JP6585068B2 - 保護膜形成フィルムおよび保護膜形成用複合シート - Google Patents

保護膜形成フィルムおよび保護膜形成用複合シート Download PDF

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Publication number
JP6585068B2
JP6585068B2 JP2016556539A JP2016556539A JP6585068B2 JP 6585068 B2 JP6585068 B2 JP 6585068B2 JP 2016556539 A JP2016556539 A JP 2016556539A JP 2016556539 A JP2016556539 A JP 2016556539A JP 6585068 B2 JP6585068 B2 JP 6585068B2
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Japan
Prior art keywords
protective film
film
forming
sheet
forming film
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Japanese (ja)
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JPWO2016068042A1 (ja
Inventor
力也 小橋
力也 小橋
山本　大輔
大輔 山本
章生 加太
章生 加太
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Lintec Corp
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Lintec Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B32B2307/402—Coloured
    • B32B2307/4026—Coloured within the layer by addition of a colorant, e.g. pigments, dyes

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)
  • Paints Or Removers (AREA)
  • Laminated Bodies (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
JP2016556539A 2014-10-29 2015-10-23 保護膜形成フィルムおよび保護膜形成用複合シート Active JP6585068B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014220295 2014-10-29
JP2014220295 2014-10-29
PCT/JP2015/079973 WO2016068042A1 (ja) 2014-10-29 2015-10-23 保護膜形成フィルムおよび保護膜形成用複合シート

Publications (2)

Publication Number Publication Date
JPWO2016068042A1 JPWO2016068042A1 (ja) 2017-08-10
JP6585068B2 true JP6585068B2 (ja) 2019-10-02

Family

ID=55857381

Family Applications (1)

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JP2016556539A Active JP6585068B2 (ja) 2014-10-29 2015-10-23 保護膜形成フィルムおよび保護膜形成用複合シート

Country Status (6)

Country Link
JP (1) JP6585068B2 (ko)
KR (1) KR102467143B1 (ko)
CN (2) CN107112219A (ko)
SG (1) SG11201703250YA (ko)
TW (1) TWI671338B (ko)
WO (1) WO2016068042A1 (ko)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI731964B (zh) * 2016-04-28 2021-07-01 日商琳得科股份有限公司 保護膜形成用複合片
TWI796297B (zh) * 2016-04-28 2023-03-21 日商琳得科股份有限公司 保護膜形成用複合片
TWI642544B (zh) * 2016-10-11 2018-12-01 武漢市三選科技有限公司 Sheet for forming cut-off substrate protective film, preparation method thereof, circuit board therewith and preparation method thereof
TWI663642B (zh) * 2017-02-09 2019-06-21 日商琳得科股份有限公司 固化性樹脂膜以及第一保護膜形成用片
WO2019058964A1 (ja) * 2017-09-25 2019-03-28 富士フイルム株式会社 硬化性組成物、膜、赤外線透過フィルタ、固体撮像素子および光センサ
JP7237847B2 (ja) 2017-10-27 2023-03-13 リンテック株式会社 保護膜形成用複合シート、及び半導体チップの製造方法
TWI786209B (zh) 2017-10-27 2022-12-11 日商琳得科股份有限公司 保護膜形成用複合片及半導體晶片的製造方法
TW201936824A (zh) * 2017-10-27 2019-09-16 日商琳得科股份有限公司 保護膜形成用膜、保護膜形成用複合片及半導體晶片的製造方法
CN111093986B (zh) 2017-10-27 2022-03-11 琳得科株式会社 保护膜形成用复合片及半导体芯片的制造方法
KR102448152B1 (ko) * 2017-10-27 2022-09-27 린텍 가부시키가이샤 보호막 형성용 필름, 보호막 형성용 복합 시트 및 반도체 칩의 제조 방법
KR102175717B1 (ko) * 2017-12-14 2020-11-06 주식회사 엘지화학 다이싱 다이 본딩 필름
JP6916836B2 (ja) * 2019-05-14 2021-08-11 日東電工株式会社 積層体の製造方法
JP7333211B2 (ja) * 2019-06-21 2023-08-24 リンテック株式会社 保護膜形成用複合シート、及び保護膜付き半導体チップの製造方法
JP2021075620A (ja) * 2019-11-08 2021-05-20 リンテック株式会社 接着フィルム及び接着複合シート

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3511346B2 (ja) * 1996-12-05 2004-03-29 三井化学株式会社 半導体ウエハの裏面研削方法及び該方法に用いる粘着フィルム
JP3544362B2 (ja) * 2001-03-21 2004-07-21 リンテック株式会社 半導体チップの製造方法
JP2003305792A (ja) * 2002-04-15 2003-10-28 Toray Ind Inc 積層樹脂シート
JP4585164B2 (ja) * 2002-07-18 2010-11-24 日東電工株式会社 紫外線硬化型粘着シート
JP5090695B2 (ja) * 2006-09-08 2012-12-05 大倉工業株式会社 偏光板の製造方法
JP2009036797A (ja) * 2007-07-31 2009-02-19 Nitto Denko Corp 光学フィルム、偏光板、および画像表示装置
JP2009138026A (ja) * 2007-12-03 2009-06-25 Furukawa Electric Co Ltd:The エネルギー線硬化型チップ保護用フィルム
JP5640051B2 (ja) 2009-01-30 2014-12-10 日東電工株式会社 半導体装置の製造方法
JP5249290B2 (ja) 2010-07-20 2013-07-31 日東電工株式会社 フリップチップ型半導体裏面用フィルム、ダイシングテープ一体型半導体裏面用フィルム、半導体装置の製造方法、及び、フリップチップ型半導体装置
CN102516889B (zh) * 2011-12-07 2013-09-25 深圳市鑫东邦科技有限公司 一种高透光率的可紫外线固化的胶粘剂

Also Published As

Publication number Publication date
JPWO2016068042A1 (ja) 2017-08-10
KR102467143B1 (ko) 2022-11-14
WO2016068042A1 (ja) 2016-05-06
CN113980535A (zh) 2022-01-28
KR20170078630A (ko) 2017-07-07
CN107112219A (zh) 2017-08-29
SG11201703250YA (en) 2017-05-30
TWI671338B (zh) 2019-09-11
TW201620963A (zh) 2016-06-16

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