JP2018088554A - Light emitting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light emitting device which can be reduced in size.SOLUTION: A light emitting device includes a light emitting element 1; a light reflection member 2 which is arranged to cover a side face of the light emitting element 1 and expose a top surface of the light emitting element 1; a frame body 4 which is formed on the light reflection member 2 to surround an outer periphery of the top surface of the light emitting element 1; a translucent member 3 arranged in the frame body 4; and a translucent sealing member 5 which covers the light reflection member 2, frame body 4, and the translucent member 3. The sealing member 5 includes a flange 7 which covers a part of the frame body 4.SELECTED DRAWING: Figure 1

Description

  The present disclosure relates to a light emitting device.

2. Description of the Related Art A light emitting device in which light extraction efficiency is improved by forming a lens above a light emitting element is known. For example, in the light emitting device described in Patent Document 1, as shown in FIG. 4 of Patent Document 1, the light emitting unit surrounded by the frame is made smaller than the lens diameter, so that the lens, the air layer, and The incident angle of the light beam incident on the interface can be reduced, and the light extraction efficiency is improved.

JP 2012-156442 A

In recent years, appliances on which light-emitting devices are mounted tend to be miniaturized, and the light-emitting devices to be mounted are also required to be further downsized. Therefore, an object of the present invention is to provide a light emitting device that can be miniaturized.

A light emitting device according to an embodiment of the present invention includes a light emitting element, a light reflecting member that covers a side surface of the light emitting element, and that exposes an upper surface of the light emitting element, and on the light reflecting member. A frame formed so as to surround the outer periphery of the upper surface, and a translucent member disposed in the frame,
A light-transmitting sealing member that covers the light-reflecting member, the frame, and the light-transmitting member, the sealing member has a flange, and a part of the frame is the Covered with buttock.

  According to the embodiment of the present invention, it is possible to provide a light emitting device that can be miniaturized.

2 is a top view of the light emitting device according to Embodiment 1. FIG. It is sectional drawing about the A-A 'line | wire of FIG. 3 is a bottom view of the light emitting device according to Embodiment 1. FIG. FIG. 3 is a partially enlarged view of FIG. 2. It is a figure which shows the manufacturing method of the light-emitting device of Embodiment 1, Fig.5 (a) is a top view, FIG.5 (b) is a side view. It is a figure which shows the manufacturing method of the light-emitting device of Embodiment 1, Fig.6 (a) is a top view, FIG.6 (b) is a side view. FIGS. 7A and 7B are diagrams illustrating a method for manufacturing the light-emitting device of Embodiment 1, in which FIG. 7A is a top view and FIG. 7B is a cross-sectional view. It is a figure which shows the manufacturing method of the light-emitting device of Embodiment 1, FIG. 8 (a) is a top view, FIG.8 (b) is sectional drawing. It is a figure which shows the manufacturing method of the light-emitting device of Embodiment 1, Fig.9 (a) is a top view, FIG.9 (b) is a side view. It is a figure which shows the manufacturing method of the light-emitting device of Embodiment 1, Fig.10 (a) is a top view, FIG.10 (b) is a side view. 4 is a diagram illustrating an example of wiring of the light emitting device of Embodiment 1. FIG. Sectional drawing of the light-emitting device of Embodiment 2 is shown. It is a figure which shows the manufacturing method of the light-emitting device of Embodiment 2. It is a figure which shows the light-emitting device of Embodiment 3.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the following description, terms indicating specific directions and positions (for example, “up”, “down”, “right”, “left” and other terms including those terms) are used as necessary. . The use of these terms is to facilitate understanding of the invention with reference to the drawings, and the technical scope of the present invention is not limited by the meaning of these terms. Moreover, the part of the same code | symbol which appears in several drawing shows the same part or member.

<Embodiment 1>
FIG. 1 is a top view of a light emitting device 100 according to Embodiment 1 of the present invention, and FIG.
FIG. 3 is a cross-sectional view taken along line -A, and FIG. 3 is a bottom view of the light emitting device according to the first embodiment.
The light emitting device of this embodiment has a light emitting surface as an upper surface, a light emitting element 1 provided with an electrode on the lower surface opposite to the light emitting surface, a side surface of the light emitting element 1 and a top surface of the light emitting element 1 exposed. The light reflection member 2 is disposed, and the frame 4 is formed on the light reflection member 2 so as to surround the outer periphery of the upper surface of the light emitting element 1. Furthermore, the light emitting device 100 includes the light transmissive member 3 disposed in the frame body 4, that is, filled in the region surrounded by the frame body 4, and includes the light reflecting member 2, the frame body 4, and the light transmissive member. The sealing member 5 that covers the conductive member 3 is provided.

In the light emitting device 100 according to the first embodiment, the light emitting element 1 includes, for example, a semiconductor layer stacked on a translucent insulating substrate, and at least a pair of positive and negative electrodes formed on one surface of the semiconductor layer side. The light reflecting member 2 is provided so as to cover at least the side surface of the light emitting element 1.

In the present embodiment, as shown in FIG. 2, the light emitting element 1 is flip-chip mounted on a substrate 8 with a bonding material such as a bump, and the side surface of the light emitting element 1 is in contact with and covered with the light reflecting member 2. . A wiring is provided on the upper surface of the substrate 8, and the wiring 9 and the electrode of the light emitting element 1 are bonded to each other through a bonding member. The light-emitting element 1 has a substantially square planar shape, and as shown in FIG.
Four are arranged in a matrix of 2 (lattice).

The interval between adjacent light emitting elements is not particularly limited, but is preferably narrower than the length of one side of the light emitting element, for example. In particular, 1 to 300 μm, more preferably 50 to 10
By setting the thickness to 0 μm, it is possible to diffuse light into a non-light emitting region between the light emitting elements using a phosphor or a diffusing material. For this reason, it is preferable that the light reflecting member 2 is disposed between adjacent light emitting elements.

It is preferable that the light reflecting member 2 covers all the side surfaces except the upper surface of the light emitting element 1. This is for suppressing light absorption between the light emitting elements. Moreover, it is preferable that the upper surface of a light reflection member is flat. The upper surface of the light emitting element may be substantially flush with the upper surface of the light emitting element, or the upper surface may be disposed at a position higher than the upper surface of the light emitting element. Here, it is intended that some unintended recesses are formed on the surface due to the weight of the resin, that is, a height difference of about several tens of μm is allowed. Further, the light reflecting member 2 is mounted on the substrate 8 and the light emitting element 1.
Other parts (for example, the protection element 16 shown in FIG. 1) may be embedded. At least a pair of terminal electrodes 18 are provided on the lower surface of the substrate 8 as shown in FIG. The shape of the pair of terminal electrodes may be slightly different by using, for example, a notch or the like, thereby forming an anode mark or a cathode mark for displaying the polarity.

A frame 4 is formed on the upper surface of the light reflecting member 2. The frame body 4 surrounds the outer periphery of the upper surface of the light emitting element 1. When a plurality of light emitting elements 1 are used, they are arranged so as to surround the outermost periphery of the plurality of light emitting elements as shown in FIG. It is preferable that the entire top surface of the light emitting element is formed so as to be exposed in the frame. For example, the light reflecting element 2 is disposed slightly outside the top surface of the light emitting element 1 located on the outermost periphery. It is preferable that the upper surface of is exposed. The distance between the outer edge of the light emitting element and the inner wall of the frame is preferably, for example, 300 μm or less and about 0 to 100 μm.
Thus, high luminance can be realized by limiting the light emitting region.

The frame body 4 is preferably formed on the upper surface of the light emitting element along the outer edge. The frame 4 can be formed of a resin material in which a substance having light reflectivity is mixed.

The translucent member 3 is disposed in the frame body 4, that is, in a recess formed by being surrounded by the frame body 4. In the present embodiment, the concave portion has a bottom surface formed by the upper surface of the light emitting element 1 and the upper surface of the light reflecting member 2 and an inner surface formed by the frame body 4. 3 is arranged.

As the translucent member 3, a resin material containing a wavelength conversion substance such as a phosphor can be suitably used. The translucent member 3 can be formed by dropping (potting) such a resin material into the frame 4. When the phosphor is used, it is preferable that the phosphor is in contact with the upper surface of the light-emitting element 1 in order to efficiently dissipate heat generated from the phosphor generated at the time of wavelength conversion. It is preferable that they are disposed by sedimentation on the element side.

FIG. 4 is a partially enlarged view of the vicinity of the light emitting element 1 of FIG. As shown in FIG. 4, it is preferable that the translucent member 3 has a two-layer structure of a phosphor layer 14 and a diffusion layer 12 in the frame body 4. Such a two-layer structure can be formed by dropping a resin material containing a diffusing material and a phosphor having a specific gravity larger than that of the diffusing material into the frame body 4 and allowing the phosphor to settle. The diffusing material having a small specific gravity is dispersed and arranged above the phosphor. The sedimentation may be forced sedimentation such as centrifugal sedimentation, or natural sedimentation. By using the diffusing material, it is possible to improve the light quality by making the dark portion between adjacent light emitting elements less noticeable and approaching the point light source.

The sealing member 5 is a translucent member provided to efficiently extract light from the light emitting element, that is, light emitted through the translucent member 3. The sealing member 5 includes the light reflecting member 2 and the frame body 4.
And the translucent member 3 are covered. Further, the sealing member 5 includes a lens portion 6 and a flange portion 7 that extends to the outer peripheral side of the lens below the lens portion 6.

As shown in FIG. 1, a part of the frame body 4 is covered with a collar portion 7. In order to improve the light extraction efficiency, it is preferable to set the lens unit 6 so large that the light emitted from the light emitting element is not totally reflected at the interface of the lens unit. However, when trying to reduce the size of the light emitting device,
There is a limit to enlarging the lens. Therefore, a part of the frame body 4 is covered with the collar portion 7. In other words, the frame body 4 is disposed across the lens portion 6 and the collar portion 7 in plan view. More preferably, as shown in FIG. 1, a part of the outer edge of the frame body 4 is covered with the collar portion 7, whereas the inner surface of the frame body 4, that is, the outer edge of the translucent member 3 is Everything is arranged under the lens unit 6. As a result, it is possible to reduce the size without reducing the light extraction efficiency as much as possible.
Moreover, it is preferable that the end surfaces of the substrate 8 and the sealing member 5 are flush with each other so that the outer edge of the substrate 8 and the outer edge of the sealing member 5 coincide with each other when viewed from above.

<The manufacturing method of the light-emitting device of Embodiment 1>
The manufacturing method of the light-emitting device according to Embodiment 1 is a method of manufacturing the light-emitting device of Embodiment 1 described above, and includes a light-emitting element placing step, a light reflecting member forming step, a frame body forming step, and a light transmitting property. An adhesive member forming step and a sealing member forming step. Hereinafter, description will be given with reference to FIGS.

(Light emitting element mounting process)
In the light emitting element mounting step, as shown in FIG. 5, a substrate 81 is prepared, and the light emitting element 1 is mounted on the substrate 81.
Is placed. The substrate 81 is plate-shaped, and the wiring 9 is formed on the upper surface, and the metal member that becomes the terminal electrode 18 is formed on the lower surface. The wiring and the terminal electrode are electrically connected by a via or the like inside the substrate. FIG. 5A is a top view and FIG. 5B is a side view. Next, FIG.
6 (b), the light-emitting element 1 is flip-chip mounted on the upper surface of the substrate 81 via a bonding member. FIG. 6A is a top view, and FIG. 6B is a side view. Note that a bonding member such as a bump, solder, a conductive paste, or an anisotropic conductive paste can be used for connection between the light emitting element 1 and the wiring 9 of the substrate 81. Note that the protection element 16 may be mounted before or after the light emitting element 1 is placed. Usually, the substrate 81 is an aggregate of a plurality of substrates 8 until it is divided in a later process. Here, a description will be given with reference to a drawing in which two substrates 8 are connected.
After the light emitting element 1 is placed on the substrate, an underfill may be optionally filled between the upper surface of the substrate and the lower surface of the light emitting element 1 in order to relieve stress with the light reflecting member 2. By forming the underfill, since the light reflecting member 2 does not enter between the upper surface of the substrate and the lower surface of the light emitting element, the reliability is improved. This is because when the light reflecting member 2 enters the lower surface of the light emitting element 1, the light reflecting member 2 may expand due to heat, and the light emitting element 1 may be lifted. In addition, it is preferable to provide the underfill with a light reflecting function because light emitted in the direction of the substrate 8 can be reflected.

The arrangement of the light-emitting elements 1 can be arbitrarily determined according to the size of the light-emitting elements to be used and the specifications of the light-emitting device to be finally obtained. A light emitting region can be formed.

(Light reflecting member forming step)
Next, as shown in FIG. 7, the side surface of the light emitting element 1 is covered with a light reflecting member 2 so that the upper surface of the light emitting element 1 is exposed. FIG. 7A is a top view, and FIG. 7B is B in FIG.
FIG. The upper surface of the protection element 16 is disposed at a position lower than the upper surface of the light emitting element 1, and it is preferable that the entire protection element 16 is embedded in the light reflecting member 2. Thereby, light absorption by the protection element 16 can be suppressed. The upper surface of the light emitting element 1 and the upper surface of the light reflecting member 2 are preferably the same height, that is, flush with each other.
The light reflecting member 2 can be formed by providing a dam material on the outer periphery of the collective substrate and pouring a resin material containing the light reflecting member into the dam material. The viscosity or the like is adjusted so as to be surely filled between the adjacent light emitting elements 1.

(Frame forming process)
Next, as shown in FIG. 8, the frame body 4 is formed so as to surround the upper surface of the light emitting element 1. FIG.
(A) is a top view, FIG.8 (b) is CC sectional view taken on the line of Fig.8 (a). The frame body 4 can be formed, for example, by discharging resin in a ring shape on the light reflecting member 2 using a resin discharge device. In addition, a frame body formed in advance with a mold or the like may be transferred or pasted onto the light reflecting member 2, or may be formed using an ink jet or a 3D printer. In this embodiment, the outer edge of the upper surface of the light emitting element 1 is formed about 100 μm along the outer edge of the upper surface of the light emitting element 1 to form a square ring with rounded four corners in plan view.

(Translucent member forming step)
Next, as shown in FIG. 9, the translucent member 3 is disposed in the frame 4. FIG. 9A is a top view, and FIG. 9B is a cross-sectional view taken along the line DD in FIG. 9A. In the present embodiment, a resin material containing a phosphor and a diffusing material is potted in a region surrounded by the frame body 4 to fill the frame body 4. Thereafter, by spontaneous sedimentation, the phosphor is placed so as to be in contact with the upper surface of the light emitting element 1, thereby forming the phosphor layer 14 in the vicinity of the light emitting element and the diffusion layer 12 thereon (see FIG. 4). .

(Sealing member forming step)
Next, as illustrated in FIG. 10, the sealing member 5 is formed on the light reflecting member 2, the frame body 4, and the translucent member 3. FIG. 10A is a top view, and FIG. 10B is a side view of FIG. For easy understanding, the light reflecting member 2 is shown so that the light emitting element 1 and the protective element 16 can be seen. As a method for forming the sealing member 5, various methods such as transfer molding, compression molding, resin application (potting), molding with a casting case, and the like can be used. Here, the sealing member 5 is formed so as to have the lens portion 6 and the flange portion 7, and is disposed so that a part of the frame body 4 is positioned below the flange portion 7. Furthermore, when forming the sealing member 5 by compression molding, it is preferable to form the air vent 20 in the collar part 7. Thereby, the lens shape can be stabilized.

(Individualization process)
Finally, the light emitting device of the first embodiment is obtained by cutting the flange portion 7 between the adjacent lens portions 6 and the lens portions 6 (XX line shown in FIG. 10) by a method such as dicing. Thereby, the end surface of the sealing member 5, the light reflection member 2, and the board | substrate 8 becomes the same surface. Since the cut surface becomes the outer edge of the light emitting device as it is, the number of removal can be improved.

In the present embodiment, as shown in FIG. 5, the circuit in the light emitting device of the four light emitting elements to be mounted has a pattern of wiring 9 that is two series and two parallel, but according to a desired circuit. Needless to say, the wiring pattern can be changed as appropriate. FIG. 11 shows an example of the wiring 9 when four light emitting elements are connected in series. Note that the number of mounted light emitting elements may be one.

<Embodiment 2>
As shown in FIG. 12, the light emitting device 200 of the second embodiment is different from the light emitting device 100 of the first embodiment in that it does not have a substrate on which the light emitting element 1 is placed. Since there is no substrate, the electrode 21 is exposed from the lower surface of the light reflecting member 2.
Since the light-emitting device of Embodiment 2 configured as described above does not have a substrate, it can be reduced in thickness and size. In addition, high-density mounting is possible by downsizing.

<Method for Manufacturing Light Emitting Device of Embodiment 2>
The manufacturing method of the light emitting device according to the second embodiment is different from the manufacturing method of the light emitting device according to the first embodiment except that a support 24 is used instead of the substrate 8 as shown in FIG. It is comprised similarly to the manufacturing method of 1. And after forming the sealing member 5, as shown by the dotted line of FIG. 13, it can form similarly to the manufacturing method of Embodiment 1 except the point which peels (removes).

<Embodiment 3>
The light emitting device 300 of Embodiment 3 can be suitably used mainly as a light source such as a backlight. The shape of the sealing member 5 is different from that of the first embodiment.
FIG. 14 is a cross-sectional view of the light emitting device 300 and the optical member 30 provided in contact with the sealing member 5 (showing a cross section in the thickness direction of the optical member). As shown in FIG. 14, the sealing member 5 has a flat surface that can be connected to the optical member 30 such as a light guide plate or a light guide film. In Embodiment 3,
The sealing member 5 is shaped so as to spread outward (upward from the back surface of the substrate 8). The side surface of the sealing member 5 is a curved surface. Further, the sealing member 5 is not in contact with the substrate 8,
The upper surface of the light reflecting member 2 exposed outside the frame body 4, the outer wall of the frame body 4, and the translucent member 3.
The upper surface of the substrate is covered. Thereby, light with good light quality can be efficiently incident on the optical member.
When the sealing member 5 is brought into contact with an edge type light guide plate, the light emitting device is preferably thin. In this case, the term “thin” refers to the length in the depth direction of the paper (ie, the thickness direction of the light guide plate). In this case, the light-emitting element 1 mounted on the substrate 8 is preferably rectangular in plan view, and the frame is also elongated in the longitudinal direction of the light-emitting element and shortened in the lateral direction in accordance with the light-emitting element. In order to reduce the thickness, the frame in the longitudinal direction may be formed thinner than the frame in the short direction.

Hereinafter, materials suitable for each component of the light emitting device of the embodiment will be described.
(Substrate 8)
The substrate on which the light emitting element 1 is mounted is usually glass epoxy, resin, ceramics (HTC).
C, LTCC) or the like, or a composite material of an insulating material and a metal member. The substrate is preferably made of ceramic or thermosetting resin having high heat resistance and weather resistance. Examples of the ceramic material include alumina, aluminum nitride, and mullite. In particular, aluminum nitride with high heat dissipation is preferable. For example, a substrate formed by combining these ceramic materials with an insulating material such as BT resin, glass epoxy, or epoxy resin may be used. As the thermosetting resin, an epoxy resin, a triazine derivative epoxy resin, a modified epoxy resin, a silicone resin, a modified silicone resin, an acrylate resin, a urethane resin, or the like can be used. Among these, it is more preferable to use a triazine derivative epoxy resin. The shape of the substrate is preferably a plate-like body having a flat surface.

(Wiring 9)
The substrate usually has wiring connected to the light emitting element on the surface and / or inside thereof. The wiring can be formed of a metal such as copper, aluminum, gold, silver, tungsten, iron or nickel, or an alloy such as iron-nickel alloy or phosphor bronze. The thickness of the wiring is, for example, from several μm to several hundred μm.

(Light emitting element 1)
As the light emitting element 1, for example, a semiconductor light emitting element such as a light emitting diode chip can be used. The semiconductor light emitting device can include a translucent substrate and a semiconductor stacked body formed thereon. For the light-transmitting substrate, for example, a light-transmitting insulating material such as sapphire (Al ₂ O ₃ ) or a semiconductor material that transmits light from the semiconductor stacked body (for example, a nitride-based semiconductor material) is used. be able to.

The semiconductor stacked body includes, for example, a plurality of semiconductor layers such as an n-type semiconductor layer, a light emitting layer (active layer), and a p-type semiconductor layer. The semiconductor layer can be formed from a semiconductor material such as a III-V group compound semiconductor or a II-VI group compound semiconductor, for example. Specifically, In _X Al _Y Ga
A nitride-based semiconductor material such as 1 _-XYN (0 ≦ X, 0 ≦ Y, X + Y ≦ 1) can be used.

As the electrode of the light emitting element, a good electrical conductor can be used, and for example, a metal such as Cu is suitable.

(Light reflecting member 2)
The light reflecting member is an insulator and can be made of a light reflecting resin having a certain degree of strength.
The light-reflective resin means a resin having a high reflectance with respect to light from the light emitting element, for example, a reflectance of 70% or more.
As the light-reflective resin, for example, a light-transmitting resin in which a light-reflective substance is dispersed can be used. As the light reflective substance, for example, titanium oxide, silicon dioxide, zirconium dioxide, potassium titanate, alumina, aluminum nitride, boron nitride, mullite and the like are suitable. The light-reflective material may be in the form of particles, fibers, thin plate pieces, etc., but in particular, the fiber-like material has a low coefficient of thermal expansion of the light reflecting member, for example, the coefficient of thermal expansion with the light emitting element. This is preferable because the difference can be reduced. The resin material contained in the light-reflecting resin is particularly preferably a thermosetting translucent resin such as a silicone resin, a silicone-modified resin, an epoxy resin, or a phenol resin.

(Frame 4)
The frame body 4 can function as a reflector for reflecting light emitted from the light emitting element 1 to the side by the inner wall surface upward to improve the light emission efficiency of the light emitting device.

Further, it is preferable to apply a material that can be formed by forming the frame on the light reflecting member 2 in a liquid or paste form and solidifying it as it is. In order to form the frame body at a sufficient height as a weir when filling the translucent member, it is pasty, that is, has a high viscosity (for example, a viscosity of 380 at 25 ° C.
A liquid material of ˜450 Pa · s) is preferred. Examples of such materials include thermosetting resins and thermoplastic resins. Specifically, phenol resins, epoxy resins, BT resins, PPA
And silicone resin. Moreover, it is preferable that a frame is white in order to make a reflectance high. Further, in order to further increase the reflectivity, the frame body has a light reflecting material (for example, a resin material that hardly absorbs light emitted by the light emitting element and has a large refractive index difference with respect to the resin that is a base material). TiO ₂ , Al ₂ O ₃ , ZrO ₂ , MgO, ZnO, etc.) powder may be dispersed in advance.

The frame body does not particularly define a height from the substrate, but it is preferable that the frame body has a height at which the phosphor layer 14 and the diffusion layer 12 can be formed separately as shown in FIG. Further, the frame does not particularly define the width (wall thickness) in plan view.

(Translucent member 3)
As the translucent member, a translucent resin material used for sealing a general light emitting device on which a light emitting diode or the like is mounted can be applied. Specifically, a silicone resin, an epoxy resin, a urea resin, or the like can be used. Can be mentioned. The translucent resin has a relatively low viscosity liquid resin material (for example, a viscosity at 25 ° C. of 0.01 to 5.0 Pa · s) because the previously formed frame is a weir. Therefore, even in a small region, filling can be facilitated.

Further, when a wavelength converting substance (for example, a phosphor having a certain specific gravity, for example) is mixed with such a low-viscosity resin material, the wavelength converting substance is likely to be precipitated before curing, and thus is placed on the substrate 8. The wavelength conversion substance is distributed in the vicinity of the surface (upper surface) of the light-emitting element 1, and the light-emitting element 1
The light emitted by is suitably wavelength-converted. Further, these resin materials may contain a colorant, a light diffusing agent, a filler and the like in addition to the wavelength converting substance according to the purpose and application. Hereinafter, the wavelength conversion substance contained in the translucent member will be described.

(Wavelength conversion substance)
Any wavelength converting substance may be used as long as it is excited by at least light emitted from the light emitting element and emits light having a different wavelength. For example,
(i) Garnet-based phosphors such as aluminum garnet (eg, yttrium-aluminum-garnet (YAG) phosphors activated with cerium, lutetium-aluminum-garnet (LAG) -based phosphors activated with cerium) ,
(ii) Nitrogen-containing calcium aluminosilicate activated with europium and / or chromium (C
_{aO-Al 2 O 3 -SiO 2} ) based phosphor,
(iii) a silicate-based ((Sr, Ba) ₂ SiO ₄ ) phosphor activated with europium,
(iv) β-SiAlON phosphor
(v) a nitride phosphor such as CASN (CaAlSiN ₃ : Eu) or SCASN;
(vi) rare earth nitride phosphors such as LnSi ₃ N11 and LnSiAlON (Ln is a rare earth element),
(vii) oxynitride phosphors such as BaSi ₂ O ₂ N ₂ : Eu and Ba ₃ Si ₆ O ₁₂ N ₂ : Eu;
(viii) Fluoride complex phosphor activated with manganese (for example, KSF type (K ₂ SiF ₆ : Mn))
Phosphor),
(iX) CaS system (CaS: Eu), SrGa ₂ S ₄ system (SrGa ₂ S ₄ : Eu), SrA
sulfide phosphors such as l ₂ O ₄ and ZnS,
(X) Chlorosilicate phosphor and the like.

Further, semiconductor materials such as II-VI, III-V, and IV-VI semiconductors, specifically, nano-sized high dispersion of CdSe, core-shell CdS _x Se _1-x / ZnS, GaP, etc. A so-called nanocrystal, which is a particle, or a light-emitting substance called a quantum dot (Q-Dots) may be used. Since the quantum dot phosphor is unstable, the surface of the particles may be coated or stabilized with PMMA (polymethyl methacrylate), a silicone resin, an epoxy resin, or a hybrid resin thereof.

(Support 24)
The support is a member on which the light emitting element 1 is placed and is removed at least after the light reflecting member 2 is molded. Thereby, the light emitting device can be further downsized. The material is not particularly limited and may be a sheet shape or a plate shape.

(Sealing member 5)
As a translucent member constituting the sealing member, a thermosetting resin such as a silicone resin, a silicone-modified resin, an epoxy resin, a phenol resin, a polycarbonate resin, an acrylic resin,
Thermoplastic resins such as methylpentene resin and polynorbornene resin can be used.
In particular, a silicone resin excellent in light resistance and heat resistance is suitable.

As mentioned above, although some embodiment which concerns on this invention was illustrated, this invention is not limited to embodiment mentioned above, It cannot be overemphasized that it can be made arbitrary, unless it deviates from the summary of this invention. .

DESCRIPTION OF SYMBOLS 1 Light emitting element 2 Light reflection member 3 Translucent member 4 Frame body 5 Sealing member 6 Lens part 7 Eaves part 8 Substrate 9 Wiring 16 Protection element 18 Terminal electrode 20 Air vent 21 Electrode 24 Support body 30 Optical members 100, 200, 300 Light emitting device

Claims (9)

A light emitting element;
A light reflecting member that covers a side surface of the light emitting element and is disposed to expose an upper surface of the light emitting element;
A frame formed on the light reflecting member so as to surround an outer periphery of the upper surface;
A translucent member disposed within the frame;
A translucent sealing member that covers the light reflecting member, the frame, and the translucent member;
The light-emitting device, wherein the sealing member has a flange, and a part of the frame is covered with the flange.   The light emitting device according to claim 1, wherein the translucent member contains a wavelength conversion substance. The light emitting device according to claim 1, wherein an upper surface of the light emitting element and an upper surface of the light reflecting member are substantially flush. The light emitting device according to claim 1, wherein a protective element is embedded in the light reflecting member. The light emitting device according to any one of claims 1 to 4, wherein the light emitting elements are plural, and an interval between the adjacent light emitting elements is 1 to 300 µm. The light-emitting device according to claim 1, further comprising a substrate on which the light-emitting element is placed, wherein the substrate has a terminal electrode on a lower surface thereof. The light emitting device according to claim 1, wherein a terminal electrode is exposed from a lower surface of the light reflecting member.   The light-emitting device according to claim 1, wherein the translucent member contains a diffusing material. The light-emitting device according to claim 1, wherein the translucent member has a phosphor precipitated on the light-emitting element side.

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