JP6573768B2 - Condition monitoring device - Google Patents

Description

  The present invention relates to a state monitoring device that monitors the state of a component mounting machine that performs a mounting operation of picking up a component with driving of a drive system and mounting the component on a substrate.

  Conventionally, in a mounting system including a component mounter for mounting an electronic component on a circuit board, an inspection device is arranged downstream of the component mounter, and after mounting of the component by the component mounter is completed, One that inspects the mounting state is known (for example, see Patent Document 1).

  Also, a mounting system that detects an abnormality while operating a component mounting apparatus is also known. For example, Patent Document 2 compares the characteristics of a feedback signal fed back from a motor by applying an operation state detection signal to a motor that drives the apparatus and the characteristics of a feedback signal registered in advance. A device for determining the presence or absence of an abnormality in a device is disclosed.

Japanese Patent Application Laid-Open No. 06-209197 Japanese Patent Laid-Open No. 04-259299

  By the way, as described above, if it is discovered that the component is not properly mounted by inspection of the mounting state, or if an operation abnormality is found in the mechanism of the component mounter, the component mounter may be stopped abnormally. However, abnormally stopping the component mounter during production leads to a reduction in the operation rate, so it is desirable to suppress it as much as possible.

  The main object of the present invention is to improve the operating rate by suppressing the component mounter from abnormally stopping during production.

  The present invention adopts the following means in order to achieve the main object described above.

The first state monitoring apparatus of the present invention is
A state monitoring device that monitors the state of a component mounting machine that performs a mounting operation of picking up a component with driving of a drive system and mounting it on a substrate,
Drive state detection means for detecting the drive state of the drive system;
A determination means for determining whether the detected drive state of the drive system is in a normal state, an abnormal state, or an abnormal sign state before reaching the abnormal state;
An abnormal stopping means for abnormally stopping the component mounter when it is determined that the detected driving state of the drive system is in the abnormal state;
Warning means for outputting a predetermined warning when it is determined that the detected drive state of the drive system is in the abnormal sign state;
It is a summary to provide.

  In the first state monitoring apparatus of the present invention, it is determined whether the drive state of the drive system detected by the drive state detection means is in a normal state, an abnormal state, or an abnormal sign state before reaching the abnormal state. When it is determined that the drive state of the drive system is in an abnormal state, the component mounter is stopped abnormally, and a predetermined warning is output when it is determined that the drive state of the drive system is in an abnormal sign state. To do. Thereby, the worker can grasp the sign of abnormality before the component mounter is abnormally stopped by the warning. For this reason, the worker can suppress the component mounter from stopping abnormally during the production by performing necessary maintenance work between the production of the component mounter, thereby improving the operating rate. be able to. Here, as the “driving state detection means”, the driving state may be detected every predetermined time, or the driving state is detected while the component mounter stops production (for example, during the setup change period). It is good also as what to do.

  In such a first state monitoring apparatus of the present invention, the drive system performs a component mounting operation by controlling the drive of the motor using feedback control, and the drive state detecting means is configured to perform the motor control by the drive control. Output torque detection and estimation means for detecting or estimating output torque output from the output torque, and the determination means performs the state determination based on the detected or estimated output torque or a change in the output torque. You can also. In this way, the state of the drive system can be grasped more accurately. In this case, it is determined that the state of the drive system is abnormal when the drive torque is equal to or greater than the first torque, and the condition of the drive system is abnormal when the drive torque is less than the first torque and equal to or greater than the second torque. It is good also as what determines with it being a precursor state. Further, even when the drive torque is less than the second torque, it may be determined that there is an abnormal sign state when the change gradient of the drive torque is greater than or equal to a predetermined gradient.

  In the first state monitoring apparatus of the present invention, the drive state detection unit includes a sound detection unit that detects a sound emitted from the drive system, and the determination unit includes a frequency characteristic of the detected sound. It is also possible to perform the state determination based on the above. In this way, the state of the drive system can be grasped more accurately. In this case, as the frequency characteristic of the detected sound, it is determined that the state of the drive system is abnormal when the sound level in a predetermined frequency band (for example, a high frequency band) is equal to or higher than a predetermined first level. In addition, when the sound level in the predetermined frequency band is less than the first level and becomes equal to or higher than the second level, it may be determined that the state of the drive system is the abnormal sign state.

  Furthermore, in the first state monitoring apparatus of the present invention, the drive state detection unit includes a temperature detection unit that detects a temperature of the drive system, and the determination unit includes the detected temperature of the drive system or the temperature of the drive system. The state determination may be performed based on a change in temperature. In this way, the state of the drive system can be grasped more accurately. In this case, it is determined that the state of the drive system is abnormal when the temperature of the drive system is equal to or higher than the first temperature, and the drive system is determined when the temperature of the drive system is lower than the first temperature and equal to or higher than the second temperature. It is good also as what determines with the state of being an abnormal sign state. Further, even when the temperature of the drive system is lower than the second temperature, it may be determined that the abnormality sign state is present when the temperature gradient is equal to or higher than a predetermined gradient.

The second state monitoring apparatus of the present invention is
A state monitoring device that monitors the state of a component mounting machine that performs a mounting operation of picking up a component with driving of a drive system and mounting it on a substrate,
Temperature state detection means for detecting a temperature state of a predetermined heat generating component provided in the component mounting machine;
Determining means for determining whether the detected temperature state is in a normal state, an abnormal state, or an abnormal sign state before reaching the abnormal state,
When it is determined that the detected temperature state is in the abnormal state, an abnormal stop unit that abnormally stops the component mounter;
Warning means for outputting a predetermined warning when it is determined that the detected temperature state is in the abnormal sign state;
It is a summary to provide.

  In the second state monitoring apparatus of the present invention, whether the temperature state of the predetermined heat generating component detected by the temperature state detecting means is in a normal state, an abnormal state, or an abnormal sign state before reaching the abnormal state. When the temperature state is determined to be abnormal, the component mounter is abnormally stopped, and when it is determined that the temperature state is abnormal, a predetermined warning is output. Thereby, the worker can grasp the sign of abnormality before the component mounter is abnormally stopped by the warning. For this reason, the worker can suppress the component mounter from stopping abnormally during the production by performing necessary maintenance work between the production of the component mounter, thereby improving the operating rate. be able to. Here, examples of the “predetermined heat generating component” include a drive circuit that drives a motor included in the drive system, a control CPU, and the like. Further, the “temperature state detection means” may be a unit that constantly detects the temperature state during production. Further, the “determination unit” may perform temperature state determination based on the detected temperature or temperature change of the heat-generating component. In this case, when the temperature of the heat generating component is equal to or higher than the first temperature, the state of the heat generating component is determined to be abnormal, and when the temperature of the heat generating component is lower than the first temperature and equal to or higher than the second temperature, the heat generating component is determined. It is good also as what determines with the state of being an abnormal sign state. Further, even if the temperature of the heat generating component is lower than the second temperature, it may be determined that the abnormal sign state is present when the temperature gradient is equal to or higher than a predetermined gradient.

1 is a configuration diagram showing an outline of a configuration of a mounting system 1. FIG. 1 is a configuration diagram showing an outline of the configuration of a component mounter 10. 3 is a block diagram showing an electrical connection relationship between a control device 70 and a management device 80. FIG. 5 is a flowchart illustrating an example of a management processing routine executed by the management device 80. 5 is a flowchart illustrating an example of a torque monitoring process routine executed by a management device 80. It is explanatory drawing which shows the mode of the secular change of the torque Tr. 7 is a flowchart illustrating an example of an operation sound monitoring process routine executed by the management device 80. 7 is a flowchart illustrating an example of a temperature monitoring processing routine executed by the management device 80.

  The form for implementing this invention is demonstrated using an Example.

  FIG. 1 is a configuration diagram illustrating an overview of the configuration of the component mounting system 1, FIG. 2 is a configuration diagram illustrating an overview of the configuration of the component mounting machine 10, and FIG. 3 illustrates a control device 70, a management device 80, and the like. It is explanatory drawing which shows these electrical connection relations. 1 and 2 is the X-axis direction, the front (front) and rear (back) directions are the Y-axis direction, and the vertical direction is the Z-axis direction.

  As shown in FIG. 1, the component mounting system 1 includes a plurality of component mounting machines 10 arranged side by side in the transport direction (substrate transport direction) of the board S, and the state monitoring device of the present invention that manages the entire component mounting system. As a management device 80.

  As shown in FIG. 2, the component mounter 10 is configured by a base 11 and a main body frame 12 supported by the base 11. As shown in FIG. 2, the component mounter 10 supplies a support base 14 provided at the lower stage portion of the main body frame 12, a substrate transport device 22 that is supported by the support base 14 and transports the substrate S, and a component P. A component supply device 20 to be mounted, a head 30 for mounting the component P supplied by the component supply device 20 to a target mounting position on the substrate S transported by the substrate transport device 22 by sucking the component P by the suction nozzle 32, and the head 30 An XY robot 40 that moves in the XY directions and a control device 70 (see FIG. 3) that is built in the base 11 and controls the entire mounting machine are provided.

  The base 11 of the component mounting machine 10 is provided with the control device 70 by heat exchange with a cooling fan or refrigerant (water) that cools the control device 70 (CPU 71 and servo controller 78 described later) by heat exchange with air. A cooling device 60 such as a cooling device for cooling is incorporated.

  Although not shown, the head 30 includes a Z-axis actuator that moves the suction nozzle 32 in the Z-axis (vertical) direction, and a θ-axis actuator that rotates the suction nozzle 32 around the Z-axis. A vacuum pump (not shown) communicates with the suction port of the suction nozzle 32. The suction nozzle 32 can suck the component P by the negative pressure from the vacuum pump acting on the suction port.

  As shown in FIG. 2, the XY robot 40 includes a pair of left and right Y-axis guide rails 43 provided on the upper portion of the main body frame 12 along the front-rear direction (Y-axis direction), and a pair of left and right Y-axis guide rails 43. A Y-axis slider 44 that can move along the Y-axis guide rail 43 in a state of being stretched over the X-axis, and an X-axis guide rail 41 provided on the lower surface of the Y-axis slider 44 along the left-right direction (X-axis direction) And an X-axis slider 42 that can move along the X-axis guide rail 41. The head 30 is attached to the X-axis slider 42, and the control device 70 can move the head 30 to an arbitrary position on the XY plane by driving and controlling the XY robot 40.

  As shown in FIG. 3, the control device 70 is configured as a microprocessor centered on a CPU 71, and includes a ROM 72, an HDD 73, a RAM 74, and an input / output interface 75 in addition to the CPU 71. These are electrically connected via a bus 76. The control device 70 is provided with a position signal from the X-axis position sensor 47 that detects the position of the X-axis slider 42, a position signal from the Y-axis position sensor 49 that detects the position of the Y-axis slider 44, and the head 30. An image signal from a mark camera (not shown) capable of imaging a reference mark attached to the substrate S, an image signal from a part camera 26 provided on the support base 14 and capable of imaging the component P adsorbed by the adsorption nozzle 32, and control The temperature signal from the temperature sensor 77 for detecting the temperature Te inside the apparatus 70, the sound signal from the microphone 79 for detecting the operation sound generated when the component mounter 10 (especially the XY robot 40) is driven, and the like are input / output. It is input via the interface 75. On the other hand, from the control device 70, a control signal to the component supply device 20, a control signal to the substrate transfer device 22, a drive signal to the X-axis actuator 50 (motor 54) that moves the X-axis slider 42, a Y-axis slider 44, a drive signal to the Y-axis actuator 51 (motor 55), a control signal to the servo controller 78 as a drive circuit for the X-axis actuator 50 and the Y-axis actuator 51, a drive signal to the head 30, and to the cooling device 60 And the like are output via the input / output interface 75. As shown in FIG. 3, the X-axis actuator 50 and the Y-axis actuator 51 are driven and controlled by ball screws 52 and 53 for screwing the X-axis slider 42 and the Y-axis slider 44, respectively, and a drive signal from the servo controller 78. The ball screw mechanism includes a motor (servo motor) 54 and 55 that rotationally drives the ball screws 52 and 53, respectively. In addition, the control device 70 is connected to the management device 80 so as to be capable of bidirectional communication, and exchanges data and control signals with each other.

  The management device 80 is a general-purpose computer, for example. As shown in FIG. 3, the management device 80 includes a CPU 81, a ROM 82, an HDD 83 that stores a production plan of a board, a RAM 84, an input / output interface 85, and the like. These are connected via a bus 86. The management device 80 receives an input signal from an input device 87 such as a mouse or a keyboard via the input / output interface 85. Further, the management device 80 outputs an image signal to the display 88 via the input / output interface 85. Here, the production plan of the board S means which parts are to be mounted on the board S in which order in each component mounting machine 10, and how many boards (mounting boards) S on which the parts are mounted are produced. This is a plan that defines such things. This production plan includes board data relating to a board to be produced, nozzle data relating to the suction nozzle 32 to be used, part data relating to a component to be mounted, mounting position data relating to a target mounting position of each component, and the like. The management apparatus 80 creates a production plan based on data input by the operator via the input device 87 and transmits the created production plan to each component mounter 10.

  Next, a state monitoring process for monitoring the operation of the management apparatus 80 configured as described above, in particular, the state of the component mounter 10 will be described. FIG. 4 is a flowchart illustrating an example of a management processing routine executed by the management device 80. This routine is repeatedly executed every predetermined time (for example, every several milliseconds or several tens of milliseconds).

  When the management processing routine is executed, the CPU 81 of the management device 80 determines whether or not the component mounter 10 is producing a mounting board (S100). When determining that the mounting board is not being produced, the CPU 81 determines whether or not the worker has instructed the start of production (S102). When determining that the start of production is instructed, the CPU 81 sets the control mode of the component mounter 10 (XY robot 40) to the position control mode (S104), and transmits the production plan (job) to the control device 70. The component P is sucked by the suction nozzle 32 and a mounting operation for mounting the component P on the target mounting position of the substrate S is instructed (S106). Here, the position control mode specifies the target position (target mounting position) in the X-axis direction and the Y-axis direction, and the position in the X-axis direction from the X-axis position sensor 47 matches the specified target position in the X-axis direction. At the same time, torque command values of the motors 54 and 55 are set by feedback control so that the Y-axis direction position from the Y-axis position sensor 49 matches the designated target position in the Y-axis direction, and the motors 54 and 55 (XY This is a control mode for driving and controlling the robot 40). After instructing the start of the mounting operation, the CPU 81 executes a temperature monitoring processing routine for monitoring the temperature inside the control device 70 of the component mounting machine 10 (S108), and ends the management processing routine.

  If the CPU 81 determines in S100 that the component mounter 10 is producing a mounting board, it executes a temperature monitoring processing routine (S108). As described above, since the management processing routine is repeatedly executed every predetermined time, the CPU 81 repeatedly executes the temperature monitoring processing routine every predetermined time during the production of the mounting board.

On the other hand, if the CPU 81 determines in S100 that the mounting board is not in production (for example, during setup change) and determines that the production start is not instructed in S102 , the component mounting machine 10 (XY robot 40) is abnormal. It is determined whether or not (failure) has been inspected (monitored) (S110), and if not inspected, whether or not a predetermined time (for example, one day) has passed since the previous inspection. Is determined (S112). When determining that the predetermined time has not elapsed since the previous inspection, the CPU 81 ends the management processing routine. On the other hand, when the CPU 81 determines that a predetermined time has elapsed since the previous inspection, the CPU 81 sets the control mode of the XY robot 40 to the speed control mode in order to inspect the drive system (XY robot 40) of the component mounter 10. (S114) The control device 70 is instructed to drive the XY robot 40 in the speed control mode (S116). Here, the speed control mode designates target speeds (constant speeds) in the X-axis direction and the Y-axis direction, and the movement speed in the X-axis direction calculated based on the position acquired a plurality of times from the X-axis position sensor 47 is It matches the designated target movement speed in the X-axis direction, and the Y-axis direction movement speed calculated based on the position acquired from the Y-axis position sensor 49 a plurality of times matches the designated target movement speed in the Y-axis direction. This is a control mode in which the torque command values of the motors 54 and 55 are set by feedback control to drive and control the motors 54 and 55 (XY robot 40). When the CPU 81 instructs to drive the XY robot 40 in this way, it executes a torque monitoring process routine (S118) and an operation sound monitoring process routine (S120), and ends the management process routine. When the CPU 81 determines that the inspection is being performed in S110, the torque monitoring process (S118) and the operation sound monitoring process (S120) are repeatedly executed until the inspection is completed.

  As described above, the temperature monitoring processing routine constantly monitors during production (during mounting operation), and the torque monitoring processing routine and the operation sound monitoring processing routine monitor every predetermined time when not in production. Hereinafter, details of the torque monitoring processing routine, the operation sound monitoring processing routine, and the temperature monitoring processing routine will be described in order.

  The torque monitoring processing routine of S118 determines the abnormality (failure) of the XY robot 40 by monitoring the torque Tr output from each motor 54, 55 (X-axis actuator, Y-axis actuator) of the XY robot 40 (inspection). And is executed according to the flowchart of FIG. The torque monitoring processing routine may individually monitor the torque output from the motor 54 (X-axis actuator) and monitor the torque output from the motor 56 (Y-axis actuator). It is good also as what is performed.

  When the torque monitoring process routine of FIG. 5 is executed, the CPU 81 of the management device 80 inputs the torque Tr output from the motors 54 and 55 from the control device 70 (S200). Here, the torque Tr may be a torque command value of the motors 54 and 55 set by feedback control in the speed control mode, or may be a torque detected by a torque sensor. When the torque is input, the CPU 81 determines whether the input torque Tr is less than the first threshold Tr1 (S202), whether it is less than the second threshold Tr2 that is lower than the first threshold Tr1 (S204), Respectively. Here, the first threshold value Tr1 indicates a lower limit value of the torque range indicating that an abnormality (failure) occurs in the XY robot 40, and the second threshold value Tr2 indicates that no abnormality (failure) occurs in the XY robot 40. However, the lower limit value of the torque range indicating that the signs are beginning to appear. The first threshold value Tr1 and the second threshold value Tr2 can be appropriately determined in consideration of the specifications of the motors 54 and 55, individual differences, and the like.

  If the CPU 81 determines that the torque Tr is less than the first threshold Tr1 and less than the second threshold Tr2, the CPU 81 further calculates a torque gradient ΔTr (S206), and whether or not the calculated torque gradient ΔTr is less than the predetermined gradient α. Is determined (S208). Here, the torque gradient ΔTr can be calculated, for example, by differentiating the torque Tr input in S200. The predetermined gradient α is a threshold value for determining a sudden change (rapid increase) in the torque Tr. If the CPU 81 determines that the torque gradient ΔTr is less than the predetermined gradient α, the CPU 81 determines whether or not the inspection end time has arrived (S212). If the CPU 81 determines that the inspection end time has not arrived, the torque monitoring processing routine is executed. Exit once.

  If the CPU 81 determines that the torque Tr is greater than or equal to the first threshold value Tr1 in S202, the inspection ends regardless of the inspection end timing (S214), and the drive system (XY robot 40) determines that the state is abnormal. At the same time (S216), the controller 70 is instructed to stop the component mounter 10 abnormally (S218), and the torque monitoring processing routine is terminated. When the component mounter 10 is abnormally stopped, the stopped state is maintained unless the operator performs a predetermined release operation.

  Further, the CPU 81 determines that the torque Tr is less than the first threshold value Tr1 and greater than or equal to the second threshold value Tr2 in the processes of S202 and S204, or the torque Tr is less than the second threshold value Tr2 in the processes of S204 to S208. If it is determined that the torque gradient ΔTr is equal to or greater than the predetermined gradient α, the abnormality sign flag is turned on (S210), and the process proceeds to S212.

  If the CPU 81 determines that the inspection end time has come in the process of S212, the CPU 81 ends the inspection (S220), and determines whether or not the abnormality sign flag is off (S222). When determining that the abnormality sign flag is off, the CPU 81 determines that the state of the drive system (XY robot 40) is normal (S224), and ends the torque monitoring processing routine. On the other hand, if the CPU 81 determines that the abnormality sign flag is on, the CPU 81 determines that the state of the drive system (XY robot 40) is an abnormality sign state (S226), and displays a warning recommending maintenance to the operator on the display 88 or the like. (S228), and the torque monitoring process routine is terminated. The warning is performed by displaying on the display 88 the location (motors 54, 55) where the sign of abnormality has occurred, the contents of necessary maintenance work, and the like.

  FIG. 6 is an explanatory diagram showing a state of the secular change of the torque Tr. As described above, the XY robot 40 moves the X-axis slider 42 along the X-axis guide rail 41 by driving the motor 54, and moves the Y-axis slider 44 along the Y-axis guide rail 43 by driving the motor 56. Let me. The torque required to move the sliders 42 and 44 gradually increases with age (see FIG. 6A). However, for example, if foreign matters such as dust adhere to the guide rails 41 and 43 or the bearings of the motors 54 and 55 are deteriorated, the torque may change suddenly (ΔTr> α) (FIG. 6 ( b)). Further, depending on individual differences of the motors 54, 55, etc., the pace of deterioration (torque increase) may be faster than usual (see FIG. 6C). If such a state is left unattended, the component mounting machine 10 may cause a suction error or suction shift when sucking a component to the suction nozzle 32, or a mounting shift may occur when mounting the component on the substrate S. There is a risk that production must be stopped. In the present embodiment, the torque Tr output from the motors 54 and 55 is periodically monitored, and the abnormal sign state shown in FIGS. 6B and 6C is determined at an early stage. Before an abnormality (failure) occurs, the operator is encouraged to perform maintenance work.

  The operation sound monitoring process routine of S120 is to determine the abnormality (failure) of the drive system (XY robot 40) by monitoring the operation sound generated when the XY robot 40 is driven. Executed according to In the operation sound monitoring process routine of FIG. 7, the same steps as those in the torque monitoring process routine of FIG.

  When the operation sound monitoring process routine of FIG. 7 is executed, the CPU 81 of the management device 80 inputs the operation sound from the microphone 79 from the control device 70 (S300), and the component level for each frequency of the input operation sound (S300). Frequency analysis is performed to check (size) by an analysis method such as Fourier analysis (S302). Then, the CPU 81 determines whether or not the level (magnitude) of the operation sound (abnormal sound) in the abnormal frequency band indicating that an abnormality (failure) has occurred in the XY robot 40 is equal to or higher than a predetermined abnormality level (S304). Whether or not the level of the operating sound in the abnormal frequency band is equal to or higher than the abnormal sign level is determined (S306). Here, the abnormality sign level is a level at which it is determined that an abnormality (failure) has not occurred in the XY robot 40 but the sign is beginning to appear, and is lower than the abnormality level and higher than the normal level.

  If the CPU 81 determines that the level of the operating sound in the abnormal frequency band is less than the abnormal level and the abnormal sign level, it determines whether or not the test end time has arrived (S212), and the test end time has not come. If determined, the operation sound monitoring processing routine is once terminated.

  If the CPU 81 determines in S304 that the level of the operating sound in the abnormal frequency band is equal to or higher than the abnormal level, the inspection ends (S214) regardless of the inspection end time, and the state of the drive system (XY robot 40) is abnormal. (S216), the controller 70 is instructed to stop abnormally (S218), and the operation sound monitoring process routine is terminated.

  If the CPU 81 determines that the operation sound level in the abnormal frequency band is less than the abnormal level and equal to or higher than the abnormal sign level in the processes of S304 and S306, the CPU 81 turns on the abnormal sign flag (S210) and proceeds to the process of S212. .

  If the CPU 81 determines that the inspection end time has come in the process of S212, the inspection ends (S220), and if the abnormality sign flag is off (S222), the state of the XY robot 40 is normal. If it is determined (S224) and the abnormal sign flag is on (S222), it is determined that the state of the XY robot 40 is in the abnormal sign state (S226), and a predetermined warning that prompts the operator to perform maintenance work is output. (S228), and the operation sound monitoring process routine is terminated.

  The temperature monitoring processing routine of S108 is to determine an abnormality (failure) of the control device 70 by monitoring the temperature Te inside the control device 70, and is executed according to the flowchart of FIG. In the temperature monitoring process routine of FIG. 8, the same step numbers are assigned to the same processes as those of the torque monitoring process routine of FIG.

  When the temperature monitoring processing routine of FIG. 8 is executed, the CPU 81 of the management device 80 inputs the temperature Te detected by the temperature sensor 77 from the control device 70 (S400), and the input temperature Te is less than the first threshold Te1. (S402) and whether it is less than the second threshold Te2 that is lower than the first threshold Te1 (S404). Here, the first threshold value Te1 indicates a lower limit value of a temperature range in which it is determined that an abnormality (failure) has occurred in the control device 70 (CPU 71, servo controller 78, etc.) or the cooling device 60 that cools the control device 70. 2 threshold value Te2 shows the lower limit value of the temperature range in which it is determined that an abnormality (failure) has not occurred in the control device 70 or the cooling device 60 but the sign is beginning to appear.

  If the CPU 81 determines that the temperature Te is less than the first threshold Te1 and less than the second threshold Te2, the CPU 81 further calculates a temperature gradient ΔTe (S406), and whether or not the calculated temperature gradient ΔTe is less than a predetermined gradient β. Is determined (S408). Here, the temperature gradient ΔTe can be calculated, for example, by differentiating the temperature Te input in S400. The predetermined gradient β is a threshold value for determining a sudden change (rapid increase) in the temperature Te. When determining that the temperature gradient ΔTe is less than the predetermined gradient β, the CPU 81 determines that the control device 70 and the cooling device 60 are in a normal state (S224), and ends the temperature monitoring processing routine.

  When determining that the temperature Te is equal to or higher than the first threshold value Te1 in S402, the CPU 81 determines that the state of the control device 70 and the cooling device 60 is abnormal (S216) and causes the component mounter 10 to abnormally stop. The controller 70 is instructed (S218), and the temperature monitoring processing routine is terminated.

  In addition, the CPU 81 determines that the temperature Te is less than the first threshold Te1 and greater than or equal to the second threshold Te2 in the processes of S402 and S404, or the temperature Te is less than the second threshold Te2 in the processes of S404 to S408. If it is determined that the temperature gradient ΔTe is equal to or greater than the predetermined gradient β, it is determined that the state of the control device 70 or the cooling device 60 is an abnormal sign state (S226), and a predetermined warning that prompts the operator to perform maintenance work is output. In step S228, the temperature monitoring process routine ends.

  The management apparatus 80 according to the embodiment described above is driven based on the torque Tr output from the motors 54 and 55 provided in the drive system (XY robot 40) of the component mounter 10 and the operation sound of the drive system (XY robot 40). It is determined whether the system (XY robot 40) is in a normal state, in an abnormal state, or in an abnormal sign state before reaching the abnormal state. If it is determined that there is an abnormal sign state, a warning that prompts the operator to perform maintenance work is output. Further, the management device 80 determines whether the drive system (XY robot 40) is in a normal state, in an abnormal state, or in an abnormal sign state before reaching the abnormal state based on the temperature Te in the control device 70. If it is determined that the component mounter 10 is in an abnormal state, the component mounter 10 is abnormally stopped, and if it is determined that the component is in an abnormal sign state, a warning that prompts the operator to perform maintenance work is output. Thereby, the worker can grasp the sign of abnormality before the component mounter 10 is abnormally stopped by the warning. An operator can suppress an abnormal stop during production by performing necessary maintenance work between production of the component mounter 10, and thus can improve the operation rate.

  In addition, the management device 80 according to the embodiment has the case where the torque Tr is less than the first threshold Tr1 and greater than or equal to the second threshold Tr2, and the torque gradient ΔTr is greater than or equal to the predetermined gradient α even when the torque Tr is less than the second threshold Tr2. In some cases, it is determined that the state of the drive system (XY robot 40) is an abnormal sign state, so the state can be determined more accurately by the torque Tr from the motors 54 and 55. Further, since the management device 80 determines that the state of the drive system (XY robot 40) is the abnormal sign state when the level of the operation sound in the abnormal frequency band is less than the abnormal level and is equal to or higher than the abnormal sign level, the operation sound Thus, the state can be determined more accurately. Further, in the management device 80, the temperature gradient ΔTe is equal to the predetermined gradient β when the temperature Te inside the control device 70 is less than the first threshold Te1 and greater than or equal to the second threshold Te2, and even when the temperature Te is less than the second threshold Te2. In the above case, it is determined that the state of the control device 70 or the cooling device 60 that cools the control device 70 is in an abnormal sign state, so that the state can be determined more accurately. Further, since the torque monitoring process and the operation sound monitoring process are performed by driving the XY robot 40 under certain conditions in the speed control mode for inspection, the state of the XY robot 40 can be correctly determined. Further, since the torque monitoring process and the operation sound monitoring process are performed every predetermined time when not in production, the state of the drive system (XY robot 40) can be determined at an appropriate frequency without reducing the operating rate. it can.

  In the embodiment, in the torque monitoring processing routine, the management device 80 determines that the abnormality sign state is present when the torque Tr is equal to or greater than the second threshold value Tr2, but the present invention is not limited to this. It may be determined as an abnormal sign state when the state of the second threshold value Tr2 or more continues for a certain period or more, or the number of times the torque Tr becomes the second threshold value Tr2 or more is counted and counted within the certain period. When the number of times reaches a predetermined number, it may be determined that there is an abnormal sign state. In addition, the management device 80 determines that the abnormal sign state is present when the torque gradient ΔTr is equal to or greater than the predetermined gradient α. However, the management device 80 is not limited to this. For example, the torque gradient ΔTr is equal to or greater than the predetermined gradient α. When the number of counts within a certain period reaches a predetermined number, or when a state where the torque gradient ΔTr is equal to or greater than the predetermined gradient α continues for a certain period or more, it is determined as an abnormal sign state. It may be a thing.

  In the embodiment, in the operation sound monitoring processing routine, the management device 80 determines that an abnormal sign state is present when the level of the operational sound in the abnormal frequency band is equal to or higher than the abnormal sign level. However, the present invention is not limited to this. Rather, it may be determined as an abnormal sign state when a state where the operating sound level in the abnormal frequency band is equal to or higher than the abnormal sign level continues for a certain period of time, or the operating sound level in the abnormal frequency band may be The number of times when the abnormality sign level is exceeded may be counted, and the abnormality sign state may be determined when the number of times counted within a certain period reaches a predetermined number.

  In the embodiment, in the temperature monitoring processing routine, the management device 80 determines that the abnormality sign state is present when the temperature Te is equal to or higher than the second threshold Te2, but the present invention is not limited to this, and the temperature Te is not limited to this. It may be determined as an abnormal sign state when the state of the second threshold Te2 or more continues for a certain period or more, or the number of times the temperature Te becomes the second threshold Te2 or more is counted and counted within the certain period. When the number of times reaches a predetermined number, it may be determined that there is an abnormal sign state. Further, the management device 80 is determined to be in the abnormal sign state when the temperature gradient ΔTe is equal to or greater than the predetermined gradient β, but is not limited thereto, and for example, the temperature gradient ΔTe is equal to or greater than the predetermined gradient β. When the number of counts within a certain period reaches a predetermined number, or when a state where the temperature gradient ΔTe is equal to or greater than the predetermined gradient β continues for a certain period or more, it is determined as an abnormal sign state. It may be a thing.

  As described above, the management device 80 is not limited to the one that immediately determines the abnormal sign state when the monitoring parameters such as the torque, the operation sound, and the temperature are within the abnormal sign area, and the monitoring parameter enters the abnormal sign area. It may be determined as an abnormal sign state when the state in which the monitoring parameter has continued for a certain period or when the number of times the monitoring parameter has entered the abnormal sign area becomes a predetermined number of times within the certain period. The monitoring parameter change gradient is not limited to that immediately when an abnormal sign state is determined, but a state in which the monitoring parameter change gradient is equal to or greater than the predetermined gradient continues for a certain period of time. Or when the number of times that the gradient of the change in the monitoring parameter becomes equal to or greater than the predetermined gradient becomes equal to or greater than the predetermined number of times within a certain period, the abnormal sign state may be determined.

  In the embodiment, the torque monitoring process, the operation sound monitoring process, and the temperature monitoring process are executed as the state monitoring process for monitoring the state of the component mounter 10, but some of them may not be executed. In addition, a vibration detection sensor that detects vibration of the component mounter 10 (XY robot 40) is provided, and the state of the component mounter 10 is in a normal state, abnormal state, or abnormal sign based on the detected vibration level (magnitude). It is good also as what determines in which state of a state. In this case, for example, as in the operation sound monitoring process, the management device 80 determines that the component mounter 10 is in an abnormal state when the detected vibration level is equal to or higher than the abnormal level, and is detected. When the vibration level is less than the abnormal level and equal to or higher than the abnormal sign level, the component mounter 10 may be determined to be in the abnormal sign state.

  In the embodiment, the management device 80 executes the temperature monitoring process during production, but may execute it when not in production. In this case, if the management device 80 is provided with a temperature sensor for detecting the temperature of the heat generating components such as the motors 54 and 55 provided in the drive system (XY robot 40), the “torque” in the torque monitoring processing routine of FIG. By substituting “temperature”, the temperature of the drive system can be monitored by the same processing.

  In the embodiment, the rotary motors 54 and 55 and the ball screw mechanism are used as the X-axis actuator 50 and the Y-axis actuator 51. However, the present invention is not limited to this. For example, a linear motor may be used. Good. Even in this case, the state of the XY robot can be determined based on the thrust of the linear motor.

  In the embodiment, the abnormality (failure) of the XY robot 40 and the abnormality sign state before the abnormality is determined, but the present invention is not limited to this, and any other drive system abnormality and abnormality sign state are not limited to this. It is good also as what determines. For example, the abnormality (failure) and the abnormal sign state of the head 30 may be determined, or the abnormality (failure) and the abnormal sign state of the component supply device 20 may be determined. For example, when a motor is provided as the Z-axis actuator or the θ-axis actuator of the head 30, the management device 80 can execute the same process as the torque monitoring process routine of FIG. 5 using the torque output from the motor. The operation sound emitted from the head 30 can be used to execute processing similar to the operation sound monitoring processing routine of FIG. The same applies to a case where a feed motor for feeding parts is provided as the part supply device 20 (for example, a tape feeder).

  In the embodiment, the state of the drive system (XY robot 40) is detected when a predetermined time has elapsed since the previous inspection, not during production. However, the present invention is not limited to this. Alternatively, when a predetermined time has elapsed since the previous inspection, production may be temporarily interrupted to detect the state of the drive system (XY robot 40).

  Here, the correspondence between the main elements of the present embodiment and the main elements of the invention described in the column of means for solving the problems will be described. That is, the management device 80 corresponds to the “status monitoring device”, and the CPU 71, torque sensor, microphone 79, and the like of the control device 70 that sets the torque command value correspond to “driving status detection means”, and the torque monitoring processing of FIG. The CPU 81 of the management device 80 that executes the processes of S200 to S216, 220 to S226 of the routine and the processes of S300 to S306, S210 to S216, and S220 to S226 of the operation sound monitoring process routine of FIG. The CPU 81 of the management device 80 that executes the process of S218 of the monitoring process routine and the process of S218 of the operation sound monitoring process routine corresponds to “abnormal stop means”, and performs the process of S228 of the torque monitoring process routine and S228 of the operation sound monitoring process routine. The CPU 81 and the display 88 of the management device 80 to be executed correspond to “warning means”. Further, the CPU 81 of the management device 80 that executes the processing of S200 of the torque management processing routine corresponds to “torque detection estimation means”. The microphone 79 corresponds to “sound detection means”. Further, the temperature sensor 77 corresponds to “temperature detection means”. Further, the temperature sensor 77 corresponds to “temperature state detection means”, and the CPU 81 of the management device 80 that executes the processes of S400 to S408, S216, S224, and S226 of the temperature monitoring processing routine of FIG. 8 corresponds to “determination means”. The CPU 81 of the management apparatus 80 that executes the process of S218 of the temperature monitoring process routine corresponds to “abnormal stopping means”, and the CPU 81 of the management apparatus 80 that executes the process of S228 of the temperature monitoring process routine and the display 88 are “ This corresponds to “warning means”.

  In addition, this invention is not limited to the Example mentioned above at all, and as long as it belongs to the technical scope of this invention, it cannot be overemphasized that it can implement with a various aspect.

The present invention can be used in the manufacturing industry of a state monitoring device according to a component mounting machine.

  DESCRIPTION OF SYMBOLS 1 Component mounting system, 10 Component mounting machine, 11 Base, 12 Main body frame, 14 Support stand, 20 Component supply apparatus, 22 Substrate conveyance apparatus, 26 Parts camera, 30 Head, 32 Suction nozzle, 40 XY robot, 41 X axis Guide rail, 42 X axis slider, 53 Y axis guide rail, 44 Y axis slider, 47 X axis position sensor (encoder), 49 Y axis position sensor (encoder), 50 X axis actuator, 51 Y axis actuator, 52, 53 Ball screw, 54, 55 motor, 60 cooling device, 70 control device, 71 CPU, 72 ROM, 73 HDD, 74 RAM, 75 I / O interface, 76 bus, 77 temperature sensor, 78 servo controller, 79 microphone (microphone), 80 management device, 81 CPU, 82 R OM, 83 HDD, 84 RAM, 85 I / O interface, 86 bus, 87 input device, 88 display.

Claims (5)

A state monitoring device that monitors the state of a component mounting machine that performs a mounting operation of picking up a component with driving of a drive system and mounting it on a substrate,
Drive state detection means for detecting the drive state of the drive system;
A determination means for determining whether the detected drive state of the drive system is in a normal state, an abnormal state, or an abnormal sign state before reaching the abnormal state;
An abnormal stopping means for abnormally stopping the component mounter when it is determined that the detected driving state of the drive system is in the abnormal state;
Warning means for outputting a predetermined warning when it is determined that the detected drive state of the drive system is in the abnormal sign state;
Equipped with a,
The determination means is when the component mounting machine is not in production of the board and the start of production is not instructed, and when the predetermined time has elapsed since the previous state determination, the drive state detection means Performing the state determination based on the detected drive state of the drive system;
Status monitoring device comprising a call. The state monitoring device according to claim 1,
The state monitoring apparatus characterized in that the determination unit performs the state determination based on a drive state of the drive system detected by the drive state detection unit during setup change of the component mounter . The state monitoring device according to claim 1 or 2,
The drive system has an XY robot that moves the head in the XY direction, performs component mounting operation in a position control mode in which the motor is driven and controlled so that the position in the XY direction matches the target position using feedback control,
The drive state detection means includes output torque detection estimation means for detecting or estimating output torque output from the motor,
The determination means causes the drive system to perform an inspection operation in a speed control mode in which the motor is driven and controlled so that the speed in the XY direction matches a target speed using feedback control, and the torque detection estimation is performed during the inspection operation. A state monitoring apparatus that performs the state determination based on an output torque detected or estimated by a means or a change in the output torque . The state monitoring device according to any one of claims 1 to 3,
The drive state detection means has sound detection means for detecting sound emitted from the drive system,
The state monitoring apparatus characterized in that the determination unit performs the state determination based on a frequency characteristic of the detected sound . The state monitoring device according to any one of claims 1 to 4,
The drive state detection means includes temperature detection means for detecting the temperature of the drive system,
The determination means performs the state determination based on the detected temperature of the drive system or a change in the temperature.
Status monitoring device comprising a call.