JP2019071470A - Light-emitting device - Google Patents

Abstract

To provide a method for easily or highly accurately manufacturing a small side-view type light-emitting device.SOLUTION: A light-emitting device having a light emission surface, a back surface located at a side opposite to the light emission surface, and a mounting surface located between the light emission surface and the back surface, includes: a light-emitting element which has a first main surface located at a light emission surface side, a second main surface located at a side opposite to the first main surface, and a side surface between the first main surface and the second main surface and which also has a first electrode and a second electrode on the main surface; a light shielding member which coats the side surface of the light-emitting element and does not coat the first main surface of the light-emitting element; a first terminal coating film which is connected to the first electrode of the light-emitting element and is placed across the back surface and the mounting surface; a second terminal coating film which is connected to the second electrode of the light-emitting element and is placed across the back surface and the mounting surface; a first conductive member which is in contact with both the first electrode and the first coating member; and a second conductive member which is in contact with both the second electrode and the second coating member.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a light emitting device.

2. Description of the Related Art Conventionally, a light emitting device provided with a light emitting element has been widely used as a light source for a backlight for liquid crystal television, a lighting fixture, and the like. And according to the use form, what has various package forms, especially the small and thin side view type light-emitting device is proposed (for example, patent documents 1, 2).
Thus, there is a need to establish a method for easily or accurately manufacturing a light emitting device that can be firmly fixed to a mounting substrate even if it is small and thin.

JP, 2015-8820, A JP, 2012-146898, A

  Embodiments of the present invention aim to provide a compact side-view type light emitting device.

  A light emitting device according to an embodiment of the present invention comprises a light emitting surface, a back surface located opposite to the light emitting surface, and a mounting surface located between the light emitting surface and the back surface. A first main surface located on the light emitting surface side and serving as a main light emitting surface, a second main surface located opposite the first main surface, and between the first main surface and the second main surface A light emitting device having a light emitting element having a first electrode and a second electrode on the second main surface, and a light shielding member covering the side surface of the light emitting element and not covering the first main surface of the light emitting device A first terminal covering film connected to the first electrode of the light emitting element and disposed across the back surface and the mounting surface; and a second electrode of the light emitting element; A second terminal covering film disposed across the mounting surface, and in contact with both the first electrode and the first covering member That the light-emitting device comprising a first conductive member, and a second conductive member in contact with both the second electrode and the second cover member.

  According to the light emitting device according to the embodiment of the present invention, a compact side view light emitting device can be easily or accurately manufactured.

FIG. 1A is a schematic plan view showing a step of arranging a light emitting element on a base according to a method of manufacturing a light emitting device of Embodiment 1. FIG. FIG. 1B is a schematic cross-sectional view taken along line X-X 'of FIG. 1A. FIG. 1C is a schematic plan view showing a step of forming a conductive member according to the method of manufacturing a light emitting device of Embodiment 1. 1D is a schematic cross-sectional view taken along line X-X 'of FIG. 1C. 1E and 1F are schematic cross-sectional views showing steps of forming a light shielding member according to the method of manufacturing a light emitting device of Embodiment 1. FIG. 1G and 1H are schematic cross-sectional views showing steps of cutting a conductive member according to the method of manufacturing a light emitting device of Embodiment 1. FIG. FIG. 1I is a schematic front view of a light emitting module in which the light emitting device according to the first embodiment is mounted on a mounting substrate as viewed from a light emitting surface side. FIG. 1J is a schematic cross-sectional view of the light emitting device according to the first embodiment. FIG. 2A is a schematic cross-sectional view showing a step of arranging a light emitting element on a base according to a method of manufacturing a light emitting device of Embodiment 2. FIG. 2B is a schematic plan view showing a step of forming a light shielding member according to the method of manufacturing a light emitting device of Embodiment 2. FIG. 2C is a schematic cross-sectional view taken along line X-X 'of FIG. 2B. FIG. 2D is a schematic cross-sectional view showing the step of forming a conductive member according to the method of manufacturing a light emitting device of Embodiment 2. 2E and 2F are schematic cross-sectional views showing steps of cutting a conductive member according to the method of manufacturing a light emitting device of Embodiment 2. FIG. 3A to 3D are schematic cross-sectional views showing the process of forming the recess of the light shielding member according to the method of manufacturing the light emitting device of the third embodiment. FIG. 3E is a schematic cross-sectional view showing the step of forming a conductive member according to the method of manufacturing a light emitting device of Embodiment 3. FIG. 3F is a schematic cross-sectional view showing a step of cutting a conductive member according to the method of manufacturing a light emitting device of Embodiment 3. 4A and 4B are schematic cross-sectional views showing steps of forming a first light shielding member according to the method of manufacturing a light emitting device of the fourth embodiment. FIG. 4C is a schematic cross-sectional view showing the step of forming a conductive member according to the method of manufacturing a light emitting device of Embodiment 4. 4D and 4E are schematic cross-sectional views showing steps of forming a second light shielding member according to the method of manufacturing a light emitting device of the fourth embodiment. 4F and 4G are schematic cross-sectional views showing steps of cutting a conductive member according to the method of manufacturing a light emitting device of the fourth embodiment. FIG. 5 is a schematic plan view of FIG. 4C. 6A and 6B are schematic plan views showing steps of forming a conductive member according to the method of manufacturing a light emitting device of the fifth embodiment.

Hereinafter, embodiments of the present invention will be described with reference to the drawings as appropriate. However, the light emitting device and the manufacturing method thereof to be described below are for embodying the technical idea of the embodiment, and are not limited to the following. In particular, the dimensions, materials, shapes, relative positions, etc. of the component parts do not limit the technical scope of the present invention, and are merely illustrative examples, and are exaggerated to clarify the explanation. is there. The embodiments described below can be applied by appropriately combining each configuration and the like.

First Embodiment
FIG. 1A is a schematic plan view showing a step of arranging a light emitting element on a base according to a method of manufacturing a light emitting device of Embodiment 1. FIG. FIG. 1B is a schematic cross-sectional view taken along line XX ′ of FIG. 1A. FIG. 1C is a schematic plan view showing a step of forming a conductive member according to the method of manufacturing a light emitting device of Embodiment 1. FIG. 1D is a schematic cross-sectional view taken along line XX ′ of FIG. 1C. 1E and 1
F is a schematic sectional drawing which shows the process of forming a light-shielding member based on the manufacturing method of the light-emitting device of Embodiment 1. FIG. 1G and 1H are schematic cross-sectional views showing steps of cutting a conductive member according to the method of manufacturing a light emitting device of Embodiment 1. FIG. FIG. 1I is a schematic front view of a light emitting module in which the light emitting device according to the first embodiment is mounted on a mounting substrate as viewed from a light emitting surface side. FIG. 1J is a schematic cross-sectional view of the light emitting device according to the first embodiment. In the first embodiment, each light emitting device 10 is formed by performing at least the following steps.
First, as shown in FIGS. 1A and 1B, the two light emitting elements 2 include the main light emitting surface M and a surface opposite to the main light emitting surface M and having the pair of electrodes 2a and 2b. Equipped, electrode 2
It arranges on the base 1 so that a and 2b face up and adjacent to each other.
Then, as shown in FIG. 1C and FIG. 1D, a pair of conductive members 3 (3a, 3b) extending from the electrodes 2a, 2b of one light emitting element 2 to the electrodes 2a, 2b of the other light emitting element 2 are formed. In other words, a pair of conductive members 3 (3a, 3b) are formed to bridge over the electrodes of one light emitting element 2 and the other light emitting element 2.
Thereafter, as shown in FIG. 1E and FIG. 1F, a light shielding member 4 covering at least the light emitting elements 2 is formed.
Then, as shown in FIG. 1G and FIG. 1H, at least a pair of conductive parts 3a and 3b between the light emitting elements 2 and the light shielding member 4 are cut in the direction perpendicular to the main light emitting surface M. Embodiment 1
Then, this cut surface can be used as the mounting surface S of the light emitting device 10.
Furthermore, by appropriately cutting the light shielding member 4 along the side surface of the light emitting element 2, as shown in FIG. 1J, the side view type light emitting device 10 in which the mounting surface S is perpendicular to the main light emitting surface M It can be shredded.
As described above, in the first embodiment, the light shielding member 4 is formed after the conductive member 3 is formed. In addition, as described later, the order of the respective steps may be changed, and the form thereof will be described in detail in the second to fourth embodiments.
Hereinafter, each process of Embodiment 1 is demonstrated in detail using drawing.

(Placement of the light emitting element on the substrate)
As shown in FIG. 1A and FIG. 1B, two light emitting elements 2 each having a main light emitting surface M and a surface opposite to the main light emitting surface M and having a pair of electrodes 2a and 2b are It arrange | positions on the base | substrate 1 so that 2a, 2b may face up and it adjoins.
First, at least two light emitting elements 2 are prepared. The light emitting element 2 includes a semiconductor layer including at least a light emitting layer, and is a main light emitting surface M and a surface opposite to the main light emitting surface M, and has a pair of positive and negative electrodes 2a,
And 2b. As described above, since the light emitting elements 2 individually separated from the wafer state can be disposed on the substrate 1 only after having the desired light distribution, the light emitting device can be formed with high yield. Can.

The planar shape of the light emitting element 2 may be any of a circle, an ellipse, a triangle, and a polygon such as a square and a hexagon. Further, the size and thickness of the light emitting element 2 can be appropriately selected. In the first embodiment, for example, the light emitting element 2 having a rectangular planar shape can be used.

Further, the base 1 on which the light emitting element 2 is to be disposed is prepared. The base 1 may be removed before cutting the conductive member and the light shielding member later, or may be used as part of a light emitting device by cutting with the conductive member and the light shielding member.

Next, the prepared light emitting element 2 is placed on the substrate 1. In the first embodiment, two light emitting elements 2 are set as one set, and one or more sets of light emitting elements 2 are disposed on the base 1. In a later step, at least one pair of conductive members for each set is The light emitting element can be formed so as not to protrude from the opposite surface to the opposite surface. Thereby, when singulated into individual light emitting devices, it is possible to efficiently form a side view type light emitting device with little light absorption, in which the conductive member is not exposed from the upper surface opposite to the mounting surface It is. However, not limited to this, three or more light emitting elements may be disposed. This form will be described in detail in the fifth embodiment.

In the first embodiment, the two light emitting elements 2 are disposed adjacent to each other on the base 1 with the electrodes 2 a and 2 b of the light emitting element 2 facing upward, that is, the main light emitting surface M contacts (faces) the base 1. . Thus, the conductive member can be easily formed on the electrode in a later process, and the light shielding member can be easily formed so as to expose the main light emitting surface M.
Further, in the two light emitting elements 2, the pair of electrodes 2 a and 2 b of one light emitting element 2 and the pair of electrodes 2 a and 2 b of the other light emitting element 2 face each other (that is, two in Embodiment 1) It is preferable to arrange so that the side surfaces in the longitudinal direction of the light emitting element 2 face each other. Thus, in the case where one electrode of one light emitting element 2 and one electrode of the other light emitting element 2 face each other (that is, the side faces in the short direction of the two light emitting elements 2 face each other) Compared to the above, it is easy to form the conductive member in a smaller amount in a later step.

Furthermore, it is preferable to arrange the two light emitting elements 2 so that the different poles of the respective light emitting elements 2 are adjacent to each other. Specifically, as shown in FIG. 1A, the positive electrode 2a of one light emitting element 2 and the negative electrode 2b of the other light emitting element 2 face each other, and the negative electrode 2b of one light emitting element 2
It is preferable to arrange the two light emitting elements 2 so that the positive electrode 2a of the other light emitting element 2 is opposite to each other. Thereby, on the mounting surface of the light emitting device, the left and right positions of the positive and negative terminals (the respective conductive members connected to the positive and negative electrodes) can be made the same.
In the two light emitting elements 2, the same poles of the respective light emitting elements 2 may be arranged to be adjacent to each other. As a result, the light emitting elements 2 can be arranged in the same direction without changing the direction of the light emitting elements 2, so the arrangement on the base 1 is easy. Furthermore, it is possible to form a light emitting device in which the left and right positions of the positive and negative terminals are different on the mounting surface.

The arrangement interval of the two light emitting elements 2 can be set arbitrarily. This interval affects the thickness of the light shielding member described later. Therefore, it is preferable to adjust the width of the gap so as to obtain the desired thickness of the light shielding member. For example, although it depends on the arrangement accuracy of the light emitting element, the cutting position accuracy in the subsequent individualization process, and the configuration of the light shielding member, the light emitting device can be arranged at intervals of about 30 μm to 300 μm. Accordingly, it is possible to easily form a conductive member in a later process and to form a light shielding member capable of sufficiently shielding light leaking from other than the main light emitting surface. further,
The number of chips can be secured, and the light emitting device can be manufactured efficiently.

When disposing the light emitting element 2 on the substrate 1, for example, an adhesive may be disposed in advance on the substrate 1 and / or the light emitting element 2, and the light emitting element 2 may be fixed on the substrate 1 by the adhesive. As the adhesive, those known in the art such as resins can be used. In particular, when the substrate 1 is used as a part of a light emitting device, it is preferable to use a resin having translucency. When the substrate 1 having adhesiveness is used, the light emitting element 2 may be fixed on the substrate by the adhesiveness of the substrate 1. Thus, the light emitting element 2 can be efficiently disposed with a small number of steps.

(Formation of a conductive member)
In Embodiment 1, next, as shown in FIG. 1C and FIG. 1D, a pair of conductive members 3 is formed from the electrode of one light emitting element 2 to the electrode of the other light emitting element 2. That is, the pair of conductive members 3 is formed so as to crosslink the two light emitting elements 2. In the first embodiment, the conductive member 3 can be formed across the adjacent different poles of the two light emitting elements 2. Specifically, a conductive member 3a extending between the positive electrode 2a of one light emitting element 2 and the negative electrode 2b of the other light emitting element 2;
A conductive member 3b extending between the negative electrode 2b of one light emitting element 2 and the positive electrode 2a of the other light emitting element 2
Can be formed.

The conductive member 3 is preferably formed between the light emitting elements 2 to a lower side than the upper surfaces of the electrodes 2 a and 2 b of the light emitting elements 2. Accordingly, in the subsequent process, the conductive member can be easily exposed from the cut surface (mounting surface of the light emitting device) obtained by cutting the pair of conductive members 3 and the light shielding member between the light emitting elements. Further, in order to prevent a short circuit of the light emitting device, the conductive member 3 is preferably provided so as not to be in direct contact with the semiconductor layer. Therefore, in the first embodiment, for example, between the light emitting elements 2, the conductive member 3 can be formed in a region covering the side surfaces of the electrodes 2a and 2b and above the lower surface of the electrodes 2a and 2b. In this case, by providing the electrodes 2a and 2b with a large thickness, the conductive member 3 can be easily formed so as not to be in direct contact with the semiconductor layer. For example, in the first embodiment, the thickness of the electrodes 2a and 2b can be 10 μm or more, more preferably 50 μm or more. This can prevent the conductive member 3 from coming into contact with the semiconductor layer. In addition, the area of the conductive member exposed from the mounting surface of the light emitting device can be secured. Light emitting element 2
The thickness of the electrodes 2a and 2b may be different.

When the surface of the light emitting element 2 is covered with an insulating member to ensure insulation, the conductive member 3 may be formed below the lower surface of the electrodes 2a and 2b, for example, to the side surface of the semiconductor layer. Thus, the area of the conductive member 3 exposed to the mounting surface of the light emitting device can be increased, and a light emitting device with high heat dissipation and mounting can be formed. However, it is preferable to form the conductive member 3 in a region up to the main light emitting surface M of the light emitting element 2. That is, the conductive member 3 is
It is preferable to form so as not to contact the base 1 between the light emitting elements 2. Thereby, in the light emitting device, light absorption due to the conductive member 3 being exposed on the same plane as the main light emitting surface M can be suppressed.

The conductive member is, for example, potted, drawn, printed, using conductive paste or solder.
It can be formed by arranging by a coating method such as thermal spraying and curing by heating. Thereby, cost and time can be reduced as compared with the case of forming the conductive member by plating or the like. In particular, when the conductive member 3 is formed prior to the light shielding member as in the first embodiment, it is preferable to apply solder as the conductive member 3. As a result, a desired amount of conductive members can be easily formed at desired positions, and a pair of conductive members 3a and 3b can be easily formed over the top surfaces of the pair of electrodes 2a and 2b. It is preferable to use AuSn, which has a relatively high melting point, as the solder, because it can prevent remelting of the conductive member 3 when mounting the light emitting device on a mounting substrate.

When the conductive member 3 is formed prior to the light shielding member 4 as in the first embodiment, the conductive member 3 is disposed in order to hold the conductive member 3 in the desired region as described above. It is preferable to adjust the viscosity. For example, the viscosity of 50 Pa · s to 500 Pa · s as the conductive member 3
More preferably, an AuSu paste having a viscosity of about 200 Pa · s to 300 Pa · s can be prepared and formed in a desired region while adjusting the amount appropriately. As described above, since the conductive member 3 can be held at a desired position by using the conductive member 3 whose viscosity is adjusted, the light emitting device can be efficiently formed with a small number of steps.

(Formation of light shielding member)
In the first embodiment, next, as shown in FIGS. 1E and 1F, a light shielding member 4 that covers at least the space between the light emitting elements 2 is formed. Specifically, the light shielding member 4 covering the two light emitting elements 2 and the pair of conductive members 3 is formed on the base 1 so as to expose the main light emitting surface M. By this,
The pair of conductive members 3a and 3b of the light emitting element 2 can be insulated, and light leakage from other than the main light emitting surface M can be prevented.

Here, as shown in FIG. 1F, the conductive member 3 may be exposed from the upper surface of the light shielding member 4. For example, as shown in FIG. 1E, the light shielding member 4 is formed to have a height covering the upper surface of the conductive member 3 and the upper portion of the light shielding member 4 is removed by cutting or polishing to expose the conductive member 3 It can be done. Alternatively, the conductive member 3 may be exposed by removing the upper portions of the light blocking member 4 and the conductive member 3. Since the upper surface side in the manufacturing process is the back surface side of the light emitting device, the conductive member 3 can be exposed as a terminal also from the back surface of the light emitting device by thus exposing the upper surface of the conductive member 3. Accordingly, it is easy to form a light emitting device with high heat dissipation and high mountability.

The light shielding member 4 may be made of a base material such as a resin and the like that contains a light reflective or light absorbing material, and is formed by molding and curing by transfer molding, compression molding, screen printing, potting or the like. it can. In particular, since the light shielding member 4 can be formed reliably between the light emitting elements 2 below the conductive member 3, a compression mold and a transfer mold are preferable.
As described above, the light shielding member may be formed at one time (in a mode in which a part of the formed light shielding member is removed is also formed at one time), and a light shielding member may be further provided. That is, the light shielding member may be formed in plural times. This form will be described in detail in the fourth embodiment.

(Cutting of conductive member)
Next, in the first embodiment, as shown in FIGS. 1G and 1H, a direction in which the pair of conductive members 3 and the light shielding member 4 between the light emitting elements 2 perpendicularly intersect with the main light emitting surface M of the light emitting elements 2 Cut into Thereby, the pair of conductive members 3 is perpendicular to the light emitting surface (main light emitting surface M) of the light emitting device.
Can be formed on the mounting surface S of the light emitting device 10 to be exposed. In Embodiment 1, by further cutting the light shielding member 4 in parallel along the side surface of the light emitting element 2, individual light emitting devices 10 can be singulated as shown in FIG. 1H.

The planar shape of the light emitting element disposed on the substrate 1 is not particularly limited as described above, but if the same shape is used, the conductive member 3 and / or the light shielding member 4 can be easily cut along the light emitting element. In the first embodiment, since the side surfaces of the two rectangular light emitting elements 2 are arranged to face each other,
The conductive member 3 and / or the light shielding member 4 can be easily cut along the side surfaces of the light emitting element 2, and the individual light emitting devices can be efficiently separated.

For the cutting, a cutting method known in the art, such as blade dicing using a blade 5, laser dicing, cutter scribing, etc. can be used.

In the case of mounting on the mounting substrate 6 as shown in FIG.
The side view type light emitting device 10 in which the mounting surface S is perpendicular to the main light emitting surface M can be formed. As in the first embodiment, by forming the conductive paste or the eutectic alloy so as to cover the two light emitting elements as in the case of the pair of conductive members 3, the time is longer than when forming the conductive member by plating or the like. And cost can be reduced to form a light emitting device. Further, by exposing the upper surface of the conductive member 3 in the light shielding member forming step, the pair of conductive members 3 can be exposed also from the back surface U of the light emitting device 10. Thus, the light emitting device 10 can be formed with high heat dissipation and high mountability to the mounting substrate 6. Moreover, even if stress is applied to the light emitting device from the front after mounting, the light emitting device 10 can be formed that is unlikely to fall to the back side.
The area of each conductive member exposed from the mounting surface is preferably such that the bonding strength can be sufficiently secured when mounting the light emitting device on the mounting substrate. For example, the area of each conductive member exposed from the mounting surface is , Can be 0.03 mm ² or more, respectively. Further, the area of each conductive member exposed from the mounting surface is preferably as large as possible without causing a short circuit when the light emitting device is mounted on the mounting substrate.

(Other process)
In addition to the above steps, for example, a step of forming a wavelength conversion layer, a step of forming a light transmitting layer, a step of forming a terminal covering film, and the like may be appropriately performed.

In the step of forming the wavelength conversion layer, the wavelength conversion layer 7 for converting the light emitted from the main light emission surface M into a desired wavelength can be formed to cover the main light emission surface M. As the wavelength conversion layer 7, for example, a base material such as a resin or glass containing a wavelength conversion material such as a phosphor can be used. The wavelength conversion 7 can be formed by a desired method such as spraying, printing, application, and sticking. As described above, the substrate 1 may be used as the wavelength conversion layer 7 by using the substrate 1 made of a translucent resin containing a wavelength conversion material. In addition, it is possible to form a light emitting device with good cutoff by forming a wavelength conversion layer whose periphery is surrounded by the frame of the light shielding member in advance and attaching it to the main light emitting surface.

In the step of forming the light transmitting layer, the light emitting surface of the light emitting device (specifically, the wavelength conversion layer 7 or the main light emitting surface M
) Is a step of forming a translucent layer 8 having transparency. By forming the light transmitting layer 8, the light emitting surface of the light emitting device can be protected. As the light transmitting layer 8, for example, resin, glass or the like having light transmitting property can be used. Further, by incorporating a filler or the like, it is possible to improve the light extraction and reduce the tackiness. The light transmitting layer 8 is, for example, a spray, a print,
It can be formed by a desired method such as application, adhesion and the like.
The step of forming the wavelength conversion layer 7 and the step of forming the light transmitting layer 8 are a pair of conductive members 3a.
It is preferable to carry out before the cutting (separating) of 3b.

In the step of forming the terminal covering film, the pair of conductive members 3a and 3b between the light emitting elements 2 and the pair of conductive members 3a and 3b of the mounting surface on which the light shielding member 4 is cut and exposed are terminals of the light emitting device. This is a step of forming the terminal covering film 9 to be protected. As the terminal covering film 9, gold, silver, nickel, aluminum, rhodium, copper, or an alloy of these, or the like can be used. The terminal covering film 9 can be provided, for example, with a thickness of 0.03 μm to 0.5 μm. Thereby, the deterioration of the conductive member can be prevented. The terminal covering film 9 can be formed, for example, by plating or sputtering. In particular, a coating film is integrally formed on the light shielding member 4 of the mounting surface S and the pair of conductive members 3a and 3b by sputtering, for example, and then the entire mounting surface S is irradiated with a laser. It is possible to remove only the covering film formed in the above, and the terminal covering film 9 can be formed efficiently. Further, by irradiating the laser, the mounting surface S is roughened, and the tackiness of the light emitting device can be reduced. In addition to the conductive members 3a and 3b exposed to the mounting surface S, the terminal covering film 9 appropriately covers the conductive members when the conductive members are exposed from the back surface U, the side surface, and the upper surface of the light emitting device. It may be provided as follows.

  Hereinafter, each component will be described in detail.

(Light emitting element)
As the light emitting element 2, a light emitting diode, a laser diode or the like generally used in the relevant field can be used. For example, nitride semiconductors (In _x Al _Y Ga _1-XY N, 0 ≦ x, 0 ≦
Y, X + Y ≦ 1), GaP, III-V compound semiconductor such as GaAs, ZnSe, II
Various semiconductors such as a group VI compound semiconductor can be used. The light emitting element 2 is
It may have a substrate for growing the semiconductor layer. Examples of the substrate include insulating substrates such as sapphire, and substrates made of oxides such as lithium niobate and neodymium gallium oxide lattice-joined to SiC, ZnO, Si, GaAs, diamond, and nitride semiconductors. Note that
The substrate may be removed using a laser lift off method or the like.

(Substrate)
As described above, sheet-like resin, ceramic, glass or the like can be used for the substrate 1. In particular, it is preferable to use a sheet-like polyimide resin from the viewpoint of heat resistance.
The planar shape, size, thickness and the like of the substrate 1 can be appropriately adjusted depending on the size and the number of the light emitting elements 2 to be disposed. In particular, when the substrate 1 is a sheet-like substrate 1 having a uniform thickness and a flat surface, the light-emitting element 2 can be stably disposed, which is preferable.

In the case of using the substrate 1 as a part of a light emitting device, it is preferable that the substrate 1 have translucency, and the transmittance of light from the light emitting element 2 is 60% or more, 70% or more, 80% or more, 90% or more Some are preferred.
In particular, when the substrate 1 is used as a part of a light emitting device, it is preferable to use a resin as the substrate 1, and silicone resin, silicone modified resin, epoxy resin, epoxy modified resin, phenol resin, polycarbonate resin, acrylic resin, TPX resin And resins made of, for example, polynorbornene resins or hybrid resins containing one or more of these resins. Among them, silicone resins or epoxy resins are preferable, and in particular, light resistance,
The silicone resin which is excellent in heat resistance is preferred.

Furthermore, when the substrate 1 is used as a part of a light emitting device, the wavelength conversion layer of the light emitting device may be obtained by including a wavelength conversion member for converting the wavelength of light from the light emitting element into the substrate 1. It can be used as
As the phosphor and / or the light emitting substance, those known in the art can be used. For example, yttrium activated aluminum garnet (YAG) phosphor activated with cerium,
Cerium-activated lutetium aluminum garnet (LAG), europium and / or chromium-activated nitrogen-containing calcium aluminosilicate (CaO-Al ₂ O ₃ -S
iO ₂ ) phosphors, europium-activated silicate ((Sr, Ba) ₂ SiO ₄ ) phosphors, β sialon phosphors, nitride phosphors such as CASN or SCASN phosphors,
Examples thereof include KSF-based phosphors (K ₂ SiF ₆ : Mn), sulfide-based phosphors, nanocrystals, and light-emitting substances referred to as quantum dots. As a material of the light emitting material, a semiconductor material, for example, I
I-VI Group, III-V group, IV-VI group semiconductor, _{specifically, CdSe, CdS x Se 1-} x / ZnS core-shell, and highly dispersed nano-sized particles of GaP and the like.

The substrate 1 may contain a filler (eg, a diffusing agent, a coloring agent, etc.). For example, silica, titanium oxide, zirconium oxide, magnesium oxide, glass, a crystal or sintered body of a phosphor, a sintered body of a phosphor and a binder of an inorganic substance, and the like can be mentioned.

(Conductive member)
As the conductive member 3, a conductive paste or a eutectic alloy can be used. For example, tin-
Solders such as bismuth-based, tin-copper-based, tin-silver-based, gold-tin-based, alloys containing Au and Sn as main components, alloys containing Au and Si as main components, Au and Ge as main components Eutectic alloys such as alloys
Alternatively, it can be formed of a conductive paste such as silver, gold, palladium or the like, or a material combining them. As described in Embodiment 1, when the conductive member is formed before the light shielding member 4, in other words, when the conductive member is formed to be held between the light emitting elements 2, AuSn solder is used as described above. It is preferable to use Further, as described in detail in the second and subsequent embodiments, when the conductive member is formed after the light shielding member 4 is formed, in other words, when the conductive member is formed in the recess of the light shielding member, or on the electrodes of the two light emitting elements. In the case of providing a pair of conductive members over the light shielding member so as to crosslink, it is preferable to use a conductive paste that can be cured at a relatively low temperature. Thereby, it is possible to suppress the color change or the deterioration of the light shielding member and maintain the light extraction efficiency of the light emitting device.

(Light blocking member)
The light shielding member 4 can be formed of, for example, a material in which a resin as a base material contains a light reflective or light absorbing material. Thereby, the light shielding member 4 can be easily formed into a desired shape. As a resin, for example, silicone resin, modified silicone resin, epoxy resin, modified epoxy resin, unsaturated polyester resin, polyimide resin, modified polyimide resin, phenol resin, urethane resin, acrylate resin, urea resin, acrylic resin, polyphthalamide (
PPA), polyphenylene sulfide (PPS), liquid crystal polymer (LCP) and the like. You may use these individually or in combination of 2 or more types of resin. In particular, heat resistance,
It is preferable to contain a silicone resin from the viewpoint of weather resistance.
When the thickness of the light shielding member 4 is, for example, 10 μm to 100 μm, a small-sized light emitting device can be formed while sufficiently shielding the light of the light emitting element from other than the main light emitting surface M.

As the light reflective or light absorbing substance, for example, ceramics, titanium dioxide, silicon dioxide, zirconium dioxide, potassium titanate, alumina, aluminum nitride, silicon nitride, boron nitride, mullite, niobium oxide, zinc oxide, barium sulfate, Various rare earth oxides (
For example, yttrium oxide, gadolinium oxide) and the like can be mentioned. The light reflecting or light absorbing substance is preferably contained in an amount of about 20% by weight to about 80% by weight, and more preferably about 30% by weight to about 70% by weight, based on the total weight of the light shielding member. Thereby, the light shielding property and the strength of the light shielding member can be secured.

Second Embodiment
FIG. 2A is a schematic cross-sectional view showing a step of arranging a light emitting element on a base according to a method of manufacturing a light emitting device of Embodiment 2. FIG. 2B is a schematic plan view showing a step of forming a light shielding member according to the method of manufacturing a light emitting device of Embodiment 2. FIG. 2C is a schematic cross-sectional view taken along line XX ′ of FIG. 2B. FIG. 2D is a schematic cross-sectional view showing the step of forming a conductive member according to the method of manufacturing a light emitting device of Embodiment 2. 2E and 2F are schematic cross-sectional views showing steps of cutting a conductive member according to the method of manufacturing a light emitting device of Embodiment 2. FIG. 2A to 2F, only one conductive member 23a of the pair of conductive members is illustrated. In the method of manufacturing the light emitting device according to the second embodiment, unlike the first embodiment, before forming the conductive member, the light shielding member having the pair of concave portions is formed at the position where the conductive member is provided. Thereby, the conductive member can be easily formed in the desired area.
Specifically, first, as shown in FIG. 2A, two light emitting elements 2 each having a main light emitting surface M and a surface opposite to the main light emitting surface M and having a pair of electrodes 2a and 2b, It arrange | positions on the base | substrate 1 so that 2a, 2b may face up and it adjoins.
Next, as shown in FIGS. 2B and 2C, a light shielding member 2 having a pair of concave portions 24a and 24b extending from the electrodes 2a and 2b of one light emitting element 2 to the electrodes 2a and 2b of the other light emitting element 2.
Form 4 In other words, the light shielding member 24 is arranged such that at least a part of the electrodes 2a and 2b of each light emitting element 2 is a part of the surface forming the recess (so that it is exposed in the recess).
A pair of recesses 24a, 24b are formed.
Then, as shown in FIG. 2D, the conductive members 23a are formed in the pair of recesses 24a.
Next, as shown in FIG. 2E, the pair of conductive members 23a between the light emitting elements 2 and the light shielding member 2
4 is cut in a direction perpendicular to the main light emitting surface M;

In the second embodiment, the light shielding member 24 having the concave portions 24 a and 24 b can be formed, for example, using a mold having a convex shape capable of forming a desired concave portion. By using a mold, it is easy to form a recess to a desired region, and a recess 24 in which a conductive member is formed between light emitting elements 2
The light shielding member 24 can be present between the light source 24 a and the side surface of the light emitting element 2. Therefore, the concave portions 24a and 24b having a depth reaching the semiconductor layer of the light emitting element 2 are formed, and the area of the conductive members 3a and 3b exposed from the mounting surface of the light emitting device is increased to secure heat dissipation and mounting properties.
It is possible to form a highly reliable light-emitting device in which a short circuit or light absorption does not easily occur.

The bottom surfaces of the pair of recesses 24a and 24b are preferably provided to a depth at which at least the upper surfaces of the electrodes 2a and 2b are exposed. In particular, the bottom surface of the recess of the light shielding member 24 between the light emitting elements 2
It is preferable to provide below the upper surface of a and 2b. Thereby, the area of the conductive members 3a and 3b exposed from the mounting surface of the light emitting device can be increased. In addition, the recess 24 a between the light emitting elements 2
Preferably, the bottom surface of 24 b is provided at a depth to the upper side than the main light emitting surface M of the light emitting element 2. Thus, the conductive member can be formed so as not to be exposed on the same plane as the main light emitting surface M, and a light emitting device with less light absorption can be easily formed.

In Embodiment 2, as shown in FIG. 2C, recesses 24a having different depths can be formed in one recess. The bottoms of the concave portions 24 a and 24 b of the second embodiment have a pair of electrodes 2 a.
, And 2b on the upper surface of the electrode (hereinafter, may be referred to as a shallow recess 24q), and between the light emitting elements 2 to the lower side of the upper surface of the electrode and from the main light emitting surface M It is provided by the depth to the upper side (it may describe as deep crevice 24s hereafter). That is, the recessed part which has a level | step difference can be formed. By forming such concave portions 24a and 24b, it is possible to secure a large area of the conductive member exposed from the mounting surface S of the light emitting device by the deep concave portions 24s while bridging the pair of conductive members between the light emitting elements.
The depth of the shallow recess 24 q can be, for example, 30 μm to 100 μm. By doing so, when the conductive member is formed in the recess, the conductive member is unlikely to overflow out of the recess. Also, the deep recess 24s (the depth of the portion further recessed from the shallow recess) is, for example, 30 μm to
It can be 100 μm. By doing so, the conductive member having a sufficient area can be easily exposed from the mounting surface of the light emitting device.

In addition, it is preferable to set the formation area of recessed part 24a, 24b as follows. The recesses 24 a and 24 b are preferably provided from the upper surface to the upper surface of the electrode for crosslinking the recess, more preferably to the outside of the electrode facing the recess and the opposite side of the electrode in the arrangement direction of the light emitting elements 2. As a result, the contact area between the conductive member and the electrodes 2a and 2b can be sufficiently secured, and a light emitting device with good heat dissipation can be easily formed. Preferably, the deep recesses 24s between the light emitting elements 2 are formed so that the side surfaces of the adjacent light emitting elements 2 are not exposed in the arrangement direction of the light emitting elements 2. Thus, the light shielding member 24 can be present between the conductive member 23 and the light emitting element 2, and a short circuit is unlikely to occur, and a light emitting device with less light absorption by the conductive member can be easily formed. The recesses 24a and 24b are preferably formed separately from the other recess as shown in FIG. 2B. For example, one recess and the other recess
It is preferable to form at intervals of μm to 150 μm. Thereby, a pair of recessed part 24a,
The pair of conductive members formed in 24b can be insulated. Also, the recesses 24a, 24
b may be formed to the outside of the side surface of the light emitting device among the cut surfaces parallel to the side surface of the light emitting element 2 to be cut in the subsequent singulation step. Thus, the conductive member can be exposed also from the side surface of the light emitting device, and the bonding strength between the light emitting device and the mounting substrate can be increased. The recesses 24a and 24b are preferably formed on the inner side of the surface to be the upper surface of the light emitting device among cut surfaces parallel to the side surfaces of the light emitting element 2 to be cut in the subsequent singulation process.
Accordingly, it is easy to form a light emitting device with less light absorption by the adhesive when mounting on a mounting substrate.

The recesses 24a and 24b may not have different depths in one recess as described above, and may be formed with a uniform depth. For example, a pair of recesses with a depth to the top surface of the electrode can be formed. By this, it is not necessary to use a mold having a complicated shape, and thus the cost can be reduced. Further, the concave portions 24a and 24b are formed to the outside of the surface to be the upper surface of the light emitting device among the cut surfaces parallel to the side surface of the light emitting element 2 to be cut later, and the conductive member 23 is exposed also from the upper surface It may be formed to This form will be described in detail in the fifth embodiment.

As shown in FIG. 2B, the recesses 24a and 24b in which the conductive members are formed can be formed in a rectangular shape in plan view. In addition, the concave portions 24a and 24b in which the conductive members are formed may be formed in a shape that becomes wider between the light emitting elements in a plan view. For example, the planar shape of the recesses 24a and 24b may be circular, elliptical, hexagonal or the like. In this case, the light emitting device having a wide conductive member toward the mounting surface is obtained by cutting the wide portions of the pair of conductive members between the light emitting elements and the light shielding member perpendicularly to the main light emitting surface in a later step. It can be formed. Thereby, it is easy to improve the heat dissipation of the light emitting device. In addition, even if it is a recessed part of a comparatively complicated shape by planar view in this way, if a metal mold | die is used like Embodiment 2, it can form easily.

In the second embodiment, since the conductive member 23 is formed in the concave portions 24a and 24b, the material, the viscosity, and the forming method of the conductive member 23 can be freely selected. In particular, it is preferable to form by potting using a conductive paste such as Ag paste. The conductive paste such as Ag paste has a relatively low melting temperature compared to solder etc. Therefore, even when the light shielding member is formed prior to the conductive member as in the second embodiment, the discoloration or deterioration of the light shielding member Restrain the conductive member 23
Can be formed. Further, by forming the conductive member 23 by potting, the conductive member 23 can be easily supplied stepwise to the deep recess 24s and the shallow recess 24q, and the conductive member 23 can be filled into the recess without a gap. In addition, according to the printing method, the conductive member 23 can be efficiently made to the concave portion formed densely.
Can be formed.

In the second embodiment, as shown in FIG. 2F, the pair of conductive members 23a can be exposed from the mounting surface S and the back surface U (upper surface side in the manufacturing process) of the light emitting device 20. Thereby, the heat dissipation and the mountability of the light emitting device 20 can be improved. In addition, a light shielding member may be further formed on the back surface U, and the light emitting device may be formed by cutting a pair of conductive members sandwiched between the light shielding members. Thereby, the individual light emitting devices 20 can be singulated while protecting the pair of conductive members.
The steps other than the above-described steps can be substantially the same as in the first embodiment, and thus detailed description will be omitted.

The pair of concave portions are formed by the convex shape of the mold as in the second embodiment, for example,
After providing the light shielding member so as to cover the light emitting element 2, the light shielding member may be formed by removing a part of the light shielding member. This form will be described in detail in the third embodiment.

Embodiment 3
3A to 3D are schematic cross-sectional views showing the process of forming the recess of the light shielding member according to the method of manufacturing the light emitting device of the third embodiment. FIG. 3E is a schematic cross-sectional view showing the step of forming a conductive member according to the method of manufacturing a light emitting device of Embodiment 3. FIG. 3F is a schematic cross-sectional view showing a step of cutting a conductive member according to the method of manufacturing a light emitting device of Embodiment 3. Light emitting device 3 of Embodiment 3
In the manufacturing method of 0, the method of forming the pair of concave portions of the light shielding member 34 is different from that of the second embodiment. In addition, in FIG. 3A-FIG. 3F, only one recessed part 34a is illustrated in figure among a pair of recessed parts. Further, only one conductive member 33a is illustrated among the pair of conductive members.
In the third embodiment, first, as in the first and second embodiments, two light emitting elements 2 are disposed on the base 1 so as to be adjacent to each other.
Then, as shown in FIG. 3A, a light shielding member 34 covering at least the light emitting elements 2 is integrally provided.
Thereafter, as shown in FIG. 3B, the recess 34a is formed by removing a part of the light shielding member 34 by a known method such as half dicing or etching using a mask as appropriate. In particular,
In terms of versatility and processing accuracy, it is preferable to form the recess 34 a by half dicing.

Specifically, the light shielding member is formed by transfer molding, compression molding, screen printing, potting, etc., so that the two light emitting elements 2 disposed on the substrate 1 are embedded, as compared to the upper surfaces of the pair of electrodes 2a and 2b. Set up to a high position. Then, with a blade having a shape and a thickness that can form a desired concave portion, half-dicing is performed so that the light shielding member covering the upper surface of the electrode for crosslinking the conductive member and the light shielding member therebetween are continuously removed. Alternatively, half dicing is performed so that the light shielding member covering the upper surface of the electrode for crosslinking the conductive member and a part of the conductive member and the light shielding member therebetween are continuously removed. Half dicing is preferably performed to the upper side of the lower surfaces of the electrodes 2a and 2b of the light emitting element 2, for example. By this,
A part of the light blocking member and the electrode can be removed without damaging the light emitting element 2 to form the recess 34 a.

As in the third embodiment, the shallow recesses 34 q and the deep recesses 3 are used as in the third embodiment by using blades having different thicknesses.
You may provide the recessed part 34a which consists of 4s. For example, as shown in FIGS. 3A and 3B:
The thick blade 5a forms a shallow recess 34q having a width from the upper surface to the upper surface of the electrodes 2a and 2b of the two light emitting elements, and a depth from the upper surface to the lower surface of the electrodes 2a and 2b. can do. In addition, as shown in FIGS. 3C and 3D, the width from the bottom surface of the shallow recess 34q to the upper side of the main light emitting surface M with a width that does not reach the side surface of the light emitting element 2 between the light emitting elements 2 It is possible to form a deep recess 34s provided at a depth. The order in which the shallow recesses 34 q and the deep recesses 34 s are formed is not particularly limited, and the shallow recesses 34 q may be formed after the deep recesses 34 s are formed.

Except for the above-described steps, substantially the same steps as those in Embodiment 2 can be performed. Specifically, as shown in FIG. 3E, the conductive members 34a are formed, and as shown in FIG. 3F, the light emitting devices 30 are singulated. As described above, a light shielding member is further formed on the upper surface (the rear surface U of the light emitting device) of the conductive member and the light shielding member, and the light emitting device is formed by cutting a pair of conductive members sandwiched between the light shielding members. You may Thus, the light emitting devices can be singulated while protecting the pair of conductive members.

As described above, according to the method of manufacturing a light emitting device of Embodiment 3, the thickness and shape of the blade, the depth of half dicing, and the like are controlled to easily achieve the desired shape without using a mold having a complicated shape. It is possible to form a light shielding member 34 having a concave portion. Therefore, the conductive member can be formed precisely in the desired area while reducing the cost.

Fourth Embodiment
4A and 4B are schematic cross-sectional views showing steps of forming a first light shielding member according to the method of manufacturing a light emitting device of the fourth embodiment. FIG. 4C is a schematic cross-sectional view showing the step of forming a conductive member according to the method of manufacturing a light emitting device of Embodiment 4. 4C is a schematic cross-sectional view taken along the line XX 'in FIG. 4D and 4E relate to the method of manufacturing the light emitting device of Embodiment 4.
It is a schematic sectional drawing which shows the process of forming a 2nd light-shielding member. 4F and 4G are schematic cross-sectional views showing steps of cutting a conductive member according to the method of manufacturing a light emitting device of the fourth embodiment. 4A to 4G, only one conductive member 43a is illustrated among the pair of conductive members.
The method of manufacturing the light emitting device of the fourth embodiment is different from the first to third embodiments in that the light shielding member is formed a plurality of times separately.
In the fourth embodiment, first, as shown in FIG. 4B, two light emitting elements 2 each having a main light emitting surface M and a surface opposite to the main light emitting surface M and having a pair of electrodes 2a and 2b are provided. , Electrode 2a,
It arrange | positions on the base | substrate 1 so that 2b may be upward and adjacent.
Next, a first light shielding member 44a that covers at least the space between the light emitting elements is formed so that the upper surfaces of the pair of electrodes 2a and 2b are exposed. For example, as shown in FIG. 4A, the first light shielding member 44a forms a light shielding member that integrally covers the two light emitting elements 2 disposed on the base 1 so that the pair of electrodes 2a and 2b are exposed. It can be formed by removing a part of the light shielding member (and the conductive member) by cutting, polishing or the like.
Next, as shown in FIG. 4C, a pair of conductive members 43a is formed from the electrodes 2a and 2b of one light emitting element 2 to the electrodes 2a and 2b of the other light emitting element 2. At this time, each of the conductive members 43 a is the first light shielding member 44 between the light emitting elements 2 on the electrode of one of the light emitting elements 2.
a) It forms continuously on the electrode of the other light emitting element 2 on a.
Next, as shown in FIG. 4E, a second light shielding member 44b that covers the pair of conductive members 43a and the first light shielding member 44a is formed. More specifically, the second light shielding member 44b covers at least the side surface of the conductive member 43a on the upper surfaces of the first light shielding member 44a and the electrodes 2a and 2b.
Form The second light blocking member 44b is, for example, as shown in FIG. 4D, a conductive member 43a.
The light shielding member is provided to a position higher than the upper surface of the conductive layer 43, and a part of the light shielding member is removed by cutting, polishing or the like so that the upper surface of the conductive member 43a is exposed. Thereby, the light emitting device 4
The pair of conductive members 43a can also be exposed from the back surface U of zero.
Then, at least the first light shielding member 44 a and the pair of conductive members 43 between the light emitting elements 2,
The light emitting device 40 can be formed by cutting perpendicularly to the main light emitting surface M and separating into pieces. When the upper surface of the conductive member 43 is covered by the second light shielding member 44b, the pair of conductive members 43a sandwiched between the first light shielding member 44a and the second light shielding member 44b between the light emitting elements 2
May be cut perpendicularly to the main light emitting surface M. Thereby, the individual light emitting devices 40 can be singulated while protecting the pair of conductive members.
Except for the above-described steps, substantially the same steps as those of Embodiment 1 can be performed.

With such a light emitting device manufacturing method, it is easy to easily form a pair of conductive members in a desired region without requiring a mold having a complicated shape or high processing accuracy by half dicing.

FIG. 5 is a schematic plan view of FIG. 4C. In the fourth embodiment, the conductive member 43 (43a
, 43b) to bridge the electrodes 2a and 2b of the light emitting element 2 made of metal.
, 2b and the first light blocking member 44a between the light emitting elements 2 are arranged continuously. The conductive members 43a and 43b such as solder are less likely to get wet on the first light shielding member 44a made of resin as a base material, and therefore, when formed by mask printing using a conductive paste, the first light shielding member 44a
It is preferable that the conductive member 43 be continuously formed on the upper side. In the fourth embodiment, as shown in FIG. 5, the width of the conductive members 43a and 43b on the first light shielding member 44a is smaller than the width of the conductive members 43a and 43b on the electrodes 2a and 2b. Sometimes. Thereby, the space between the conductive members 43a and 43b can be sufficiently secured on the mounting surface S of the light emitting device 40, and a short circuit of the light emitting device 40 when mounted on the mounting substrate can be prevented.

Fifth Embodiment
6A and 6B are schematic plan views illustrating a method of manufacturing a light emitting device according to Embodiment 5 of the present invention. The fifth embodiment differs from the first to fourth embodiments in that a pair of three or more light emitting elements 2 is formed as a pair to form a pair of conductive members 53 (53 a, 53 b) extending over the electrodes of the light emitting elements 2.

For example, as shown in FIG. 6A, three or more light emitting elements 2 (four in the figure) are arranged in a row direction on the substrate 1 so that the electrodes 2a and 2b face upward, as one set, and adjacent A pair of conductive members 53 (53a, 53b) are formed to be continuous on the electrodes of the light emitting elements.
Then, a light shielding member covering the light emitting element 2 and the conductive member 53 is formed, and the pair of conductive members 53 and the light shielding member between at least the light emitting elements 2 are cut in the direction perpendicular to the main light emitting surface M. The light emitting device can be singulated into a side view type light emitting device in which the pair of conductive members 53 are exposed from S.
In the fifth embodiment, for example, the mounting surface S is obtained by cutting at a position indicated by a dashed line in FIG. 6A.
The pair of conductive members can also be exposed from the upper surface of the light emitting device on the opposite side, and a freely selectable light emitting device can be formed with either the upper surface or the lower surface as the mounting surface. in this case,
Among the upper and lower surfaces of the light emitting device, the mounting surface can be selected as the surface on which the left and right positions of the positive and negative terminals (the conductive members 53a and 53b connected to the positive and negative electrodes) are the same as the main light emitting surface. When disposing the two light emitting elements 2 on the substrate 1, the same poles of the respective light emitting elements 2 may be disposed so as to be adjacent (opposite) to each other.

Also, as shown in FIG. 6B, for example, one row (or column) of adjacent rows (or columns)
The light emitting elements 2 are disposed on the base 1 so that the pair of electrodes of the light emitting element 2 and the pair of electrodes of the light emitting elements 2 in the other row (or column) face each other. A conductive member 53c is formed over the four opposing electrodes.
Then, the conductive member is exposed from the mounting surface and the side surface of the light emitting device by cutting the conductive member 53c between the light emitting elements 2 and the light shielding member perpendicularly to the main light emitting surface (at the position indicated by the dashed line in the figure). A light emitting device can be formed. Accordingly, it is easy to form a light emitting device with high heat dissipation and high mountability.

In the fifth embodiment, the conductive members 53a, 53b, and 53c are formed earlier than the light shielding member. However, the present invention is not limited thereto, and a pair of recesses extending over the electrodes of three or more light emitting elements 2 is provided. A light shielding member may be formed, and a conductive member may be formed in the recess. Thus, the conductive member can be easily formed in a desired area on the electrode of the light emitting element with high accuracy.

The light emitting device according to the embodiment of the present invention may be used for various light emitting devices such as illumination light sources, light sources for various indicators, light sources for vehicles, light sources for displays, light sources for backlight of liquid crystals, light sources for sensors, and traffic lights. Can.

DESCRIPTION OF SYMBOLS 1 base 2 light emitting element 2a, 2b electrode 3 (3a, 3b), 23a, 43 (43a, 43b), 53 (53a, 53b), 53
c Conductive member 4, 24, 34, 44 Light shielding member 44a First light shielding member 44b Second light shielding member 24a, 24b, 34a Recess 24q, 34q Shallow recess 24s, 34s Deep recess 5, 5a, 5b Blade 6 Mounting substrate 7 Wavelength conversion layer 8 Light transmission layer 9 Terminal coating film 10, 20, 30, 40 Light emitting device

Claims (9)

A light emitting device having a light emitting surface, a back surface located on the opposite side of the light emitting surface, and a mounting surface located between the light emitting surface and the back surface.
Between the first main surface located on the light emitting surface side and serving as the main light emitting surface, the second main surface located opposite to the first main surface, and the first main surface and the second main surface A light emitting element having a side surface and having a first electrode and a second electrode on the second main surface;
A light shielding member that covers the side surface of the light emitting element and does not cover the first major surface of the light emitting element;
A first terminal covering film connected to the first electrode of the light emitting element and disposed across the back surface and the mounting surface;
A second terminal covering film connected to the second electrode of the light emitting element and disposed across the back surface and the mounting surface;
A first conductive member in contact with both the first electrode and the first covering member;
A second conductive member in contact with both the second electrode and the second covering member.   The light emitting device according to claim 1, wherein the conductive member is a conductive paste or a solder.   The light emitting device according to claim 1, wherein the light emitting device comprises a wavelength conversion layer including a phosphor on a first main surface of the light emitting element.   The light emitting device according to claim 3, wherein a planar shape of the wavelength conversion layer is larger than a planar shape of the light emitting element.   The light emitting device according to claim 3, wherein the light emitting device comprises a light transmitting layer on an upper surface of the wavelength conversion layer.   The light emitting device according to claim 1, wherein a thickness of the first terminal covering film and the second terminal covering film is 0.03 μm to 0.5 μm.   The light emitting device according to claim 1, wherein the light shielding member is an epoxy resin or a modified epoxy resin.   The light emitting device according to claim 1, wherein the first conductive member, the second conductive member, and the light shielding member are disposed substantially flush on a lower surface of the light emitting device. The first conductive member covers only a part of the side surface of the first electrode,
The light emitting device according to claim 1, wherein the second conductive member covers only a part of the side surface of the second electrode.