JP2010199487A - Light emitting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To make a shape, number and position of marks different, and, in addition, to propose a mark. <P>SOLUTION: The light emitting device includes a light emitting element, a substrate having a mounting part for arranging the light emitting element, and a phosphor layer having a phosphor emitting fluorescent light by absorbing light of the light emitting element. The substrate includes a conductive wire which is arranged on an upper surface with the light emitting element mounted and is connected to an electrode of the light emitting element, and a first mark formed of conductive material. The phosphor layer includes a first phosphor layer arranged on a surface of the light emitting element, and a second phosphor layer as a second mark recognized separately from the first mark, arranged with a space from the first phosphor layer. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a light emitting device in which a light emitting element is mounted on a substrate, and more particularly to a light emitting device with improved recognition of a mark provided on a substrate.

  The light emitting device includes a light emitting element, a substrate having the light emitting element disposed thereon and a conductive wiring electrically connected to the light emitting element, and a sealing member that covers the light emitting element disposed on the substrate. Yes. In addition, there has been proposed a light-emitting device that emits mixed light of light from a light-emitting element and light whose wavelength has been converted by the phosphor by including a phosphor in the sealing member.

  Here, on the substrate on which the light emitting element is arranged, a mark for accurately recognizing the position where the light emitting element is arranged, a cathode mark indicating the polarity of the electrode terminal of the light emitting device, and a molding position deviation of the sealing member are determined. Marks for various purposes, such as marks to be performed, are provided.

  For example, as shown in FIG. 8, a light emitting device 10 disclosed in Japanese Patent Application Laid-Open No. 2008-235580 includes a light emitting element 4 and a conductive wiring that arranges the light emitting element 4 and is electrically connected to the light emitting element 4. A substrate 1 having 2, 3, a conductive wire connecting the electrode of the light emitting element 4 and the conductive wirings 2, 3, a sealing member 7 covering the light emitting element 4 and the conductive wire disposed on the substrate 1, , Is composed of.

  The marks 8, 9 a, and 9 b in the light emitting device 10 are formed on the upper surface of the substrate 1 on which the light emitting element 4 is disposed, and are marks (molding) for determining the degree of deviation from the molding position of the sealing member 7. It can be used as a position deviation determination mark). Specifically, the mark 8 has an L-shape, and a plurality of marks 8 are provided so as to sandwich the sealing member 7 from both sides. By comparing the positions of these marks 8 and the sealing member 7, it can be determined whether or not the sealing member 7 has shifted from the position where molding is planned, and the distance between the mark 8 and the sealing member 7 is determined. By measuring the above, it is possible to determine how much the sealing member 7 has deviated from the position where molding is planned, and to exclude non-standard ones from the manufacturing process of the light emitting device. These marks can also be used as marks for accurately recognizing the position where the light emitting element 4 is arranged on the substrate 1.

  In addition, strip-shaped marks 9 a and 9 b are provided at both corners of the upper surface of the substrate 1 so as to be substantially parallel to the side forming the outer edge of the substrate 1. These marks 9a and 9b can be used as marks indicating division lines for dividing the aggregate substrate into individual substrates 1 in the process of manufacturing the light emitting device. Further, any one of the marks 9a at both corners of the substrate is different in shape and number from that of the other mark 9b and is provided at both corners on the back surface of the substrate 1 of the light emitting device and is not visible from the upper surface side. Which of the positive and negative electrode terminals is the negative electrode terminal can be used as a mark (cathode mark) for identifying the negative electrode terminal of the light-emitting device from the positive electrode terminal.

  The above marks can be formed of a conductive material together with the formation of a pair of positive and negative conductive wirings when the substrate 1 is formed. For example, by printing a paste-like conductive material on the surface of a ceramic green sheet made of ceramics, forming conductive wiring and marks, laminating ceramic green sheets of various shapes, and then firing, A substrate having a mark can be formed.

JP 2008-235580 A

  However, as described above, since a mark for various purposes is provided on the substrate on which the light emitting element is arranged, what is indicated by the mark only by identifying the purpose of the mark by changing the shape, number and position of the mark. However, it is difficult to judge.

  Accordingly, the present invention proposes a light-emitting device that can be used as a mark for various purposes in addition to changing the shape, number, and position of the mark, and further provides a light-emitting device with improved mark recognition.

  In order to achieve the above object, a light-emitting device according to the present invention includes a light-emitting element, a substrate having a mounting portion on which the light-emitting element is disposed, and a phosphor that emits fluorescence by absorbing light from the light-emitting element. A light emitting device comprising: a body layer; and a first mark provided on the upper surface on which the light emitting element is disposed, the conductive wiring connected to the electrode of the light emitting element, and a conductive material. The phosphor layer is disposed on the surface of the light emitting element, and is spaced from the first phosphor layer, and the first phosphor layer A second phosphor layer that is a second mark that is recognized separately from the mark.

  A light-emitting device according to the present invention is a light-emitting device including a light-emitting element, a substrate having a mounting portion on which the light-emitting element is disposed, and a phosphor that absorbs light of the light-emitting element and emits fluorescence. The substrate includes a conductive wiring connected to an electrode of the light emitting element and a first mark on an upper surface on which the light emitting element is disposed, and a part of the conductive wiring is formed on the light emitting element. A second portion is extended from the mounting portion toward the outer periphery of the substrate, the phosphor is deposited on the conductive wiring, and a part of the surface of the phosphor deposition layer is recognized separately from the first mark. It is characterized by the mark.

  The substrate includes a sealing member, and the sealing member includes a lens portion that covers the light-emitting element, and a flange portion provided on a periphery of the lens portion, and the second portion The mark is preferably covered with the collar portion.

  The conductive wiring has an extension portion extending from the light emitting element mounting portion toward the outer periphery of the substrate, and an end portion having a width larger than the extension portion, and the end portion is connected to the second mark. It is preferable that

  It is preferable that the extension portion is covered with a lens portion of the sealing member, and the end portion is covered with a flange portion of the sealing member.

  The shape of the second mark is preferably L-shaped or T-shaped.

  The phosphor preferably includes a YAG phosphor. The phosphor preferably includes a nitride-based phosphor.

  It is preferable that the first mark has substantially the same shape as the end of the second mark, and the first mark and the second mark have different observation colors.

  A method of manufacturing a light emitting device according to the present invention is a method of manufacturing a light emitting device including a light emitting element, a substrate on which the light emitting element is arranged, and a phosphor that absorbs light of the light emitting element and emits fluorescence. A first light-emitting element disposed on a substrate having a pair of positive and negative conductive wirings and a plurality of marks made of a conductive material, and any one of the marks is connected to the conductive wiring. A second step of connecting the pair of positive and negative electrodes of the light emitting element to the pair of positive and negative conductive wirings, and applying a voltage to the conductive wiring to place the charged phosphor on the surface of the conductive wiring. And a third step of depositing.

  The method for manufacturing a light emitting device according to the present invention includes a step of arranging a plurality of light emitting elements on a collective substrate, and a step of dividing the collective substrate into pieces as the mark by using the mark as a mark. It is preferable to have.

  The step of molding the sealing member that covers the light emitting element inside the plurality of marks is compared with the molding schedule of the sealing member by comparing the positions of the molded sealing member and the mark. And determining the deviation from the position.

  The light emitting element has a pair of positive and negative electrodes on the same surface side, and the first step and the second step are simultaneously performed by joining the electrodes to the conductive wiring with a conductive material. Is preferred.

  In the present invention, in addition to a mark made of a conductive material, a mark made of a fluorescent material is provided on a substrate, so that the mark recognizability can be improved and further used as a mark for various purposes.

FIG. 1 is a schematic perspective view of a light emitting device according to an embodiment of the present invention. FIG. 2 is a schematic top view of a light emitting device according to an embodiment of the present invention. 3 is a cross-sectional view in the III-III direction of FIG. 4 is a cross-sectional view in the IV-IV direction of FIG. FIG. 5 is an enlarged partial top view showing a part of the light emitting device according to the embodiment of the present invention. FIG. 6 is a schematic top view of a light emitting device according to another embodiment of the present invention. FIG. 7 is a schematic top view of a light emitting device according to another embodiment of the present invention. FIG. 8 is a schematic perspective view of a light emitting device shown as the prior art of the present invention.

  The best mode for carrying out the present invention will be described below with reference to the drawings. However, the form shown below illustrates the light emitting device for embodying the technical idea of the present invention, and the present invention does not limit the light emitting device to the following.

  Further, the present specification by no means specifies the members shown in the claims to the members of the embodiments. The dimensions, materials, shapes, relative arrangements, and the like of the components described in the embodiments are not intended to limit the scope of the present invention only to the description unless otherwise specified. It is just an example. Note that the size, positional relationship, and the like of the members shown in each drawing may be exaggerated for clarity of explanation. Further, in the following description, the same name and reference sign indicate the same or the same members, and detailed description will be omitted as appropriate. Furthermore, each element constituting the present invention may be configured such that a plurality of elements are constituted by the same member and the plurality of elements are shared by one member, and conversely, the function of one member is constituted by a plurality of members. It can also be realized by sharing.

[Light emitting device]
As shown in FIG. 1, the present invention is a phosphor including a light emitting element 11, a substrate 12 having a mounting portion on which the light emitting element 11 is disposed, and a phosphor that absorbs light from the light emitting element 11 and emits fluorescence. And a light emitting device including the layer. Regarding such a light-emitting device, in addition to making the mark different in shape, number, and position to make a mark of various purposes, a light-emitting device proposed as a mark that can be used as a mark and further improving the recognition of the target mark is proposed. In order to provide the above, the present inventor conducted various studies.

  As a result, as shown in FIG. 7, a pair of positive and negative conductive wirings 13a and 13b connected to the electrodes of the light emitting element 11 and a conductive material are provided on the upper surface of the substrate 12 on which the light emitting element 11 is disposed. The first phosphor layer is disposed on the surface of the light emitting element 11, and the first phosphor layer is spaced from the first phosphor layer. The problem has been solved by forming the second phosphor layer which is the second mark 35b recognized separately from the mark 15a.

  According to the present invention, in addition to the phosphor layer provided in the light-emitting element, a mark formed by the phosphor layer and a mark formed by a conductive material are provided, so that the recognizability depends on the presence or absence of the phosphor. And can be used as a mark for various purposes such as a cathode mark, a positional deviation determination mark for the arrangement of a sealing member and a light emitting element. For example, when the observation color of the phosphor forming the second mark is the same as the observation color of the first mark, the phosphor of the second mark is irradiated by irradiating the phosphor with excitation light from outside the light emitting device. Can be used as a mark for various purposes depending on the difference in the presence or absence of a phosphor from the first mark.

  In addition, as shown in FIG. 2, the present invention includes a light emitting element 11, a substrate 12 having a mounting portion on which the light emitting element 11 is disposed, a phosphor that absorbs light from the light emitting element 11 and emits fluorescence, The substrate 12 includes a pair of positive and negative conductive wirings 13a and 13b connected to an electrode of the light emitting element 11 and a first mark 15a on an upper surface on which the light emitting element 11 is disposed. A part of the conductive wiring 13b is extended from the mounting portion of the light emitting element 11 toward the outer periphery of the substrate 12, and the phosphor is deposited on the conductive wiring 13b. The second mark 15b is recognized separately from the first mark 15a.

  The present invention provides a mark formed by depositing a phosphor and a mark not deposited by a phosphor. Thereby, it can be used as a mark for various purposes in addition to a mark that is recognized by a difference in shape and number by giving a recognition property as a mark depending on the presence or absence of a phosphor. By electrophoretic deposition of the phosphor on the surface of the conductive wiring, the phosphor can be deposited on the pattern of the conductive wiring having a desired shape, and the second mark having the desired shape can be provided.

  As shown in FIGS. 1, 3, and 4, the light emitting device of the present invention can arrange a sealing member 14 on a substrate 12, and the sealing member 14 has a convex lens shape that covers the light emitting element 11. Lens portion 14a, and a collar portion 14b connected to the periphery of the lens portion 14a. Furthermore, it is preferable that the second mark 15 b is covered with the flange portion 14 b of the sealing member 14. Thereby, the 2nd mark 15b comprised from the deposition layer of fluorescent substance can be protected from an external environment.

  FIG. 5 is an enlarged partial top view showing the vicinity of the second mark 15b shown in FIG. As shown in FIG. 5, the conductive wiring 13b disposed on the upper surface of the substrate 12 includes extension portions B and C extending from the mounting portion of the light emitting element 11 toward the outer periphery of the substrate 12, and the extension portions B, It is preferable to have an end A that is wider than C, and that end A is the second mark 15b. Such a shape further increases the recognizability of the second mark 15b.

  Further, as shown in FIGS. 2 and 5, at least a part of the extended portions B and C of the conductive wiring 13b is covered with the lens portion 14a of the sealing member 14, and the end A of the conductive wiring 13b is sealed. It is preferable that the stopper member 14 is covered with the flange portion 15b.

  Apart from the surface of the light emitting element, extra wavelength conversion is performed by the phosphor deposited on the conductive wiring, so that the optical characteristics of the light emitting device may deteriorate, such as chromaticity varies depending on the observation direction of the light emitting device. . Therefore, the width of the conductive wiring on which the phosphor is electrophoretically deposited is narrow inside the lens part and wide outside the lens part, thereby converting the wavelength separately from the phosphor layer arranged on the surface of the light emitting element. It is possible to suppress the presence of the phosphor layer that is subjected to as much as possible, and to suppress deterioration of optical characteristics.

  The shape of the first and second marks is not particularly limited, but the second mark may be a part of the L-shaped or T-shaped shape in the conductive wiring applied to the substrate. preferable. For example, as shown in FIGS. 2 and 5, the end A of the conductive wiring 13b and the extension B of the conductive wiring 13b can be used to form a T-shaped second mark 25b. As shown, it may be an L-shaped second mark 35b.

  The more complicated the shape of the mark, the higher the recognizability, but the easier it is to form the mark. The recognizability can be easily improved by adopting the minimum shape necessary for pattern recognition of the mark shape as the mark as in this embodiment. Also, an L-shaped or T-shaped second mark under a collar portion having substantially no lens function (for example, a light-transmitting thin film with a flat surface as shown in FIGS. 3 and 4). By arranging and covering, it is possible to visually recognize the L-shape or T-shape itself on the substrate 12 as a plan view without intervening the lens action, so that the recognition as a mark can be enhanced.

  The phosphor preferably includes a YAG phosphor. The second mark can be recognized as yellow, which is the observation color of the YAG phosphor.

  The phosphor preferably includes a nitride-based phosphor. The second mark can be recognized as red, which is the observation color of the nitride phosphor. Further, by mixing the YAG phosphor and the nitride phosphor to form the phosphor layer, the observation color of the mark can be the mixed color of these phosphors.

  The first mark has substantially the same shape as the end of the second mark, and it is preferable that the observation color is different between the first mark and the second mark. Thereby, when the first mark and the second mark have the same shape, they can be easily identified by the difference in the observation color.

[Method for Manufacturing Light Emitting Device]
The present invention also relates to a method for manufacturing a light emitting device including a light emitting element, a substrate on which the light emitting element is disposed, and a phosphor that absorbs light of the light emitting element and emits fluorescence. In such a method of manufacturing a light-emitting device, in addition to making the shape, number, and position of marks different, in order to efficiently form a highly recognizable one that can be used as a mark for various purposes, Study was carried out.

  As a result, the production method of the present invention has solved the problem by having at least the following steps (1) to (3). (1) A first arrangement in which a light emitting element is disposed on a substrate having a pair of positive and negative conductive wirings and a plurality of marks provided by a conductive material, and any one of the marks is connected to the conductive wiring. (2) a second step of connecting a pair of positive and negative electrodes of a light emitting element to a pair of positive and negative conductive wirings, and (3) applying a voltage to the conductive wiring to place a charged phosphor on the surface of the conductive wiring. A third step of deposition.

  By adopting a manufacturing method having these steps, the present invention enables the phosphor to be placed on the wiring pattern having a predetermined shape in parallel with the electrophoretic deposition of the phosphor on the surface of the light emitting element or the surface of the conductive wiring. By depositing, the phosphor deposition layer can be the second mark. Therefore, the number of manufacturing steps can be reduced and a light emitting device can be efficiently formed without requiring a step of forming the second mark separately from the formation of the phosphor layer on the surface of the light emitting element. In addition, when the phosphor layer is formed by electrophoretic deposition, the phosphor is deposited only at the location where the conductive wiring is formed. Therefore, since the second mark formed by depositing the phosphor on the upper surface of the substrate can be clearly distinguished from other portions of the substrate surface, the recognizability of the second mark can be improved. it can.

  Electrophoretic deposition of the phosphor on the surface of the light emitting element or the conductive wiring can be performed by the following steps. For details on the electrophoretic deposition, refer to application publications (for example, Japanese Patent Application Laid-Open No. 2006-210491 and Japanese Patent Application Laid-Open No. 2007-134378) previously filed by the applicant of the present patent application and published.

  First, after the light emitting element is arranged on the substrate, the light emitting element and the conductive wiring are electrically connected. When the surface of the light emitting element is an insulating semiconductor growth substrate (for example, a sapphire substrate), the surface is previously coated with an aluminum metal thin film or a composite oxide (ITO) film of indium and tin. Therefore, it is necessary to provide conductivity to the surface of the light emitting element on which the phosphor is deposited.

  Next, the substrate on which the light emitting element is disposed is immersed in an electrolytic solution containing a charged phosphor. Finally, a voltage having a polarity different from the charge of the phosphor is applied to the surface of the light emitting element and the conductive wiring. Thereby, the phosphor is attracted and deposited on the surface of the light emitting element by an electric force.

  Further, the method for manufacturing a light emitting device of the present invention includes a step of arranging a plurality of light emitting elements on the collective substrate, and dividing the collective substrate using the mark as a mark to separate the light emitting device into pieces. It is preferable to have. Thereby, since the recognition property of the division | segmentation location when dividing | segmenting an aggregate substrate can be improved, each light-emitting device can be divided | segmented into an exact shape. As a method of dividing the collective substrate, for example, a method of cutting by dicing or a method of cutting by irradiating a dividing line with a laser can be used. In order to make it easy to divide the substrate, it is preferable to form grooves in advance along the dividing lines.

  In addition, a method for manufacturing a light emitting device includes a step of molding a sealing member that covers a light emitting element on the inner side surrounded by a plurality of marks, and by comparing the positions of the molded sealing member and the mark. It is preferable to have a step of determining a deviation from a planned molding position of the stop member. Thereby, the precision of the positional deviation determination of a sealing member can be improved.

  Further, in the method of manufacturing the light emitting device, the light emitting element has a pair of positive and negative electrodes on the same surface side, and the electrodes are joined to the conductive wiring with a conductive material, whereby the first step and the second step Are preferably made simultaneously. Accordingly, the number of steps is reduced, so that a light-emitting device can be formed with high productivity. Hereinafter, each constituent member in the light emitting device of this embodiment and the manufacturing method thereof will be described in detail.

(Light emitting element)
In this embodiment mode, a light-emitting device in which a light-emitting element is arranged on a substrate will be described. However, the present invention is not limited to such a mode, and the light-receiving element and other semiconductor elements (for example, the light-emitting element is protected from overvoltage). For example, a resistor, a transistor or a capacitor), or a combination of at least two of them. There may be one or more light emitting elements and other semiconductor elements.

The light-emitting element in this embodiment includes a phosphor on the surface, and has an active layer that can emit light having a wavelength capable of exciting the phosphor. As a material for forming such a light-emitting element, there may be mentioned various semiconductors such as ZnSe and GaN, short wavelength emission can nitride semiconductor capable of efficiently exciting the phosphor _{(In X Al Y Ga 1-} X _-YN , _0≤X , _0≤Y , X + Y≤1) are preferred. Various emission wavelengths can be selected depending on the material of the semiconductor layer and the degree of mixed crystal.

  When a nitride semiconductor is used as the material of the light emitting element, a material such as sapphire, spinel, SiC, Si, ZnO, or GaN is preferably used for the semiconductor growth substrate. In order to form a nitride semiconductor with good crystallinity with high productivity, it is preferable to use a sapphire substrate. A nitride semiconductor can be formed on the sapphire substrate using MOCVD or the like. Further, the semiconductor growth substrate can be removed after the semiconductor layers are stacked. Further, when the semiconductor growth substrate is, for example, an insulating semiconductor growth substrate such as a sapphire substrate, the semiconductor growth substrate is removed, and then the conductive semiconductor layer exposed on the outermost surface of the light emitting element is formed. By applying a voltage, the phosphor layer can also be formed on the surface of the light emitting element by electrophoretic deposition as described above.

  In the light-emitting device that emits white mixed-color light, the emission wavelength of the light-emitting element is preferably 400 nm to 530 nm, and more preferably 420 nm to 490 nm. In order to further improve the excitation and emission efficiency of the light emitting element and the phosphor, 450 nm or more and 475 nm or less are more preferable.

  The connection between the electrode of the light emitting element and the pair of positive and negative conductive wirings of the substrate can be made by a conductive wire, or the light emitting element is arranged so that the electrode of the light emitting element faces the conductive wiring, and gold or solder Both can be electrically and mechanically joined by a conductive material.

The conductive wire is required to have good ohmic properties, mechanical connectivity, electrical conductivity, and thermal conductivity with the electrode of the light emitting element. Preferably ^{0.01cal / (s) (cm 2} ) (℃ / cm) or higher as heat conductivity, and more preferably ^{0.5cal / (s) (cm 2} ) (℃ / cm) or more. In consideration of workability and the like, the diameter of the conductive wire is preferably Φ10 μm or more and Φ45 μm or less. Specific examples of such conductive wires include conductive wires using metals such as gold, copper, platinum, and aluminum, and alloys thereof.

  After the light emitting element is fixed to the substrate, each electrode of the light emitting element and the conductive wiring of the substrate are connected by a conductive wire. Here, the bonding material for fixing the light emitting element is not particularly limited, and includes an insulating adhesive such as an epoxy resin, a eutectic material containing Au and Sn, and a resin containing a conductive material. A conductive paste or glass can be used. Here, Ag is preferable as the conductive material contained in the conductive paste, and when an Ag paste having an Ag content of 80% to 90% is used, a light emitting device having excellent heat dissipation can be obtained.

(substrate)
The substrate of this embodiment is a member having a mounting portion on which a conductive wiring electrically connected to the light emitting element and an electrode terminal for connecting to an external electrode are arranged, and the light emitting element is arranged. In particular, on the upper surface of the substrate of this embodiment, as described above, a mark for accurately recognizing the position where the light emitting element is arranged, a cathode mark indicating the polarity of the electrode terminal of the light emitting device, and a molding of a sealing member Marks for various purposes, such as marks for determining positional deviation, are provided.

  As the substrate of this embodiment, a substrate in which conductive wiring is applied to a plate-like insulating member can be preferably used. The light emitting element is disposed on a mounting portion provided on the surface of the substrate. The mounting portion is a region having substantially the same outer shape as that of the light emitting element, and can be provided on the surface of the insulating member constituting the substrate or can be provided on the conductive wiring exposed on the surface of the substrate. Furthermore, a sealing member that covers at least the light-emitting element can be disposed on the substrate.

  Note that the shapes and positions of the conductive wirings and electrode terminals provided on the substrate are appropriately adjusted in consideration of the size and shape of the light-emitting elements arranged on the substrate, the ease of tension of the conductive wires, and the like.

  Examples of the material for the insulating member constituting the substrate include glass epoxy resin in which a glass component is contained in an epoxy resin, and ceramics.

When a high contrast is required for the light emitting device, it is preferable to make the substrate darker by adding a pigment such as Cr ₂ O ₃ , MnO ₂ , Fe ₂ O ₃ to the insulating member. Alternatively, in order to give a high light reflectance to the substrate, it is preferable to include a white pigment such as titanium dioxide in the insulating member.

  In particular, when high heat resistance and high light resistance of the light emitting device are desired, it is preferable to use ceramics as a material for the insulating member. The main material of the ceramic is preferably selected from alumina, aluminum nitride, mullite and the like. A ceramic substrate is obtained by adding a sintering aid to these main materials and sintering. For example, 90 to 96% by weight of the raw material powder is alumina, and 4 to 10% by weight of viscosity, talc, magnesia, calcia, silica and the like are added as sintering aids and sintered in a temperature range of 1500 to 1700 ° C. 40-60% by weight of ceramics and raw material powder is alumina, and 60-40% by weight of borosilicate glass, cordierite, forsterite, mullite, etc. are added as sintering aids and sintered in the temperature range of 800-1200 ° C. And ceramics. Such a ceramic substrate can take various shapes at the green sheet stage before firing. In addition, conductive wiring (or an underlying layer thereof) having various pattern shapes can be applied at the stage of the green sheet before firing. For example, by performing screen printing of a paste-like material containing tungsten, the base layer of the conductive wiring for forming the second mark and the first mark insulated from the conductive wiring can be formed. .

  After the ceramic material is fired, a plating made of silver, gold, or aluminum or a metal material on the outermost surface is disposed on the underlying layer of the conductive wiring by sputtering. Note that the outermost surface of the conductive wiring is preferably covered with a metal material having a high reflectance with respect to light from the light-emitting element. Examples of such a metal material include silver and aluminum.

(Sealing member)
The sealing member is a light-transmitting member that is provided on the substrate so as to cover at least the light-emitting element and can transmit light from the light-emitting element. For example, as shown in FIGS. 1, 3, and 4, the sealing member 14 includes a convex lens-shaped lens portion 14 a disposed on the substrate 12 so as to cover the light emitting element 11, and a peripheral edge of the lens portion 14 a. And a collar portion 14b that is disposed on the substrate 12 in a connected manner. As a method for forming the sealing member 14 on the substrate 12, various known molding techniques such as compression molding, injection molding, or transfer molding can be used.

  The material of the sealing member is not particularly limited, and, for example, a silicone resin, an epoxy resin, a urea resin, a fluororesin, and a translucent material excellent in weather resistance such as a hybrid resin containing at least one of those resins. Resin can be used. The material of the sealing member is not limited to an organic material, and an inorganic material having excellent light resistance such as glass and silica gel can also be used. Moreover, the sealing member of this form can add all members, such as a viscosity extender, a light-diffusion agent, a pigment, and fluorescent substance, according to a use. For example, a colorant corresponding to the emission color of the light emitting device can be added. Examples of the light diffusing agent include barium titanate, titanium oxide, aluminum oxide, silicon dioxide, calcium carbonate, and a mixture containing at least one of them.

  Various lens functions can be given by making the lens part 14a of a sealing member into a desired shape. Specifically, a convex lens shape, a concave lens shape, an elliptical shape as viewed from the light emission observation surface, or a shape obtained by combining a plurality of them can be used.

(Phosphor)
In the light emitting device of this embodiment, a phosphor is disposed on the surface of the light emitting element or the surface of the conductive wiring. Further, on the surface of the substrate, separately from the first mark made of the conductive material, and separately from the first phosphor layer covering the surface of the light emitting element, the second phosphor layer containing the second phosphor layer containing the phosphor. The mark is formed. These marks are formed on the surface of the conductive wiring of the substrate by electrophoretic deposition as described above, in addition to a method in which a conductive material or phosphor is mixed with another material such as a resin and printed on the surface of the substrate. Can do. Furthermore, after applying a mask having a predetermined shape, marks of various shapes can be formed by sputtering or vapor deposition.

As an example of the phosphor, the following phosphor containing a rare earth element can be given. Specifically, a garnet having at least one element selected from the group of Y, Lu, Sc, La, Gd, Tb, and Sm, and at least one element selected from the group of Al, Ga, and In (Steorite) type phosphor. In particular, the aluminum garnet phosphor includes Al and at least one element selected from Y, Lu, Sc, La, Gd, Tb, Eu, Ga, In, and Sm, and at least selected from rare earth elements. It is a phosphor activated by one element, and is a phosphor that emits light when excited by visible light or ultraviolet light emitted from a light emitting element. For example, in addition to yttrium aluminum oxide phosphor (YAG phosphor), Tb _2.95 Ce _0.05 Al ₅ O ₁₂ , Y _2.90 Ce _0.05 Tb _0.05 Al ₅ O ₁₂ , Y _2.94 Ce _0.05 Pr _0.01 Al ₅ O ₁₂ , Y _2.90 Ce _0.05 Pr _0.05 Al ₅ O _{12 and the} like. Among these, particularly in the present embodiment, two or more kinds of yttrium / aluminum oxide phosphors containing Y and activated by Ce or Pr and having different compositions are used.

In addition, the nitride-based phosphor contains N and at least one element selected from Be, Mg, Ca, Sr, Ba, and Zn, and C, Si, Ge, Sn, Ti, Zr, and Hf And a phosphor activated by at least one element selected from rare earth elements. As the nitride-based phosphor, for _{example, (Sr 0.97 Eu 0.03) 2} Si 5 N 8, (Ca 0.985 Eu 0.015) 2 Si 5 N 8, (Sr 0.679 Ca 0.291 Eu _0.03 ) ₂ Si ₅ N ₈ , and the like.

  Examples according to the present invention will be described in detail below. Needless to say, the present invention is not limited to the following examples.

  FIG. 1 is a schematic perspective view of a light emitting device 100 according to the present embodiment. FIG. 2 is a schematic top view of the light emitting device 100 of this example. 3 is a cross-sectional view in the III-III direction of FIG. 4 is a cross-sectional view in the IV-IV direction of FIG. FIG. 5 is an enlarged top view showing a part of the light emitting device 100 of the present embodiment shown in FIG.

  As shown in FIG. 1, the light emitting device 100 according to the present embodiment includes a substrate 12 on which a pair of positive and negative conductive wires 13a and 13b are arranged, a light emitting element 11 arranged on the substrate 12, and conductive wires 13a and 13b. And a phosphor layer (not shown) deposited on the surface of the light emitting element 11 and a sealing member 14 covering them.

  As shown in the sectional views of FIGS. 3 and 4, the substrate 12 is composed of conductive wiring and an insulating member. The insulating member is mainly made of alumina, and includes a first insulating layer 12a formed with a pair of positive and negative conductive wirings on the upper surface of the substrate 12, and a second insulating layer 12b below the first insulating layer 12a. The third insulating layer 12c under the second insulating layer 12b and the fourth insulating layer 12d under the third insulating layer 12c are stacked. Inner layer wiring is provided between the insulating layers (shown by a thick line in the cross-sectional view) or in the thickness direction of each insulating layer, and the pair of positive and negative conductive wirings 13a and 13b are connected to the back surface of the substrate by the inner layer wiring. That is, it is connected to a pair of positive and negative electrode terminals arranged on the back surface of the fourth insulating layer. The substrate 12 of this embodiment has a substantially rectangular parallelepiped shape, and is a square of about 3.5 mm × about 3.5 mm in size and shape when the upper surface is viewed in plan.

  The base layer and the inner layer wiring of the conductive wirings 13a and 13b are formed by printing a conductive paste mixed with copper, molybdenum and tungsten powder on a ceramic sheet material constituting the substrate and simultaneously firing it.

  Further, the first mark 15a of the present embodiment is also formed in a strip shape as shown in FIG. 2 on the surface of the ceramic sheet material that forms the upper surface of the substrate. These first marks 15a are insulated from the conductive wirings 13a and 13b. The first mark 15 a is formed so that its longitudinal direction is substantially parallel to three sides forming the outer shape of the upper surface of the substrate 12. Furthermore, electrolytic plating is applied to the underlying layer of the conductive wirings 13a and 13b so that the outermost surfaces of the conductive wirings 13a and 13b are Au.

  The light emitting element 11 of this embodiment has a pair of positive and negative electrodes on the same surface side, and these electrodes are arranged toward the pair of positive and negative conductive wirings 13a and 13b, and are electrically connected by bumps made of Au. Mechanically and mechanically joined.

  As shown in FIGS. 2, 3, and 4, a part of the pair of positive and negative conductive wirings 13 a and 13 b is formed on the upper surface of the first insulating layer 12 a constituting the substrate 12 from the mounting portion directly below the light emitting element 11. The lens portion 14a extends to the outer edge portion, and is further connected from the outer edge portion to an inner layer wiring arranged in the thickness direction of each insulating layer constituting the substrate.

  As shown in FIG. 5, the conductive wiring 13 b includes extension portions B and C that extend from the mounting portion of the light emitting element 11 toward the outer periphery of the substrate 12, and end portions that are wider than the extension portions B and C. The second mark 15b is configured by the end A and the extension B. That is, the width of the extended portions B and C of the conductive wiring is smaller than the width of the end portion A of the conductive wiring. Note that the width of the conductive wiring means a length measured in a direction (IV-IV direction in FIG. 2) perpendicular to the extending direction of the conductive wiring (III-III direction in FIGS. 2 and 5).

  More specifically, the conductive wiring 13b extends further from the outer edge portion of the lens portion 14a toward the outer periphery of the substrate 12, and is a conductor arranged in connection with the conductive wiring to the outer edge portion of the lens portion 14a. The wiring is a conductive wiring for forming a phosphor layer on which a phosphor is deposited by electrophoretic deposition and using the phosphor layer as the second mark 15b. Similar to the shape of the first mark 15a, this conductor wiring has a strip-shaped "-" shape that is substantially parallel to one side forming the upper surface outline of the substrate and a strip-shaped "|" shape that is substantially perpendicular to the side. It has a letter shape.

  The phosphor layer and the second mark 15b of the present embodiment are formed by applying a voltage having a polarity different from that of the YAG phosphor to the conductive wirings 13a and 13b of the substrate 12 so that the surface of the light emitting element and the positive and negative pairs The phosphor is deposited on the conductive wirings 13a and 13b. Note that a conductive thin film is formed on the surface of the light emitting element in advance, and the thin film is electrically connected to the pair of positive and negative conductive wirings 13a and 13b via the electrodes and bumps of the light emitting element. Thereby, the phosphor can be deposited on the surface of the light emitting element by electrophoretic deposition by applying a voltage to the pair of positive and negative conductive wirings 13a and 13b.

  The sealing member 14 of the present embodiment is formed by compression molding using a silicone resin as a material, and as shown in FIGS. 1, 3, and 4, a convex lens-shaped lens portion 14 a that covers the light emitting element 11. And a flange portion 14b formed on the upper surface of the substrate 12 by connecting to the outer edge portion of the lens portion 14a. As shown in FIG. 2, the lens portion 14a is oriented from four directions by three first marks 15a and one second mark 15b. The upper surface of the flange portion 14b is a substantially flat surface parallel to the upper surface of the substrate 12, and the size (volume) of the flange portion 14b is sufficiently smaller than the overall size of the lens portion 14a. For example, the lens portion 14a of the present embodiment is a substantially hemispherical convex lens having a radius of about 1.20 to 1.50 mm, and the collar portion 14b is a thin film having a thickness of about 50 to 100 μm. Therefore, the amount of light propagating through the collar part 14b is very small, and the lens function of the collar part 14b is so small that it can be ignored.

  As shown in FIG. 1, a first mark 15a and a second mark 15b are formed on the upper surface of the substrate 12 outside the outer edge of the lens portion 14a, and these marks are covered by the flange portion 14b. Has been.

  These marks are division lines when dicing the part of the sealing member and the substrate when determining the molding position deviation of the lens portion 14a or when separating from the collective substrate in the manufacturing process of the light emitting device 100. It can be used as a mark indicating. Further, the first mark 15a is observed in a black color, while the second mark 15b is observed in a yellow color by the YAG phosphor. 15b can be used as a cathode mark.

  As shown in FIGS. 3 and 4, the heat conductive members 16 a and 16 b made of CuW are provided on the substrate 12 of the light emitting device 100 of the present embodiment, respectively, as the second insulating layer 12 b and the third insulating layer. It is arranged in a slightly larger planar shape than the light emitting element 11 so as to penetrate the layer 12c in the thickness direction. In addition, the planar shape of the heat conductive member 16b is larger than the planar shape of the heat conductive member 16a. Furthermore, the upper surface of the heat conductive member 16a and the back surface of the heat conductive member 16b are covered with a first insulating layer 12a and a fourth insulating layer 12d, respectively. Here, the first insulating layer 12a and the fourth insulating layer 12d can insulate the pair of positive and negative conductive wires and electrode terminals, and do not impair the heat dissipation from the light emitting element to the back surface of the substrate. It is formed with a layer thickness.

  FIG. 6 is a top view of the light emitting device 200 of the present embodiment. The light emitting device is formed in the same manner as in Example 1 except that the second mark 25b of the light emitting device 200 of the present embodiment is formed as an L-shaped end portion of the conductive wirings 13a and 13b on which the phosphor is deposited. . The first mark 15a of the present embodiment is three strip-shaped marks formed so as to be substantially parallel to the three sides of the outer edge of the upper surface of the substrate 12, similarly to the first mark 15a of the first embodiment. is there. Therefore, since the second mark 25b has a different shape from the other three first marks 15a, the recognizability of the second mark 25b can be enhanced by the difference in shape and the difference due to the presence of the phosphor. it can.

  FIG. 7 is a top view of the light emitting device 300 of the present embodiment. The second mark 35b in the present embodiment is formed by printing with a resin material containing a phosphor at a location insulated from the conductive wirings 13a and 13b provided on the substrate 12. That is, the resin material containing the phosphor is printed on the surface of the insulating member constituting the substrate 12 in the same strip shape as the first mark 15a, not on the conductive wirings 13a and 13b of the substrate 12. . The phosphor layer forming the second mark 35b is formed with a space from the phosphor layer formed on the surface of the light emitting element 11 and the conductive wirings 13a and 13b.

  Otherwise, the light emitting device is formed in the same manner as in Example 1. Thereby, since the observation color of the phosphor itself can be recognized regardless of the observation color of the metal material forming the outermost surface of the conductive wiring, the recognizability of the second mark can be improved.

  The semiconductor light-emitting device of the present invention includes various devices equipped with semiconductor light-emitting elements, specifically lighting devices used for image reading devices in facsimiles, copiers, hand scanners, etc., as well as flashlights and lighting. When manufacturing semiconductor light emitting devices that can be used for various lighting devices such as light sources for light sources, LED light sources, backlight sources such as mobile phones, traffic lights, illumination switches, in-vehicle stop lamps, various sensors and various indicators It can be used easily and easily with higher accuracy.

DESCRIPTION OF SYMBOLS 100, 200, 300 ... Light-emitting device 11 ... Light-emitting element 12 ... Board | substrate 12a, 12b, 12c, 12d ... Insulating layer 13a, 13b which comprises a board | substrate ... ..Sealing member 14a ... Lens portion 14b ... Hedge portion 15a ... First mark 15b, 25b, 35b ... Second mark 16a, 16b ... Heat conductive member

Claims (13)

A light-emitting device comprising: a light-emitting element; a substrate having a mounting portion on which the light-emitting element is disposed; and a phosphor layer containing a phosphor that absorbs light of the light-emitting element and emits fluorescence.
The substrate has conductive wiring connected to the electrode of the light emitting element on the upper surface on which the light emitting element is disposed, and a first mark provided by a conductive material,
The phosphor layer is a first phosphor layer disposed on the surface of the light emitting element, a first phosphor layer disposed at a distance from the first phosphor layer, and recognized separately from the first mark. A light emitting device comprising: a second phosphor layer which is a second mark. A light-emitting device comprising: a light-emitting element; a substrate having a mounting portion on which the light-emitting element is disposed; and a phosphor that absorbs light of the light-emitting element and emits fluorescence.
The substrate has conductive wiring connected to the electrode of the light emitting element and a first mark on an upper surface on which the light emitting element is disposed,
A part of the conductive wiring is extended from the mounting portion of the light emitting element toward the outer periphery of the substrate, and a phosphor is deposited on the conductive wiring, and the deposited layer of the phosphor is connected to the first mark. And a second mark which is recognized separately.   The substrate includes a sealing member, and the sealing member includes a lens portion that covers the light emitting element, and a flange portion provided on a peripheral edge of the lens portion. The light emitting device according to claim 1, wherein the mark is covered with the flange portion.   The conductive wiring has an extension extending from the mounting portion of the light emitting element toward the outer periphery of the substrate, and an end having a width larger than the extension, and the end is connected to the second mark. The light-emitting device according to claim 2 or 3.   The light emitting device according to claim 4, wherein the extension portion is covered with a lens portion of the sealing member, and the end portion is covered with a flange portion of the sealing member.   The light emitting device according to claim 4, wherein a shape of the second mark is an L shape or a T shape.   The light emitting device according to any one of claims 1 to 6, wherein the phosphor includes a YAG phosphor.   The light-emitting device according to claim 1, wherein the phosphor includes a nitride-based phosphor.   The first mark has substantially the same shape as the second mark, and the observation color is different between the first mark and the second mark. Light emitting device. A method of manufacturing a light emitting device comprising: a light emitting element; a substrate on which the light emitting element is disposed; and a phosphor that absorbs light of the light emitting element and emits fluorescence.
A first step of disposing a light emitting element on a substrate having a pair of positive and negative conductive wirings and a plurality of marks provided by a conductive material, and any one of the marks is connected to the conductive wirings When,
A second step of connecting the pair of positive and negative electrodes of the light emitting element to the pair of positive and negative conductive wires;
And a third step of applying a voltage to the conductive wiring to deposit a charged phosphor on the surface of the conductive wiring.   The manufacturing of the light-emitting device according to claim 10, further comprising a step of arranging a plurality of light-emitting elements on the collective substrate, and dividing the collective substrate using the mark as a mark to separate the collective substrate as the light-emitting device. Method.   The step of molding a sealing member that covers the light emitting element inside the plurality of marks, and the molding schedule of the sealing member by comparing the positions of the molded sealing member and the mark The method for manufacturing a light-emitting device according to claim 10, further comprising: determining a deviation from a position.   The light-emitting element has a pair of positive and negative electrodes on the same surface side, and the first step and the second step are performed simultaneously by joining these electrodes to the conductive wiring with a conductive material. Item 13. A method for manufacturing a light emitting device according to any one of Items 10 to 12.

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