JP6634655B1 - パワーモジュール - Google Patents

パワーモジュール Download PDF

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Publication number
JP6634655B1
JP6634655B1 JP2019064549A JP2019064549A JP6634655B1 JP 6634655 B1 JP6634655 B1 JP 6634655B1 JP 2019064549 A JP2019064549 A JP 2019064549A JP 2019064549 A JP2019064549 A JP 2019064549A JP 6634655 B1 JP6634655 B1 JP 6634655B1
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JP
Japan
Prior art keywords
semiconductor element
casing
power semiconductor
sealing material
cooler
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2019064549A
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English (en)
Japanese (ja)
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JP2020167216A (ja
Inventor
英之 市田
英之 市田
廉雄 山木
廉雄 山木
誉 菅原
誉 菅原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Keihin Corp
Original Assignee
Keihin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Keihin Corp filed Critical Keihin Corp
Priority to JP2019064549A priority Critical patent/JP6634655B1/ja
Application granted granted Critical
Publication of JP6634655B1 publication Critical patent/JP6634655B1/ja
Priority to CN202010216213.3A priority patent/CN111755390A/zh
Publication of JP2020167216A publication Critical patent/JP2020167216A/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2019064549A 2019-03-28 2019-03-28 パワーモジュール Active JP6634655B1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2019064549A JP6634655B1 (ja) 2019-03-28 2019-03-28 パワーモジュール
CN202010216213.3A CN111755390A (zh) 2019-03-28 2020-03-25 功率模块

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019064549A JP6634655B1 (ja) 2019-03-28 2019-03-28 パワーモジュール

Publications (2)

Publication Number Publication Date
JP6634655B1 true JP6634655B1 (ja) 2020-01-22
JP2020167216A JP2020167216A (ja) 2020-10-08

Family

ID=69166725

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019064549A Active JP6634655B1 (ja) 2019-03-28 2019-03-28 パワーモジュール

Country Status (2)

Country Link
JP (1) JP6634655B1 (zh)
CN (1) CN111755390A (zh)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3545019B2 (ja) * 1993-11-04 2004-07-21 株式会社豊田自動織機 電子製品の封止ケース
US5977613A (en) * 1996-03-07 1999-11-02 Matsushita Electronics Corporation Electronic component, method for making the same, and lead frame and mold assembly for use therein
JP4236826B2 (ja) * 2001-04-02 2009-03-11 三菱電機株式会社 パワーモジュールおよびその製造方法
JP2004239368A (ja) * 2003-02-06 2004-08-26 Yasuhisa Seo 空気抜き器具
JP2014203978A (ja) * 2013-04-05 2014-10-27 三菱電機株式会社 パワーモジュール
JP6208980B2 (ja) * 2013-05-20 2017-10-04 カルソニックカンセイ株式会社 半導体モジュール及びその製造方法
JP6287620B2 (ja) * 2014-06-23 2018-03-07 富士電機株式会社 半導体装置およびその製造方法
CN107210279B (zh) * 2015-05-21 2019-07-19 三菱电机株式会社 电力用半导体装置

Also Published As

Publication number Publication date
CN111755390A (zh) 2020-10-09
JP2020167216A (ja) 2020-10-08

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