JP6616302B2 - ホットスポット位置特定のためのロックインサーモグラフィ方法およびシステム - Google Patents

ホットスポット位置特定のためのロックインサーモグラフィ方法およびシステム Download PDF

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JP6616302B2
JP6616302B2 JP2016535373A JP2016535373A JP6616302B2 JP 6616302 B2 JP6616302 B2 JP 6616302B2 JP 2016535373 A JP2016535373 A JP 2016535373A JP 2016535373 A JP2016535373 A JP 2016535373A JP 6616302 B2 JP6616302 B2 JP 6616302B2
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frequency
signal
sample
phase shift
specific
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Japanese (ja)
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JP2016534344A5 (enExample
JP2016534344A (ja
Inventor
シュミット，クリスチャン
マインハルト−ヴィルディガー，ライコ
アルトマン，フランク
ナウマン，ファルク
シュランゲン，ルドルフ
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Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV
FEI EFA Inc
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Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV
DCG Systems Inc
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00—Investigating or analyzing materials by the use of thermal means
    • G01N25/72—Investigating presence of flaws
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/0066—Radiation pyrometry, e.g. infrared or optical thermometry for hot spots detection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/0096—Radiation pyrometry, e.g. infrared or optical thermometry for measuring wires, electrical contacts or electronic systems
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/309—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of printed or hybrid circuits or circuit substrates
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/311—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Pathology (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Immunology (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
  • Radiation Pyrometers (AREA)
JP2016535373A 2013-08-23 2014-05-30 ホットスポット位置特定のためのロックインサーモグラフィ方法およびシステム Active JP6616302B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP13181506.0 2013-08-23
EP13181506.0A EP2840387A1 (en) 2013-08-23 2013-08-23 Lock-in thermography method and system for hot spot localization
PCT/EP2014/061232 WO2015024679A1 (en) 2013-08-23 2014-05-30 Lock-in thermography method and system for hot spot localization

Publications (3)

Publication Number Publication Date
JP2016534344A JP2016534344A (ja) 2016-11-04
JP2016534344A5 JP2016534344A5 (enExample) 2017-08-17
JP6616302B2 true JP6616302B2 (ja) 2019-12-04

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ID=49000875

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JP2016535373A Active JP6616302B2 (ja) 2013-08-23 2014-05-30 ホットスポット位置特定のためのロックインサーモグラフィ方法およびシステム

Country Status (7)

Country Link
US (1) US20160202126A1 (enExample)
EP (1) EP2840387A1 (enExample)
JP (1) JP6616302B2 (enExample)
DE (1) DE112014003881T5 (enExample)
SG (1) SG11201600524YA (enExample)
TW (1) TWI563251B (enExample)
WO (1) WO2015024679A1 (enExample)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014218136B4 (de) * 2014-09-10 2019-07-18 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Thermographische Untersuchungseinrichtung sowie Verfahren zur zerstörungsfreien Untersuchung einer oberflächennahen Struktur an einem Prüfobjekt
CN104776918B (zh) * 2015-03-30 2018-06-08 中国人民解放军第二炮兵工程大学 一种相位提取方法
CN104916120B (zh) * 2015-06-12 2018-11-06 深圳市共进电子股份有限公司 一种智能红外发射设备的自动化生产测试系统及方法
EP3282249A1 (de) 2016-08-09 2018-02-14 Saint-Gobain Glass France Verfahren und vorrichtung zur detektion von gasen in kunststoffschichten durch lock-in-infrarotthermographie
JP2018096776A (ja) * 2016-12-12 2018-06-21 国立研究開発法人産業技術総合研究所 導電材料の内部構造、電流分布、抵抗分布を可視化する装置と方法
JP2019193417A (ja) * 2018-04-24 2019-10-31 学校法人日本大学 領域抽出装置
US10607104B1 (en) * 2019-01-31 2020-03-31 Raytheon Company System and method for detecting daytime solar glint using multi-band mid-wave infrared imagery
JP7554052B2 (ja) 2020-01-31 2024-09-19 浜松ホトニクス株式会社 半導体故障解析装置
CN111665403B (zh) * 2020-04-29 2022-12-23 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） 层叠型电子元件的失效点定位方法、装置和系统
JP7579852B2 (ja) * 2020-05-26 2024-11-08 浜松ホトニクス株式会社 半導体デバイス検査方法及び半導体デバイス検査装置
CN115667955A (zh) * 2020-05-26 2023-01-31 浜松光子学株式会社 半导体器件检查方法及半导体器件检查装置
CN111898333B (zh) * 2020-06-24 2021-12-10 北京智芯仿真科技有限公司 集成电路频率响应频率点提取与响应曲线计算方法及装置
ES2932781A1 (es) * 2021-07-19 2023-01-25 Consejo Superior Investigacion Metodo para la medida cuantitativa de temperatura
US20250076231A1 (en) * 2022-03-15 2025-03-06 Nippon Telegraph And Telephone Corporation Monitoring device
CN114858285A (zh) * 2022-04-02 2022-08-05 电子科技大学 一种线性调频红外无损检测系统
CN115541653A (zh) * 2022-12-02 2022-12-30 山东大学 一种3d系统级封装器件的缺陷定位方法及系统
CN117538378B (zh) * 2023-11-24 2024-06-28 山东大学 一种基于方波热源的锁相热成像缺陷快速检测方法
CN119290952A (zh) * 2024-08-29 2025-01-10 北京微电子技术研究所 一种叠层封装半导体器件缺陷检测与定位方法、系统
CN119827576B (zh) * 2024-11-25 2025-10-17 江苏大学 一种基于调频式红外热成像检测复合材料内部缺陷深度的方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4792683A (en) * 1987-01-16 1988-12-20 Hughes Aircraft Company Thermal technique for simultaneous testing of circuit board solder joints
JP2758488B2 (ja) * 1990-07-25 1998-05-28 周次 仲田 電子部品の接合部検査装置
DE19837889C1 (de) * 1998-08-20 2000-12-21 Siemens Ag Thermowellen-Meßverfahren
US6394646B1 (en) * 1999-04-16 2002-05-28 General Electric Company Method and apparatus for quantitative nondestructive evaluation of metal airfoils using high resolution transient thermography
US7709794B2 (en) * 2008-02-05 2010-05-04 Kla-Tencor Corporation Defect detection using time delay lock-in thermography (LIT) and dark field LIT
JP5631484B2 (ja) * 2010-06-08 2014-11-26 ディーシージー システムズ、 インコーポライテッドＤｃｇ Ｓｙｓｔｅｍｓ Ｉｎｃ． ３次元ホットスポット位置特定
EP2444795A1 (en) * 2010-10-22 2012-04-25 DCG Systems, Inc. Lock in thermal laser stimulation through one side of the device while acquiring lock-in thermal emission images on the opposite side

Also Published As

Publication number Publication date
DE112014003881T5 (de) 2016-05-12
US20160202126A1 (en) 2016-07-14
SG11201600524YA (en) 2016-02-26
TW201514482A (zh) 2015-04-16
EP2840387A1 (en) 2015-02-25
TWI563251B (en) 2016-12-21
WO2015024679A1 (en) 2015-02-26
JP2016534344A (ja) 2016-11-04

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