JP6578539B1 - 導電性ボール定置用マスクの製造方法 - Google Patents
導電性ボール定置用マスクの製造方法 Download PDFInfo
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- JP6578539B1 JP6578539B1 JP2019046528A JP2019046528A JP6578539B1 JP 6578539 B1 JP6578539 B1 JP 6578539B1 JP 2019046528 A JP2019046528 A JP 2019046528A JP 2019046528 A JP2019046528 A JP 2019046528A JP 6578539 B1 JP6578539 B1 JP 6578539B1
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- 238000000034 method Methods 0.000 title claims description 32
- 238000004519 manufacturing process Methods 0.000 title claims description 14
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 72
- 125000006850 spacer group Chemical group 0.000 claims abstract description 51
- 238000007747 plating Methods 0.000 claims abstract description 46
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 36
- 239000000758 substrate Substances 0.000 claims abstract description 8
- 238000000206 photolithography Methods 0.000 claims description 9
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 abstract description 7
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 abstract description 7
- 229910045601 alloy Inorganic materials 0.000 abstract description 7
- 239000000956 alloy Substances 0.000 abstract description 7
- 239000011574 phosphorus Substances 0.000 abstract description 7
- 229910052796 boron Inorganic materials 0.000 abstract description 6
- 229910052698 phosphorus Inorganic materials 0.000 abstract description 6
- 230000008021 deposition Effects 0.000 description 12
- 101100269850 Caenorhabditis elegans mask-1 gene Proteins 0.000 description 10
- 238000009713 electroplating Methods 0.000 description 6
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 239000002585 base Substances 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 229910000521 B alloy Inorganic materials 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 229910001096 P alloy Inorganic materials 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- RJTANRZEWTUVMA-UHFFFAOYSA-N boron;n-methylmethanamine Chemical compound [B].CNC RJTANRZEWTUVMA-UHFFFAOYSA-N 0.000 description 2
- 239000003638 chemical reducing agent Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910001379 sodium hypophosphite Inorganic materials 0.000 description 2
- 239000003513 alkali Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002932 luster Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- CVHZOJJKTDOEJC-UHFFFAOYSA-N saccharin Chemical compound C1=CC=C2C(=O)NS(=O)(=O)C2=C1 CVHZOJJKTDOEJC-UHFFFAOYSA-N 0.000 description 1
- 229940081974 saccharin Drugs 0.000 description 1
- 235000019204 saccharin Nutrition 0.000 description 1
- 239000000901 saccharin and its Na,K and Ca salt Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 235000011121 sodium hydroxide Nutrition 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Abstract
Description
ことを特徴とする、導電性ボール定置用マスクの製造方法。
図1は実施の形態に係る、導電性ボール定置用マスク1の平面図(a)と断面図(b)である。まず、導電性ボール定置用マスク1は、大きく分けて、搭載層2とスペーサー層3を備えており、搭載層2とスペーサー層3は、一体不可分に密着している。
2 搭載層
21 開口
3 スペーサー層
Claims (1)
- 導電性ボールを、ワークの被定置面上に所定のパターンで配列された電極上に定置するための、導電性ボール定置用マスクの製造方法であって、
電気伝導性を有する基板上に、フォトリソグラフィ法で開口パターンに相当する第1レジスト層を形成する工程と、
光沢剤を添加しない電解ニッケルめっき法で、前記電極に対応するパターンで面内に形成され、導電性ボールが挿通可能な大きさの開口を有する搭載層を形成する工程と、
前記搭載層の上に、フォトリソグラフィ法で前記開口を塞ぐように、スペーサー層に対応する第2レジスト層を、間隔が1mm未満の部分を有するように形成する工程と、
無電解ニッケルめっき法で、前記第2レジスト層の間隔に、前記開口を塞がないように格子状、線状、面状、またはこれらの組み合わせである前記スペーサー層を、前記搭載層と一体的に形成する工程と、
前記第1レジスト層と前記第2レジスト層を除去する工程と、を含み、
前記搭載層のめっき成長面は、無光沢である、
ことを特徴とする、導電性ボール定置用マスクの製造方法。
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JP2019046528A JP6578539B1 (ja) | 2019-03-13 | 2019-03-13 | 導電性ボール定置用マスクの製造方法 |
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JP2019046528A JP6578539B1 (ja) | 2019-03-13 | 2019-03-13 | 導電性ボール定置用マスクの製造方法 |
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JP6578539B1 true JP6578539B1 (ja) | 2019-09-25 |
JP2020150136A JP2020150136A (ja) | 2020-09-17 |
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