JP6615701B2 - 配線基板、半導体装置及び配線基板の製造方法 - Google Patents

配線基板、半導体装置及び配線基板の製造方法 Download PDF

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JP6615701B2
JP6615701B2 JP2016125463A JP2016125463A JP6615701B2 JP 6615701 B2 JP6615701 B2 JP 6615701B2 JP 2016125463 A JP2016125463 A JP 2016125463A JP 2016125463 A JP2016125463 A JP 2016125463A JP 6615701 B2 JP6615701 B2 JP 6615701B2
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insulating layer
layer
metal film
wiring
recess
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JP2017228719A5 (enExample
JP2017228719A (ja
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晃輔 塚本
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Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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Priority to US15/627,542 priority patent/US10396024B2/en
Publication of JP2017228719A publication Critical patent/JP2017228719A/ja
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    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15313—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a land array, e.g. LGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3512—Cracking

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Geometry (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Wire Bonding (AREA)
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JP7202784B2 (ja) * 2018-04-27 2023-01-12 新光電気工業株式会社 配線基板、半導体装置及び配線基板の製造方法
US10573583B2 (en) 2018-06-20 2020-02-25 Texas Instruments Incorporated Semiconductor device package with grooved substrate
KR102145203B1 (ko) * 2018-07-19 2020-08-18 삼성전자주식회사 팬-아웃 반도체 패키지
JP7240909B2 (ja) * 2019-03-13 2023-03-16 新光電気工業株式会社 配線基板及びその製造方法
CN112205082B (zh) * 2019-04-23 2022-08-09 庆鼎精密电子（淮安）有限公司 电路板及其制作方法
US10950531B2 (en) * 2019-05-30 2021-03-16 Advanced Semiconductor Engineering, Inc. Semiconductor device package and method of manufacturing the same
JP2021093417A (ja) * 2019-12-09 2021-06-17 イビデン株式会社 プリント配線板、及び、プリント配線板の製造方法
CN113517209A (zh) * 2020-04-10 2021-10-19 长鑫存储技术有限公司 半导体结构及其形成方法
KR102881008B1 (ko) * 2020-12-16 2025-11-04 삼성전기주식회사 인쇄회로기판 및 전자부품 패키지
JP7700986B2 (ja) 2021-10-19 2025-07-01 新光電気工業株式会社 配線基板及びその製造方法
US12119319B2 (en) * 2021-12-13 2024-10-15 Amkor Technology Singapore Holding Pte. Ltd. Electronic devices and methods of manufacturing electronic devices
EP4535420A1 (en) * 2023-10-06 2025-04-09 Imec VZW A semiconductor component comprising structured contacts and a method for producing the component

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