oxide, chromium oxide, manganese oxide, glass , Carbon black, phosphor crystals or sintered bodies, and sintered bodies of phosphors and inorganic binders. Optionally, the refractive index of the filler may be adjusted. For example, 1.8 or more is mentioned, and in order to efficiently scatter light and obtain high light extraction efficiency, it is preferably 2 or more, and more preferably 2.5 or more. Of these, titanium oxide is preferable because it is relatively stable against moisture and has a high refractive index and excellent thermal conductivity.
The shape of the filler particles may be any of crushed, spherical, hollow and porous. The average particle diameter (median diameter) of the particles is preferably about 0.08 to 10 μm, which can obtain a light scattering effect with high efficiency. For example, the filler is preferably about 10 to 60% by weight with respect to the weight of the translucent member 10.

  The translucent members 10 and 210 include base portions 13 and 213 of the translucent member and convex portions 12 and 212 of the translucent member.

  The magnitude | size of the base material 11 of a translucent member can be suitably determined with the magnitude | size of the convex parts 12 and 212 of a translucent member, a manufacturing apparatus, etc.

The size of the convex portion 212 of the translucent member can be appropriately determined depending on the size of the light emitting devices 100 and 200.
For example, the length L4 in the longitudinal direction shown in FIG. 13C can be about 1 to 1000 times, 50 to 500 times, and 100 to 450 times the length L5 in the short direction. According to the method for manufacturing a light emitting device of the present embodiment, even when a translucent member having a length in the longitudinal direction that is very long with respect to the length in the lateral direction is used, it is easily manufactured. be able to. In addition, by using such a light emitting device having an elongated light emitting surface, an illumination device (backlight device) can be easily manufactured as compared with a case where a plurality of light emitting devices are mounted.
Specifically, the length L4 in the longitudinal direction shown in FIG. 13C can be about 2.5 cm to 13.6 cm, and about 4 cm to 10 cm. Accordingly, since only one light emitting device needs to be mounted on one backlight device, it is possible to easily mount the light emitting device and manufacture the backlight device.
The length L5 in the short direction shown in FIG. 13C can be specifically 200 to 400 μm, more preferably 200 to 300 μm. Thereby, it can be set as the thin light-emitting device 100,200.
While the thickness of the translucent members 10 and 210 affects the height of the light emitting device (L3 in FIG. 13A), the risk of breakage increases as the thickness decreases. Moreover, since the quantity of the fluorescent substance which can be contained is restrict | limited, it selects suitably. In addition, Preferably it is about 10-300 micrometers, More preferably, about 30-200 micrometers is mention | raise | lifted.

  The translucent sealing member 1, 201 or the translucent member base material 11, 211 may be a single layer, or may have a laminated structure of a plurality of layers as required, as shown in FIG. 2B or the like. it can. For example, you may have the 2nd layer which is the fluorescent substance non-containing layers 11b and 211b which do not contain a fluorescent substance on the 1st layers 11a and 211a which are fluorescent substance containing layers containing a fluorescent substance. A plurality of layers containing different types of phosphors may be laminated. For example, by forming a first layer containing a first phosphor that emits green light and a second layer containing a second phosphor that emits red light separately, and then bonding them together, a two-layer structure of light transmission It is possible to obtain the base material 11 of the sexual member. Moreover, after forming a 1st layer, the base material 11 of the translucent member of a 2 layer structure can also be obtained by forming a 2nd layer on it by the spray method etc. Moreover, as shown to FIG. 1B, the fluorescent substance containing part containing a fluorescent substance and the fluorescent substance non-containing part which does not contain a fluorescent substance substantially may be laminated | stacked. Such a translucent member can be formed, for example, by laminating a plurality of separately formed sheets. Alternatively, two layers of phosphor layers containing different phosphors may be bonded to a layer that does not include a phosphor that does not contain phosphors to form a three-layer translucent member.

  When the phosphor used in the light emitting device is a material that easily deteriorates due to environmental influences such as moisture, the phosphor is not substantially contained on the light extraction side surface of the phosphor-containing portion of the translucent sealing member 1. It is preferable to provide a phosphor-free portion. Thereby, since contact with outside air and a fluorescent substance can be suppressed, deterioration of a fluorescent substance can be suppressed. Moreover, you may provide the layer containing a filler (for example, a diffusing agent, a coloring agent etc.) in the part provided in the light extraction surface side of a translucent sealing member. By providing a layer containing such a filler, it can be expected to improve the uniformity of color unevenness and to reduce the tackiness of the light emitting device. Further, by using a filler having a higher thermal conductivity than the base material, the reliability of the light-emitting device can be improved by improving the thermal conductivity.

  Examples of the filler include silica, titanium oxide, zirconium oxide, magnesium oxide, magnesium carbonate, magnesium hydroxide, calcium carbonate, calcium hydroxide, calcium silicate, zinc oxide, barium titanate, aluminum oxide, iron oxide, chromium oxide, Examples include manganese oxide, glass, carbon black, phosphor crystals or sintered bodies, and sintered bodies of phosphors and inorganic binders. It is preferable to select a filler material having a high refractive index. For example, 1.8 or more is mentioned, and in order to efficiently scatter light and obtain high light extraction efficiency, it is preferably 2 or more, and more preferably 2.5 or more. Of these, titanium oxide is preferable because it is relatively stable against moisture and has a high refractive index and excellent thermal conductivity. The shape of the filler particles may be any of crushed, spherical, hollow and porous. The average particle diameter (median diameter) of the particles is preferably about 0.08 to 10 μm, which can obtain a light scattering effect with high efficiency. For example, the filler is preferably about 10 to 60% by weight with respect to the weight of the translucent member.

  When the translucent members 10 and 210 are first manufactured from a liquid material containing a liquid resin and a particulate phosphor, it is preferable to mix fine fillers such as aerosil into the translucent members 10 and 210. . Thereby, thixotropy is imparted to the material of the translucent members 10 and 210 to reduce sedimentation of the phosphor, and the base member 11 of the translucent member in which the phosphor is uniformly dispersed can be formed.

Light emitting element 2,202
The light emitting elements 2 and 202 are mounted on the convex portion 1 of the translucent member.
The light emitting elements 2 and 202 have a main light emitting surface and an electrode forming surface opposite to the main light emitting surface.
The size, shape, and emission wavelength of the light emitting elements 2 and 202 can be appropriately selected. When a plurality of light emitting elements 2 are mounted on one light emitting device 100, 200, the arrangement may be irregular or may be regularly arranged such as a matrix. In order to reduce unevenness in light emission intensity and color unevenness, it is preferable that the light emitting elements are regularly arranged and the intervals between the plurality of light emitting elements are substantially uniform as shown in FIG. 13E.

  In the case where the plurality of light emitting elements 302 are provided in one light emitting device 300, any connection form of series, parallel, series parallel, or parallel series may be used. As shown in FIG. 13B, the plurality of light emitting elements 2 may be manufactured in an electrically separated state and electrically connected via a mounting substrate 60 on which the light emitting device 300 is mounted. In addition, a plurality of light emitting elements 302 can be connected in series by providing a conductive metal film that connects the positive and negative electrodes 302a and 302b of different light emitting elements 302 on the surface of the light reflecting member.

The length L7 in the longitudinal direction of the light emitting element shown in FIG. 16A can be, for example, about 200 μm to 1500 μm. The thickness is preferably about 500 μm to 1200 μm, more preferably about 700 μm to 1100 μm.
The length L8 in the short direction of the light emitting element 2 shown in FIG. 16A can be, for example, about 50 μm to 400 μm. The thickness is preferably about 100 μm to 300 μm. Thereby, it can mount in the thin light-emitting device 100. FIG.

In the case where the light emitting device 100 having a long length L1 is manufactured by using the light emitting element 2 whose length L7 in the longitudinal direction is 3 times, preferably 5 times or more, the length L8 in the short direction. Even in such a case, the number of the light emitting elements 2 can be suppressed and the manufacturing can be easily performed. Further, by using the light emitting element 2 whose length L7 in the longitudinal direction is about 3 to 6 times the length L8 in the short direction, the possibility that the light emitting element 2 is damaged during manufacturing is reduced. 100 can be easily manufactured.
The thickness L9 of the light emitting element 2 shown in FIG. 16C is preferably about 80 μm to 200 μm, for example. Accordingly, for example, when the light emitting device 100 is mounted so that the light incident end surface of the light guide plate and the light emitting surface are parallel when the light emitting device 100 is incorporated into the backlight device, the width of the frame portion of the backlight device is reduced. Can be narrowed.

  As shown in FIG. 16C, the light-emitting element 2 used in the light-emitting device 100 includes, as a semiconductor stacked body 2c, a first semiconductor layer (for example, an n-type semiconductor layer), a light-emitting layer, and a second semiconductor layer (for example, a p-type semiconductor layer). ) Are stacked in this order, and the first electrode 2a electrically connected to the first semiconductor layer and the second semiconductor layer are electrically connected to the same surface side (for example, the surface on the second semiconductor layer side) which is the lower surface. And the second electrode 2b connected to the first electrode 2b. The semiconductor stacked body 2c is normally stacked on the element substrate 2d. However, the light emitting element 2 may be accompanied by the element substrate 2d or may not include the element substrate 2d.

The types and materials of the first semiconductor layer, the light emitting layer, and the second semiconductor layer are not particularly limited, and examples thereof include various semiconductors such as III-V group compound semiconductors and II-VI group compound semiconductors. Specific examples thereof include nitride-based semiconductor materials such as In _X Al _Y Ga _1-XY N (0 ≦ X, 0 ≦ Y, X + Y ≦ 1), and include InN, AlN, GaN, InGaN, and AlGaN. InGaAlN or the like can be used. As the film thickness and layer structure of each layer, those known in the art can be used.

Examples of the element substrate 2d include a growth substrate capable of epitaxially growing a semiconductor layer. Examples of the material of the element substrate 2d include an insulating substrate such as sapphire (Al ₂ O ₃ ) and spinel (MgA 1 ₂ O ₄ ), the nitride-based semiconductor substrate described above, and the like. By using a light-transmitting element substrate 2d such as a sapphire substrate as a substrate for growing a semiconductor layer, it can be used for a light emitting device without being removed from the semiconductor stacked body.

The element substrate 2d may have a plurality of convex portions or irregularities on the surface. Moreover, you may have an off angle of about 0-10 degree with respect to predetermined crystal planes, such as C surface and A surface.
The element substrate 2d may have a semiconductor layer such as an intermediate layer, a buffer layer, or a base layer, an insulating layer, or the like between the first semiconductor layer.
The shape of the semiconductor stacked body 2c is not particularly limited in a plan view, and a quadrangle or a shape approximate to this is preferable. The size of the semiconductor stacked body 2 c in plan view can be adjusted as appropriate depending on the size of the light emitting element 2 in plan view.

1st electrode 2a, 202a and 2nd electrode 2b, 202b
The first electrode 2 a and the second electrode 2 b are provided on the lower surface 2 y side of the light emitting element 2. It is preferably formed on the same surface side of the semiconductor stacked body 2c (the surface on the opposite side when the element substrate 2d is present). Thereby, the flip-chip mounting which makes the positive / negative connection terminal of the mounting substrate 60, the 1st electrode 2a of the light emitting element 2, and the 2nd electrode 2b oppose and can be performed can be performed.

  The first electrode 2a and the second electrode 2b can be formed of, for example, a single layer film or a laminated film of a metal such as Au, Pt, Pd, Rh, Ni, W, Mo, Cr, Ti, or an alloy thereof. . Specifically, the laminated layers are Ti / Rh / Au, W / Pt / Au, Rh / Pt / Au, W / Pt / Au, Ni / Pt / Au, Ti / Rh, etc. from the semiconductor layer side. A membrane is mentioned. The film thickness may be any film thickness used in this field.

  Further, the first electrode 2a and the second electrode 2b are respectively close to the first semiconductor layer and the second semiconductor layer, and a material layer having a higher reflectivity with respect to light emitted from the light emitting layer than other materials of the electrode, It is preferable to arrange as a part of these electrodes.

  Examples of the material having high reflectance include a layer containing silver, a silver alloy, or aluminum. As the silver alloy, any material known in the art may be used. The thickness of the material layer is not particularly limited, and may be a thickness that can effectively reflect the light emitted from the light emitting element 2, for example, about 20 nm to 1 μm. The larger the contact area of the material layer with the first semiconductor layer or the second semiconductor layer, the better.

  In addition, when using silver or a silver alloy, in order to prevent silver migration, it is preferable to form a coating layer that covers the surface (preferably, the upper surface and the end surface). As such a coating layer, what is necessary is just to be formed with the metal and alloy which are normally used as a conductive material, for example, the single layer or laminated layer containing metals, such as aluminum, copper, and nickel, is mentioned. It is done. Of these, AlCu is preferably used. The thickness of the coating layer is about several hundred nm to several μm in order to effectively prevent silver migration.

As long as the first electrode 2a and the second electrode 2b are electrically connected to the first semiconductor layer and the second semiconductor layer, respectively, the entire surface of the electrode may not be in contact with the semiconductor layer. A part of 2a may not be located on the first semiconductor layer and / or a part of the second electrode 2b may be located on the second semiconductor layer. That is, for example, the first electrode 2a may be disposed on the second semiconductor layer via the insulating film or the like, or the second electrode 2b may be disposed on the first semiconductor layer. Thereby, since the shape of the 1st electrode 2a or the 2nd electrode 2b can be changed easily, the light-emitting devices 100 and 200 can be mounted easily.
The insulating film here is not particularly limited, and may be either a single layer film or a laminated film used in this field. By using an insulating film or the like, the first electrode 2a and the second electrode 2b can be set to an arbitrary size and position regardless of the plane area of the first semiconductor layer and / or the second semiconductor layer.

  In this case, it is preferable that the first electrode 2a and the second electrode 2b have substantially the same planar shape at least on the surface connected to the mounting substrate 60. Further, as shown in FIG. 13B, it is preferable that the first electrode 2a and the second electrode 2b are arranged so as to face each other across the central portion of the semiconductor stacked body 2c.

  The first main surface (surface opposite to the semiconductor layer) of the first electrode 2a and the second electrode b may have a step, but is preferably substantially flat. Here, the term “flat” refers to the height from the second main surface (surface opposite to the first main surface) of the semiconductor stacked body 2c to the first main surface of the first electrode 2a and the second main surface of the semiconductor stacked body 2c. It means that the height from the surface to the first main surface of the second electrode 2b is substantially the same. Here, “substantially the same” allows a variation of about ± 10% of the height of the semiconductor stacked body 2c.

  In this way, by arranging the first main surfaces of the first electrode 2a and the second electrode 2b to be substantially flat, that is, by arranging them substantially on the same surface, as shown in FIG. It becomes easy to join. The formation of the first electrode 2a and the second electrode 2b can be realized by, for example, providing a metal film on the electrode by plating or the like, and thereafter polishing or cutting to be flat. .

  Between each of the first electrode 2a and the second electrode 2b and the first semiconductor layer and the second semiconductor layer, a DBR (distributed Bragg reflector) layer or the like is disposed within a range that does not hinder the electrical connection therebetween. May be. The DBR has a multilayer structure in which a low refractive index layer and a high refractive index layer are laminated on an underlayer arbitrarily formed of an oxide film, for example, and selectively reflects light having a predetermined wavelength. Specifically, a predetermined wavelength can be reflected with high efficiency by alternately laminating films having different refractive indexes with a thickness of 1/4 of the wavelength. As a material, it can be formed including at least one oxide or nitride selected from the group consisting of Si, Ti, Zr, Nb, Ta, and Al.

Translucent adhesive 3,203
For mounting and bonding the light-emitting element 2 to the light-transmitting members 10 and 210, it is preferable to use a light-transmitting adhesive 3,203.
For the light-transmitting adhesives 3, 203, it is preferable to use a light-transmitting resin, and it is preferable that the light-transmitting adhesive 3203 is a material that is liquid and can be bonded by being cured. As such a translucent resin, thermosetting resins such as silicone resins, silicone-modified resins, epoxy resins, and phenol resins can be preferably used. Since the light-transmitting adhesives 3 and 203 are provided in contact with the light-extracting side surface and the side surface of the light-transmitting sealing member 1 and the light-emitting element 2, the light-transmitting adhesives 3 and 203 are easily affected by the heat generated in the light-emitting element 2 during lighting. . The thermosetting resin is suitable for the translucent adhesive 3 because it is excellent in heat resistance. The translucent adhesive 3,203 preferably has a high light transmittance.

  An additive that scatters light may be added to the light-transmitting adhesive 3,203. Thereby, the light emitted between the light emitting elements 2 can be made uniform in the translucent adhesive 3. In order to adjust the refractive index of the translucent adhesive 3 or to adjust the viscosity of the translucent members (liquid resin materials 31 and 231) before curing, a filler such as aerosil may be added. Thereby, it is possible to prevent the light-transmitting adhesives 3, 203 from flowing more than necessary and spread, and the light-emitting elements 2, 202 can be stably mounted on the convex portions 12, 212 of the light-transmitting member. .

Light emitting device 100, 200
The sizes of the light emitting devices 100 and 200 are, for example, substantially the same as the planar shape of the above-described translucent sealing members 1 and 201 on the light emitting surface, and are light reflective around the translucent sealing members 1 and 201. It is large because the members 4 and 204 are provided.

  The height of the light emitting devices 100 and 200 (L3 shown in FIG. 13A) is preferably about 300 μm to 700 μm, for example. Thereby, for example, when the light emitting device is mounted so that the light incident end surface of the light guide plate and the light emitting surface are parallel when the light emitting device is incorporated in the backlight device, the width of the frame portion of the backlight device is reduced. be able to. For the same reason, for example, as shown in FIG. 13B, it is preferable to use a portion where the electrodes 302 a and 302 b of the light emitting element are exposed on the outer surface of the light emitting device 300 as mounting electrodes of the light emitting device 300. In addition, it is preferable to have a thin metal layer provided over the surfaces of the electrodes 302 a and 302 b of the light emitting element 302 and the surface of the light reflective member 304. Thereby, the light emitting device can be reduced in size and thickness.

First Example First, a silicone resin, a YAG: Ce phosphor, and about 2 wt% of aerosil with respect to the resin are mixed with a centrifugal stirring deaerator.

  Next, after apply | coating the obtained mixture on the release film made from a fluororesin, it shape | molds into a 150-micrometer-thick sheet form with a doctor blade. The obtained sheet is cured at 150 ° C. for 8 hours. Thus, the base material of a translucent member is formed.

  Next, the base material of the translucent member, which has been cured, is attached to the upper surface of a support composed of a heat-resistant UV sheet having an adhesive layer on both sides and a shock-resistant glass capable of transmitting UV light. .

Next, the base material of the translucent member is diced with a dicer vertically and horizontally so as to form a convex portion having the shape of the light emitting portion of the light emitting device, thereby forming a plurality of groove portions and forming a plurality of convex portions.
At this time, the thickness of the light reflecting member of the light emitting device to be obtained is adjusted by adjusting the thickness of the dicing blade so that the thickness of the light reflecting member after cutting and the thickness of the blade in the final product dicing, for example, about 200 μm. Secure.

  Next, a liquid resin material, which is a silicone resin containing 2 wt% of Aerosil, is applied to the upper surfaces of the convex portions of the plurality of translucent members separately by dispensing.

  Next, a translucent sapphire substrate, a semiconductor layer, and an electrode constituting a light extraction surface are provided on the upper surface of the convex portion of the translucent member, the width is about 200 μm, the length is about 800 μm, and the height is about A 150 μm light emitting element is mounted so that the upper surface of the sapphire substrate and the translucent member face each other. Thereafter, the liquid resin material is cured, and the light emitting element and the translucent member are bonded with a translucent adhesive. At this time, the translucent adhesive is disposed between the side surfaces of the plurality of adjacent light emitting elements, and at the end of the translucent member on the short side, from the lower surface side of the light emitting element to the translucent member side. It is formed in a widening shape.

  Next, light reflection in which silica having an average particle size of 14 μm and titanium oxide having an average particle size of 0.3 μm as inorganic particles are mixed at 2 wt% and 60 wt% with respect to the weight of the silicone resin, respectively. Formulating the sex member material.

  Next, the upper surface of the support, the convex portions of the plurality of translucent members, the translucent adhesive, and the light reflective member that collectively covers the plurality of light emitting elements mounted thereon are made of gold. Molded by compression molding using a mold and cured.

  Next, the base of the plurality of translucent members, a part of the convex portions, and the light reflecting member are ground to expose the convex portions of the plurality of translucent members from the light reflecting member.

  Next, the electrode is exposed by grinding the light-reflecting member from the surface opposite to the side on which the translucent member is provided.

  Next, the light reflective member is cut by dicing with reference to the position of the exposed electrode of the light emitting element to obtain a plurality of light emitting devices.

Finally, UV light is irradiated from the support side to reduce the adhesive strength of the adhesive layer of the heat-resistant UV sheet. Thereafter, the light emitting device is peeled from the UV sheet.
A plurality of light emitting devices can be obtained by the method as described above.

Second Example First, as in the first example, a sheet-like phosphor-containing sheet-like molded product containing a phosphor is obtained.
Next, 2 wt% of Aerosil is added to the silicone resin and mixed with a centrifugal stirring deaerator. The obtained mixture is applied onto a release film made of a fluororesin, and then formed into a sheet having a thickness of 150 μm by a doctor blade, thereby obtaining a transparent sheet-like transparent sheet-like molded product.

Next, each of these sheets is temporarily cured at 120 ° C. for 1 hour.
Next, the phosphor-containing sheet-like molded product and the transparent sheet-like molded product that have been pre-cured are bonded at 80 ° C. with a pressure of 0.5 MPa.

Next, the bonded sheet is fully cured at 150 ° C. for 8 hours.
Thus, the base material 11 of the translucent member having a thickness of 270 μm having the phosphor-containing layer 11a made of the phosphor-containing sheet-like molded product and the phosphor-free layer 11b made of the transparent sheet-like molded product is obtained. .

  Similar to the first embodiment, the base material 11 of the translucent member is attached to the support 50 having the adhesive layer 50a which is a UV sheet. At this time, the phosphor non-containing layer 11b side is bonded to the UV sheet.

  Next, the convex part 12 is shape | molded by dicing the base material 11 of a translucent member. Further, the height of the blade is adjusted so that 50 μm of the phosphor non-containing layer 11b is not cut. In other words, the base material 11 of the translucent member is a phosphor-free material having a thickness of 50 μm in which the part of the phosphor-non-containing layer 11b on the side in contact with the support 50 is continuous without being separated. A convex portion 12 in which a phosphor-free layer 12b and a phosphor-containing layer 12a, which are separated from each other above the base portion and have a height from the upper surface of the base portion 13 of 220 μm, are laminated. Cut into multiple shapes. Thereby, in the next forming step, the light transmissive member 10 is deformed by the pressure at the time of forming the light reflective member 4, or the light reflective member 4 enters between the support 50 and the light transmissive member 10. It is possible to suppress dripping.

  Next, the light emitting element 2 is mounted, the light reflective member 4 is formed, and the electrodes 2a and 2b of the light emitting element 2 are exposed by the same method as in the first embodiment.

  Next, UV light is irradiated from the support 50 side to weaken the adhesive strength of the adhesive layer 50a, the base material 11 of the translucent member is peeled off from the support 50, and transferred to a support provided with another UV sheet. . At this time, the transfer is performed so that the surfaces of the support 50 and the electrodes 2a and 2b of the light-emitting element 2 of the light-reflecting member 4 that are exposed adhere to each other.

Next, the base material 11 of the translucent member is ground, and the base portion 13 of the translucent member, a part of the base material 41 of the light reflective member 4, and one of the phosphor-free layers 12 b constituting the convex portion 12. Remove the part.
Next, the base material 41 of the light reflective member is cut by dicing using the exposed position of the transparent sealing member 1 as a reference.
Next, UV light is irradiated from the glass temporary support member side to cure the adhesive layer, and the completed light emitting device 100 is peeled from the support.
By the method as described above, the light emitting device 100 including the phosphor non-containing layer 11b on the light emitting surface side of the translucent sealing member can be obtained.

  According to this method, since the phosphor-free portions 11b and 12b are removed when the base portions 13 and 12 of the translucent member are removed, the thickness of the phosphor-containing portion 12a due to the removal does not vary. As a result, variations in emission color of the manufactured light emitting device 100 can be reduced. Further, by removing the portion not containing the phosphor, the phosphor-containing layer 12a is not exposed during the removing step, so that the phosphor contained in the phosphor-containing layer can be protected. In addition, since it is not necessary to remove the member containing the phosphor, the amount of the necessary phosphor can be reduced and the material cost can be reduced. Moreover, the phosphor containing layer 1a can be protected by providing the phosphor non-containing portion 1b on the surface side of the light emitting device 100.

Third Example In this example, the light emitting device 300 of FIGS. 13A to 13E is manufactured. The upper surface of the convex portion of the translucent member used for manufacturing the light emitting device 300 has a short side length L5 of about 300 μm and a longitudinal length L4 of about 49500 μm in plan view. The height from the upper surface of the base is about 120 μm. 33 light emitting elements 302 having a width of 200 μm, a length of 1000 μm, and a height of 150 μm are mounted on the convex portion of the light transmitting member at an interval of 500 μm. A light-transmitting adhesive 303 is continuously provided between the plurality of light-emitting elements 302. Otherwise, the light emitting device is manufactured in substantially the same manner as in Example 2. Thereby, a linear light-emitting device that is long in the longitudinal direction as shown in FIGS. 13A to 13E can be easily manufactured. 13A to 13E includes a plurality of light emitting elements 302 having a longitudinal direction and a short direction in a plan view, and a light-transmitting sealing member 301 having a longitudinal direction and a short direction in a plan view, The light-transmitting adhesive 303 that bonds the light-emitting element 302 and the light-transmitting sealing member 301, the side surface of the light-emitting element 302, the light-transmitting adhesive 303, and the side surface of the light-transmitting sealing member 301 are covered. A light reflective member 304 is provided, and the light emitting adhesives 303 are arranged side by side so that the longitudinal direction of the plurality of light emitting elements 302 and the longitudinal direction of the light transmitting sealing member 301 coincide with each other. It is arranged between the side surfaces of 302.

  Such a light emitting device 300 can be suitably used as an end face light incident type backlight light source. That is, in recent years, in an electronic device including a display in which a light emitting device is used as a light source of a backlight device, the display panel is narrowed (inside the panel) in order to increase the ratio of the display unit to the size of the surface including the display unit. Demand for expansion of the effective screen area). On the other hand, when a plurality of light emitting elements arranged in a light emitting device is used as a light emitting device used as a light source of a backlight device, the light emitted from the light emitting device has an angle dependency of intensity and color. Therefore, brightness and color tone unevenness is large in the vicinity of the light-emitting device, which is unsuitable as a display unit. Therefore, there is a problem that a certain distance from the light emitting device 300 cannot be used as a display unit, and it is difficult to enlarge the display unit.

  However, according to the configuration of the light emitting device 300 obtained in this embodiment, the light emitted from the plurality of light emitting elements 302 is made uniform in the translucent adhesive 303 disposed between the light emitting elements 302. The light enters the translucent sealing member 301 and is emitted from the surface of the translucent sealing member 301 substantially uniformly. Thereby, since the angle dependency of the intensity | strength or color of the light radiate | emitted from the light-emitting device 300 can be reduced, such a light-emitting device 300 can be arrange | positioned in the light-guide plate vicinity of a backlight apparatus. Thereby, the frame part of a backlight apparatus can be narrowed and the display part of a backlight apparatus can be expanded. Therefore, a display (illumination device) 390 including the light emitting device 300 of this embodiment as shown in FIG. 14 can have an enlarged display unit.

Example 4
In the present embodiment, the upper surface of the convex portion of the translucent member is a substantially square of 1100 μm × 1100 μm. A light emitting element 402 having a substantially square shape of 1000 μm × 1000 μm is mounted on the convex portion. Otherwise, the light emitting device is manufactured in substantially the same manner as in Example 2. Thereby, the light-emitting device 400 as shown to FIG. 15A and FIG. 15B can be manufactured easily. Such a light-emitting device 400 is preferably used for a direct-type backlight in which a plurality of light-emitting devices are arranged in a matrix, or a flash for a camera of a smartphone because of its small size.

Although several embodiments and examples according to the present invention have been described above, the present invention is not limited to the above-described embodiments and examples, and is arbitrary as long as it does not depart from the gist of the present invention. It goes without saying that it can be done.
The light-emitting device disclosed in this specification may be used as a top-emitting type light-emitting device that is mounted such that the light-emitting surface faces away from the mounting substrate, and preferably the direction in which the light-emitting surface intersects the mounting surface, preferably The light emitting device may be used as a side light emitting type light emitting device that is mounted so as to be substantially perpendicular to the mounting surface.

1, 201, 301, 401 Translucent sealing member 1a, 201a, 301a, 401a First layer (phosphor-containing portion) of translucent sealing member
1b, 201b, 301b, 401b Second layer of translucent sealing member (phosphor non-containing part)
11, 211 Base material of translucent member 11a, 211a First layer of base material of translucent member (phosphor-containing portion)
11b, 211b The second layer of the base material of the translucent member (phosphor-free portion)
11c End material of base material of translucent member 10,210 Translucent member 12, 212 Convex part of translucent member 12a, 212a First layer (phosphor-containing part) of convex part of translucent member
12b, 212b Second layer of convex part of translucent member (phosphor non-containing part)
13, 213 Base of translucent member 14, 214 Groove, recess 2, 202, 302, 402 Light emitting element 2a, 202a, 302a, 402a First electrode 2b, 202b, 302b, 402b Second electrode 2c Semiconductor stacked body 2d element Substrate 3, 203, 303, 403 Translucent adhesive 31, 231 Liquid resin material 4, 204, 304, 404 Light reflective member 41 Base material 50, 250 of light reflective member Support 50 a, 250 a Adhesive layer 100, 200, 300, 400 Light emitting device 100w... Light emitting surface 390 of light emitting device Illuminating device (backlight device)

Claims (10)

Preparing a translucent member comprising a base and a convex portion on the first surface side of the base,
Preparing a light emitting element having a main light emitting surface and an electrode forming surface opposite to the main light emitting surface;
The light emitting element is mounted on the convex part of the light transmissive member so that the main light emitting surface of the light emitting element faces the upper surface of the convex part of the light transmissive member.
Forming a light reflective member that covers the side surface of the light emitting element and the side surface of the convex portion of the translucent member ;
Removing the base of the translucent member;
Manufacturing method of light-emitting device. The translucent member has a plurality of the convex portions connected by the base portion,
  Cutting the light reflective member between the plurality of convex portions;
  The manufacturing method of the light-emitting device of Claim 1.   In the step of preparing the translucent member,
  Preparing a base material of a translucent member in which a phosphor-containing part and a phosphor-free part substantially containing no phosphor are laminated,
  By forming a groove in the phosphor-containing portion, the convex portion is formed.
  The manufacturing method of the light-emitting device of Claim 1 or 2. In removing the base of the translucent member,
Removing a part of the convex portion of the translucent member and a part of the light reflective member;
The manufacturing method of the light-emitting device of any one of Claim 1 to 3 . Prepare a base material for the translucent member,
Preparing a light emitting element having a main light emitting surface and an electrode forming surface opposite to the main light emitting surface;
The light emitting element is mounted so that the main light emitting surface of the light emitting element faces the first surface of the light transmissive member,
By forming a recess in the base of the translucent member, a base is formed on the base of the translucent member, and a convex is an area where the light emitting element is mounted on the base,
Forming a light reflective member that covers the side surface of the light emitting element and the side surface of the convex portion of the translucent member;
Manufacturing method of light-emitting device. The translucent member has a plurality of the convex portions connected by the base portion,
Removing the base of the translucent member;
Cutting the light reflective member between the plurality of convex portions;
The manufacturing method of the light-emitting device of Claim 5.   In removing the base of the translucent member,
  Removing a part of the convex portion of the translucent member and a part of the light reflective member;
  A method for manufacturing a light emitting device according to claim 6.   In the step of preparing the base material of the translucent member,
  Preparing a base material of a translucent member in which a phosphor-containing part and a phosphor-free part substantially containing no phosphor are laminated,
  In the step of forming the convex part, a concave part is formed by forming a groove in the phosphor-containing part, and the convex part is formed.
  The manufacturing method of the light-emitting device of any one of Claim 5 to 7.   In the step of removing the base of the translucent member,
  The manufacturing method of the light-emitting device according to claim 8, wherein the phosphor-free portion is removed. A plurality of the light emitting elements are mounted on one of the convex portions;
The manufacturing method of the light-emitting device of any one of Claim 1 to 9.