JP6625562B2 - 先進的金属パターニングを有する高密度スタティックランダムアクセスメモリアレイ - Google Patents
先進的金属パターニングを有する高密度スタティックランダムアクセスメモリアレイ Download PDFInfo
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- JP6625562B2 JP6625562B2 JP2016567790A JP2016567790A JP6625562B2 JP 6625562 B2 JP6625562 B2 JP 6625562B2 JP 2016567790 A JP2016567790 A JP 2016567790A JP 2016567790 A JP2016567790 A JP 2016567790A JP 6625562 B2 JP6625562 B2 JP 6625562B2
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- metal
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- metal lines
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- access memory
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B10/00—Static random access memory [SRAM] devices
- H10B10/12—Static random access memory [SRAM] devices comprising a MOSFET load element
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/83—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
- H10D62/832—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge being Group IV materials comprising two or more elements, e.g. SiGe
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
- H10D89/10—Integrated device layouts
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- Semiconductor Memories (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- General Engineering & Computer Science (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/281,710 | 2014-05-19 | ||
| US14/281,710 US9318564B2 (en) | 2014-05-19 | 2014-05-19 | High density static random access memory array having advanced metal patterning |
| PCT/US2015/026588 WO2015179050A1 (en) | 2014-05-19 | 2015-04-20 | High density static random access memory array having advanced metal patterning |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017516313A JP2017516313A (ja) | 2017-06-15 |
| JP2017516313A5 JP2017516313A5 (enExample) | 2018-05-24 |
| JP6625562B2 true JP6625562B2 (ja) | 2019-12-25 |
Family
ID=53015968
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016567790A Active JP6625562B2 (ja) | 2014-05-19 | 2015-04-20 | 先進的金属パターニングを有する高密度スタティックランダムアクセスメモリアレイ |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9318564B2 (enExample) |
| EP (1) | EP3146564B1 (enExample) |
| JP (1) | JP6625562B2 (enExample) |
| KR (1) | KR102231182B1 (enExample) |
| CN (1) | CN106463502B (enExample) |
| ES (1) | ES2875037T3 (enExample) |
| WO (1) | WO2015179050A1 (enExample) |
Families Citing this family (43)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US9029230B2 (en) | 2013-01-31 | 2015-05-12 | Taiwan Semiconductor Manufacturing Co., Ltd. | Conductive line routing for multi-patterning technology |
| DE102016114714A1 (de) | 2015-10-20 | 2017-04-20 | Taiwan Semiconductor Manufacturing Company, Ltd. | Speichervorrichtung und Verfahren zu ihrer Herstellung |
| US10411019B2 (en) * | 2015-10-20 | 2019-09-10 | Taiwan Semiconductor Manufacturing Co., Ltd. | SRAM cell word line structure with reduced RC effects |
| US9923140B2 (en) * | 2016-04-20 | 2018-03-20 | Sandisk Technologies Llc | Low power barrier modulated cell for storage class memory |
| US10217703B2 (en) * | 2017-01-03 | 2019-02-26 | Xilinx, Inc. | Circuits for and methods of implementing an inductor and a pattern ground shield in an integrated circuit |
| US10923425B2 (en) * | 2017-01-20 | 2021-02-16 | Arm Limited | Power distribution |
| US10361080B2 (en) | 2017-07-04 | 2019-07-23 | United Microelectronics Corp. | Patterning method |
| US10790395B2 (en) | 2018-06-12 | 2020-09-29 | International Business Machines Corporation | finFET with improved nitride to fin spacing |
| US10770657B2 (en) | 2018-08-14 | 2020-09-08 | Newport Fab, Llc | High reliability phase-change material (PCM) radio frequency (RF) switch using trap-rich region |
| US10686128B2 (en) | 2018-08-14 | 2020-06-16 | Newport Fab, Llc | Semiconductor devices having phase-change material (PCM) radio frequency (RF) switches and integrated passive devices |
| US10862477B2 (en) | 2018-08-14 | 2020-12-08 | Newport Fab, Llc | Read out integrated circuit (ROIC) for rapid testing of functionality of phase-change material (PCM) radio frequency (RF) switches |
| US10686010B2 (en) | 2018-08-14 | 2020-06-16 | Newport Fab, Llc | Fabrication of semiconductor device using a shared material in a phase-change material (PCM) switch region and a resonator region |
| US10566321B1 (en) | 2018-08-14 | 2020-02-18 | Newport Fab, Llc | Wafer-to-wafer and die-to-wafer bonding of phase-change material (PCM) switches with integrated circuits and bonded two-die devices |
| US10476001B1 (en) | 2018-08-14 | 2019-11-12 | Newport Fab, Llc | Manufacturing RF switch based on phase-change material |
| US10833004B2 (en) | 2018-08-14 | 2020-11-10 | Newport Fab, Llc Dba Jazz Semiconductor | Capacitive tuning circuit using RF switches with PCM capacitors and PCM contact capacitors |
| US10937960B2 (en) | 2018-08-14 | 2021-03-02 | Newport Fab, Llc | Concurrent fabrication of and structure for capacitive terminals and ohmic terminals in a phase-change material (PCM) radio frequency (RF) switch |
| US11057019B2 (en) | 2018-08-14 | 2021-07-06 | Newport Fab, Llc | Non-volatile adjustable phase shifter using non-volatile radio frequency (RF) switch |
| US10529922B1 (en) | 2018-08-14 | 2020-01-07 | Newport Fab, Llc | Substrates and heat spreaders for heat management and RF isolation in integrated semiconductor devices having phase-change material (PCM) radio frequency (RF) switches |
| US10916540B2 (en) | 2018-08-14 | 2021-02-09 | Newport Fab, Llc | Device including PCM RF switch integrated with group III-V semiconductors |
| US10454027B1 (en) | 2018-08-14 | 2019-10-22 | Newport Fab, Llc | Phase-change material (PCM) radio frequency (RF) switches with stressor layers and contact adhesion layers |
| US10944052B2 (en) | 2018-08-14 | 2021-03-09 | Newport Fab, Llc | Phase-change material (PCM) radio frequency (RF) switch using a chemically protective and thermally conductive layer |
| US10475993B1 (en) | 2018-08-14 | 2019-11-12 | Newport Fab, Llc | PCM RF switch fabrication with subtractively formed heater |
| US10862032B2 (en) | 2018-08-14 | 2020-12-08 | Newport Fab, Llc | Phase-change material (PCM) radio frequency (RF) switch |
| US10461253B1 (en) | 2018-08-14 | 2019-10-29 | Newport Fab, Llc | High reliability RF switch based on phase-change material |
| US10749109B2 (en) | 2018-08-14 | 2020-08-18 | Newport Fab, Llc | Read out integrated circuit (ROIC) for rapid testing and characterization of resistivity change of heating element in phase-change material (PCM) radio frequency (RF) switch |
| US10739290B2 (en) | 2018-08-14 | 2020-08-11 | Newport Fab, Llc | Read out integrated circuit (ROIC) for rapid testing and characterization of conductivity skew of phase-change material (PCM) in PCM radio frequency (RF) switches |
| US11159145B2 (en) | 2018-08-14 | 2021-10-26 | Newport Fab, Llc | Radio frequency (RF) filtering using phase-change material (PCM) RF switches |
| US10686130B2 (en) | 2018-08-14 | 2020-06-16 | Newport Fab, Llc | Phase-change material (PCM) contact configurations for improving performance in PCM RF switches |
| US10707125B2 (en) | 2018-08-14 | 2020-07-07 | Newport Fab, Llc | Fabrication of contacts in an RF switch having a phase-change material (PCM) and a heating element |
| US10693061B2 (en) | 2018-08-14 | 2020-06-23 | Newport Fab, Llc | Semiconductor devices having phase-change material (PCM) radio frequency (RF) switches and integrated active devices |
| US10615338B2 (en) | 2018-08-14 | 2020-04-07 | Newport Fab, Llc | Phase-change material (PCM) contacts with slot lower portions and contact dielectric for reducing parasitic capacitance and improving manufacturability in PCM RF switches |
| US10770389B2 (en) | 2018-08-14 | 2020-09-08 | Newport Fab, Llc | Phase-change material (PCM) radio frequency (RF) switches with capacitively coupled RF terminals |
| US11196401B2 (en) | 2018-08-14 | 2021-12-07 | Newport Fab, Llc | Radio frequency (RF) module using a tunable RF filter with non-volatile RF switches |
| US10916585B2 (en) * | 2018-08-14 | 2021-02-09 | Newport Fab, Llc | Stacked phase-change material (PCM) radio frequency (RF) switches with improved RF power handling |
| US10978639B2 (en) | 2018-08-14 | 2021-04-13 | Newport Fab, Llc | Circuits for reducing RF signal interference and for reducing DC power loss in phase-change material (PCM) RF switches |
| US11050022B2 (en) | 2018-08-14 | 2021-06-29 | Newport Fab, Llc | Radio frequency (RF) switches having phase-change material (PCM) and heat management for increased manufacturability and performance |
| US11521676B2 (en) * | 2020-04-30 | 2022-12-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | SRAM structure with asymmetric interconnection |
| US12080608B2 (en) | 2020-07-17 | 2024-09-03 | Synopsys, Inc. | Self-limiting manufacturing techniques to prevent electrical shorts in a complementary field effect transistor (CFET) |
| US11915984B2 (en) | 2020-07-17 | 2024-02-27 | Synopsys, Inc. | Forming a wrap-around contact to connect a source or drain epitaxial growth of a complimentary field effect transistor (CFET) to a buried power rail (BPR) of the CFET |
| US11710634B2 (en) * | 2020-07-17 | 2023-07-25 | Synopsys, Inc. | Fabrication technique for forming ultra-high density integrated circuit components |
| US11742247B2 (en) | 2020-07-17 | 2023-08-29 | Synopsys, Inc. | Epitaxial growth of source and drain materials in a complementary field effect transistor (CFET) |
| US20220302129A1 (en) * | 2021-03-10 | 2022-09-22 | Invention And Collaboration Laboratory Pte. Ltd. | SRAM Cell Structures |
| US20250220868A1 (en) * | 2024-01-03 | 2025-07-03 | Taiwan Semiconductor Manufacturing Company, Ltd. | Memory device and method of operating the same |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW317643B (enExample) * | 1996-02-23 | 1997-10-11 | Handotai Energy Kenkyusho Kk | |
| US6235560B1 (en) * | 1999-08-16 | 2001-05-22 | Agere Systems Guardian Corp. | Silicon-germanium transistor and associated methods |
| US6787469B2 (en) | 2001-12-28 | 2004-09-07 | Texas Instruments Incorporated | Double pattern and etch of poly with hard mask |
| US7927782B2 (en) | 2007-12-28 | 2011-04-19 | Texas Instruments Incorporated | Simplified double mask patterning system |
| US20090189227A1 (en) * | 2008-01-25 | 2009-07-30 | Toshiba America Electronic Components, Inc. | Structures of sram bit cells |
| US20090189198A1 (en) * | 2008-01-25 | 2009-07-30 | Toshiba America Electronic Components, Inc. | Structures of sram bit cells |
| US7879727B2 (en) | 2009-01-15 | 2011-02-01 | Infineon Technologies Ag | Method of fabricating a semiconductor device including a pattern of line segments |
| US8222698B2 (en) * | 2009-06-29 | 2012-07-17 | Analog Devices, Inc. | Bond pad with integrated transient over-voltage protection |
| US20120280324A1 (en) * | 2010-11-03 | 2012-11-08 | Texas Instruments Incorporated | Sram structure and process with improved stability |
| US10181474B2 (en) | 2011-09-19 | 2019-01-15 | Texas Instruments Incorporated | SRAM layout for double patterning |
| US9152039B2 (en) * | 2011-10-18 | 2015-10-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | Multiple patterning technology method and system for achieving minimal pattern mismatch |
| JP6087506B2 (ja) | 2012-01-31 | 2017-03-01 | キヤノン株式会社 | 描画方法及び物品の製造方法 |
| US9036404B2 (en) | 2012-03-30 | 2015-05-19 | Taiwan Semiconductor Manufacturing Company, Ltd. | Methods and apparatus for SRAM cell structure |
| US8976573B2 (en) * | 2012-04-13 | 2015-03-10 | Taiwan Semiconductor Manufacturing Company, Ltd. | Apparatus for SRAM cells |
| US8823178B2 (en) * | 2012-09-14 | 2014-09-02 | Globalfoundries Inc. | Bit cell with double patterned metal layer structures |
| US8830732B2 (en) * | 2012-11-30 | 2014-09-09 | Taiwan Semiconductor Manufacturing Company, Ltd. | SRAM cell comprising FinFETs |
| US9245595B2 (en) * | 2013-12-20 | 2016-01-26 | Nvidia Corporation | System and method for performing SRAM access assists using VSS boost |
-
2014
- 2014-05-19 US US14/281,710 patent/US9318564B2/en active Active
-
2015
- 2015-04-20 JP JP2016567790A patent/JP6625562B2/ja active Active
- 2015-04-20 CN CN201580025203.9A patent/CN106463502B/zh active Active
- 2015-04-20 ES ES15719395T patent/ES2875037T3/es active Active
- 2015-04-20 EP EP15719395.4A patent/EP3146564B1/en active Active
- 2015-04-20 WO PCT/US2015/026588 patent/WO2015179050A1/en not_active Ceased
- 2015-04-20 KR KR1020167031716A patent/KR102231182B1/ko active Active
Also Published As
| Publication number | Publication date |
|---|---|
| ES2875037T3 (es) | 2021-11-08 |
| EP3146564B1 (en) | 2021-05-26 |
| WO2015179050A1 (en) | 2015-11-26 |
| KR102231182B1 (ko) | 2021-03-22 |
| EP3146564A1 (en) | 2017-03-29 |
| CN106463502B (zh) | 2019-12-20 |
| CN106463502A (zh) | 2017-02-22 |
| KR20170005005A (ko) | 2017-01-11 |
| JP2017516313A (ja) | 2017-06-15 |
| US9318564B2 (en) | 2016-04-19 |
| US20150333131A1 (en) | 2015-11-19 |
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