JP6596653B2 - Component mounting apparatus, component mounting method, and component mounting system - Google Patents

Description

  The present invention relates to a component mounting apparatus, a component mounting method, and a component mounting system for stacking semiconductor chips each having a connection electrode formed on a substrate.

  In the field of manufacturing electronic devices, a component mounting operation for mounting a semiconductor chip on a workpiece such as a substrate is performed. In this component mounting operation, a transfer operation in which a semiconductor chip on which connection electrodes such as solder bumps and through electrodes are formed is taken out from the component supply unit and transferred to the substrate, and the connection electrodes of the mounted semiconductor chip are transferred to the substrate. The crimping operation for joining to the circuit electrode is performed. In recent years, with the progress of miniaturization and higher functionality of electronic devices, it is required to further increase the mounting density of a mounting board incorporated in the electronic device. In order to cope with such high-density mounting, so-called stack mounting in which a plurality of semiconductor chips are stacked and mounted has been adopted.

  In Patent Document 1, a chip stack is manufactured in which a plurality of thinly polished semiconductor chips are stacked and temporarily bonded. And the component mounting operation | work which carries out the main crimping | compression-bonding of the chip | tip laminated body of several places collectively from the upper part with a load tool is performed.

JP 2012-2222038 A

  However, if there are variations in the height of the plurality of chip laminates, connection failure may occur when performing final pressure bonding in a lump.

  Accordingly, an object of the present invention is to provide a component mounting apparatus, a component mounting method, and a component mounting system that can suppress the occurrence of poor connection of stacked semiconductor chips.

A component mounting apparatus according to the present invention forms a chip data storage unit that stores data relating to the thickness of a chip, and a chip stack in which the chips are stacked by mounting chips at a plurality of mounting points set on a workpiece. A mounting section; and a thickness acquisition means for acquiring a thickness of the mounting point that is the sum of the thickness of the workpiece at the mounting point and the thickness of the chip already mounted at the mounting point. The portion is based on the thickness of the mounting point, and the thickness of the mounting point when a next chip is mounted on the chip already mounted at the mounting point satisfies the predetermined condition at the plurality of mounting points. The next chip selected to be mounted is mounted on the mounting point, and the predetermined condition is that a difference in thickness of the mounting point between at least two mounting points selected from the plurality of mounting points Is a predetermined range.
Another component mounting apparatus according to the present invention includes a chip data storage unit that stores data relating to the thickness of a chip, and a chip stacked body in which the chips are stacked at a plurality of mounting points set on a workpiece. A mounting portion to be formed, and a thickness acquisition means for acquiring a thickness of the mounting point that is the sum of the thickness of the workpiece at the mounting point and the thickness of the chip already mounted at the mounting point, The mounting portion has a predetermined thickness at the plurality of mounting points when the next chip is mounted on a chip already mounted at the mounting point based on the thickness of the mounting point. The next chip selected to be a condition is mounted on the mounting point, and the predetermined condition is that the thickness of the mounting point of at least two mounting points selected from the plurality of mounting points is each with a predetermined range

The component mounting method of the present invention includes a first mounting step of mounting a chip on a plurality of mounting points set on a workpiece, and the thickness of the workpiece at the mounting point and the thickness of the chip mounted on the mounting point. A step of acquiring the thickness of the mounting point which is the sum, and when the next chip is further mounted on the chip mounted in the first mounting step based on the acquired thickness of the mounting point A second mounting step of mounting the next chip selected so that the thickness of the mounting point is a predetermined condition at the plurality of mounting points, and the mounting points include the second mounting step. A chip stacked body in which chips are stacked is formed, and the predetermined condition is that a difference in thickness of the mounting points between at least two mounting points selected from the plurality of mounting points is within a predetermined range. .
Another component mounting method of the present invention includes a first mounting step of mounting a chip on a plurality of mounting points set on a workpiece, the thickness of the workpiece at the mounting point, and the thickness of the chip mounted on the mounting point. And a step of acquiring the thickness of the mounting point which is the sum of the above and the next chip is mounted on the chip mounted in the first mounting step based on the acquired thickness of the mounting point. A second mounting step of mounting the next chip selected so that the thickness of the mounting point at the time satisfies a predetermined condition at the plurality of mounting points, and the plurality of mounting points The chip stack is formed by laminating the chips, and the predetermined condition is that the thicknesses of the mounting points of at least two mounting points selected from the plurality of mounting points are within a predetermined range, respectively. .

The component mounting system according to the present invention includes a mounting unit that mounts chips at a plurality of mounting points set on a workpiece to form a chip stack in which the chips are stacked, and a thickness of the workpiece at the mounting points. A component mounting apparatus having a thickness acquisition unit that acquires a thickness of a mounting point that is the sum of the thicknesses of the chips and a chip data storage unit that stores data relating to the thickness of the chip, and the mounting The portion is based on the thickness of the mounting point acquired by the thickness acquisition means, and the thickness of the mounting point when the next chip is further mounted on the already mounted chip is the plurality. The next chip selected to satisfy a predetermined condition at the mounting point is mounted on the mounting point, and the predetermined condition is between at least two mounting points selected from the plurality of mounting points. The fruit Difference in thickness of the point is in a predetermined range.
Another component mounting system according to the present invention includes a mounting unit that forms a chip stack in which chips are stacked by mounting chips at a plurality of mounting points set on a work, and the thickness of the work at the mounting points. A component mounting apparatus having a thickness acquisition unit that acquires a thickness of a mounting point that is the sum of the thicknesses of mounted chips, and a chip data storage unit that stores data relating to the thickness of the chip; Based on the thickness of the mounting point acquired by the thickness acquisition means, the mounting portion has a thickness of the mounting point when a next chip is further mounted on the already mounted chip. The next chip selected so as to satisfy a predetermined condition at the plurality of mounting points is mounted on the mounting point, and the predetermined condition includes at least two mounting points selected from the plurality of mounting points. Of the above The thickness of the loading is within a predetermined range, respectively.

  According to the present invention, it is possible to suppress the occurrence of poor connection of stacked semiconductor chips.

Configuration explanatory diagram of a component mounting system according to an embodiment of the present invention Explanatory drawing of the chip laminated body formed by the component mounting system of one embodiment of this invention The perspective view of the component mounting apparatus of one embodiment of this invention The principal part front view of the component mounting apparatus of one embodiment of this invention Explanatory drawing of the component storage part with which the component mounting apparatus of one embodiment of this invention is equipped, and a component supply stage (A) The figure which shows the some chip | tip C which divided | segmented the semiconductor wafer supplied to component mounting system of one embodiment of this invention (b) The figure which shows an example of the chip data which a component mounting system memorize | stores The block diagram which shows the control system of the component mounting system of one embodiment of this invention Flow chart of component mounting work by component mounting system of one embodiment of the present invention (A) An explanatory diagram of a substrate on which a chip is mounted by the component mounting device M1 in a component mounting operation by the component mounting system of one embodiment of the present invention (b) an explanatory diagram of a substrate on which a chip is mounted by the component mounting device M2

  Next, embodiments of the present invention will be described with reference to the drawings. First, a component mounting system will be described with reference to FIG. In FIG. 1, the component mounting system 1 has a function of manufacturing a chip stack S by mounting a semiconductor chip (hereinafter referred to as “chip C”) on a substrate 4. The component mounting system 1 has a configuration in which component mounting apparatuses M1 to M3 are connected and connected by a communication network 2, and the whole is controlled by a management computer 3. The component mounting apparatuses M <b> 1 to M <b> 3 perform a component mounting operation in which the chip C is taken out from the divided semiconductor wafer and transferred and mounted on the mounting point of the substrate 4.

  In FIG. 1, the substrate 4 is composed of a plurality of individual substrates 4a having LSIs and connection wirings formed on the upper surface. The substrate 4 carried into the component mounting system 1 is conveyed in the order of the component mounting device M1, the component mounting device M2, and the component mounting device M3, and the chip stack is mounted on each individual substrate 4a by stacking the chips C. S is formed. Thereafter, the plurality of chip laminated bodies S on the substrate 4 are collectively pressure-bonded by a main pressure bonding apparatus (not shown), and a bond is formed between the connection electrodes of each chip C of the chip laminated body S. Subsequently, the board | substrate 4 is divided | segmented into the piece board | substrate 4a, and becomes individual chip laminated body S. FIG.

  FIG. 2 shows an example of the chip stack S formed on the substrate 4. In the substrate 4, a chip stack S (S *) in which four chips C (C1 * to C4 *) are respectively stacked is formed at the mounting points 4b set on the plurality of individual substrates 4a. Each chip C is provided with connection electrodes such as solder bumps or through vias. Bonding between the connection electrodes of each chip C is formed by thermocompression bonding by the main pressure bonding apparatus, and the chips C are electrically connected. In the component mounting system 1, for example, the chip C1 * is mounted by the component mounting apparatus M1, the chip C2 * is mounted by the component mounting apparatus M2, and the chip C3 * and the chip C4 * are mounted by the component mounting apparatus M3 while the substrate 4 is sequentially conveyed. The

  Next, the configuration of the component mounting apparatuses M1 to M3 will be described with reference to FIGS. The component mounting apparatuses M1 to M3 have the same configuration, and the component mounting apparatus M1 will be described below. Further, the substrate transport direction is defined as the X direction, the direction orthogonal to the X direction in the horizontal plane is defined as the Y direction, and the direction orthogonal to the horizontal plane is defined as the Z direction.

  In FIG. 3, a component supply stage 6, a unit assembly stage 7 and a substrate holding stage 8 are arranged in the Y direction on a base 5, and a substrate transfer unit 9 is located upstream of the substrate holding stage 8 in the X direction. Is arranged. A component storage unit 10 is disposed upstream of the component supply stage 6 in the X direction.

  A holding table 6a provided in the component supply stage 6 holds a wafer ring 11 for holding and holding a plurality of chips C (semiconductor chips) obtained by dividing the semiconductor wafer W into pieces by an adhesive sheet 11a. That is, the wafer ring 11 and the adhesive sheet 11a serve as a chip holder that holds a plurality of chips C. The component storage unit 10 stores the wafer rings 11 holding the plurality of chips C in a state of being vertically stacked at equal intervals. The component supply stage 6 takes out the wafer ring 11 from the component storage unit 10 and holds it on the holding table 6a.

  The unit assembly stage 7 has functions such as a tool stocker 17, a relay stage 18, and a component recognition camera 19, which will be described later, on a moving table 7 a that reciprocates in the X direction by a linear movement mechanism (see the X-axis movement mechanism 70 shown in FIG. 4). The unit is collectively arranged. The substrate holding stage 8 is configured to horizontally drive a substrate holding table 8b for receiving and holding a substrate carrier 4c on which the substrate 4 carried by the transport rail 8a is placed by an XY table mechanism 83 (see FIG. 4). . A substrate carrier 4 c on which the substrate 4 is placed is carried into the substrate holding stage 8 from the upstream side by the conveyance rail 9 a of the substrate conveyance unit 9.

  Above the component supply stage 6, the unit assembly stage 7, and the substrate holding stage 8, the Y-axis frame 12 is positioned at the end of the base 5 in the X direction, and both ends are supported by the support posts 12a in the Y direction. It is built in. On the front surface of the Y-axis frame 12, a head moving mechanism 13 that incorporates and drives a mounting head 14 described below in the Y direction by linear motor driving is incorporated. A mounting unit 20 having a function of holding the chip C and mounting it on the substrate 4 is mounted on the mounting head 14.

  In FIG. 4, a first camera 21, a second camera 22, and a third camera 23 are disposed above the component supply stage 6, the relay stage 18, and the substrate holding stage 8 for position recognition. The first camera 21 images the chip C to be taken out at the component supply stage 6. The second camera 22 images the chip C taken out from the component supply stage 6 and temporarily placed on the relay stage 18. The third camera 23 captures an image of the substrate 4 held on the substrate holding stage 8 and recognizes the position of the mounting point 4b. The component recognition camera 19 disposed on the unit assembly stage 7 images the chip C taken out from the component supply stage 6 from below.

  In FIG. 4, the component supply stage 6 includes an XY table mechanism 61, and a plurality of support members 63 are erected on a horizontal moving plate 62 mounted on the upper surface of the XY table mechanism 61. The support member 63 supports the holding table 6a on which the wafer ring 11 is held on the upper surface. On the wafer ring 11, a plurality of chips C obtained by dividing the semiconductor wafer W into individual pieces are held on the adhesive sheet 11a in a predetermined arrangement in a face-up posture with the active surface facing upward.

  Here, a plurality of chips C obtained by dividing the semiconductor wafer W supplied by the wafer ring 11 into individual pieces will be described with reference to FIG. The semiconductor wafer W is divided into six columns in the X direction and six rows in the Y direction, and rectangular chips C are formed in a matrix. Each chip C is numbered 1 to 6 from the left to the right as the chip X position, and 1 to 6 from the top to the bottom as the chip Y position.

  FIG. 6B shows an example of chip data D referred to in a component mounting operation described later. The chip data D is mapping data, and stores a wafer number Da for specifying the semiconductor wafer W, a chip X position Dx and a chip Y position Dy for specifying the X position and the Y position of the chip C in the semiconductor wafer W. The chip C to be mounted on the substrate 4 is specified by the wafer number Da, the chip X position Dx, and the chip Y position Dy. The XY coordinates of each chip C in the semiconductor wafer W (in the wafer ring 11) are calculated from the chip X position Dx, the chip Y position Dy, and the chip size of the chip C stored separately in the X direction and Y direction. The

  Note that a tray in which storage portions are formed in a matrix shape is used as a chip holder for holding the chips C, and a tray on which a plurality of chips C are placed in each storage portion is held by a holding table 6 a of the component supply stage 6. May be supplied. In the chip data D when the chip C is supplied in the tray, the tray number, the X position on the tray, and the Y position on the tray are stored. The selected chip C is the tray number, the X position on the tray, and on the tray. Specified by the Y position.

  In FIG. 4, a pick-up work position [P1] for picking up the chip C from the adhesive sheet 11a is set on the component supply stage 6. The position of the first camera 21 corresponds to the pickup work position [P1], and the position of the chip C to be picked up is recognized by recognizing the imaging result obtained by imaging the chip C on the adhesive sheet 11a by the first camera 21. Is detected.

  In the component take-out operation, the XY table mechanism 61 is driven to move the wafer ring 11 horizontally in the XY direction, thereby positioning the desired chip C to be taken out at the pick-up work position [P1]. The chip C to be taken out is specified by the wafer number Da, the chip X position Dx, and the chip Y position Dy of the chip data D.

  In FIG. 3, a pickup head 15 including a pickup nozzle 15 a that sucks and holds the chip C is disposed above the component supply stage 6. The pickup head 15 is held by a pickup arm 16a. The pickup arm 16 a is provided to extend above the component supply stage 6 from the pickup head moving mechanism 16 that is suspended from the lower surface of the Y-axis frame 12. By driving the pickup head moving mechanism 16, the pickup arm 16a moves in the XYZ directions and rotates around the X direction axis (arrow a in FIG. 4).

  Thus, the pickup head 15 can pick up the chip C from the component supply stage 6 and transfer it to the relay stage 18 provided in the unit assembly stage 7. Further, by rotating the pickup arm 16a and inverting the pickup head 15, the posture of the chip C held by the pickup nozzle 15a can be reversed.

  In FIG. 4, the unit assembly stage 7 and the substrate holding stage 8 are provided on the upper surface of the base plate 82, and the base plate 82 is supported from below by a plurality of support posts 81 erected on the upper surface of the base 5. . A moving table 7 a is provided on the plate 71 arranged on the upper surface of the base plate 82 via an X-axis moving mechanism 70 so as to be movable in the X direction.

  In FIG. 3, a tool stocker 17, a relay stage 18, and a component recognition camera 19 are collectively arranged on the moving table 7a. In the tool stocker 17, a plurality of work tools such as a component holding nozzle 20a mounted on the mounting unit 20 are used for each component type that are exchanged according to the component type. The relay stage 18 is disposed between the component supply stage 6 and the substrate holding stage 8 and is provided integrally with the tool stocker 17. A chip C taken out from the component supply stage 6 by the pickup head 15 is placed on the relay stage 18 for position correction.

  In FIG. 4, a relay position [P2] is set in the relay stage 18, and the second camera 22 is arranged corresponding to the relay position [P2]. By moving the relay stage 18 by the X-axis moving mechanism 70, the chip C placed on the relay stage 18 can be positioned at the relay position [P2] and imaged by the second camera 22. Thereby, the position of the chip C placed on the relay stage 18 is detected. The component recognition camera 19 is disposed adjacent to the relay stage 18, and similarly, by driving the X-axis moving mechanism 70, the imaging position can be positioned at the component recognition position [P3].

  The substrate holding stage 8 has a configuration in which a substrate holding table 8 b that holds a substrate carrier 4 c on which the substrate 4 is placed is provided on an XY table mechanism 83. On the substrate holding stage 8, a mounting work position [P4] for mounting the chip C on the substrate 4 received and held on the substrate holding table 8b is set, and the third camera 23 is mounted on the mounting work position [P4]. It is arranged corresponding to. By imaging the substrate 4 with the third camera 23, the position of the mounting point 4b set on the substrate 4 is detected. By driving the XY table mechanism 83, the substrate holding table 8b moves horizontally in the XY direction together with the substrate 4, and an arbitrary mounting point 4b set on the substrate 4 can be positioned at the mounting work position [P4]. .

  Next, the mounting head 14 will be described. 3 and 4, two guide rails 13 a for guiding the mounting head 14 in the Y direction are provided on the front surface of the head moving mechanism 13 provided on the Y-axis frame 12. A stator 13b constituting a linear motor for driving the mounting head 14 in the Y direction is disposed between the two guide rails 13a. A slider (not shown) is slidably fitted in the Y direction in the guide rail 13a, and this slider is fixed to the back surface of the vertical moving plate 14a.

  On the back surface of the moving plate 14a, a mover (not shown) that constitutes a linear motor is disposed facing the stator 13b. By driving these linear motors, the mounting head 14 is guided by the guide rail 13a and moves in the Y direction. An elevating mechanism 14b is disposed on the front surface of the moving plate 14a, and an elevating plate 14c is disposed on the front surface of the elevating mechanism 14b so as to be slidable in the vertical direction. By driving the elevating mechanism 14b, the elevating plate 14c moves up and down. A mounting unit 20 having a component holding nozzle 20a at the bottom is detachably mounted on the elevating plate 14c.

  The mounting unit 20 has a function of holding the chip C, which is a component to be mounted, by the component holding nozzle 20a, and the chip C supplied from the component supply stage 6 is mounted on the substrate 4 held by the substrate holding stage 8. To do. The mounting unit 20 includes a pressure sensor 20b, and the pressure sensor 20b measures the pressure applied to the chip C when the chip C is mounted on the substrate 4. The elevating mechanism 14b includes a linear scale 14d, and the linear scale 14d measures the position of the mounting unit 20 in the vertical direction.

  Next, the component storage unit 10 will be described. In FIG. 5, the component storage unit 10 includes a magazine 10 a that stores wafer rings 11 vertically at equal intervals. The magazine 10a is moved up and down by the elevating drive mechanism 10b (arrow b). Each wafer ring 11 holds a plurality of chips C obtained by dividing the semiconductor wafer W (W1 to W3) into individual pieces, and the wafer ring 11 and the semiconductor wafer W are linked by the wafer number Da of the chip data D. Has been. The holding table 6a of the component supply stage 6 is provided with a ring holding mechanism 6b that holds the wafer ring 11 electromagnetically or mechanically so as to be movable in the X direction.

  The wafer ring 11 is taken in and out of the magazine 10a according to the following procedure. When removing the wafer ring 11 from the magazine 10a, the magazine 10a is moved in the vertical direction, and the wafer ring 11 designated by the wafer number Da is held by the ring holding mechanism 6b and placed on the holding table 6a (arrow c). ). When the wafer ring 11 is stored, the magazine 10a is moved, the empty shelf is adjusted to the height of the holding table 6a, and the wafer ring 11 held by the ring holding mechanism 6b is stored in the magazine 10a (arrow d).

  In this way, in the component take-out operation, the component supply stage 6 takes out the wafer ring 11 from the component storage unit 10 and moves it to the pickup work position [P1]. That is, the component supply stage 6 takes out the wafer ring 11 from the component storage section 10 (chip holder storage section) capable of storing a plurality of wafer rings 11 (chip holders) holding a plurality of chips C, and picks up the work position [ P1] is a chip holder positioning portion that is positioned at (chip takeout position). Further, the component storage unit 10 and the component supply stage 6 serve as a component supply unit that supplies the chip C mounted on the substrate 4 to the chip extraction position.

  In the above configuration, the component storage unit 10, the component supply stage 6, the pickup head moving mechanism 16, the unit assembly stage 7, the mounting head 14, the head moving mechanism 13, the substrate holding stage 8, and the substrate transporting unit 9 The mounting part 100 is formed which forms the chip stacked body S in which the chips C are stacked on the plurality of mounting points 4b set to “1”. That is, the component mounting system 1 includes component mounting apparatuses M1 to M3 each having a mounting unit 100.

  Next, the configuration of the control system of the component mounting system 1 will be described with reference to FIG. The management computer 3 is connected to the component mounting apparatuses M1 to M3 via the communication network 2. The component mounting apparatuses M1 to M3 have the same configuration, and the component mounting apparatus M1 will be described below. The component mounting apparatus M1 includes a device control unit 41, a device storage unit 42, a recognition processing unit 44, a mounting control unit 45, and a mounting unit 100. The device control unit 41 controls the following units based on the control program stored in the device storage unit 42, the mounting data 43, and the like. Thereby, each operation for taking out the chip C from the component supply stage 6 and mounting the taken out chip C on the substrate 4 held by the substrate holding stage 8 is executed.

  The apparatus control unit 41 controls the component storage unit 10 and the component supply stage 6 based on the mounting data 43 to take out the wafer ring 11 on which the chip C to be mounted is held from the component storage unit 10 and hold table 6a. Then, the part picking operation for positioning to the pick-up work position [P1] is executed. The wafer ring 11 taken out from the component storage unit 10 is designated by the wafer number Da of the mounting data 43. The chip C positioned at the pickup work position [P1] is specified by the chip X position Dx and the chip Y position Dy of the mounting data 43.

  That is, the component supply stage 6 takes out the wafer ring 11 (chip holder) including the next chip C to be mounted based on the mounting data 43 from the component storage unit 10 (chip holder storage unit). It becomes a chip holder positioning part to be positioned at the pick-up work position [P1] (chip take-out position).

  Further, the device control unit 41 controls the unit assembly stage 7, the head moving mechanism 13, the mounting head 14, and the pickup head moving mechanism 16 based on the mounting data 43, so that the chip C positioned at the pickup work position [P 1] is controlled. The parts are picked up by the pickup head 15, delivered to the mounting head 14, and transferred to the mounting work position [P4].

  When the chip C held by the wafer ring 11 is mounted on the substrate 4 face up, the chip C held by the pickup head 15 is temporarily placed on the relay stage 18 at the relay position [P2] and temporarily placed. The chip C is picked up by the mounting head 14 and transferred to the mounting work position [P4]. When mounting on the substrate 4 face down, the pickup head 15 holding the chip C is reversed and moved to the relay position [P2], and directly transferred to the mounting head 14 at this position to the mounting work position [P4]. Transport.

  Further, the apparatus control unit 41 controls the substrate transport unit 9 and the substrate holding stage 8 based on the mounting data 43, and transfers and holds the substrate 4 from the substrate transport unit 9 to the next mounting point. A substrate positioning operation for positioning the substrate 4 held so that 4b becomes the mounting work position [P4] is executed.

  The recognition processing unit 44 performs recognition processing on the imaging results captured by the first camera 21, the second camera 22, the third camera 23, and the component recognition camera 19. Based on these recognition results, the device control unit 41 picks up the chip C at the pick-up work position [P1], transfers the chip C at the relay position [P2], and the substrate of the chip C at the mounting work position [P4]. 4 is corrected for each operation position.

  The mounting control unit 45 controls the lifting mechanism 14b of the mounting head 14 and the mounting unit 20 based on the mounting data 43, the pressure sensor 20b, and the measurement results of the linear scale 14d, and the chip C is mounted on the mounting work position [P4]. The component mounting operation to be mounted on 4 is executed. Further, the mounting control unit 45 executes a mounting height calculation operation for calculating the height from the lower surface of the substrate 4 to the upper surface of the uppermost chip C that is already mounted at the mounting point 4b during the component mounting operation. .

  In the mounting height calculation operation, the mounting control unit 45 first drives and controls the lifting mechanism 14b to lower the component holding nozzle 20a that holds the chip C. Next, the mounting control unit 45 stops the lowering of the component holding nozzle 20a when the held chip C comes into contact with the substrate 4 and the pressure sensor 20b detects a predetermined pressure, and the linear scale 14d at this position is stopped. The height of the mounting point 4b is calculated by processing the measurement result. This calculation result is the height from the upper surface of the substrate carrier 4c to the lower end of the component holding nozzle 20a, and is the mounting point thickness H at the mounting point 4b (see FIG. 2).

  As described above, the elevating mechanism 14b, the pressure sensor 20b, the linear scale 14d, and the mounting control unit 45 include the substrate thickness hb of the substrate 4 (work) at the mounting point 4b and the chip thickness h of the already mounted chip C. The thickness acquisition means acquires the mounting point thickness H of the mounting point 4b, which is the sum of the above. The mounting point thickness H acquired every time the chip C is mounted by the mounting height calculation operation is linked to the data relating to the position of the mounting point 4b on the substrate number 4d and the substrate 4, and the substrate of the management computer 3 to be described later It is stored in the substrate data 36 of the data storage unit 35.

  In FIG. 7, the management computer 3 includes a management control unit 31, a management storage unit 32, a chip data storage unit 34, a board data storage unit 35, and a mounting data creation unit 38. The management control unit 31 has a function of supervising control in each device constituting the component mounting system 1. The chip data storage unit 34 stores data relating to the chip thickness h (chip thickness) of the chip C supplied to the component mounting apparatuses M1 to M3 and mounted on the substrate 4 as the chip data D.

  In FIG. 6B, the chip thickness column Dh of the chip data D stores the chip thickness h of the chip C specified by the chip X position Dx and the chip Y position Dy. The chip thickness h is measured and stored by a laser-type height sensor, a contact-type height sensor, or the like before being set on the wafer ring 11 that holds the chip C. The chip thickness h may be directly measured using all the chips C of the semiconductor wafer W or indirectly using a curved surface model after measuring the height of the representative point of the semiconductor wafer W. As described above, the chip data storage unit 34 includes the chip X position Dx, the chip Y position Dy (chip position), and the chip thickness h (chip thickness) on the wafer ring 11 (chip holder) that holds the plurality of chips C. Mapping data including

  In FIG. 7, the board data storage unit 35 is a board related to the mounting point thicknesses H of the plurality of mounting points 4 b obtained by the mounting height calculation operation when the chip C is mounted on the board 4 in the component mounting apparatuses M1 to M2. A work data storage unit that stores data 36. The mounting point thickness H acquired by the mounting control unit 45 of the component mounting apparatuses M1 and M2 is associated with the data relating to the positions of the board number 4d and the mounting point 4b and stored in the board data storage unit 35 of the management computer 3. Is done. The mounting point thickness H may be measured by separately providing a laser-type height sensor, a contact-type height sensor, or the like in the component mounting apparatuses M1 and M2 in addition to the above-described thickness acquisition unit. .

  The mounting data creation unit 38 includes a chip thickness h (chip thickness) stored in the chip data storage unit 34 and mounting points of a plurality of mounting points 4b stored in the substrate data storage unit 35 (work data storage unit). Based on the board data 36 relating to the thickness H (the thickness of the mounting point), the mounting data 33 specifying the chip C to be mounted on the mounting point 4b of the board 4 is created.

  Specifically, the mounting data creating unit 38 uses the mounting point thickness H acquired in the component mounting apparatus M1 (component mounting apparatus M2) as the mounting data 33 for the component mounting apparatus M2 (for component mounting apparatus M3). Based on the component mounting apparatus M2 (components), the mounting point thickness H when the next chip C2 * (chips C3 *, C4 *) is mounted satisfies the following predetermined condition at the plurality of mounting points 4b. The next chip C is selected and designated from a plurality of chips C2 * (chips C3 *, C4 *) set in the mounting apparatus M3).

  For example, the predetermined condition is that a difference in mounting point thickness H (mounting point thickness) between at least two mounting points 4b selected from a plurality of mounting points 4b is determined by chip stacking in batch bonding by the present crimping apparatus. It is set so as to be within a predetermined range in which connection failure between the chips C constituting the body S does not occur. Alternatively, the predetermined condition is that the chip stack S is formed in the batch crimping by the present crimping apparatus in which the mounting point thickness H (mounting point thickness) of at least two or more mounting points 4b selected from the plurality of mounting points 4b. Is set to be within a predetermined range in which a connection failure between the chips C constituting the circuit does not occur.

  The mounting data 33 for the component mounting apparatus M1 is created based on the mounting point thickness H (substrate thickness hb) acquired until the substrate 4 is carried into the component mounting system 1. Further, when the variation in the mounting point thickness H is small, it is not necessary to consider the acquired mounting point thickness H when creating the mounting data 33 for the component mounting apparatuses M1 to M2. That is, at least when the mounting data 33 for the component mounting apparatus M3 on which the chip C4 * of the uppermost layer of the chip stack S is mounted, the mounting point thickness H acquired in the component mounting apparatus M2 is taken into consideration. That's fine.

  The created mounting data 33 is stored in the management storage unit 32, transferred to the component mounting apparatuses M1 to M3, and stored as mounting data 43 in the device storage unit 42. The mounting unit 100 of the component mounting apparatuses M1 to M3 mounts the chip C based on the mounting data 43 stored in the device storage unit 42. That is, the mounting unit 100 mounts when the next chip C is mounted on the already mounted chip C based on the mounting point thickness H (the thickness of the mounting point) acquired by the thickness acquisition unit. The next chip C selected so that the point thickness H satisfies the predetermined condition at the plurality of mounting points 4b is mounted on the mounting point 4b.

  Next, a component mounting operation (component mounting method) by the component mounting system 1 of the present embodiment will be described with reference to FIG. 9 along the flow of FIG. Here, the chip C1 * is mounted on the substrate 4 in order by the component mounting apparatus M1, the chip C2 * is mounted by the component mounting apparatus M2, the chip C3 * and the chip C4 * are mounted by the component mounting apparatus M3, and the chip stacking shown in FIG. An example of forming the body S * will be described.

  First, the chip thickness h of the chip C is measured, the chip number D is the wafer number Da as the chip data D, and the chip C on the wafer ring 11 (chip holder) on which the adhesive sheet 11a holding the plurality of chips C is extended. Mapping data including the X position Dx, the chip Y position Dy, and the chip thickness h of the chip C is created (ST1: chip data creation process). Next, the wafer rings 11 holding the chips C mounted on the substrate 4 are respectively stored in the component storage portions 10 of the corresponding component mounting apparatuses M1 to M3. Further, chip data D corresponding to the stored chip C is stored in the chip data storage unit 34. The board 4 to be mounted is put into the component mounting system 1 and transferred to the board holding stage 8 of the component mounting apparatus M1.

  Next, the mounting data creation unit 38 adds the chip C1 * to the mounting point 4b of the substrate 4 based on the data regarding the chip thickness h1 * of the chip C1 * mounted on the component mounting apparatus M1 included in the stored chip data D. The mounting data 33 for mounting is created. In the mounting data 33, the chip C1 * to be mounted is specified by the wafer number Da, the chip X position Dx, and the chip Y position Dy. The created mounting data 33 is transmitted to the component mounting apparatus M1 by the management control unit 31, and stored in the apparatus storage unit 42 as mounting data 43 (ST2: first mounting data creating step). If there is board data 36 relating to the mounting point thickness H (board thickness hb) acquired before the board 4 is carried into the component mounting system 1, the mounting data for the component mounting apparatus M1 is taken into account. 43 may be created.

  Next, the mounting unit 100 of the component mounting apparatus M1 mounts the chip C1 * on the plurality of mounting points 4b set on the substrate 4 (work) based on the mounting data 43 stored in the device storage unit 42 (ST3: No. 1). 1 mounting process). FIG. 9A shows a state of the substrate 4 on which the chip C1 * is mounted by the component mounting apparatus M1. When mounting the chip C1 *, the mounting controller 45 is the sum of the substrate thickness hb * (workpiece thickness) at the mounting point 4b and the chip thickness h1 * of the chip C1 * mounted at the mounting point 4b. A certain mounting point thickness H * (1) (the thickness of the mounting point) is calculated and acquired (ST4: first mounting point thickness acquisition step). The acquired data regarding the mounting point thickness H * (1) is stored as substrate data 36 in the substrate data storage unit 35 (ST5: first substrate data storage step).

  Next, the mounting data creation unit 38 includes data relating to the chip thickness h2 * of the chip C2 * mounted on the component mounting apparatus M2 included in the stored chip data D, and the first mounting point thickness acquisition step (ST4). (ST5) obtained and stored in step (5), the mounting point thickness H * (2) when the next chip C2 * is mounted is based on the data relating to the mounting point thickness H * (1) of the substrate 4. The next chip C2 * is selected so as to satisfy a predetermined condition at the mounting point 4b, and mounting data 33 for mounting the next chip C2 * on the mounting point 4b is created. The created mounting data 33 is transmitted to the component mounting apparatus M2 by the management control unit 31, and stored in the apparatus storage unit 42 as mounting data 43 (ST6: second mounting data creation step).

  Next, the mounting unit 100 of the component mounting apparatus M2 mounts the next chip C2 * on the mounting point 4b of the substrate 4 conveyed from the component mounting apparatus M1 based on the mounting data 43 stored in the device storage unit 42 (ST7). : Second mounting step). That is, in the second mounting step (ST7), based on the mounting point thickness H * (1) of the mounting point 4b acquired, the next step is further performed on the chip C1 * mounted in the first mounting step (ST3). The next chip C2 * selected so that the mounting point thickness H * (2) when mounting the chip C2 * is a predetermined condition at the plurality of mounting points 4b is mounted on the mounting point 4b. FIG. 9B shows a state of the substrate 4 on which the next chip C2 * is mounted by the component mounting apparatus M2.

  When mounting the chip C2 *, the mounting control unit 45 is the sum of the substrate thickness hb * (workpiece thickness) at the mounting point 4b and the chip thickness h2 * of the chip C2 * mounted at the mounting point 4b. A certain mounting point thickness H * (2) (the thickness of the mounting point) is calculated and acquired (ST8: second mounting point thickness acquisition step). The acquired data regarding the mounting point thickness H * (2) is stored as substrate data 36 in the substrate data storage unit 35 (ST9: second substrate data storage step).

  Next, the mounting data creation unit 38 includes data on the chip thicknesses h3 * and h4 * of the chips C3 * and C4 * mounted on the component mounting apparatus M3 included in the stored chip data D, and the second mounting point thickness. Based on the data regarding the mounting point thickness H * (2) of the substrate 4 acquired and stored in the acquisition step (ST8), the mounting point thickness when the next chips C3 * and C4 * are mounted The next chips C3 * and C4 * are selected so that the height H * is a predetermined condition at the plurality of mounting points 4b, and mounting data 33 for mounting the next chips C3 * and C4 * on the mounting points 4b is obtained. create. The created mounting data 33 is transmitted to the component mounting apparatus M3 by the management control unit 31, and stored in the apparatus storage unit 42 as mounting data 43 (ST10: third mounting data creation step).

  Next, the mounting unit 100 of the component mounting apparatus M3 mounts the next chips C3 * and C4 * on the mounting point 4b of the substrate 4 transported from the component mounting apparatus M2 based on the mounting data 43 stored in the device storage unit 42. (ST11: Third mounting step). That is, the third mounting step (ST11) is further performed on the chip C2 * mounted in the second mounting step (ST7) based on the mounting point thickness H * (2) of the acquired mounting point 4b. The next chips C3 * and C4 * selected so that the mounting point thickness H * when the chips C3 * and C4 * are mounted are a predetermined condition at the plurality of mounting points 4b are mounted on the mounting point 4b. . FIG. 2 shows a state of the substrate 4 on which the chips C3 * and C4 * are mounted by the component mounting apparatus M3.

  At this time, each mounting point 4b of the substrate 4 is stacked with chips C1 * to C4 * in which the mounting point thickness H or the difference in mounting point thickness H is within a predetermined range at the plurality of mounting points 4b. A chip stack S * is formed. That is, after the first mounting step (ST3), a step of acquiring the mounting point thickness H on which the chip C is mounted (first mounting point thickness acquisition step (ST4), second mounting point thickness acquisition). Step (ST8)) and a step of mounting the next chip C selected based on the acquired mounting point thickness H on the mounting point 4b (second mounting step (ST7), third mounting step (ST11)) ) Is repeated to form the chip stack S.

  In addition, the second mounting data creation step (ST6) and the third mounting data creation step (ST10) include data on the stored chip thickness h (chip thickness) and the stored mounting point thickness H ( The mounting data 33 (43) for forming the chip stack S in which the chips C are stacked on the plurality of mounting points 4b set on the substrate 4 (work) is created based on the data regarding the thickness of the mounting points) It becomes a process to do.

  Next, after the chip stack S is formed, the substrate 4 is unloaded from the component mounting apparatus M3, and a plurality of chip stacks S on the substrate 4 (workpiece) are collectively pressed in the crimping apparatus (ST12: batch). Crimping process). As a result, in the plurality of chip stacks S * on the substrate 4, the bonds between the chips C1 * to C4 * are collectively formed. In the present invention, the mounting point thickness H or the difference between the mounting point thicknesses H is within a predetermined range at the plurality of mounting points 4b of the plurality of chip stacks S * in the substrate 4 to be subjected to collective pressure bonding. For this reason, pressure is not applied nonuniformly to the chip stack S * during batch bonding. Thereby, it is possible to suppress the occurrence of poor connection between the stacked chips C1 * to C4 *. Thereafter, the substrate 4 that has been pressure-bonded is divided into individual substrates 4a to form individual chip stacks S.

  The component mounting system 1 is sequentially loaded with substrates 4 to be mounted on a mounting substrate (chip stack S) to be produced. The component mounting system 1 uses the chip C prepared in ST1 and repeats ST2 to ST12 to sequentially stack chips C1 * to C4 * on the substrate 4 to produce a chip stack S.

  As described above, in the present embodiment, the chip C is mounted on the plurality of mounting points 4b set on the substrate 4, and the substrate thickness hb at the mounting point 4b and the chip thickness of the chip C mounted at the mounting point. The mounting point thickness H which is the sum of h is obtained. Based on the acquired mounting point thickness H, a plurality of mounting point thicknesses H when a next chip C (for example, C2 *) is further mounted on the mounted chip C (for example, C1 *) are plural. The next chip C selected so as to satisfy a predetermined condition at the mounting point 4b is mounted on the mounting point 4b. Thereby, the variation in the height of the plurality of chip stacks S formed on the substrate 4 is suppressed, and it is possible to suppress the occurrence of poor connection between the stacked chips C when collectively press-bonding.

  In the component mounting system 1 described above, the management computer 3 includes the mounting data creation unit 38, the chip data storage unit 34, and the board data storage unit 35. However, the present invention is not limited to this form. . For example, the component mounting apparatuses M1 to M3 may include the mounting data creation unit 38, the chip data storage unit 34, and the board data storage unit 35.

  When the stacked chips C1 * to C4 * constituting the chip stack S shown in FIG. 2 are of the same type, the component mounting system 1 does not connect the component mounting apparatuses M1 to M3, for example, component mounting The chip stack S can be formed only by the device M1. Further, the mounting data creation unit 38, the chip data storage unit 34, and the board data storage unit 35 may be provided in the component mounting apparatus M1. Thereby, for example, the chip stack S in which four memory chips of the same type are stacked on the substrate 4 can be formed only by the component mounting apparatus M1.

  The component mounting apparatus M1 includes a chip data storage unit 34 that stores chip data D relating to the chip thickness h of the chip C, and a chip in which the chip C is stacked on a plurality of mounting points 4b set on the substrate 4 (work). The sum of the mounting part 100 forming the stacked body S, the substrate thickness hb (workpiece thickness) at the mounting point, and the chip thickness h (chip thickness) of the chip C already mounted at the mounting point. A thickness acquisition means for acquiring a certain mounting point thickness H (the thickness of the mounting point). Based on the mounting point thickness H, the mounting unit 100 has the mounting point thickness H when the next chip C is mounted on the chip C already mounted at the mounting point 4b at the plurality of mounting points 4b. The next chip C selected so as to satisfy the predetermined condition is mounted on each mounting point 4b.

  In the above embodiment, the chip stack S is formed on the substrate 4 (work) formed of a plurality of individual substrates 4a having LSIs and connection wirings formed on the upper surface portion. There is no limit. For example, it may be a printed board having a plurality of chip laminates S formed on its upper surface or a multi-sided printed board comprising a plurality of unit boards on which the chip laminate S is formed. In other words, the present invention can be applied to a form in which a plurality of chip stacks S are collectively crimped when crimped by the present crimping apparatus.

  The component mounting apparatus, the component mounting method, and the component mounting system of the present invention have the effect of suppressing the occurrence of poor connection of stacked semiconductor chips, and are useful in the component mounting field where components are mounted on a substrate. .

1 Component mounting system 4 Substrate (workpiece)
4b Mounting point 6 Component supply stage (chip holder positioning part)
10 Parts storage (chip holder storage)
11 Wafer ring (chip holder)
11a Adhesive sheet (chip holder)
14b Elevating mechanism (thickness acquisition means)
14d linear scale (thickness acquisition means)
20b Pressure sensor (thickness acquisition means)
100 Mounting part C Chip H Mounting point thickness (Mounting point thickness)
h Chip thickness (chip thickness)
hb Substrate thickness (workpiece thickness)
M1 to M3 Component mounting device S Chip stack [P1] Pickup work position (chip takeout position)

Claims (10)

A chip data storage unit for storing data relating to the thickness of the chip;
A mounting portion for mounting a chip on a plurality of mounting points set on a workpiece to form a chip stack in which the chips are stacked;
Thickness acquisition means for acquiring the thickness of the mounting point that is the sum of the thickness of the workpiece at the mounting point and the thickness of the chip already mounted at the mounting point;
The mounting portion has a predetermined thickness at the plurality of mounting points when the next chip is mounted on a chip already mounted at the mounting point based on the thickness of the mounting point. The next chip selected to be a condition is mounted on the mounting point,
The predetermined condition is that the difference in thickness of the mounting points between at least two mounting points selected from the plurality of mounting points is within a predetermined range. A work data storage unit for storing data relating to the thickness of the mounting points of the plurality of mounting points acquired;
  Based on the chip thickness stored in the chip data storage unit and the data on the mounting point thickness of the plurality of mounting points stored in the work data storage unit, the chip is mounted at the mounting point of the workpiece. It further includes a mounting data creation unit that creates mounting data for selecting the next chip,
  The component mounting apparatus according to claim 1, wherein the mounting unit mounts the selected next chip on the mounting point based on the mounting data. The component mounting apparatus according to claim 1, wherein the chip data storage unit stores mapping data including a chip position on a chip holder that holds a plurality of chips and a thickness of the chip. A chip holder storage section capable of storing a plurality of the chip holders;
  A chip holder positioning unit that takes out the stored chip holder and positions the chip holder at a chip removal position;
  4. The chip holder positioning unit takes out the chip holder including the next chip to be mounted from the chip holder storage unit based on the mounting data and positions the chip holder at the chip extraction position. The component mounting apparatus described in 1. A first mounting step of mounting chips on a plurality of mounting points set on the workpiece;
  Obtaining a thickness of the mounting point that is the sum of the thickness of the workpiece at the mounting point and the thickness of the chip mounted at the mounting point;
  Based on the acquired thickness of the mounting point, the thickness of the mounting point when the next chip is further mounted on the chip mounted in the first mounting step is predetermined at the plurality of mounting points. A second mounting step of mounting the next chip selected so as to satisfy the above condition at the mounting point,
  Forming a chip stack in which the chips are stacked at the plurality of mounting points;
  The predetermined condition is a component mounting method in which a difference in thickness of the mounting points between at least two mounting points selected from the plurality of mounting points is within a predetermined range. 6. The component mounting method according to claim 5, wherein after the first mounting step, the chip stack is formed by repeating the step of obtaining the thickness of the mounting point and the second mounting step. Storing data relating to the thickness of the mounting points of the plurality of mounting points obtained;
  Mounting data for forming a chip stack in which the chips are stacked at a plurality of mounting points set on the workpiece based on the data on the thickness of the chip and the data on the stored thickness of the mounting point And a step of creating
  The component mounting method according to claim 5 or 6, wherein, in the second mounting step, the next chip is mounted based on the mounting data. Further comprising the step of creating mapping data including the position of the chip on the chip holder holding the plurality of chips and the thickness of the chip;
  The component mounting method according to claim 7, wherein the mapping data is referred to in the step of creating the mounting data. The component mounting method according to claim 5, further comprising a step of collectively pressing the plurality of chip stacks on the workpiece after the chip stack is formed. A mounting portion for mounting a chip on a plurality of mounting points set on a workpiece to form a chip stack in which the chips are stacked;
  A component mounting apparatus having a thickness acquisition means for acquiring a thickness of a mounting point that is a sum of a thickness of a workpiece at the mounting point and a thickness of a chip already mounted;
  A chip data storage unit for storing data relating to the thickness of the chip,
  Based on the thickness of the mounting point acquired by the thickness acquisition means, the mounting portion has a thickness of the mounting point when a next chip is further mounted on the already mounted chip. Mounting the next chip selected to be a predetermined condition at the plurality of mounting points at the mounting point;
  The predetermined condition is a component mounting system in which a difference in thickness of the mounting points between at least two mounting points selected from the plurality of mounting points is within a predetermined range.

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