JP7174215B2 - Light-emitting device manufacturing method and light-emitting device - Google Patents

Description

The present disclosure relates to a method for manufacturing a light emitting device and a light emitting device.

2. Description of the Related Art Conventionally, a light-emitting device equipped with a light-emitting element has been used for a backlight of a liquid crystal display device or the like. In such a light-emitting device, a light-transmitting member containing phosphor is bonded onto the light-emitting element with a light-transmitting bonding member. (Patent Document 1, etc.).

JP 2013-077679 A

However, in the manufacturing method of the light emitting device of Patent Document 1, the bonding members positioned between the adjacent light emitting elements are connected to each other, and there is a possibility that the light emitting elements will move due to the stress that the bonding members attract. As a result, the mounting accuracy of the light emitting element may deteriorate.

An object of the present disclosure is to provide a method for manufacturing a light-emitting device with improved mounting accuracy of light-emitting elements, and a light-emitting device manufactured by such a method.

The manufacturing method of the light-emitting device of the present disclosure includes:
Prepare a substrate on which a plurality of light emitting elements are arranged,
a first light-transmitting layer having a first surface and a second surface located on the opposite side of the first surface; preparing a plurality of translucent members having recesses with openings larger than the planar shape of the element;
disposing the light emitting element via a bonding member in the concave portion of the translucent member;
forming a light-reflecting member covering at least a portion of the outer surface of the light-transmitting member;
It includes cutting the substrate or the light reflecting member to obtain a plurality of light emitting devices.

Further, the light-emitting device of the present disclosure is
a light emitting element;
a first light-transmitting layer having a first surface and a second surface located on the opposite side of the first surface; a translucent member having a concave portion covering the top surface and side surfaces of the element;
a bonding member positioned between the light emitting element and the translucent member;
and a light-reflecting member that covers at least a portion of the outer surface of the light-transmitting member.

Advantageous Effects of Invention According to the present disclosure, it is possible to provide a method for manufacturing a light-emitting device with improved mounting accuracy of light-emitting elements, and a light-emitting device manufactured by such a manufacturing method.

4A to 4D are schematic cross-sectional process diagrams showing a method for manufacturing the light emitting device of Embodiment 1; 4A to 4D are schematic cross-sectional process diagrams showing a method for manufacturing the light emitting device of Embodiment 1; 4A to 4D are schematic cross-sectional process diagrams showing a method for manufacturing the light emitting device of Embodiment 1; 4A to 4D are schematic cross-sectional process diagrams showing a method for manufacturing the light emitting device of Embodiment 1; 4A to 4D are schematic cross-sectional process diagrams showing a method for manufacturing the light emitting device of Embodiment 1; 4A to 4D are schematic cross-sectional process diagrams showing a method for manufacturing the light emitting device of Embodiment 1; 1 is a schematic cross-sectional view of a light-emitting device obtained by the method for manufacturing a light-emitting device of Embodiment 1. FIG. FIG. 10 is a schematic cross-sectional view of a light-emitting device obtained by the method for manufacturing a light-emitting device of Embodiment 2; It is a schematic sectional drawing which shows the modification of a translucent member. It is a schematic sectional drawing which shows the modification of a translucent member. It is a schematic sectional process drawing which shows the manufacturing method of the recessed part of a translucent member. It is a schematic sectional process drawing which shows the manufacturing method of the recessed part of a translucent member. It is a schematic sectional process drawing which shows the manufacturing method of the recessed part of a translucent member. It is a schematic sectional process drawing which shows the modification of the manufacturing method of a light-emitting device. It is a schematic sectional drawing which shows the method of arrange|positioning a translucent member to a light emitting element. 4 is a schematic cross-sectional view showing a modification of the light emitting device of Embodiment 1. FIG.

The manufacturing method of the light-emitting device and the light-emitting device described below are for embodying the technical idea of the present invention, and unless there is a specific description, the present invention is not limited to the following. Moreover, the content described in one embodiment can also be applied to other embodiments. The sizes, aspect ratios, positional relationships, etc. of members shown in each drawing may be exaggerated or omitted for clarity or ease of explanation. Moreover, in the embodiments described below, the same term "translucent member" may be used before and after singulation.

(Embodiment 1)
As shown in FIGS. 1A to 1F, the method for manufacturing the light emitting device 10 of Embodiment 1 includes preparing a substrate 2 on which a plurality of light emitting elements 1 are arranged (FIG. 1A), and forming a first surface 3a and a first surface 3a. It has a first light-transmitting layer 3 having a second surface 3b located on the opposite side, and a phosphor layer 4 disposed on the first surface 3a side, and the second surface 3b side has a planar shape of the light emitting element 1. A plurality of light-transmitting members 5 having recesses 5a each having a large opening shape are prepared (FIGS. 1B and 1C), and light-emitting elements 1 are arranged in the recesses 5a of the light-transmitting members 5 via bonding members 6. (FIG. 1D), forming a light reflecting member 7 covering at least a part of the outer surface of the translucent member 5 (FIG. 1E), and cutting the substrate 2 and the light reflecting member 7 to form a plurality of light emitting devices 10. (FIG. 1F).

According to the method for manufacturing the light-emitting device 10 of Embodiment 1, most of the bonding member 6 that bonds the light-emitting element 1 can be retained within the concave portion 5 a of the translucent member 5 . As a result, in the step of arranging a plurality of light emitting elements 1, the bonding members 6 are connected between the adjacent light emitting elements 1, and the stress of the bonding members 6 attracting each other prevents the light emitting elements 1 from moving from a predetermined position. can be effectively prevented. As a result, the mounting accuracy of the light emitting element 1 can be improved.

(Preparation of substrate 2)
First, as shown in FIG. 1A, a substrate 2 is prepared. For the substrate 2, for example, a mounting substrate having positive and negative terminals arranged on its surface can be used.
The substrate 2 can be formed of, for example, a resin film, a metal plate, a ceramic plate, or the like, or a composite. The substrate 2 may be rigid or flexible.

A plurality of light emitting elements 1 are arranged on the upper surface of the substrate 2 . Each electrode of the light emitting element 1 is connected to each positive and negative terminal of the mounting substrate by a conductive bonding material.

The light emitting element 1 has a semiconductor laminate, a first electrode and a second electrode.
In the semiconductor laminate, a first semiconductor layer (e.g., n-type semiconductor layer), a light-emitting layer, and a second semiconductor layer (e.g., p-type semiconductor layer) are stacked in this order, and the same surface side (e.g., second semiconductor layer side) surface) has both a first electrode electrically connected to the first semiconductor layer and a second electrode electrically connected to the second semiconductor layer. As a result, flip-chip mounting can be performed in which the light-emitting element 1 is opposed to and bonded to the substrate 2, which will be described later. A semiconductor laminate is usually laminated on a growth substrate, and the light-emitting device 1 may or may not have a growth substrate. The types and materials of the first semiconductor layer, the light-emitting layer, and the second semiconductor layer are not particularly limited, and examples thereof include various semiconductors such as III-V group compound semiconductors and II-VI group compound semiconductors. Specific examples include nitride-based semiconductor materials such as InxAlyGa1 _-XYN ( _0≤X , 0≤Y, _X +Y≤1). The film thickness and layer structure of each layer can be those known in the art.
The shape of the semiconductor laminate in a plan view is not particularly limited, and a rectangular shape or a shape similar thereto is preferable. The size of the semiconductor laminate in a plan view can be appropriately adjusted according to the size of the light emitting element 1 in a plan view. For example, when the light emitting element 1 is rectangular in plan view, the length in the longitudinal direction of the light emitting element 1 is 200 μm to 1500 μm, the length in the lateral direction is 50 μm to 400 μm, and the thickness is 80 μm to 200 μm. be done.

The first electrode and the second electrode can be formed of, for example, single-layer films or laminated films of metals such as Au, Pt, Pd, Rh, Ni, W, Mo, Cr, and Ti, or alloys thereof. Specifically, from the semiconductor layer side, stacked layers such as Ti/Rh/Au, W/Pt/Au, Rh/Pt/Au, W/Pt/Au, Ni/Pt/Au, Ti/Rh, etc. membranes. The film thickness may be any film thickness used in the field. Further, a layer containing a material having a higher reflectance with respect to light emitted from the light emitting layer than other materials of the electrode is arranged as a part of the electrode on the side closer to the first semiconductor layer and the second semiconductor layer, respectively. is preferred. Materials with high reflectance include layers comprising silver or silver alloys and aluminum. When using silver or a silver alloy, it is preferable to form a coating layer covering the surface (preferably, the upper surface and the end surface) in order to prevent the migration of silver. Such a coating layer may be formed of a metal or alloy that is usually used as a conductive material. be done.

In the light emitting element 1, a DBR (distributed Bragg reflector) layer or the like may be arranged on the side of the electrode arrangement surface of the semiconductor laminate within a range that does not hinder electrical connection. A DBR is, for example, a multi-layered structure in which a low refractive index layer and a high refractive index layer are laminated optionally on an underlying layer made of an oxide film or the like, and selectively reflects light of a predetermined wavelength. Specifically, by alternately laminating films having different refractive indices with a thickness of 1/4 of the wavelength, it is possible to reflect a predetermined wavelength with high efficiency. The material can include at least one oxide or nitride selected from the group consisting of Si, Ti, Zr, Nb, Ta, and Al.
The size, shape, emission wavelength, etc. of the light emitting element 1 can be appropriately selected. The plurality of light emitting elements 1 may have different sizes, shapes, emission wavelengths, etc., but are preferably the same.

It is preferable that the plurality of light emitting elements 1 be arranged regularly on the substrate 2 so that the intervals between the plurality of light emitting elements 1 in the X direction or the Y direction are approximately equal. This makes it easier to cut, which will be described later.
For example, the distance between the light emitting elements 1 in the X direction or the Y direction can be 10 μm to 1000 μm, preferably 200 μm to 800 μm.

(Preparation of Plural Translucent Members 5)
Next, a plurality of translucent members 5 are prepared. As shown in FIGS. 1B and 1C, the plurality of translucent members 5 can be prepared by preparing an aggregate of plate-like translucent members 5 and separating them into individual pieces. It is also possible to prepare a plurality of separated translucent members 5 . In the first embodiment, a method of preparing a plurality of translucent members 5 by preparing an aggregate of plate-shaped translucent members 5 and separating them into individual pieces will be mainly described. The assembly of translucent members 5 has a laminated structure of at least the first translucent layer 3 and the phosphor layer 4 . The phosphor layer 4 is laminated on one surface of the first light-transmitting layer 3 (hereinafter sometimes referred to as the first surface 3a).
The first light-transmitting layer 3 may transmit light emitted from the light-emitting element 1 described later, and preferably transmits 60% or more, 70% or 80% or more of the light.
The first light-transmitting layer 3 can be made of light-transmitting resin, glass, or the like. Examples of resins include silicone resins, silicone-modified resins, epoxy resins, phenol resins, polycarbonate resins, acrylic resins, TPX resins, polynorbornene resins, and hybrid resins containing one or more of these resins. Of these, silicone resins and epoxy resins are preferred, and silicone resins, which are particularly excellent in light resistance and heat resistance, are more preferred.

The first light-transmitting layer 3 may further contain a filler (for example, a diffusing agent, a coloring agent, a phosphor, etc.). Examples include silica, titanium oxide, zirconium oxide, magnesium oxide, magnesium carbonate, magnesium hydroxide, calcium carbonate, calcium hydroxide, calcium silicate, zinc oxide, barium titanate, aluminum oxide, iron oxide, chromium oxide, manganese oxide, and glass. , carbon black and the like. Among them, titanium oxide is preferable because it is relatively stable against moisture and the like, has a high refractive index, and has excellent thermal conductivity. The shape of the particles of the filler may be crushed, spherical, hollow, porous, or the like. The average particle diameter (median diameter) of the particles is preferably about 0.08 μm to 10 μm. Thereby, a light scattering effect can be obtained with high efficiency. It is preferable that the filler content is, for example, 10 wt % to 60 wt % with respect to the weight of the first light-transmitting layer 3 . For example, by forming a layer containing a filler in the first light-transmitting layer 3, improvement of color unevenness and reduction of tackiness of the light-emitting device can be expected. Further, when the first light-transmitting layer 3 is made of resin, by using a filler with high thermal conductivity, the thermal conductivity can be improved, and the reliability of the light-emitting device can be improved.
The thickness of the first light-transmitting layer 3 is, for example, about 5 μm to 80 μm.

The phosphor layer 4 may be made of a phosphor crystal, sintered body, or the like, or may be made of the above translucent resin, glass, or the like containing a phosphor.
Phosphors include those known in the art. For example, cerium-activated yttrium aluminum garnet (YAG) phosphors, cerium-activated lutetium aluminum garnet (LAG) phosphors, nitrogen-containing calcium aluminosilicates activated with europium and/or chromium (CaO—Al ₂ O ₃ —SiO ₂ ) phosphor, europium-activated silicate ((Sr, Ba) ₂ SiO ₄ ) phosphor, β-SiAlON phosphor, KSF phosphor (K ₂ SiF ₆ : Mn), fine semiconductor particles called quantum dot phosphors, and the like. As a result, a light-emitting device that emits a mixed color light (for example, white light) of primary light and secondary light of visible wavelengths, and a light-emitting device that emits secondary light of visible wavelengths upon being excited by primary light of ultraviolet light can be obtained. can. When the light-emitting device is used as a backlight of a liquid crystal display or the like, it is excited by the blue light emitted from the light-emitting element 1, and a red-emitting phosphor (for example, a KSF-based phosphor) and a green-emitting phosphor (for example, β-sialon phosphor) is preferably used. Thereby, the color reproduction range of the display using the light emitting device can be widened.
The shape of the phosphor may be crushed, spherical, hollow, porous, or the like.
When the phosphor is contained in a translucent resin or the like, for example, the average particle diameter (median diameter) of the phosphor is about 0.08 μm to 10 μm. The phosphor content is preferably 10 wt % to 60 wt % with respect to the weight of the phosphor layer 4 .
The thickness of the phosphor layer 4 is preferably about 80 μm to 200 μm from the viewpoint of suppressing a decrease in luminous flux while achieving desired chromaticity.

When an inorganic material such as glass or a sintered body of phosphor is used as the translucent member 5, deterioration of the translucent member 5 can be reduced, so that a highly reliable light emitting device can be obtained. Such a light-emitting device can be used, for example, as a light source for vehicle headlights.
The aggregate of the translucent member 5 should be large enough to cover the plurality of light emitting elements 1 , that is, larger than the total planar area of the plurality of light emitting elements 1 . For example, in plan view, sizes such as 20 cm×10 cm, 3 cm×3 cm, and 9 cm×6 cm can be mentioned.

As shown in FIG. 1C, the light-transmitting member 5 is provided on the side of the first light-transmitting layer 3 opposite to the surface on which the phosphor layer 4 is laminated (hereinafter sometimes referred to as the second surface 3b). A recess 5a is formed. The concave portion 5a has an opening shape larger than the planar shape of the light emitting element. The size of the opening of the concave portion 5a is preferably 10 μm to 50 μm larger than the outer edge of the light emitting element 1 or 5% to 20% larger than one side of the light emitting element 1 . This makes it easy to form the joint member 6, which will be described later, into a desired shape. For example, the bonding member 6 can be arranged not only on the top surface of the light emitting element 1 but also on the side surface of the light emitting element 1, so that the light emitted from the side surface of the light emitting element 1 can be efficiently incident on the translucent member 5 via the bonding member 6. can be done. As a result, the light extraction of the light emitting device 10 can be improved.

The shape of the inner surface of the recess 5a may be curved in a hemispherical or dome shape, or may be flat in a columnar or trapezoidal shape. Further, the shape of the inner side surface of the concave portion 5a may be perpendicular to the surface of the phosphor layer 4 of the translucent member 5, or may have an inclination. For example, the inner side surface of the recess 5a may have an inclined surface that widens toward the upper surface of the recess 5a.
In addition, it is preferable that the shape of the opening of the concave portion 5a is similar or similar to the outer edge of the light emitting element.

The depth of the concave portion 5a can be the same as the thickness of the first light-transmitting layer 3, or can be smaller than that. However, it is preferable that the depth of the concave portion 5a is, for example, 5 μm to 50 μm. As a result, the bonding member 6 can be arranged in a proper position and in an appropriate shape on the side surface of the light emitting element 1, and furthermore, since the recess 5a has a constant depth, the positioning between the recess 5a and the light emitting element 1 is made easy. easier to do.

The first light-transmitting layer 3 having the recesses 5a can have various shapes. For example, the first light-transmitting layer 3 can be a first light-transmitting layer 3X in which the first light-transmitting layer 3 is not arranged on the bottom surface of the recess 5a as shown in FIG. Thus, the first light-transmitting layer 3Y may be arranged on the bottom surface (3B, see FIG. 6) of the concave portion 5a.
The thickness (T in FIG. 1C) of the concave portion 5a located on the side surface of the light emitting element 1 may be 2 μm or more, and examples thereof range from 2 μm to 40 μm.
As the thickness T of the concave portion 5a located on the side surface of the light emitting element 1 increases, the light emitted from the side surface of the light emitting element 1 can be guided to the translucent member 5 more. can be manufactured.
The surface of the translucent member 5, including the inner surface of the recess 5a and the surface of the phosphor layer 4, may be flat or uneven.

The translucent member 5 may have at least the first translucent layer 3 and the phosphor layer 4 as described above. The translucent member 5 may be further laminated with one or more translucent layers and/or phosphor layers. For example, the light-transmitting member 5 may be a light-transmitting member 5Y having a second light-transmitting layer 8 located on the opposite side of the phosphor layer 4 from the first light-transmitting layer 3, as shown in FIG. 3B. .
The second light-transmitting layer 8 may transmit the light emitted from the light-emitting element 1, and preferably transmits 60% or more, 70% or 80% or more of the light. The second light-transmitting layer 8 can be made of, for example, light-transmitting resin, glass, or the like. As the translucent resin, the same one as that of the first translucent layer 3 can be used.
By having the second light-transmitting layer 8, the light-emitting surface can be protected from the external environment.

The translucent member 5 can be formed by compression molding, transfer molding, injection molding, spraying, printing, potting, or the like, for example, using a material obtained by mixing a liquid resin and a phosphor. Also, the translucent member 5 can be formed by impregnating a resin into a phosphor formed on a resin layer to have a substantially uniform thickness by electrophoretic deposition or the like. Thereby, for example, a sheet-shaped, film-shaped or plate-shaped translucent member 5 can be formed.
The recesses 5a in the translucent member 5 can be formed during or after the process of forming the sheet, film, or plate by these methods. For example, as shown in FIG. 4A, after laminating the first light-transmitting layer 3 and the phosphor layer 4, as shown in FIG. By pressing 9 against the surface of the first light-transmitting layer 3, recesses 5a can be formed as shown in FIG. 4C. In this case, for example, the concave portions 5a may be formed by pressing the first light-transmitting layer 3 in a semi-cured state and then curing the same.
An assembly of translucent members 5 having a plurality of recesses 5a is cut between the recesses 5a, so that a plurality of translucent members 5 to be applied to one light-emitting device can be manufactured at the same time. . This can simplify the manufacturing process.

(Joining Translucent Member 5 and Light Emitting Element 1)
As shown in FIG. 1D , the light-emitting element 1 is arranged via the bonding member 6 so that the light-emitting surface of the light-emitting element 1 is accommodated in the concave portion 5 a of the translucent member 5 .
For example, as shown in FIG. 6, the light-transmitting member 5 is sucked from the upper surface side by the suction device 12, so that the bottom surface 3B of the concave portion 5a is pushed up from below with the push-up needle 11, so that the light-emitting element 1 is exposed. Deploy. Therefore, a depression 13 caused by the thrusting needle 11 may be formed on the bottom surface 3B of the recessed portion 5a. Since the recess 13 increases the contact area of the bonding member 6 with the translucent member 5 , stronger adhesion of the translucent member 5 to the light emitting element 1 can be ensured.

The bonding member 6 preferably transmits 60% or more of the light emitted from the light emitting element 1 . Moreover, it is preferably a material that is liquid and can be cured by light, heat, or the like. Thermosetting resins such as silicone resins, silicone-modified resins, epoxy resins, and phenol resins are particularly preferably used as the joining member 6 . Also, the bonding member 6 may be added with an additive that scatters light. Thereby, the light emitted from the light emitting element 1 can be made uniform within the bonding member 6 .

For example, when the translucent member 5 is prepared, the joining member 6 can be placed in the recess 5a of the translucent member 5 . Also, the bonding member 6 can be arranged in advance on the upper surface (that is, the light emitting surface) of the light emitting element 1 .

The bonding member 6 is required to have a sufficient amount to bond the light emitting element 1 within the recess 5a of the translucent member 5, and covers part of the side surface of the light emitting element 1 inside and outside the recess 5a. It is preferable to set it as the amount obtained. Furthermore, it is more preferable to set the amount so as to cover the entire side surface of the light emitting element 1 .
In particular, in order for the bonding member 6 to be arranged on the side surface of the light emitting element 1 located in the recess 5a and on the side surface of the light emitting element 1 exposed from the recess 5a, for example, the light emitting element 1 is preferred. The pressure in this case is, for example, 0.1 Pa to several Pa. Furthermore, it is more preferable to apply heat, light, or the like to the bonding member 6 in order to harden the bonding member 6 after applying pressure. As a result, the light emitting element 1 and the translucent member 5 can be firmly fixed in place. When heat is applied, for example, 300°C or less is preferable, and 100°C to 250°C is more preferable. When light is applied, it can be, for example, 10 mJ/cm ² to 1000 mJ/cm ² .
Light emitted from the light emitting element 1 can be made uniform inside the bonding member 6 by allowing the bonding member 6 to wrap around the side surface of the light emitting element 1 appropriately, for example, by allowing the bonding member 6 to contain a diffusing agent. can. Thereby, the unevenness of the light emitted from the light emitting device 10 can be reduced. Furthermore, since the concave portion 5a can effectively prevent the bonding member 6 from adhering to the adjacent translucent member 5 and/or the light emitting element 1, strict control of the amount of the bonding member 6 becomes unnecessary. At the same time, it is possible to arrange the translucent member 5 at a suitable position on the light emitting element 1 . As a result, it is possible to omit the process of adjusting the misalignment of the arrangement after the translucent member 5 is arranged on the light emitting element 1, thereby simplifying the manufacturing process.

(Formation of light reflecting member 7)
As shown in FIG. 1E, a light-reflecting member 7 covering at least a portion of the outer surface of the translucent member 5 is formed. The light-reflecting member 7 preferably covers the surface of the bonding member 6 arranged on the side surface of the light emitting element 1 and further covers the side surface of the light emitting element 1 when exposed from the bonding member 6 . As for the coating here, it is preferable that the light reflecting member 7 and the surface of the joining member 6 or the side surface of the light emitting element 1 are in contact with each other. Furthermore, it is preferable that the light reflecting member 7 is formed on the lower surface of the light emitting element 1 . For example, the light reflective member 7 is preferably formed on the side surface of the electrode of the light emitting element 1 and partly between the light emitting element 1 and the substrate 2. It is more preferable that all of them are formed. As a result, the light emitted from the light emitting element 1 can be efficiently reflected by the light reflecting member 7 , and substantially all of the emitted light can enter the phosphor layer 4 . In addition, by covering the side surface of the light-transmitting member 5 with the light-reflecting member 7, even when a plurality of light-emitting devices 10 are arranged adjacent to each other with a short interval, the light-emitting device can be manufactured with good parting property. can do. A good parting property means that the difference in contrast between the light-emitting region and the non-light-emitting region is large.

The light reflecting member 7 is preferably made of a material capable of reflecting light emitted from the light emitting element 1 . Specifically, it can be formed by adding a light-reflecting substance to a resin material similar to the translucent resin described above. Light-reflecting substances include titanium oxide, silicon oxide, zirconium oxide, magnesium oxide, yttrium oxide, yttria-stabilized zirconia, calcium carbonate, calcium hydroxide, calcium silicate, zinc oxide, barium titanate, potassium titanate, alumina, Examples include aluminum nitride, boron nitride, and mullite. Among them, titanium oxide is preferable because it is relatively stable against moisture and the like and has a high refractive index.

The light-reflecting member 7 can be formed by die molding such as compression molding, transfer molding, or injection molding, printing, potting, or the like. Among them, compression molding and transfer molding are preferable because they are easier to use. The light reflecting member 7 is preferably formed integrally with the plurality of light emitting elements 1 , but may be formed separately for each light emitting element 1 .

When the light-reflecting member 7 is formed integrally with a plurality of light-emitting elements 1, it depends on the distance between the light-emitting elements 1 and the thickness of the material removed during cutting (for example, the thickness of the blade). After cutting, which will be described later, the thickness of the side surface of the translucent member 5 is preferably 10 μm or more, and the thickness from the side surface of the light emitting element 1 is preferably 30 μm or more, and more preferably 20 μm to 80 μm. preferable.
The light reflecting member 7 is preferably formed so as to be flush with the upper surface of the translucent member 5 joined to the light emitting surface of each light emitting element 1 . This makes it possible to avoid interference with light extraction from the light emitting surface.

For example, as shown in FIG. 5, the light reflecting member 7 is formed so as to bury the entire light emitting element 1 including the translucent member 5 , that is, to cover the upper surface of the translucent member 5 . After that, the light-reflecting member 7 arranged on the top surface of the light-transmitting member 5 is removed, and the top surface of the light-transmitting member 5 is removed so that the light-reflecting member 7 is flush with the top surface of the light-transmitting member 5 . may be exposed. The light reflecting member 7 can be removed by polishing or grinding, cutting, polishing, CMP, ultrasonic processing, laser processing, or the like.
When the upper surface of the light-transmitting member 5 is embedded with the light-reflecting member 7, as shown in FIG. is preferred. That is, using the translucent member 5Y having a three-layer structure of the phosphor layer 4, the first translucent layer 3Y, and the second translucent layer 8, the second translucent layer is formed on the side far from the light emitting surface of the light emitting element. A layer 8 is preferably placed. As a result, even if part of the light-transmitting member 5 is removed together with the light-reflecting member 7, the phosphor amount in the light-transmitting member 5 can be prevented from fluctuating, and stable light conversion can be achieved. can be ensured.

(cut)
As shown in FIG. 1F, the substrate 2 and the light reflecting member 7 are cut. Thus, the light emitting device 10 can be manufactured. Further, when the light reflecting member 7 is formed separately for each light emitting element 1, only the substrate 2 may be cut.
Cutting may be performed for each light emitting element 1 between each light emitting element 1 or for each of a plurality of light emitting elements 1 . With the latter, a light emitting device 20 having a plurality of light emitting elements 1 can be manufactured.
For this cutting, methods such as dicing, Thomson processing, ultrasonic processing, and laser processing can be used.
The cutting may be performed so as to remove the light reflecting member 7 corresponding to the space between the adjacent translucent members 5 between the adjacent translucent members 5 . Between the adjacent translucent members 5 , the light reflecting members 7 are arranged with a width smaller than the interval between the translucent members 5 so that the side surfaces of the translucent members 5 are covered with the light reflecting members 7 . is preferably removed. By covering the side surface of the translucent member 5 with the light reflecting member 7, the light leakage from the side surface of the translucent member 5 can be prevented, and the light emitting device 10 having a clearing effect can be obtained.

The light-emitting device 10 manufactured in Embodiment 1 is
It has a light-emitting element 1, a first light-transmitting layer 3 having a first surface 3a and a second surface 3b located on the opposite side of the first surface 3a, and a phosphor layer 4 disposed on the first surface 3a side. a translucent member 5 having recesses 5a covering the upper surface and side surfaces of the light emitting element 1 on the second surface 3b side; a bonding member 6 positioned between the light emitting element 1 and the translucent member 5; and a light reflecting member 7 covering at least part of the outer surface of the optical member 5 .

In the light-emitting device 10 manufactured in Embodiment 1, the light-emitting element 1 is arranged on the substrate 2 as shown in FIG. 2A.
The translucent member 5 comprises a first translucent layer 3 and a phosphor layer 4. The first translucent layer 3 has a first surface 3a and a second surface 3b located on the opposite side of the first surface 3a. and has a phosphor layer 4 on the first surface 3a side. Further, the second surface 3b side has a concave portion 5a covering the upper surface and side surface of the light emitting element 1. As shown in FIG. In the concave portion 5a of the translucent member 5, the lower surface of the concave portion 5a and the light emitting surface of the light emitting element 1 are arranged with the bonding member 6 interposed therebetween.
The shape of the opening of the concave portion 5 a is preferably larger than the planar shape of the light emitting element 1 and similar to the planar shape of the light emitting element 1 .
Moreover, the concave portion 5a only needs to cover at least a portion of the side surface of the light emitting element 1, and preferably covers substantially the entire side surface. By covering substantially the entire side surface of the light emitting element 1 with the concave portion 5a, the light emitted from the side surface of the light emitting element 1 can be more guided to the translucent member 5, and a light emitting device with high luminous efficiency can be obtained. .

Further, the translucent member 5 may have a second translucent layer 8 on the surface of the phosphor layer 4 opposite to the surface on which the first translucent layer 3 is arranged.

The bonding member 6 is arranged on the upper surface of the light emitting element 1 . The bonding member 6 is preferably arranged on a part of the side surface of the light emitting element 1 in addition to the upper surface of the light emitting element 1 , and preferably arranged on substantially the entire side surface of the light emitting element 1 . Thereby, stronger adhesion between the translucent member 5 and the light emitting element 1 can be ensured. Moreover, the light emitted from the side surface of the light emitting element 1 can be more guided to the translucent member 5 .
In addition, as shown in FIG. 2A , the bonding member 6 can be arranged on a side surface of the light emitting element 1 on which the concave portion 5 a is not arranged on the side of the light emitting element 1 . In this case, it is preferable that the joining member 6 has a concave curved surface facing the side surface of the light emitting element 1 from the second surface 3b of the translucent member 5 toward the side surface.

In the light emitting device 10 , the light reflecting member 7 covers the outer surface of the translucent member 5 , the adhesive member 6 , the side surface of the light emitting element 1 and the substrate 2 . By covering the outer surface of the light-transmitting member 5 with the light-reflecting member 7, it is possible to secure a good parting property.

A recess 13 may be further formed in the lower surface of the recess 5a. It is preferable that the recess 13 is formed in the first light-transmitting layer 3 of the light-transmitting member 5 . As a result, the contact area between the translucent member 5 and the bonding member 6 increases, and stronger adhesion of the translucent member 5 to the light emitting element 1 can be ensured.

By arranging the light-transmitting bonding member 6 as described above, for example, by including a filler in the first light-transmitting layer 3, the light emitted from the light-emitting element 1 is made uniform within the bonding member 6. can be made As a result, the luminous efficiency of the light emitting device 10 can be improved.
Further, the light-emitting device 10 having the recessed portion 5a in the translucent member 5 does not need to strictly control the amount of the bonding member 6, and can be arranged in an appropriate position and in an appropriate shape.

(Modification)
As a modification of the light emitting device 10 of Embodiment 1, as shown in FIG. 7, for example, four light emitting elements 1 and four translucent members 5 are arranged in one light emitting device 20. . In addition, the bonding member 6 positioned between the light emitting element 1 and the translucent member 5 integrally joins at least a part of the outer surface of each translucent member 5 and also joins the side surfaces of the plurality of light emitting elements 1. and a light-reflecting member 7 integrally covering the substrate. Such a light-emitting device 20 also has the same effects as the light-emitting device 10 .
Further, in the light emitting device 20 as described above, since the light reflecting member 7 is arranged between the adjacent light emitting element 1 and the light transmitting member 5, even if they are arranged close to each other, the light emitting region and a non-light-emitting region, and a good parting property can be secured.

(Embodiment 2)
The method for manufacturing the light emitting device 30 of Embodiment 2 includes the step of removing the substrate 2 after the step of forming the light reflecting member 7 and before the step of obtaining the plurality of light emitting devices 30 . As the substrate 2 used in the second embodiment, for example, a support substrate used only for arranging the light emitting elements 1 at regular intervals can be used.
For the substrate 2, a heat-resistant adhesive sheet or the like can be used as such a support substrate, or a translucent substrate can be used. As the translucent substrate, a translucent sheet such as a transparent resin sheet or a glass sheet can be used.

The process of removing the substrate 2, which is different from the manufacturing method of the first embodiment, will be mainly described below.
Note that the manufacturing method of the second embodiment is substantially the same as the manufacturing method of the first embodiment up to the step of forming the light reflecting member 7 .
(cut)
As in the manufacturing method of the light emitting device of Embodiment 1, an intermediate having the light reflecting member 7 formed thereon is prepared. After that, the light reflecting member 7 is cut so that part or all of the substrate 2 remains between the light emitting elements 1 . In other words, the plurality of light emitting devices 30 are connected by the substrate 2 because the substrate 2 is not completely cut.
(Step of removing substrate 2)
Next, the substrate 2 is removed from the intermediate to obtain a plurality of light emitting devices 30 . By cutting the substrate 2 so that part or all of it remains in the cutting step, the substrate 2 can be easily removed, many light-emitting devices 30 can be obtained by one-time removal, and the manufacturing process can be simplified. .
The light-emitting device 30 manufactured by the manufacturing method of Embodiment 2 differs from the light-emitting device 10 manufactured in Embodiment 1 in that it does not have the substrate 2, as shown in FIG. 2B. By not including the substrate 2, a thinner light-emitting device can be obtained.

REFERENCE SIGNS LIST 1 light emitting element 2 substrate 3, 3X, 3Y first translucent layer 3a first surface 3b second surface 3B bottom surface 4 phosphor layer 5, 5X, 5Y translucent member 5a concave portion 6 joining member 7 light reflecting member 8 th 2 light-transmitting layer 9 mold 9a convex portion 10, 20 light-emitting device 11 push-up needle 12 suction device 13 dent

Claims (13)

Prepare a substrate on which a plurality of light emitting elements are arranged,
a first light-transmitting layer having a first surface and a second surface located opposite to the first surface; a phosphor layer disposed on the first surface side; preparing a translucent member having a plurality of recesses having an opening shape larger than the planar shape of the light emitting element;
cutting the translucent member having a plurality of recesses between the recesses to obtain a plurality of translucent members;
disposing the light emitting element via a bonding member in each of the recesses of the translucent member;
forming a light-reflecting member covering at least a portion of the outer surface of each of the plurality of light-transmitting members;
A method for manufacturing a light-emitting device, comprising cutting the substrate or the light-reflecting member to obtain a plurality of light-emitting devices. In the step of preparing the translucent member,
2. The method of manufacturing a light-emitting device according to claim 1, wherein the recess is provided so that the shape of the opening of the recess is similar to the planar shape of the light-emitting element. 3. The method of manufacturing a light-emitting device according to claim 1, wherein the depth of said recess is lower than the height of said light-emitting element. The method of manufacturing a light-emitting device according to any one of claims 1 to 3 , wherein the light-transmitting member further comprises a second light-transmitting layer located on the opposite side of the phosphor layer to the first light-transmitting layer. . The step of forming the light reflective member includes:
a step of covering the upper surface of the light-transmitting member with the light-reflecting member;
The method of manufacturing a light-emitting device according to any one of claims 1 to 4 , further comprising: removing the light-reflecting member covering the top surface of the light-transmitting member to expose the light-transmitting member. . The step of arranging the light emitting element via the bonding member includes:
6. The method of manufacturing a light-emitting device according to claim 1 , further comprising the step of disposing the bonding member on the upper surface of each of the plurality of light-emitting elements. The step of arranging the light emitting element via the bonding member includes:
7. The method of manufacturing a light-emitting device according to claim 1 , further comprising the step of disposing the joining member in the recess. The method of manufacturing a light emitting device according to any one of claims 1 to 7 , wherein the joining member covers part of the side surface of the light emitting element. a light emitting element;
a first light-transmitting layer having a first surface and a second surface located opposite to the first surface; a phosphor layer disposed on the first surface side; a translucent member having a recess covering only a part of the upper surface and side surface of the light emitting element;
The second surface located between the light-emitting element and the light-transmitting member, and on the side surface of the light-emitting element where the recess is not arranged on the side of the light-emitting element, the second surface around the recess. a bonding member having a concave curved surface on the side surface toward the side surface where the recess is not arranged on the side of the light emitting element from the side;
and a light-reflecting member that covers at least part of the outer surface of the light-transmitting member. 10. The light emitting device according to claim 9 , wherein the joining member partially covers the side surface of the light emitting element. 11. The light emitting device according to claim 9 , wherein the translucent member further has a recess on the lower surface of the recess. The light-emitting device according to any one of claims 9 to 11 , wherein the light-transmitting member further comprises a second light-transmitting layer located on the opposite side of the phosphor layer to the first light-transmitting layer. The light-emitting device according to any one of claims 9 to 12 , further comprising a substrate on which the light-emitting element is arranged.

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