SG11201600524YA - Lock-in thermography method and system for hot spot localization - Google Patents

Lock-in thermography method and system for hot spot localization

Info

Publication number
SG11201600524YA
SG11201600524YA SG11201600524YA SG11201600524YA SG11201600524YA SG 11201600524Y A SG11201600524Y A SG 11201600524YA SG 11201600524Y A SG11201600524Y A SG 11201600524YA SG 11201600524Y A SG11201600524Y A SG 11201600524YA SG 11201600524Y A SG11201600524Y A SG 11201600524YA
Authority
SG
Singapore
Prior art keywords
lock
hot spot
thermography method
spot localization
localization
Prior art date
Application number
SG11201600524YA
Inventor
Christian Schmidt
Raiko Meinhardt-Wildegger
Frank Altmann
Falk Naumann
Rudolf Schlangen
Original Assignee
Dcg Systems Inc
Fraunhofer Ges Forschung
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dcg Systems Inc, Fraunhofer Ges Forschung filed Critical Dcg Systems Inc
Publication of SG11201600524YA publication Critical patent/SG11201600524YA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00—Investigating or analyzing materials by the use of thermal means
    • G01N25/72—Investigating presence of flaws
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/0066—Radiation pyrometry, e.g. infrared or optical thermometry for hot spots detection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/0096—Radiation pyrometry, e.g. infrared or optical thermometry for measuring wires, electrical contacts or electronic systems
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/309—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of printed or hybrid circuits or circuit substrates
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/311—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits
SG11201600524YA 2013-08-23 2014-05-30 Lock-in thermography method and system for hot spot localization SG11201600524YA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP13181506.0A EP2840387A1 (en) 2013-08-23 2013-08-23 Lock-in thermography method and system for hot spot localization
PCT/EP2014/061232 WO2015024679A1 (en) 2013-08-23 2014-05-30 Lock-in thermography method and system for hot spot localization

Publications (1)

Publication Number Publication Date
SG11201600524YA true SG11201600524YA (en) 2016-02-26

Family

ID=49000875

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201600524YA SG11201600524YA (en) 2013-08-23 2014-05-30 Lock-in thermography method and system for hot spot localization

Country Status (7)

Country Link
US (1) US20160202126A1 (en)
EP (1) EP2840387A1 (en)
JP (1) JP6616302B2 (en)
DE (1) DE112014003881T5 (en)
SG (1) SG11201600524YA (en)
TW (1) TWI563251B (en)
WO (1) WO2015024679A1 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014218136B4 (en) * 2014-09-10 2019-07-18 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Thermographic examination device and method for the non-destructive examination of a near-surface structure on a test object
CN104776918B (en) * 2015-03-30 2018-06-08 中国人民解放军第二炮兵工程大学 A kind of phase extraction method
CN104916120B (en) * 2015-06-12 2018-11-06 深圳市共进电子股份有限公司 A kind of automated production test system and method for intelligent infrared transmitting equipment
EP3282249A1 (en) 2016-08-09 2018-02-14 Saint-Gobain Glass France Method and device for detection of gases in plastic coatings by lock-in infrared thermography
JP2018096776A (en) * 2016-12-12 2018-06-21 国立研究開発法人産業技術総合研究所 Device and method for visualizing internal structure, current distribution, and resistance distribution of conductive material
JP2019193417A (en) * 2018-04-24 2019-10-31 学校法人日本大学 Area extraction device
US10607104B1 (en) * 2019-01-31 2020-03-31 Raytheon Company System and method for detecting daytime solar glint using multi-band mid-wave infrared imagery
JP2021121785A (en) * 2020-01-31 2021-08-26 浜松ホトニクス株式会社 Semiconductor failure analyzer
CN111665403B (en) * 2020-04-29 2022-12-23 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） Failure point positioning method, device and system for laminated electronic component
US20230184825A1 (en) * 2020-05-26 2023-06-15 Hamamatsu Photonics K.K. Semiconductor device inspection method and semiconductor device inspection device
US20230184827A1 (en) * 2020-05-26 2023-06-15 Hamamatsu Photonics K.K. Semiconductor device inspection method and semiconductor device inspection apparatus
CN111898333B (en) * 2020-06-24 2021-12-10 北京智芯仿真科技有限公司 Method and device for extracting frequency response frequency points and calculating response curve of integrated circuit
ES2932781A1 (en) * 2021-07-19 2023-01-25 Consejo Superior Investigacion MÉTODO PARA LA MEDIDA CUANTITATIVA DE TEMPERATURA (Machine-translation by Google Translate, not legally binding)
WO2023175710A1 (en) * 2022-03-15 2023-09-21 日本電信電話株式会社 Observation device
CN114858285A (en) * 2022-04-02 2022-08-05 电子科技大学 Linear frequency modulation infrared nondestructive testing system
CN115541653A (en) * 2022-12-02 2022-12-30 山东大学 Defect positioning method and system for 3D system-in-package device
CN117538378A (en) * 2023-11-24 2024-02-09 山东大学 Phase-locked thermal imaging defect rapid detection method based on square wave heat source

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4792683A (en) * 1987-01-16 1988-12-20 Hughes Aircraft Company Thermal technique for simultaneous testing of circuit board solder joints
JP2758488B2 (en) * 1990-07-25 1998-05-28 周次 仲田 Electronic component joint inspection system
DE19837889C1 (en) * 1998-08-20 2000-12-21 Siemens Ag Thermowave measuring method
US6394646B1 (en) * 1999-04-16 2002-05-28 General Electric Company Method and apparatus for quantitative nondestructive evaluation of metal airfoils using high resolution transient thermography
US7709794B2 (en) * 2008-02-05 2010-05-04 Kla-Tencor Corporation Defect detection using time delay lock-in thermography (LIT) and dark field LIT
KR101716104B1 (en) * 2010-06-08 2017-03-14 디씨지 시스템스 인코포레이티드 Three-dimensional hot spot localization
EP2444795A1 (en) * 2010-10-22 2012-04-25 DCG Systems, Inc. Lock in thermal laser stimulation through one side of the device while acquiring lock-in thermal emission images on the opposite side

Also Published As

Publication number Publication date
US20160202126A1 (en) 2016-07-14
TW201514482A (en) 2015-04-16
JP2016534344A (en) 2016-11-04
JP6616302B2 (en) 2019-12-04
WO2015024679A1 (en) 2015-02-26
DE112014003881T5 (en) 2016-05-12
EP2840387A1 (en) 2015-02-25
TWI563251B (en) 2016-12-21

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