JP2005183572A - Device, system, and method for mounting electronic component, device and method for screen printing and device and method for reflow - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To detect an abnormality in the operation of an electronic component mounting device when an electronic component mounting system runs. <P>SOLUTION: The electronic component mounting device 11 of the electronic component mounting system comprises a board transfer mechanism 12 which holds and transfers a circuit board 9; a mounting mechanism 14 which mounts an electronic component on the circuit board 9; a component supply 13 which supplies an electronic component to the mounting mechanism 14; an operation sound capturing section 5 which captures operation sounds generated by those mechanisms as they operate; a memory 61 which stores data of a standard operation sound that is generated by the mechanisms operating normally, and data of an abnormal operation sound that is generated when the mechanisms operate abnormally; and a detecting circuit 62 which detects the abnormal operation of the board transfer mechanism 12, the mounting mechanism 14, or the component supply section 13 on the basis of an operation sound captured by the operation sound capturing section 5 (captured operation sound data). The electronic component mounting device 11 compares captured operation sound data with the standard operation sound data to detect an abnormal operation, and then with the abnormal operation sound data to specify the type of the abnormal operation. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a technique for mounting electronic components on a circuit board.

  Conventionally, in many mounting systems for mounting electronic components on a circuit board such as a printed circuit board, a printing apparatus that prints a solder paste on the circuit board, and a mounting apparatus that mounts the electronic components on the solder paste applied on the circuit board 2. Description of the Related Art A reflow apparatus is used that performs reflow on a circuit board on which an electronic component is mounted (a process in which a solder paste is melted and then solidified by heating and cooling the circuit board to fix the electronic component to the circuit board). In such a mounting system, the mounting (mounting) state of the electronic component is usually inspected by a dedicated inspection device after all the mounting of the electronic component on one circuit board is completed or after the reflow is completed. Has been done.

  In recent years, technologies for mounting electronic parts via anisotropic conductive films and pastes and mounting electronic parts having bumps via non-conductive films and pastes are also used in various fields. Yes.

  On the other hand, a technique for detecting an abnormal operation of an electronic component mounting apparatus while the apparatus is operating has also been proposed. For example, in Patent Document 1, a detection signal is applied to a motor that drives the apparatus, and the characteristics of the feedback signal fed back from the motor are compared with the signal characteristics that are registered in advance, thereby correcting the abnormal operation of the apparatus. Techniques for detection are disclosed.

There has also been proposed a technique for detecting an abnormal operation of a device by measuring vibrations during operation of the device. For example, Patent Document 2 discloses a technique for detecting an insertion abnormality by measuring vibration of a device at the time of piston insertion in a piston insertion device for inserting a piston into a cylindrical hole. Patent Document 3 discloses a system that monitors the operating state of a device using a sensor that measures multidimensional information such as vibration in a rotating device such as an exhaust pump of a semiconductor manufacturing apparatus.
JP-A-4-259299 Japanese Patent Laid-Open No. 7-9271 JP 2000-259222 A

  By the way, in the mounting system which mounts an electronic component on a circuit board, the mounting abnormality of an electronic component arises by the operation | movement abnormality of various mechanisms of each apparatus which comprises a system. For example, in a mounting apparatus for mounting electronic components, the electronic components may be mounted at a position shifted from a predetermined position on a circuit board due to vibration of a mechanism that moves the mounting head. In addition, there is a case where the electronic component is not properly mounted on the circuit board due to a shift in the timing of suction or release of the electronic component of the mounting head.

  When the mounting state of the electronic component is inspected after all the mounting of the electronic component to the circuit board is completed or the reflow is completed as in the past, it was discovered that the electronic component is not mounted or mounted properly. However, it is difficult to grasp the exact cause of the abnormality caused by which operation abnormality of which mechanism. On the other hand, providing all dedicated mechanisms for detecting abnormalities for each type of abnormal operation for all mechanisms of the mounting system increases the number and types of sensors, and the device. It is not realistic with a major design change.

  The present invention has been made in view of the above problems, and in an electronic component mounting system for mounting electronic components on a circuit board, abnormal operation of the device by a simple and versatile technique that does not involve significant design changes of the device. The main purpose is to detect during operation.

  The invention according to claim 1 is an electronic component mounting apparatus for mounting an electronic component on a circuit board, wherein the electronic component is mounted on a circuit board holding unit that holds the circuit board and the circuit board held by the board holding unit. A mounting mechanism, a component supply unit that supplies an electronic component to the mounting mechanism, an operation sound acquisition unit that acquires an operation sound generated during operation of the substrate holding unit, the mounting mechanism, or the component supply unit, and the operation A detection unit configured to detect an operation abnormality of the substrate holding unit, the mounting mechanism, or the component supply unit based on the operation sound acquired by the sound acquisition unit.

  A second aspect of the invention is the electronic component mounting apparatus according to the first aspect, wherein a standard operation sound when the substrate holding unit, the mounting mechanism, or the component supply unit normally operates is stored in advance. A storage unit is further provided, and the detection unit detects the operation abnormality by comparing the operation sound acquired by the operation sound acquisition unit with the standard operation sound.

  A third aspect of the present invention is the electronic component mounting apparatus according to the first aspect, wherein a plurality of predetermined types of operation abnormality that may occur in the substrate holding unit, the mounting mechanism, or the component supply unit are provided. A storage unit that stores a plurality of abnormal operation sounds that are generated when the operation is abnormal, and the detection unit acquires the operation sound acquired by the operation sound acquisition unit and the plurality of abnormal operations stored in the storage unit. The operation abnormality is detected by collating with sound and the type of the operation abnormality is specified.

  According to a fourth aspect of the present invention, in the electronic component mounting apparatus according to the third aspect, the mounting operation of the electronic component on the circuit board is stopped based on the type of the operation abnormality identified by the detection unit. And / or a control unit that selects and executes notification to the worker.

  According to a fifth aspect of the present invention, in the electronic component mounting apparatus according to any one of the first to fourth aspects, the electronic component is mounted on the circuit board held by the board holding portion by the mounting mechanism. The operation sound generated at the time is acquired by the operation sound acquisition unit.

  The invention according to claim 6 is the electronic component mounting apparatus according to any one of claims 1 to 4, wherein a tape member in which a plurality of electronic components are arranged and stored is attached to the component supply unit, and the mounting is performed. An operation sound generated when the electronic component is sent out together with the tape member by the component supply unit to a predetermined supply place for supplying the electronic component to the mechanism is acquired by the operation sound acquisition unit.

  A seventh aspect of the present invention is the electronic component mounting apparatus according to any one of the first to fourth aspects, wherein a tape member in which a plurality of electronic components are arranged and accommodated is attached to the component supply unit, and the component The supply unit includes a cutting unit that cuts and removes a portion of the tape member where the electronic component has been supplied to the mounting mechanism, and an operation sound that is generated when the tape member is cut by the cutting unit, Acquired by the operation sound acquisition unit.

  Invention of Claim 8 is the electronic component mounting apparatus in any one of Claim 1 thru | or 4, Comprising: The said mounting mechanism receives the electronic component from the said component supply part, The component holding part which hold | maintains, A moving mechanism that moves the component holding portion relative to the circuit board held by the substrate holding portion in a direction along the main surface of the circuit board, and the component holding portion is moved by the moving mechanism. The operation sound generated during the operation is acquired by the operation sound acquisition unit.

  Invention of Claim 9 is an electronic component mounting apparatus in any one of Claim 1 thru | or 4, Comprising: The said mounting mechanism receives the electronic component from the said component supply part, The component holding part which hold | maintains, A rotating mechanism for rotating the component holding unit, and an operation sound generated when the component holding unit is rotated by the rotating mechanism is acquired by the operating sound acquisition unit.

  A tenth aspect of the present invention is the electronic component mounting apparatus according to any one of the first to fourth aspects, wherein the mounting mechanism receives and holds an electronic component from the component supply unit, and And an operating mechanism that raises and lowers the component holding unit, and an operation sound that is generated when the component holding unit is moved up and down by the elevating mechanism is acquired by the operating sound acquisition unit.

  An eleventh aspect of the present invention is the electronic component mounting apparatus according to any one of the first to fourth aspects, wherein the mounting mechanism receives the electronic component from the component supply unit and holds it by vacuum suction. The operation sound that is generated when the electronic component is adsorbed by the component holding unit is acquired by the operation sound acquisition unit.

  The invention according to claim 12 is the electronic component mounting apparatus according to claim 11, wherein the mounting mechanism further includes a switching valve that switches between suction and blow of the electronic component by the component holding portion, and the operation sound. An operation sound generated when the switching valve is operated is acquired by the acquisition unit.

  According to a thirteenth aspect of the present invention, there is provided a screen printing apparatus for printing a solder paste on a circuit board through a mask in which an opening of a printed pattern is formed, the board holding unit holding the circuit board, and the circuit board on the circuit board A squeegee that fills the opening of the mask with the solder paste on the mask by moving relative to the mask in a predetermined direction along a main surface of the mask held by the mask, and the squeegee in the predetermined direction Acquired by the squeegee moving mechanism that moves relative to the mask, the operation sound acquisition unit that acquires the operation sound generated during the operation of the substrate holding unit or the squeegee movement mechanism, and the operation sound acquisition unit. A detection unit that detects an abnormal operation of the substrate holding unit or the squeegee moving mechanism based on an operation sound.

  The invention according to claim 14 is the screen printing apparatus according to claim 13, wherein the operation sound generated while the squeegee moves while the squeegee is in contact with the mask is caused by the action of the action. Acquired by the sound acquisition unit.

  According to a fifteenth aspect of the present invention, there is provided a reflow apparatus for performing reflow on a circuit board on which electronic components are mounted on a printed solder paste, the board transport mechanism transporting the circuit board along a predetermined transport path; A heat source, a blower mechanism that guides the gas heated by the heat source to a circuit board that is being transported by the transport mechanism, and an operation sound acquisition unit that acquires an operation sound generated when the substrate transport mechanism or the blower mechanism is operated. And a detection unit that detects an abnormal operation of the substrate transport mechanism or the blower mechanism based on the operation sound acquired by the operation sound acquisition unit.

  The invention according to claim 16 is an electronic component mounting system for mounting an electronic component on a circuit board, and a plurality of devices for performing processing related to mounting of the electronic component, and an operation for acquiring operation sounds of the plurality of devices. A sound acquisition unit, a detection unit that detects an operation abnormality of the plurality of devices based on the operation sound acquired by the operation sound acquisition unit, and information related to the operation abnormality detected by the detection unit is stored. And a storage unit.

  The invention according to claim 17 is the electronic component mounting system according to claim 16, wherein a control signal is sent to another device when an abnormal operation of any of the plurality of devices is detected by the detection unit. Is further provided.

  The invention according to claim 18 is the electronic component mounting system according to claim 16 or 17, wherein a combination of the type of operation abnormality and the corresponding worker is stored in advance for each of a plurality of types of operation abnormality. The apparatus further includes a storage unit, and an abnormality notification unit that notifies the operator corresponding to the type of operation abnormality detected by the detection unit to the operation abnormality.

  The invention according to claim 19 is the electronic component mounting system according to claim 17, wherein the plurality of devices include a plurality of electronic component mounting devices for mounting electronic components on a circuit board, and the detection unit When an operation abnormality indicating inoperability is detected in any of the plurality of electronic component mounting apparatuses, the operation of the plurality of electronic component mounting apparatuses is changed by the system control unit.

  The invention according to claim 20 is an electronic component mounting method for mounting an electronic component on a circuit board, comprising: a) a step of holding the circuit board in a predetermined position by the substrate holding portion; and b) the electronic component being a component supply portion. C) a step of supplying the electronic component to the circuit board, d) a step of mounting the electronic component on the circuit board, and d) of the substrate holding part, the component supply unit or the mounting mechanism in the steps a) to c). A step of acquiring an operation sound generated along with the operation; and e) a step of detecting an operation abnormality of the substrate holding unit, the mounting mechanism, or the component supply unit based on the operation sound.

  The invention according to claim 21 is a screen printing method for printing a solder paste on a circuit board through a mask in which an opening of a printed pattern is formed, and a) the circuit board is held at a predetermined position by the board holding part. B) a step of bringing the circuit board into contact with the lower surface of the mask; and c) moving the squeegee relative to the mask in a predetermined direction along the main surface of the mask by a squeegee moving mechanism. A step of filling the solder paste on the mask into the opening of the mask; and d) obtaining an operation sound generated in accordance with the operation of the substrate holding part or the squeegee moving mechanism in the steps a) to c). And e) a step of detecting an operation abnormality of the substrate holding unit or the squeegee moving mechanism based on the operation sound.

  The invention according to claim 22 is a reflow method for performing reflow on a circuit board having electronic components mounted on a printed solder paste, wherein a) the circuit board is moved along a predetermined transport path by a substrate transport mechanism. A step of carrying; b) a step of introducing the gas heated by the blower mechanism to a circuit board being carried by the carry mechanism; and c) the substrate carrying mechanism or the blower mechanism in the steps a) and b). And d) a step of detecting an operation abnormality of the substrate holding unit or the air blowing mechanism based on the operation sound.

  According to the first to twelfth and twentieth aspects of the present invention, it is possible to detect an abnormal operation during the operation of the electronic component mounting apparatus without a significant design change of the apparatus.

  According to the invention of claim 3, the operation abnormality of the electronic component mounting apparatus and the type of the operation abnormality can be easily detected. According to the invention of claim 4, when the operation abnormality is detected, the electronic component mounting is performed as necessary. The operation of the device can be stopped.

  According to the fifth aspect of the present invention, it is possible to detect a collision of the component holding portion against the circuit board or insufficient push-in.

  In the invention of claim 6, an abnormality in the operation of feeding the tape member can be detected, and in the invention of claim 7, an abnormality in the cutting operation of the tape member can be detected.

  In the invention of claim 8, an operation abnormality of the moving mechanism of the component holding unit can be detected, and in the invention of claim 9, an operation abnormality at the time of rotation of the component holding unit can be detected. In this invention, it is possible to detect an operation abnormality when the component holding portion is raised and lowered, and in the invention of claim 11, it is possible to detect an abnormal absorption of the electronic component by the component holding portion.

  In the twelfth aspect of the present invention, it is possible to detect an abnormal operation of the switching valve.

  According to the inventions of claims 13, 14 and 21, an operation abnormality can be detected during the operation of the screen printing apparatus without any significant design change of the apparatus. In the invention of claim 14, the operation during movement of the squeegee Abnormalities can be detected.

  In the inventions of claims 15 and 22, an abnormal operation can be detected during operation of the reflow apparatus.

  According to the sixteenth to nineteenth aspects of the present invention, it is possible to detect an operation abnormality of a plurality of apparatuses using a common technique during operation of the electronic component mounting system.

  In the invention of claim 17, when an operation abnormality is detected, the operation of another device can be automatically controlled. In the invention of claim 18, the electronic component mounting system can be efficiently maintained. In the invention of claim 19, even if any of the plurality of electronic component mounting apparatuses becomes inoperable, the mounting of the electronic components can be continued.

  FIG. 1 is a perspective view showing a configuration of an electronic component mounting apparatus 11 according to the first embodiment of the present invention. The electronic component mounting device 11 is a device that mounts fine electronic components on a solder paste applied on a circuit board 9 such as a printed circuit board.

  The electronic component mounting apparatus 11 holds the circuit board 9 and transports it in the (+ X) direction in FIG. 1. The electronic component mounting apparatus 11 mounts the electronic component on the circuit board 9 held at a predetermined position by the substrate transport mechanism 12. Two mounting mechanisms 14, a component supply unit 13 that supplies electronic components to the mounting mechanism 14, and a control unit 8 that controls these configurations are provided. The electronic component mounting apparatus 11 further includes an operation sound acquisition unit 5 that measures and acquires operation sounds generated when the substrate transport mechanism 12, the mounting mechanism 14, and the component supply unit 13 operate.

  The board transport mechanism 12 includes a pair of guide rails 121 extending in the X direction on the base 120, and the circuit board 9 held by the guide rails 121 is (+ X) direction by a belt provided in the guide rails 121. To be transported. The substrate transport mechanism 12 includes a transport drive unit 122 to which the guide rail 121 is connected. The transport drive unit 122 changes the distance between the pair of guide rails 121 and drives the belt in the guide rail 121. Do. A screen printing apparatus (not shown) for printing solder paste on the circuit board 9 is disposed on the (−X) side of the guide rail 121, and the circuit board 9 is passed from the screen printing apparatus to the guide rail 121.

  The two mounting mechanisms 14 are arranged above the guide rail 121 so as to be aligned in the X direction in FIG. 1 (that is, the direction along the moving direction of the circuit board 9). A head unit moving mechanism 142 that moves 141 in the XY plane (that is, in a direction along the main surface of the circuit board 9) is provided. The head portion moving mechanism 142 includes an X direction moving mechanism 1421 that moves the head portion 141 in the X direction, and a Y direction moving mechanism 1422 that moves the X direction moving mechanism 1421 in the Y direction. The direction moving mechanism 1422 uses a linear motor (not shown) as a drive source. In FIG. 1, illustration of a frame that supports the mounting mechanism 14 and the like is omitted.

  The component supply unit 13 includes a plurality of component cassettes 131 arranged in the X direction. Each component cassette 131 includes a reel 132 that is disposed on the (+ Y) side of the head portion 141 and to which a tape member on which a plurality of electronic components are arranged and stored is wound and attached. The component supply unit 13 is disposed on the lower (−Z) side of the plurality of reels 132, and supplies electronic components to the mounting mechanism 14 in the used portion of the tape member (that is, the tape member attached to the component cassette 131). A cutting part 133 is further provided for cutting and removing the finished part).

  The operation sound acquisition unit 5 includes a guide rail 121, a component cassette 131, a cutting unit 133, a head unit 141, a plurality of microphones 51 that acquire operation sound arranged near the head unit moving mechanism 142, and a changeover switch. And a sampling unit 52 provided with an A / D converter and the like. The microphone 51 is fixed to a frame not shown.

  The electronic component mounting apparatus 11 further includes an arithmetic unit 60, and a board in the arithmetic unit 60 stores a memory 61 that stores various information, information stored in the memory 61, and an operation sound acquisition unit 5. Based on the operation sound acquired by the microphone 51, a detection circuit 62 is provided for detecting an operation abnormality of the substrate transport mechanism 12, the mounting mechanism 14, or the component supply unit 13. In the electronic component mounting apparatus 11, operation sounds (hereinafter referred to as “standard operation sounds”) when the substrate transport mechanism 12, the mounting mechanism 14, and the component supply unit 13 operate normally are acquired in advance, and the standard operation sounds are acquired. It is stored in the memory 61 as data. The memory 61 further includes a plurality of operation sounds (hereinafter referred to as “abnormality”) that are generated when a plurality of predetermined types of operation abnormalities occur among the operation abnormalities that may occur in the substrate transport mechanism 12, the mounting mechanism 14, and the component supply unit 13. "Operation sound" is stored in advance as abnormal operation sound data.

  FIG. 2 is a bottom view of the mounting mechanism 14 as viewed from below ((−Z) side). The head portion 141 of the mounting mechanism 14 includes ten suction nozzles 145 that are component holding portions that receive and hold electronic components by vacuum suction from the component cassette 131 (see FIG. 1). As shown in FIG. 2, in the head portion 141, five suction nozzles 145 are arranged in one row along the X direction, and another row (five) suction nozzles 145 are parallel to the suction nozzle 145. Be placed. In the mounting mechanism 14, the head portion moving mechanism 142 (X direction moving mechanism 1421 and Y direction moving mechanism 1422) moves the head portion 141 in a direction along the main surface of the circuit board 9, so that the suction nozzle 145 is moved to the substrate transport mechanism. The circuit board 9 is moved relative to the circuit board 9 held at a predetermined position 12 (see FIG. 1).

  FIG. 3 is a right side view of the mounting mechanism 14 and the substrate transport mechanism 12 as viewed from the (−X) side. The head unit 141 includes a nozzle rotating mechanism 147 that rotates the suction nozzle 145 about an axis that faces the Z direction, and a nozzle lifting mechanism 146 that moves the suction nozzle 145 up and down (moves in the Z direction). The electronic component mounting apparatus 11 can mount the electronic component sucked by the suction nozzle 145 on the circuit board 9 in various directions by these mechanisms. In addition, the board transport mechanism 12 includes support pins 123 that support the circuit board 9 held at both ends by the guide rails 121 from the lower side at the mounting position of the electronic component. The support pins 123 are lifted by an elevating mechanism (not shown) to support the lower surface of the circuit board 9, and the circuit board 9 is bent downward ((−Z) side) by an impact when an electronic component is mounted. To prevent.

  FIG. 4 is a view showing one suction nozzle 145 and a nozzle shaft 1410 to which the suction nozzle 145 is attached. In FIG. 4, for convenience of illustration, a part of the nozzle shaft 1410 (part indicated by parallel oblique lines) is shown in a cross section. FIG. 4 also shows the switching valve 148 connected to the nozzle shaft 1410 and the microphone 51 that acquires the operation sound of the switching valve 148.

  The suction nozzle 145 is attached to the lower side ((−Z) side) of the nozzle shaft 1410 and can be replaced in accordance with the type of electronic component to be sucked. An opening 1450 for sucking electronic components by vacuum suction is formed at the lower end of the suction nozzle 145, and a suction path 1451 for vacuum suction extending substantially along the Z direction is provided at the center of the suction nozzle 145. ing.

  The nozzle shaft 1410 includes a sliding portion 1411 to which the suction nozzle 145 is attached, a chuck portion 1412 for holding the sliding portion 1411, and a spring provided in the chuck portion 1412 and attached to the sliding portion 1411 and the chuck portion 1412. 1413. A suction passage 1414 for vacuum suction extending substantially along the Z direction is provided at the center of the sliding portion 1411 and the chuck portion 1412, and is connected to the suction passage 1451 of the suction nozzle 145. The sliding portion 1411 is supported by a chuck portion 1412 and a spring 1413. When the suction nozzle 145 moves up and down together with the nozzle shaft 1410 by the nozzle lifting mechanism 146 (see FIG. 3), the suction nozzle 145 is forced from the tip. Then, the spring 1413 contracts and the sliding portion 1411 slides while being guided by the chuck portion 1412.

  The suction passage 1414 of the nozzle shaft 1410 is connected to a switching valve 148 via a pipe 1483, and is connected to the vacuum pump 1481 or the compressor 1482 by switching the switching valve 148 under the control of the control unit 8 (see FIG. 1). The When the suction path 1414 is connected to the vacuum pump 1481 side, air in the suction path 1414 and the suction path 1451 is exhausted and the electronic component is adsorbed to the opening 1450. Further, when the suction path 1414 is connected to the compressor 1482 side, air is sent to the suction path 1414 and the suction path 1451, and the suction and holding of the electronic components in the opening 1450 are released. As described above, in the mounting mechanism 14, by switching the switching valve 148, the suction and blow (release of suction and holding) of electronic components by the suction nozzle 145 are switched. The vacuum pump 1481 and the compressor 1482 may be provided in the electronic component mounting apparatus 11 or in a factory where the electronic component mounting apparatus 11 is installed.

  FIG. 5 is an enlarged perspective view showing the nozzle rotation mechanism 147. The nozzle rotation mechanism 147 is disposed above ((+ Z) side) the nozzle holding portion 1415 that holds the nozzle shaft 1410 to which the suction nozzle 145 is attached, and gears 1473 attached to the ten nozzle shafts 1410, respectively. A rectangular gear 1474 that surrounds the outside of the ten gears 1473, a driving gear 1475 disposed outside the rectangular gear 1474, and a motor 1476 that rotates the driving gear 1475 are provided. Teeth 1477 that mesh with the drive gear 1475 are provided on the outer surface of the rectangular gear 1474 on the (+ Y) side, and teeth 1478 that mesh with the gear 1473 are provided on the inner surface of the (+ Y) side and the (−Y) side. The ten gears 1473 are arranged so as not to contact the adjacent gears 1473.

  In the nozzle rotation mechanism 147, when the drive gear 1475 is rotated by the motor 1476, the rectangular gear 1474 is moved in the X direction, and the ten gears 1473 are simultaneously rotated, and the ten suction nozzles 145 are moved to the nozzle shaft. It is rotated together with 1410. In the head part 141, when the rectangular gear 1474 moves in the (+ X) direction, the (+ Y) side row (five) suction nozzles 145 rotate counterclockwise when viewed from the (+ Z) direction, The suction nozzles 145 in one row on the -Y) side rotate clockwise. When the rectangular gear 1474 moves in the (−X) direction, the rotation direction of the suction nozzles 145 in each row is opposite to the above.

  FIG. 6 is an enlarged right side view showing the vicinity of the nozzle lifting mechanism 146. The nozzle raising / lowering mechanism 146 is disposed above ((+ Z) side) the nozzle holding portion 1415 that holds the nozzle shaft 1410 to which the suction nozzle 145 is attached and the nozzle rotating mechanism 147. The nozzle lifting mechanism 146 includes a cylinder box 1461 connected to the ten nozzle shafts 1410, a cam follower 1465 connected to the cylinder box 1461 via the plate 1464, and a substantially disc-shaped eccentricity to which the cam follower 1465 is urged. A lifting motor 1466 having a cam 1467 at the tip is provided. The cylinder box 1461 includes ten air cylinders 1462 corresponding to the nozzle shafts 1410. The air cylinders 1462 are connected to a compressor (not shown) via valves 1463, respectively, and air is supplied individually.

  When the suction nozzle 145 is moved up and down, first, suction nozzles 145 (one or more) that descend from the ten suction nozzles 145 to the lowest point are selected, and the selected suction nozzle 145 is selected. The valve 1463 of the corresponding air cylinder 1462 is opened and air is supplied. Subsequently, the eccentric cam 1467 attached to the elevating motor 1466 rotates, and the cylinder box 1461 moves down along the guide 1468 together with the cam follower 1465 urged by the urging spring 1460 to the eccentric cam 1467. Accordingly, the ten nozzle shafts 1410 are pushed downward (in the (−Z) direction) by the air cylinders 1462 that descend.

  At this time, since air is supplied to the selected air cylinder 1462, the corresponding suction nozzle 145 is pushed down and lowered. On the other hand, since air is not supplied to the other air cylinders 1462, the shaft 1469 of the air cylinder 1462 is pushed back upward by the spring 1419 attached to the nozzle shaft 1410, and the corresponding suction nozzle 145 returns to the original suction nozzle 145. Stay in position. When the eccentric cam 1467 further rotates, the cylinder box 1461 rises and the compressed spring 1419 returns to the original state, so that the suction nozzle 145 that has been lowered rises to the original position. In this way, only the selected suction nozzle 145 moves in the vertical direction by the nozzle lifting mechanism 146.

  7 and 8 are right side views showing the internal structure of the cutting unit 133 (see FIG. 1) of the component supply unit 13. FIG. The cutting unit 133 includes a fixed blade 1331, a movable blade 1332 that is movable in the Y direction, a link member 1333 that is connected to the movable blade 1332, another link member 1334 that is further connected to the link member 1333, and a link A member 1334 is provided with a motor 1335 connected to the rotating shaft. In the cutting part 133, when the link member 1334 is rotated by the motor 1335, the moving blade 1332 is slid in the (−Y) direction as shown in FIG. The tape member 130 is sandwiched between the fixed blade 1331 and cut.

  FIG. 9 is a diagram showing a flow of operations of the electronic component mounting apparatus 11 when electronic components are mounted on the circuit board 9 shown in FIG. Hereinafter, the operation of the electronic component mounting apparatus 11 will be described with reference to FIG. 9 and other drawings as necessary. In the electronic component mounting apparatus 11, electronic components are normally mounted on two circuit boards 9 in parallel by two mounting mechanisms 14. However, for convenience of explanation, one circuit board 9 is mounted by one mounting mechanism 14. Only the manner in which electronic components are mounted will be described. Further, although steps S21 to S27 in FIG. 9 are repeated, the flow of the repetitive operation is not shown.

  When an electronic component is mounted on the circuit board 9 by the electronic component mounting apparatus 11 shown in FIG. 1, first, the circuit board 9 to which a solder paste is applied to a plurality of positions on the upper surface is the (− X is received by the guide rail 121 from the screen printing apparatus located on the side, and is conveyed to the lower part of the mounting mechanism 14 by the belt. When the circuit board 9 is arranged at a predetermined mounting position, the support pin 123 (see FIG. 3) rises from below the circuit board 9 and comes into contact with the lower surface of the circuit board 9 so that the circuit board 9 is guided by the guide rail. 121 and the support pin 123 (step S11). In the electronic component mounting apparatus 11, the operation sound generated when the circuit board 9 is held by the board transport mechanism 12 is acquired by the microphone 51 arranged in the vicinity of the board transport mechanism 12. Note that detection of operation abnormality based on the acquired operation sound will be described later (the same applies to each operation described below).

  Subsequently, the component cassette 131 controlled by the control unit 8 sends the electronic component together with the tape member 130 (see FIG. 7) from the reel 132 to the tip of the component cassette 131 on the (−Y) side (guide rail 121 side). Then, the electronic component is placed at a predetermined supply location for supplying the electronic component to the mounting mechanism 14 (step S21). In the electronic component mounting apparatus 11, an operation sound generated when the tape member 130 is sent out is acquired by the microphone 51 disposed in the vicinity of the component cassette 131. The head unit 141 is moved in advance to the component supply unit 13 side by the head unit moving mechanism 142 controlled by the control unit 8, and is positioned above the electronic component supply place.

  When the tape member 130 is sent out by the component cassette 131, the used part of the tape member 130 is guided by the component cassette 131 and sent to the cutting part 133, and the tip of the tape member 130 is cut to the cutting part as shown in FIG. Inside 133, it is sandwiched between the fixed blade 1331 and the movable blade 1332 and cut (step S22). In the electronic component mounting apparatus 11, an operation sound generated when the tape member 130 is cut by the cutting unit 133 is acquired by the microphone 51 disposed in the vicinity of the cutting unit 133.

  Next, the suction nozzle 145 is lowered toward the component cassette 131 by the nozzle lifting mechanism 146 (see FIG. 6), and is positioned above the electronic component arranged on the tape member 130. Subsequently, the suction nozzle 145 and the vacuum pump 1481 are connected by the switching valve 148 shown in FIG. 4, the electronic component is held at the tip of the suction nozzle 145 (step S23), and the suction nozzle 145 is raised by the nozzle lifting mechanism 146. To return to the original position. In the electronic component mounting apparatus 11 shown in FIG. 1, the operation sound generated when the suction nozzle 145 is moved up and down by the nozzle lifting mechanism 146 is disposed near the head unit 141 located above the electronic component supply location. 51. Further, the operation sound generated when the switching valve 148 (see FIG. 4) is operated is acquired by the microphone 51 disposed in the vicinity of the switching valve 148, and the operation sound generated when the electronic component is sucked by the suction nozzle 145. Is acquired by the microphone 51 disposed in the vicinity of the electronic component supply location. In the head unit 141, the operation of sucking and holding the electronic components for all of the ten suction nozzles 145 may be repeated, or the suction operation may be performed only for some of the suction nozzles 145.

  After sucking and holding the electronic component, the suction nozzle 145 moves to a predetermined position together with the head portion 141 by the head portion moving mechanism 142, and the electronic component is held by the camera (not shown) (the posture and suction of the sucked and held electronic component). The position at the tip of the nozzle 145 is confirmed, and the nozzle rotation mechanism 147 (see FIG. 5) is rotated about the axis facing the Z direction to correct the posture of the electronic component (step S24). As described above, in the head portion 141, the ten suction nozzles 145 are rotated in conjunction with the nozzle rotating mechanism 147. For this reason, in the head unit 141, the correction amount of the posture of the electronic component held by each suction nozzle 145 (the rotation angle of the suction nozzle 145) is stored, and the stored correction amount when each electronic component described later is mounted. The posture is corrected according to In the electronic component mounting apparatus 11, the operation sound generated while the suction nozzle 145 moves by the head unit moving mechanism 142 is continuously acquired by the microphone 51 disposed in the vicinity of the head unit moving mechanism 142. In addition, the operation sound generated when the suction nozzle 145 is rotated by the nozzle rotation mechanism 147 is acquired by the microphone 51 disposed in the vicinity of the head unit 141.

  Thereafter, the head portion 141 is moved above the circuit board 9 held by the substrate transport mechanism 12 by the head portion moving mechanism 142 (step S25), and the suction nozzle 145 and the held electronic component are applied with solder paste. It is located at a position opposite to the mounted position. During this time, the operation sound of the head unit moving mechanism 142 is continuously acquired. Then, the suction nozzle 145 is lowered toward the circuit board 9 by the nozzle lifting mechanism 146 (see FIG. 6) controlled by the control unit 8, and the suction nozzle 145 and the compressor 1482 are connected by the switching valve 148 (see FIG. 4). Then, the vacuum suction is released, and the electronic component held at the tip of the suction nozzle 145 is attached to the solder paste on the circuit board 9 (step S26), and the suction nozzle 145 moves up and returns to the original position.

  In the electronic component mounting apparatus 11, the operation sound generated when the electronic component is mounted on the circuit board 9 held by the board transport mechanism 12 by the mounting mechanism 14 is caused by the microphone 51 disposed in the vicinity of the circuit board 9. To be acquired. Further, operation sounds of the nozzle lifting mechanism 146 and the switching valve 148 are also acquired. Since ten suction nozzles 145 rotate in conjunction with the head portion 141, when mounting an electronic component, the operation of mounting the electronic component after correcting the posture of the electronic component by rotating the suction nozzle 145, This is performed sequentially for each suction nozzle 145. In the head portion 141, the sliding portion 1411 (see FIG. 4) that holds the suction nozzle 145 is slidable in the vertical direction. Therefore, when the electronic component is mounted on the circuit board 9, the electronic component and the circuit The impact generated on the suction nozzle 145 and the circuit board 9 due to contact with the solder paste on the board 9 is alleviated.

  When all the electronic components held by the suction nozzle 145 of the head unit 141 are mounted on the circuit board 9, the head unit 141 is moved by the head unit moving mechanism 142 and returned to the component supply unit 13 side (step S27). . During this time, the operation sound of the head unit moving mechanism 142 is continuously acquired. Thereafter, the electronic component mounting apparatus 11 confirms whether or not all the electronic components have been mounted on the circuit board 9. If not, the electronic component is supplied by the component supply unit 13 and the suction nozzle 145. The electronic component suction and mounting on the circuit board 9 are repeated (steps S21 to S27).

  When all the electronic components are mounted on the single circuit board 9 by the mounting mechanism 14, the circuit board 9 is transported downstream by the guide rail 121. That is, the two circuit boards 9 on which the mounting of the electronic components by the two mounting mechanisms 14 is completed are carried out from the guide rail 121 to another device (for example, a reflow device) downstream. Note that different mounting operations may be performed on the same circuit board 9 by the two mounting mechanisms 14, and in this case, the circuit from the (−X) side mounting mechanism 14 to the (+ X) side mounting mechanism 14. At the same time as the substrate 9 is transported, the circuit substrate 9 is unloaded from the (+ X) side mounting mechanism 14.

  FIG. 10 is a block diagram illustrating a configuration related to an operation for detecting an operation abnormality of the electronic component mounting apparatus 11. FIG. 11 is a diagram showing the flow of the above operation. The plurality of microphones 51 of the operation sound acquisition unit 5 shown in FIG. 10 are connected to the detection circuit 62 via the sampling unit 52, and the detection circuit 62 is connected to the memory 61 and the control unit 8. Connected to the control unit 8 are a substrate transport mechanism 12, a component supply unit 13, a mounting mechanism 14, and a switching valve 148 that are controlled by the control unit 8. The control unit 8 is connected to a lamp 81 and a display 82 for notifying the operator of the state of the apparatus.

  The sampling unit 52 converts an operation sound acquired by the microphone 51 into digital data, and a changeover switch 521 that selectively transmits operation sounds from the plurality of microphones 51 to the A / D converter 522. Is provided. The detection circuit 62 includes a comparison unit 621 that compares the output from the operation sound acquisition unit 5 with various types of information stored in the memory 61 in advance. As described above, the memory 61 stores the standard operation sound data 611 and the abnormal operation sound data 612 in advance. Note that the number of microphones 51, standard operation sound data 611, and abnormal operation sound data 612 is actually larger than the number shown in FIG.

  In the electronic component mounting apparatus 11 shown in FIG. 1, in the supply of the electronic component by the component supply unit 13, the suction of the electronic component by the suction nozzle 145, and the mounting operation to the circuit board 9 (FIG. 9: Steps S21 to S27), Various operation sounds are acquired as described above. Hereinafter, of these operation sounds, the operation sound generated when the electronic component is mounted on the circuit board 9 by the mounting mechanism 14 is taken as an example, and FIGS. 10 and 11 and other drawings are used as necessary. The operation of the electronic component mounting apparatus 11 that detects an abnormal operation at the time of mounting the electronic component will be described with reference to FIG.

  First, the microphone 51 arranged in the vicinity of the circuit board 9 held by the board transport mechanism 12 is selected by the changeover switch 521, and the operation sound in the vicinity of the circuit board 9 when the electronic component is mounted by the mounting mechanism 14; That is, the electronic component that has been attracted and held by the suction nozzle 145 and is lowered is pressed by the solder paste on the circuit board 9 (hereinafter referred to as “pushing of the electronic component”), and an operation sound that is mounted on the circuit board 9 is acquired. (Step S31). The operation sound acquired by the microphone 51 is sent to the sampling unit 52, converted to digital data by the A / D converter 522, and frequency-analyzed by the detection circuit 62 to show data (hereinafter referred to as the relationship between the frequency and acoustic characteristics). "Acquired operation sound data") is detected. Subsequently, the comparison operation unit 621 of the detection circuit 62 compares the acquired operation sound data with the standard operation sound data 611 of the head unit moving mechanism 142 (step S32), and whether or not the difference is within a certain range, that is, whether there is an operation abnormality. It is confirmed whether or not it has been detected (step S33). If no operation abnormality is detected (the acquired operation sound data and the standard operation sound data 611 are approximate), the operation abnormality detection operation ends.

  When an operation abnormality is detected (the acquired operation sound data and the standard operation sound data 611 are greatly different), a plurality of abnormalities of the head movement mechanism 142 stored in the memory 61 by the comparison unit 621 and the acquired operation sound data are stored. The operation sound data 612 is collated. For example, when an abnormality due to a sliding failure of the sliding portion 1411 of the nozzle shaft 1410 (insufficient smoothness to slide upward to alleviate the impact due to contact with the circuit board 9 at the time of mounting) occurs, The force at the time of pushing in becomes larger than usual, and a collision sound between the suction nozzle 145 and the circuit board 9 is generated. The memory 61 stores such abnormal operation sound as abnormal operation sound data 612. In addition to the above, the collision noise between the suction nozzle 145 and the circuit board 9 generated due to the holding abnormality in which the circuit board 9 is held in the state of being warped to the (+ Z) side due to the raising / lowering abnormality of the support pin 123 or the like. Or mounting abnormality due to insufficient pressing of the electronic component due to a holding abnormality held in a state where the circuit board 9 is warped to the (−Z) side (mounting deviation in which the electronic component is mounted at a position different from the mounting position, electronic component If the suction nozzle 145 that has slid into the nozzle shaft 1410 does not return to its original position due to an operating noise when the circuit board 9 is not installed, etc. The operation sound or the like at the time of abnormal mounting caused by the above is stored in the memory 61 in advance.

  In the electronic component mounting apparatus 11, the type of the detected abnormal operation is identified as a result of collation between the acquired operation sound data and the abnormal operation sound data 612 by the detection circuit 62 (step S 34), and is specified by the control unit 8. Based on the type of operation abnormality (for example, sliding failure of the sliding portion 1411), stop of the mounting operation of the electronic component on the circuit board 9 and / or notification to the operator is selected and executed. Specifically, when it is determined by the control unit 8 that it is not necessary to stop the operation of the apparatus, the lamp 81 shown in FIG. Thus, the type of operation abnormality is displayed on the display 82. When it is determined that the operation of the apparatus needs to be stopped, the operations of the substrate transport mechanism 12, the head unit moving mechanism 142, the head unit 141, the switching valve 148, and the like are stopped by the control of the control unit 8 (step S35). ). Further, after the operation of each unit is stopped as necessary, or simultaneously with the stop, the type of operation abnormality is notified to the operator.

  As described above, the electronic component mounting apparatus 11 can detect an abnormal operation during operation of the apparatus without making a significant design change by using the operation sound. In addition, it is possible to easily detect abnormalities of various configurations by a highly versatile method of using operation sound, and by detecting the acquired operation sound data and the standard operation sound data 611, the operation abnormality can be detected. It is further facilitated. Furthermore, the type of abnormal operation can be easily detected by collating with the abnormal operation sound data 612. When an abnormal operation is detected, the operation of the apparatus can be stopped as needed under the control of the control unit 8.

  Further, the electronic component mounting apparatus 11 can detect a collision or insufficient push of the suction nozzle 145 against the circuit board 9 by acquiring an operation sound generated at the time of mounting the electronic component. It is possible to prevent damage to the nozzle 145 and abnormal mounting of electronic components such as mounting displacement and missing parts.

  The electronic component mounting apparatus 11 can detect various operational abnormalities other than the operational abnormalities at the time of mounting the electronic components described above. FIG. 12 is a diagram illustrating a state of abnormal cutting of the tape member 130 in the cutting unit 133. When there is a gap in the vertical direction (Z direction) between the fixed blade 1331 and the movable blade 1332 or when the blade is worn, the tape member 130 is cut as shown in FIG. Instead, an abnormality that occurs between the fixed blade 1331 and the movable blade 1332 occurs. As a result, the tape member 130 attached to the component cassette 131 is pulled and moved to the cutting portion 133 side, and the electronic components arranged at the predetermined supply position also move together, and the suction nozzle 145 is moved. As a result, a supply abnormality that prevents electronic components from being supplied occurs.

  In the electronic component mounting apparatus 11 shown in FIG. 1, the operation sound generated when the tape member 130 is cut by the cutting unit 133 is acquired, compared with the standard operation sound data 611, and compared with the abnormal operation sound data 612. Is performed and a cutting abnormality such as biting of the tape member 130 is detected, and notification to the operator is selected and executed (FIG. 11: steps S31 to S35). Thereby, the supply abnormality of the electronic component with respect to the suction nozzle 145 can be prevented. In addition, by acquiring an operation sound generated when the tape supply unit 130 is sent out by the component supply unit 13, it is possible to detect an abnormality in the operation of sending out the tape member 130, and to detect an abnormal supply of electronic components to the suction nozzle 145. Can be prevented.

  In the electronic component mounting apparatus 11, a ball screw mechanism, a guide mechanism (not shown) or the like that constitutes the head unit moving mechanism 142 is obtained by acquiring an operation sound generated while the head unit 141 moves by the head unit moving mechanism 142. The abnormal movement of the head part moving mechanism 142 can be detected, and the mounting displacement of the electronic parts due to the malfunction of the head part moving mechanism 142 and the damage of the head part moving mechanism 142 due to the seizure of the ball screw mechanism and the guide mechanism can be prevented. In the electronic component mounting apparatus 11, the operation of acquiring the operation sound of the head unit moving mechanism 142 and confirming whether or not an operation abnormality is detected as compared with the standard operation sound data 611 ends the movement of the head unit 141. If the operation abnormality is detected, the type of the operation abnormality is specified, and the movement of the head unit 141 is stopped and / or the operator is notified (FIG. 11: Step S31). ~ S35).

  Further, in the electronic component mounting apparatus 11, an operation sound generated when the electronic component is sucked by the suction nozzle 145 is acquired, so that the suction nozzle due to a shift in the suction position of the electronic component, a foreign matter clogging of the suction nozzle 145, or the like. 145 can detect an abnormal suction of the electronic component, and can prevent an erroneous suction due to insufficient suction force or a mounting deviation of the electronic component. In addition, by acquiring an operation sound generated when the switching valve 148 (see FIG. 4) is operated, it is possible to detect an abnormal operation of the switching valve 148. It is possible to prevent mounting leakage due to lack.

  In the electronic component mounting apparatus 11, the operation sound generated when the suction nozzle 145 is moved up and down by the nozzle lifting mechanism 146 shown in FIG. 6 is acquired, so that the suction nozzle 145 is moved up and down due to deterioration or damage of the biasing spring 1460. Abnormal operation can be detected, electronic component mounting abnormality due to poor contact between the eccentric cam 1467 and the cam follower 1465, and damage to the cam follower 1465 due to collision between the eccentric cam 1467 and the cam follower 1465 can be prevented. it can.

  Further, when the operation sound generated when the suction nozzle 145 is rotated by the nozzle rotation mechanism 147 shown in FIG. 5 is acquired, the gear 1473, the rectangular gear 1474, and the drive gear 1475 are spilled. It is possible to detect an abnormal operation during the rotation of the suction nozzle 145 due to foreign matter mixing in between and the seizure of the nozzle rotation mechanism 147, and the like. Or, damage can be prevented from spreading).

  In the nozzle rotation mechanism 147, as shown in FIG. 13, ten gears 1473b for rotating the ten suction nozzles 145 (see FIG. 5) are arranged so as to mesh with the adjacent gear 1473b, and are driven by a motor. The rotating drive gear 1475b (shown with a parallel oblique line for convenience of illustration) may be arranged to mesh with one gear 1473b. In this case, one gear 1473b meshing with the drive gear 1475b is rotated by the rotation of the drive gear 1475b, and the other gear 1473b is also rotated in conjunction with this. Further, each of the ten gears may be configured to be able to rotate independently. In any of these structures, it is possible to detect an abnormal operation when the suction nozzle 145 rotates by using a highly versatile method that uses operation sound.

  As described above, the electronic component mounting apparatus 11 acquires the operation sound generated during the operation of the substrate transport mechanism 12, the mounting mechanism 14, and the component supply unit 13, and based on this, without significant design change of the apparatus. It is possible to easily detect the operation abnormality and the type of operation abnormality during operation of the apparatus.

  FIG. 14 is a perspective view showing a configuration of an electronic component mounting apparatus 11a according to the second embodiment of the present invention. Similar to the electronic component mounting apparatus 11 shown in FIG. 1, the electronic component mounting apparatus 11 a is a device that mounts fine electronic components on a solder paste applied on a circuit board 9 such as a printed circuit board.

  The electronic component mounting apparatus 11a includes a substrate holding unit 12a that holds the circuit board 9, a mounting mechanism 14a that mounts the electronic component on the circuit board 9 held by the substrate holding unit 12a, and a component supply that supplies the electronic component to the mounting mechanism 14a. Unit 13a, and a plurality of microphones 51 that acquire operation sounds generated during operation of substrate holding unit 12a, mounting mechanism 14a, and component supply unit 13a. Since the electronic component mounting apparatus 11a is a so-called rotary type, each mechanical configuration is greatly different from the electronic component mounting apparatus 11 shown in FIG. 1, but other configurations related to abnormality detection (operation sound acquisition unit shown in FIG. 1). 5 are the same as those in FIG. 1 and are denoted by the same reference numerals in the following description.

  The substrate holding unit 12a holds the circuit board 9, and the stage movement that holds the stage 125 and moves in the XY plane in FIG. 14 (that is, in the direction along the main surface of the circuit board 9). A mechanism 126 is provided. The mounting mechanism 14 a includes a substantially cylindrical rotary head 151, a plurality of suction nozzles 145 attached on the lower side ((−Z) side) of the rotary head 151, and a plurality of suction nozzles 145 on the circumference of the rotary head 151. A nozzle rotating mechanism 152 that rotates along the nozzles, a nozzle lifting mechanism that lifts and lowers the suction nozzle 145, and a component confirmation unit 153 that inspects the position of the electronic component held by the suction nozzle 145.

  The component supply unit 13 a is substantially the same as that shown in FIG. 1, and includes a plurality of component cassettes 131 arranged in the X direction, a cassette table 134 that holds a plurality of component cassettes 131, and a component cassette 131 together with the cassette table 134. Is provided with a parts cassette moving mechanism 135 for moving in the X direction. The component cassette 131 is disposed on the (+ Y) side of the rotary head 151 and includes a reel 132 around which a tape member on which a plurality of electronic components are arranged and stored is wound. The component cassette moving mechanism 135 includes a motor 1352, a ball screw 1351 connected to the motor 1352, and a guide rail 1353. When the motor 1352 is driven by the control unit 8, the ball screw 1351 rotates and the ball screw 1351. 14 smoothly moves along the guide rail 1353 in the X direction in FIG.

  FIG. 15 is a diagram showing the rotary head 151 and the nozzle lifting mechanism 154 of the mounting mechanism 14a, and shows a part (portion shown with parallel oblique lines) in cross section. In FIG. 14, the nozzle lifting mechanism 154 is housed in the housing of the rotary head 151.

  The rotary head 151 includes a cylindrical cam 1511 in which a cam groove 1511a is formed, a substantially cylindrical slider 1512 that is attached to the outside of the cylindrical cam 1511 so as to be movable up and down, and a substantially cylindrical shape that is rotatably attached to the outside of the slider 1512. The rotating member 1513 includes a plurality of nozzle units 1514 attached to the cylindrical cam 1511 via the slider 1512 and the rotating member 1513. A suction nozzle 145 is attached to the lower end of each nozzle unit 1514, and the rotating member 1513 is rotated by the nozzle rotating mechanism 152 (see FIG. 14), whereby the periphery of the cylindrical cam 1511 rotates along the cam groove 1511a.

  The nozzle raising / lowering mechanism 154 includes a first lever 1541 connected to the slider 1512, a link mechanism 1542, a second lever 1543 connected to the first lever 1541 via the link mechanism 1542, and some radii are radii of other parts. A smaller deformed disk-shaped plate cam 1544 and a belt 1545 for transmitting rotation of a motor (not shown) to the plate cam 1544 are provided. A cam follower 1543a is provided at the tip of the second lever 1543 and is urged to the plate cam 1544 by an urging spring 1543b.

  In the nozzle lifting mechanism 154, when the motor is driven to rotate the plate cam 1544, the cam follower 1543 a approaches the rotation axis of the plate cam 1544 as the radius of the plate cam 1544 decreases at the contact portion between the cam follower 1543 a and the plate cam 1544. Direction (substantially (−Y) direction)), and the connection portion of the second lever 1543 with the link mechanism 1542 moves substantially upward ((+ Z) direction). Along with this, the connecting portion of the first lever 1541 with the link mechanism 1542 moves together with the link mechanism 1542, and the connecting portion of the first lever 1541 with the slider 1512 is extended while the spring 1541a attached to the first lever 1541 is extended. Moves downward. As a result, the slider 1512 moves downward while extending the spring 1512 a attached to the slider 1512, and the suction nozzle 145 is pushed down by the slider 1512 together with the nozzle unit 1514 and descends. With the suction nozzle 145 lowered, the second lever 1543, the link mechanism 1542 and the first lever 1541 return to their original positions as the plate cam 1544 rotates, and the extended springs 1512a and 1541a return to their original states. As a result, the slider 1512 moves up to the original position.

  The electronic component mounting operation by the electronic component mounting apparatus 11a shown in FIG. 14 will be described with a focus on one suction nozzle 145. In the electronic component mounting apparatus 11a, first, the control unit 8 controls the nozzle lifting mechanism 154, and the (+ Y) side suction nozzle 145 in FIG. 15, that is, the suction nozzle 145 located above the component cassette 131 is lowered. Then, the electronic component on the component cassette 131 rises after being sucked. Subsequently, the suction nozzle 145 is intermittently rotated by the nozzle rotation mechanism 152 shown in FIG. 14 in the clockwise direction when viewed from the (+ Z) side with the cylindrical cam 1511 as the center, and above the component confirmation unit 153. The component confirmation unit 153 confirms the holding state of the electronic component (the posture of the electronic component sucked and held and the position at the tip of the suction nozzle 145), and the posture of the electronic component is corrected by a rotation mechanism (not shown). Is done.

  Next, the suction nozzle 145 is intermittently rotated again and moved to the position of the suction nozzle 145 shown on the (−Y) side in FIG. 15, lowered by the nozzle lifting mechanism 154, and previously moved by the stage moving mechanism 126. The electronic component is mounted on the circuit board 9 by moving so that the predetermined mounting position is located directly below the suction nozzle 145. Thereafter, the suction nozzle 145 further rotates in the clockwise direction, moves around the cylindrical cam 1511, and moves above the component cassette 131. In the electronic component mounting apparatus 11a, these operations are sequentially repeated by the plurality of suction nozzles 145, whereby the electronic component is mounted on the circuit board 9.

  In the electronic component mounting apparatus 11a shown in FIG. 14, various operation sounds are acquired in the above-described electronic component mounting operation, and an operation abnormality of the mounting mechanism 14a is detected based on the acquired operation sounds. Hereinafter, the operation of the electronic component mounting apparatus 11a that detects an operation abnormality will be described. The configuration related to the operation of detecting an operation abnormality of the electronic component mounting apparatus 11a is substantially the same as the configuration of the electronic component mounting apparatus 11 shown in FIG. The difference between the two configurations is the arrangement of the microphone 51 of the operation sound acquisition unit 5, and the substrate holding unit 12 a and the component supply unit instead of the substrate transport mechanism 12, the component supply unit 13 and the mounting mechanism 14 controlled by the control unit 8. 13a and a mounting mechanism 14a are provided.

  In the electronic component mounting apparatus 11a, the operation sounds of the board holding unit 12a, the mounting mechanism 14a, and the component supply unit 13a during the mounting operation of the electronic component are shown in FIG. 10 through the microphone 51 shown in FIGS. Obtained by the obtaining unit 5 (FIG. 11: step S31) and sent to the detection circuit 62. Subsequently, the comparison operation unit 621 compares the acquired operation sound data with the standard operation sound data stored in the memory 61 (step S32), and confirms whether or not there is an operation abnormality (step S33). When an operation abnormality is detected, the comparison operation unit 621 compares the acquired operation sound data with the plurality of abnormal operation sound data 612 stored in the memory 61, and specifies the type of the detected operation abnormality (step S34). ) Based on the specified type of operation abnormality, the control unit 8 selectively stops the operation of mounting the electronic component on the circuit board 9 and / or notifies the operator (step S35).

  For example, in the nozzle lifting mechanism 154 shown in FIG. 15, when the biasing spring 1543b is damaged due to insufficient lubrication or when the biasing spring 1543b is deteriorated due to secular change, the force for biasing the cam follower 1543a to the plate cam 1544 The cam follower 1543a cannot follow the rotation of the plate cam 1544, and a phenomenon (so-called cam jump) may occur in which the plate cam 1544 moves away from the plate cam 1544 and contacts (collises) with the plate cam 1544 again. If this phenomenon occurs, the raising and lowering of the suction nozzle 145 may be hindered, and there may be a mounting abnormality (mounting displacement or mounting leakage). If left as it is, the cam follower 1543a and the nozzle lifting mechanism 154 may be damaged. is there. Further, the urging spring 1543b has a function of suppressing rattling, shaking, etc. in the connection of the second lever 1543, the link mechanism 1542, the first lever 1541, the slider 1512 and the like together with the springs 1512a and 1541a. When the spring deteriorates or is damaged, the structure of the suction nozzle 145 that moves up and down becomes large, and a further mounting abnormality occurs.

  In the electronic component mounting apparatus 11a, an operation sound generated when the suction nozzle 145 is moved up and down by the nozzle lifting mechanism 154 is acquired, so that the abnormal operation when the suction nozzle 145 moves up and down due to deterioration or damage of the biasing spring 1543b. Can be detected. As a result, when a cam jump has occurred, a collision sound between the plate cam 1544 and the cam follower 1543a is detected, and the operation of the apparatus is stopped (or notified to the operator). It is possible to prevent abnormal mounting of electronic components due to poor contact with the cam follower 1543a and damage to the cam mechanism due to collision between the plate cam 1544 and the cam follower 1543a.

  Further, in the electronic component mounting apparatus 11a shown in FIG. 14, by acquiring an operation sound generated while the component cassette 131 moves by the component cassette moving mechanism 135, a ball screw mechanism (ball ball) constituting the component cassette moving mechanism 135 is obtained. An abnormal operation of the screw 1351, the motor 1352, and the guide rail 1353), an abnormal supply of electronic components due to a malfunction of the component cassette moving mechanism 135 (supply position deviation or supply error), and a ball screw mechanism. It is possible to prevent damage to the component cassette moving mechanism 135 due to, for example, seizure.

  Further, in the electronic component mounting apparatus 11a, by obtaining an operation sound generated while the stage 125 is moved by the stage moving mechanism 126, an operation abnormality of the stage moving mechanism 126 can be detected. It is possible to prevent abnormal mounting of electronic components (mounting deviation or missing item) due to malfunction.

  In addition to the above, the electronic component mounting apparatus 11a can easily detect the abnormal operation and the type of abnormal operation during operation of the same configuration as the electronic component mounting apparatus 11 shown in FIG. Accordingly, the operation of the apparatus can be stopped. In addition, since these detections are realized by acquiring operation sound, a significant design change of the apparatus is not required for detecting an operation abnormality.

  FIG. 16 is a diagram showing a configuration of a screen printing apparatus 21 according to the third embodiment of the present invention. The screen printing apparatus 21 is an apparatus that prints a solder paste on a circuit board 9 such as a printed board via a mask 231.

  The screen printing apparatus 21 includes a substrate holding unit 22 that holds the circuit board 9, a thin plate-shaped mask 231 having an opening 231 a formed corresponding to the printing pattern, and the circuit board 9 that is held by the substrate holding unit 22. A mask holding unit 23 for holding the mask 231; a squeegee mechanism 24 that moves by pressing the solder paste accumulated on the mask 231 (that is, a squeegee); a camera 271 that captures an image of the circuit board 9; and the board holding unit 22 and the squeegee A microphone 51 is provided for acquiring an operation sound generated when the mechanism 24 is operated. Other configurations related to abnormality detection (the sampling unit 52, the arithmetic unit 60, the control unit 8, etc. of the operation sound acquisition unit 5 shown in FIG. 1 are omitted in FIG. 16), and are the same as those in FIG. The same reference numerals are used in the following description.

  The substrate holding unit 22 holds the circuit board 9 and a stage moving mechanism 222 that holds the stage 221 and moves in the XY plane in FIG. 16 (that is, in a direction along the main surface of the circuit board 9). , A stage rotation mechanism 223 that rotates the stage 221 in the XY plane about an axis that faces the Z direction, and a stage lifting mechanism 224 that moves the stage 221 in the Z direction. The mask holding unit 23 holds an edge portion around the mask 231.

  The squeegee mechanism 24 includes a head unit 241 and a head unit moving mechanism 242 that moves the head unit 241 in the Y direction. The head unit moving mechanism 242 uses a linear motor (not shown) as a drive source. The head unit 241 includes two squeegees 245 and two squeegee lifting mechanisms 246 that move the squeegee 245 in the Z direction. The two squeegees 245 are attached to the squeegee lifting mechanism 246 obliquely with respect to the Z direction so that the lower ends of the two squeegees 245 are separated from each other. In the squeegee mechanism 24, the head unit moving mechanism 242 moves the head unit 241 in the Y direction, so that the squeegee 245 moves relative to the mask 231 in the Y direction.

  FIG. 17 is a diagram showing a flow of operations of the screen printing apparatus 21 when printing a solder paste on the circuit board 9. Hereinafter, the operation of the screen printing apparatus 21 will be described with reference to FIGS. 16 and 17. When the solder paste is printed by the screen printing device 21, first, the circuit board 9 is held on the stage 221 of the board holding unit 22 positioned in advance below the camera 271 (step S 41).

  Subsequently, an alignment mark on the circuit board 9 is imaged by the camera 271. The stage moving mechanism 222 and the stage rotating mechanism 223 are controlled by the control unit 8 (see FIG. 10) based on the image data acquired by imaging, and the stage 221 moves and rotates in the XY plane to The posture is corrected (step S42). In the screen printing apparatus 21, the operation sound generated when the posture of the circuit board 9 is corrected by the stage moving mechanism 222 and the stage rotating mechanism 223 is acquired by the microphone 51 disposed in the vicinity of the board holding unit 22. . Note that detection of operation abnormality based on the acquired operation sound will be described later (the same applies to each operation described below).

  Next, the circuit board 9 is moved in the (−Y) direction by the stage moving mechanism 222 to be positioned below the mask 231 (step S43), and is lifted by the stage elevating mechanism 224 to the (−Z) side of the mask 231 ( It abuts on the main surface of the squeegee 245 opposite to the side facing the squeegee 245 (step S44). In the screen printing apparatus 21, the operation sound generated when the circuit board 9 moves or rises is continuously acquired by the microphone 51 disposed in the vicinity of the board holding unit 22.

  When the circuit board 9 comes into contact with the mask 231, the squeegee 245 on the (+ Y) side is raised by the squeegee lifting mechanism 246 in the head portion 241 that was previously positioned on the (−Y) side of the circuit board 9, and (−Y ) -Side squeegee 245 is lowered by the squeegee raising / lowering mechanism 246 and the lower end abuts on the (+ Z) -side main surface of the mask 231.

  Subsequently, the squeegee 245 moves along with the main surface of the mask 231 to the (+ Y) side together with the head portion 241 by the head portion moving mechanism 242. At this time, the squeegee 245 on the (−Y) side moves in contact with the mask 231, and the solder paste on the mask 231 is pushed out (squeezed) in the (+ Y) direction to fill the opening 231 a of the mask 231. (Step S45). In the screen printing apparatus 21, the operation sound generated while the squeegee 245 is moved by the head unit moving mechanism 242 is continuously acquired by the microphone 51 disposed in the vicinity of the head unit moving mechanism 242 and the mask 231. In the screen printing apparatus 21, the solder paste may be filled in the opening 231 a by moving the head portion 241 from the (+ Y) side of the circuit board 9 to the (−Y) side. In this case, contrary to the above, the squeegee 245 on the (+ Y) side moves in contact with the mask 231 to squeeze the solder paste.

  When the solder paste squeegee is completed, the circuit board 9 is lowered by the stage elevating mechanism 224 (step S46), the solder paste filled in the opening 231a is transferred to the circuit board 9, and printing on the circuit board 9 is completed. When printing of one circuit board 9 is completed, the circuit board 9 is carried out to another downstream device (for example, an electronic component mounting device).

  In the screen printing apparatus 21, the posture correction, movement and elevation of the circuit board 9 by the stage moving mechanism 222, the stage rotating mechanism 223, and the stage elevating mechanism 224, and the squeegee operation of the solder paste by the squeegee mechanism 24 (steps S42 to S46). As described above, various operation sounds are acquired, and abnormal operations of the substrate holding unit 22 and the squeegee mechanism 24 are detected based on the acquired operation sounds. Hereinafter, the operation of the screen printing apparatus 21 that detects an operation abnormality will be described.

  The configuration related to the operation of detecting an abnormal operation of the screen printing apparatus 21 is substantially the same as that of the electronic component mounting apparatus 11 shown in FIG. The difference between the two configurations is that the arrangement of the microphone 51 of the operation sound acquisition unit 5 and the substrate holding unit 22 and the squeegee mechanism 24 are controlled by the control unit 8.

  In the screen printing apparatus 21, the operation sound of the board holding unit 22 and the squeegee mechanism 24 at the time of printing the solder paste is acquired by the operation sound acquisition unit 5 shown in FIG. 10 through the microphone 51 shown in FIG. 16 (FIG. 11: In step S31), the acquired operation sound data and the standard operation sound data are compared by the detection circuit 62 (step S32), and the presence or absence of an operation abnormality is confirmed (step S33). When an operation abnormality is detected, the acquired operation sound data and the abnormal operation sound data 612 are collated to identify the type of operation abnormality (step S34), and the printing operation is stopped and / or based on the type of operation abnormality. Alternatively, notification to the worker is selected and executed (step S35).

  For example, in the squeegee mechanism 24, when the solder paste on the mask 231 is hardened due to a change over time, the hardened solder paste by the movement of the squeegee 245 may be rubbed against the mask 231 and the mask 231 may be damaged. Similarly, when foreign matter is mixed in the solder paste on the mask 231, the mask 231 may be rubbed and damaged by the foreign matter. In such a case, in the screen printing apparatus 21, the operation sound generated while the squeegee 245 moves is acquired by the operation sound acquisition unit 5, so that an operation abnormality during the movement of the squeegee can be detected. Specifically, by obtaining a frictional sound between the mask 231 and the squeegee 245, it is possible to detect an abnormal operation due to deterioration of the solder paste or contamination of the solder paste, and to prevent damage to the mask 231. it can.

  In the screen printing apparatus 21, a ball screw mechanism, a guide mechanism (not shown), and the like constituting the head portion moving mechanism 242 are obtained by acquiring an operation sound generated while the squeegee 245 is moved by the head portion moving mechanism 242. , A solder paste squeegee failure due to a malfunction of the head portion moving mechanism 242, and damage to the head portion moving mechanism 242 due to seizure of the ball screw mechanism can be prevented. Further, by acquiring the operation sound of the squeegee lifting mechanism 246, an operation abnormality can be detected, and a squeegee failure caused by an abnormality in the relative position between the squeegee 245 and the mask 231 can be prevented.

  In the screen printing apparatus 21, an operation sound generated while the stage 221 moves by the stage moving mechanism 222 can be acquired, so that an abnormal operation of the stage moving mechanism 222 can be detected. It is also possible to prevent an abnormal posture of the circuit board 9 during printing.

  As described above, the screen printing apparatus 21 can easily detect the operation abnormality and the type of the operation abnormality during the operation of the apparatus without a significant design change, and the operation of the apparatus can be performed as necessary. Can be stopped. As a result, it is possible to prevent solder paste printing abnormality on the circuit board 9.

  FIG. 18 is a diagram showing a configuration of a reflow apparatus 31 according to the fourth embodiment of the present invention. The reflow device 31 is a device that performs reflow on a circuit board 9 such as a printed board on which electronic components are mounted on a printed solder paste.

  The reflow device 31 holds the circuit board 9 and transports the circuit board 9 along a predetermined transport path (in the (+ X) direction in FIG. 18), and a plurality of (this book) that performs processing with heating on the circuit board 9. In the embodiment, seven heating units 34, the cooling unit 33 that cools the circuit board 9 heated by the heating unit 34, and the operation sound generated when the substrate transport mechanism 32, the heating unit 34, and the cooling unit 33 are operated. Is provided. Other configurations related to the abnormality detection (the sampling unit 52, the arithmetic unit 60, the control unit 8 and the like of the operation sound acquisition unit 5 shown in FIG. 1 are omitted in FIG. 18), and are the same as those in FIG. The same reference numerals are used in the following description.

  The substrate transport mechanism 32 includes a set of guide rails 321 extending in the X direction, and the circuit board 9 held by the guide rails 321 is transported in the (+ X) direction by a belt provided in the guide rails 321. An electronic component mounting device (not shown) for mounting electronic components on the circuit board 9 is disposed on the (−X) side of the guide rail 321, and the circuit board 9 is passed from the electronic component mounting device to the guide rail 321. It is.

  The seven heating parts 34 are arranged in a row in the X direction in FIG. 18 (that is, the direction along the moving direction of the circuit board 9), and each of them heats the circuit board 9 (hereinafter referred to as “processing space”). .)) A furnace body 341 that forms 340, a heater 342 that is a heat source for heating the internal space of the furnace body 341 (that is, the processing space 340), and air is blown in the processing space 340 to remove gas in the processing space 340. A blast mechanism 345 is provided that guides the gas heated by the heater 342 to the circuit board 9 that is being transported by the substrate transport mechanism 32. The blower mechanism 345 includes a fan 346 that blows air and a motor 347 that drives the fan 346. The guide rail 321 is disposed through these furnace bodies 341 and holds the circuit board 9 in the processing space 340. The heater 342 and the air blowing mechanism 345 are respectively arranged on the upper side ((+ Z) side) and the lower side ((−Z) side) of the circuit board 9 held in the processing space 340. The cooling unit 33 is disposed on the downstream side ((+ X) side) of the heating unit 34 and above the guide rail 321, and includes a cooling fan 331 and a motor 332 that drives the cooling fan 331.

  FIG. 19 is a diagram showing a flow of the operation of the reflow device 31 when performing reflow on the circuit board 9. Hereinafter, the operation of the reflow apparatus 31 will be described with reference to FIGS. 18 and 19. When reflow is performed by the reflow device 31, first, the furnace body of the heating unit 34 in which the circuit board 9 is located on the most upstream side ((−X) side in FIG. 18) by the guide rail 321 of the substrate transport mechanism 32. It is carried into 341 (step S51). In the reflow device 31, the operation sound generated when the circuit board 9 is transported by the substrate transport mechanism 32 is continuously acquired by the microphone 51 disposed in the vicinity of the substrate transport mechanism 32. Note that detection of operation abnormality based on the acquired operation sound will be described later (the same applies to each operation described below).

  The processing space 340 of each heating unit 34 is preheated by the heater 342 and maintained at a predetermined temperature, and the gas in the processing space 340 is convected by the fan 346 driven by the motor 347, so that the processing space 340 The temperature is made uniform. When the circuit board 9 is conveyed, the circuit board 9 sequentially passes through the processing spaces 340 of all the seven heating units, and thus the circuit board 9 is based on a predetermined temperature profile (heating temperature and heating time). Is heated (step S52), and then the circuit board 9 is unloaded from the most downstream heating section 34 (step S53). In the reflow device 31, the operation sound of the blower mechanism 345 is continuously acquired by the microphone 51 disposed in the vicinity of the heating unit 34, and the operation sound at the time of carrying out the circuit board 9 is also acquired in the same manner as in step S51. By heating the circuit board 9, the solder paste on the circuit board 9 on which the electronic component is mounted is melted. In the present embodiment, the circuit board 9 is preliminarily heated by the four heating units 34 on the upstream side, and the solder paste is melted by the three heating units 34 on the downstream side.

  When the heating of the circuit board 9 is completed, the circuit board 9 is transported below the cooling unit 33, and the circuit board 9 is blown by the cooling fan 331 driven by the motor 332 to cool the circuit board 9 ( Step S54). In the reflow device 31, the operation sound of the cooling unit 33 is continuously acquired by the microphone 51 disposed in the vicinity of the cooling unit 33.

  When the solder paste is cooled and hardened in the cooling unit 33, the electronic component is fixed to the circuit board 9, and the reflow to one circuit board 9 is completed, and the circuit board 9 is another device downstream (for example, an inspection device). It is carried out to. In the reflow device 31, the plurality of circuit boards 9 are normally held by the substrate transport mechanism 32 and sequentially carried into the plurality of heating units 34, whereby the plurality of circuit boards 9 are reflowed in parallel.

  In the reflow device 31, various operation sounds are acquired and acquired as described above in the transport of the circuit board 9 by the substrate transport mechanism 32, the heating by the heating unit 34, and the cooling by the cooling unit 33 (steps S51 to S54). Abnormal operation of the substrate transport mechanism 32, the air blowing mechanism 345, and the cooling unit 33 is detected based on the operation sound. Hereinafter, the operation of the reflow device 31 for detecting an operation abnormality will be described.

  The configuration related to the operation of detecting the operation abnormality of the reflow device 31 is substantially the same as the configuration of the electronic component mounting device 11 shown in FIG. The difference between the two configurations is that the arrangement of the microphone 51 of the operation sound acquisition unit 5 and the substrate transport mechanism 32, the heating unit 34, and the cooling unit 33 are controlled by the control unit 8.

  In the reflow apparatus 31, the operation sounds of the substrate transport mechanism 32, the heating unit 34, and the cooling unit 33 during reflow are acquired by the operation sound acquisition unit 5 shown in FIG. 10 via the microphone 51 shown in FIG. 18 (FIG. 11: In step S31), the acquired operation sound data and the standard operation sound data are compared by the detection circuit 62 (step S32), and the presence or absence of an operation abnormality is confirmed (step S33). If an operation abnormality is detected, the acquired operation sound data and the abnormal operation sound data 612 are collated to identify the type of operation abnormality (step S34), and the reflow operation is stopped and / or based on the type of operation abnormality. Alternatively, notification to the worker is selected and executed (step S35).

  For example, in the heating unit 34, when the motor 347 of the air blowing mechanism 345 deteriorates due to insufficient oil supply or the like and abnormal vibration occurs, the air blowing efficiency by the fan 346 is lowered and the temperature in the processing space 340 becomes uneven, and the circuit board There is a possibility that an abnormality occurs in the heat treatment for 9. In this case, in the reflow device 31, the operation sound of the blower mechanism 345 is acquired by the operation sound acquisition unit 5, so that the operation abnormality of the blower mechanism 345 can be detected, and the circuit board due to the temperature abnormality in the processing space 340. 9 failure processing can be prevented. Further, the reflow apparatus 31 can detect an operation abnormality of the substrate transport mechanism 32 by acquiring an operation sound generated when the circuit board 9 is transported by the substrate transport mechanism 32.

  As described above, the reflow device 31 can easily detect the operation abnormality and the type of the operation abnormality during operation of the device without acquiring a significant design change by acquiring the operation sound. The operation of the apparatus can be stopped as necessary. As a result, reflow abnormality to the circuit board 9 can be prevented.

  FIG. 20 is a diagram showing a configuration of an electronic component mounting system 10 according to the fifth embodiment of the present invention. The electronic component mounting system 10 is a system for mounting electronic components on a circuit board 9 such as a printed circuit board. The screen printing device 21 shown in FIG. The electronic component mounting apparatus 11 shown in FIG. 18 and the reflow apparatus 31 shown in FIG. 18 are provided, and a system management unit 811 that manages these apparatuses is further provided. In the electronic component mounting system 10, the number of electronic component mounting devices 11 is not limited to three, and an electronic component mounting device 11 a shown in FIG. 14 may be provided instead of the electronic component mounting device 11.

  The system management unit 811 detects an operation abnormality in any one of the detection circuits 62 (see FIG. 10) of the screen printing apparatus 21, the electronic component mounting apparatus 11, and the reflow apparatus 31 (hereinafter collectively referred to as “apparatus”). In this case, the abnormality information reception unit 812 that receives information related to the detected operation abnormality (information including the part and time at which the operation abnormality occurred, the type of operation abnormality, etc., and hereinafter referred to as “abnormal information”). The system control unit 813 that controls the operation of each device based on the abnormality information received by the abnormality information reception unit 812, stores the acquired abnormality information, and the type of operation abnormality for each of a plurality of types of operation abnormality And the corresponding worker (the worker who is in charge of maintenance when an abnormal operation occurs, hereinafter referred to as “person in charge”) A system storage unit 814 that stores information in advance, an abnormality notification unit 815 that notifies a person in charge stored in the system storage unit 814 based on the abnormality information received by the abnormality information reception unit 812, and an operation that performs various calculations Part 816.

  In each device of the electronic component mounting system 10, as described above, the operation sound is acquired by the operation sound acquisition unit 5, thereby detecting an operation abnormality that occurs during operation. FIG. 21 is a diagram illustrating an operation flow of the system management unit 811 when an operation abnormality is detected in the electronic component mounting apparatus 11 of the electronic component mounting system 10. The operation of the system management unit 811 will be described below with reference to FIG. 21 and other drawings as appropriate.

  For example, when an operation abnormality is detected in the detection circuit 62 of the electronic component mounting apparatus 11 on the most upstream side ((−X) side in FIG. 20), abnormality information is sent to the system management unit 811 and the abnormality information reception unit. 812 is accepted (step S61). Subsequently, the information related to the combination of the type of operation abnormality and the person in charge stored in the system storage unit 814 is collated with the abnormality information by the system control unit 813 to identify the person in charge corresponding to the type of operation abnormality. The notification unit 815 transmits abnormality information to the terminal carried by the person in charge and notifies the person in charge of the occurrence and content of the abnormality (step S62). The person in charge who is notified of the abnormality information may be one person or a plurality of persons.

  Next, the system management unit 811 confirms whether or not the electronic component mounting apparatus 11 in which the operation abnormality has occurred can be operated (step S63), and if it can be operated, the processing is continued. On the other hand, when an operation abnormality indicating inoperability is detected, it is examined whether all electronic components can be mounted using the remaining two electronic component mounting apparatuses 11 (step S64). When it is determined that the operation can be continued, a part of the electronic component mounting system 10 is temporarily stopped as necessary, and the person in charge is notified of the operation, and the operation contents of each device are defined. An operation program is newly created by the calculation unit 816 (or based on another operation program stored in the system storage unit 814 in advance), and a control signal is transmitted to each device including the electronic component mounting device 11 to each device. Is changed by the system control unit 813 (step S65).

  When it is impossible to continue with the remaining devices, it is determined that the operation of the electronic component mounting device 11 and other devices needs to be stopped, and a control signal is sent to the control unit 8 of each device to operate the devices. Stopped (step S66). In this case, the operation of the electronic component mounting device 11 in which the operation abnormality has occurred and the upstream device (screen printing device 21) are immediately stopped, and the device (on the downstream side of the electronic component mounting device 11 in which the operation abnormality has occurred ( The two electronic component mounting devices 11 and the reflow device 31) are sequentially stopped after the processing of the circuit board 9 being processed in these devices is completed. In the electronic component mounting system 10, notification to the person in charge may be made after the operation of the apparatus is stopped.

  In the system management unit 811, even when an operation abnormality occurs in the screen printing apparatus 21 or the reflow apparatus 31, the abnormality information is accepted and notified to the person in charge, and the operation of the apparatus is stopped as necessary. (Steps S61 to S63, S66). In the present embodiment, since each of these devices is provided one by one, the operations shown in steps S64 and S65 (substitution of the operation of the same type of device) are not performed.

  As described above, in the electronic component mounting system 10, the operation abnormality of the devices constituting the system can be detected during operation of the system without a significant change in the mechanical configuration of the system by a common technique of acquiring operation sound. It can be easily detected. Further, the operation of the electronic component mounting system 10 can be stopped as necessary. Thereby, the mounting failure of the electronic component resulting from the operation abnormality which generate | occur | produced in either of the some apparatus which comprises the electronic component mounting system 10 can be prevented efficiently.

  Further, in the electronic component mounting system 10, since the abnormality information is notified to a person in charge who can perform necessary maintenance for each of various types of operation abnormalities, the electronic component mounting system 10 can be efficiently maintained. Can do.

  Further, in the electronic component mounting system 10, even when any one of the plurality of electronic component mounting apparatuses 11 becomes inoperable, the remaining electronic component mounting apparatus 11 that operates normally is used to mount the electronic components. The mounting of electronic components can be continued. Even when one of the two head portions 141 of the electronic component mounting device 11 or a part of the plurality of suction nozzles 145 becomes inoperable, the operation of each device is changed and operates normally. The mounting of electronic components can be continued using the suction nozzle 145 and the head unit 141.

  As mentioned above, although embodiment of this invention has been described, this invention is not limited to the said embodiment, A various change is possible. For example, the structure for sliding the suction nozzle 145 of the electronic component mounting apparatus is not limited to the structure shown in FIG. 4, and the suction nozzle 145 itself may slide relative to the sliding portion 1411, and the spring 1413. May be provided outside the chuck portion 1412.

  In the mounting mechanism of the electronic component mounting apparatus, the electronic component may be held by another component holding unit such as a mechanical chuck instead of the suction nozzle. Even in this case, an operation sound generated when the electronic component is held by the component holding unit is detected, thereby detecting an abnormal operation of the component holding unit.

  In the electronic component mounting device, it is not always necessary to acquire operation sounds for all of the substrate transport mechanism (substrate holding unit), mounting mechanism, and component supply unit, and it operates only on any part that is likely to cause abnormal operation. Sound may be acquired to detect the operation abnormality and the type of operation abnormality (the same applies to the screen printing device 21 and the reflow device 31). In this case, the standard operation sound data and the abnormal operation sound data stored in advance in the memory 61 may be only the data of the corresponding parts.

  In each device (screen printing device 21, electronic component mounting device, and reflow device 31), when the operation sound acquisition points are concentrated in a narrow range, a plurality of operation sound acquisitions are performed with a single microphone. May be. Further, the operation sound acquired by the operation sound acquisition unit 5 does not necessarily need to be an audible sound acquired by the microphone, and vibrations of the target part or a frame to which the target part is attached are acquired as the operation sound. May be. In this case, the operation sound acquisition unit 5 is provided with an acceleration sensor or the like that measures vibration instead of the microphone 51.

  In each device, the comparison between the acquired operation sound data and the standard operation sound data is not performed, but only the acquired operation sound data and the abnormal operation sound data are collated, and the type of the operation abnormality and the operation abnormality may be detected at the same time. . In addition, when there is one type of operation abnormality that is likely to occur in the acquisition target part, the acquired operation sound data and the abnormal operation sound data are not compared, and the detection circuit 62 only detects the operation abnormality. It may be broken.

  The type and number of devices provided in the electronic component mounting system 10 are not limited to the above embodiment. In the electronic component mounting system 10, any two or more of the screen printing device 21, the electronic component mounting device 11, the electronic component mounting device 11 a, and the reflow device 31 are provided, and these devices are managed by the system management unit 811. What is necessary is just to provide other apparatuses (for example, test | inspection apparatus etc.).

  In addition to the apparatus shown in the above embodiment, the operation sound acquisition unit 5 and the detection circuit 62 are mounted on the circuit board 9, an inspection machine that inspects the mounting state of the electronic components mounted on the circuit board 9. You may provide in the dispenser etc. which apply | coat a sealing agent to an electronic component. In this case, even in an inspection machine, a dispenser, or the like, an operation abnormality of the apparatus can be detected during operation based on the acquired operation sound. In addition to mounting using solder paste, abnormality detection based on operation sound can be used for various devices used when mounting electronic components on circuit boards by other methods. For example, an apparatus for mounting an electronic component such as a bare IC chip on a circuit board using a film or paste having anisotropic conductivity or a non-conductive film or paste has a configuration common to various apparatuses in the above embodiment. Therefore, abnormality detection based on operation sound can be used in the same manner as in the above embodiment. In addition, since the same transport mechanism, holding mechanism, various moving mechanisms, suction chucks, and the like are provided for the device for manufacturing the semiconductor device, the operation sound acquired by the operation sound acquisition unit 5 and the detection circuit 62 is provided. Based on the above, it is possible to detect an abnormal operation of the apparatus during operation.

The perspective view which shows the electronic component mounting apparatus which concerns on 1st Embodiment Bottom view showing the mounting mechanism Right side view showing the mounting mechanism and board transport mechanism Diagram showing suction nozzle and nozzle shaft Diagram showing nozzle rotation mechanism Diagram showing the vicinity of the nozzle lifting mechanism Right side view showing the internal structure of the cutting part Right side view showing the internal structure of the cutting part The figure which shows the flow of operation of an electronic component mounting device The block diagram which shows the structure which detects the operation | movement abnormality of an electronic component mounting apparatus The figure which shows the flow of the operation | movement which detects the operation | movement abnormality of an electronic component mounting apparatus The figure which shows the mode of the cutting | disconnection abnormality in a cutting part The figure which shows the other example of the structure of a nozzle rotation mechanism The perspective view which shows the structure of the electronic component mounting apparatus which concerns on 2nd Embodiment. Diagram showing nozzle lifting mechanism The figure which shows the structure of the screen printing apparatus which concerns on 3rd Embodiment. Diagram showing the flow of operation of the screen printing device The figure which shows the structure of the reflow apparatus which concerns on 4th Embodiment. The figure which shows the flow of operation of the reflow device The figure which shows the structure of the electronic component mounting system which concerns on 5th Embodiment The figure which shows the flow of operation of the system management section

Explanation of symbols

DESCRIPTION OF SYMBOLS 5 Operation | movement sound acquisition part 8 Control part 9 Circuit board 10 Electronic component mounting system 11, 11a Electronic component mounting apparatus 12, 32 Substrate conveyance mechanism 12a, 22 Board holding part 13, 13a Component supply part 14, 14a Mounting mechanism 21 Screen printing apparatus 31 reflow device 61 memory 62 detection circuit 126 stage moving mechanism 130 tape member 133 cutting unit 142,242 head unit moving mechanism 145 suction nozzle 146,154 nozzle lifting mechanism 147 nozzle rotating mechanism 148 switching valve 152 nozzle rotating mechanism 231 mask 231a opening 245 Squeegee 340 Processing space 342 Heater 345 Blower mechanism 611 Standard operation sound data 612 Abnormal operation sound data 811 System management unit 812 Abnormal information reception unit 813 System control unit 814 System storage unit 815 Abnormal communication Part S11, S21~S27, S31~S35, S41~S46, S51~S54, S61~S66 step

Claims (22)

An electronic component mounting apparatus for mounting electronic components on a circuit board,
A board holding unit for holding a circuit board;
A mounting mechanism for mounting electronic components on the circuit board held by the board holding unit;
A component supply unit for supplying electronic components to the mounting mechanism;
An operation sound acquisition unit for acquiring operation sound generated during operation of the board holding unit, the mounting mechanism or the component supply unit;
A detection unit that detects an operation abnormality of the substrate holding unit, the mounting mechanism, or the component supply unit based on the operation sound acquired by the operation sound acquisition unit;
An electronic component mounting apparatus comprising: The electronic component mounting apparatus according to claim 1,
A storage unit for storing a standard operation sound when the substrate holding unit, the mounting mechanism or the component supply unit normally operates in advance;
The electronic component mounting apparatus, wherein the detection unit detects the operation abnormality by comparing the operation sound acquired by the operation sound acquisition unit with the standard operation sound. The electronic component mounting apparatus according to claim 1,
Among the operation abnormalities that can occur in the board holding unit, the mounting mechanism, or the component supply unit, further includes a storage unit that stores a plurality of abnormal operation sounds respectively generated when a plurality of types of operation abnormalities are determined in advance.
The detection unit compares the operation sound acquired by the operation sound acquisition unit and the plurality of abnormal operation sounds stored in the storage unit to detect the operation abnormality and identify the type of the operation abnormality An electronic component mounting apparatus characterized by that. The electronic component mounting apparatus according to claim 3,
The apparatus further comprises a control unit that selects and executes a stop of the mounting operation of the electronic component on the circuit board and / or a notification to the operator based on the type of the operation abnormality specified by the detection unit. Electronic component mounting device. An electronic component mounting apparatus according to any one of claims 1 to 4,
The electronic component mounting apparatus, wherein an operation sound generated when an electronic component is mounted on the circuit board held by the substrate holding unit is acquired by the operation sound acquisition unit. An electronic component mounting apparatus according to any one of claims 1 to 4,
A tape member in which a plurality of electronic components are arranged and stored is attached to the component supply unit,
The operation sound generated when the electronic component is sent out by the component supply unit together with the tape member to a predetermined supply place for supplying the electronic component to the mounting mechanism is acquired by the operation sound acquisition unit. Electronic component mounting device. An electronic component mounting apparatus according to any one of claims 1 to 4,
A tape member in which a plurality of electronic components are arranged and stored is attached to the component supply unit,
The component supply unit includes a cutting unit that cuts and removes a portion of the tape member where the supply of the electronic component to the mounting mechanism is completed,
The electronic component mounting apparatus, wherein an operation sound generated when the tape member is cut by the cutting unit is acquired by the operation sound acquisition unit. An electronic component mounting apparatus according to any one of claims 1 to 4,
The mounting mechanism is
A component holding unit that receives and holds an electronic component from the component supply unit;
A moving mechanism that moves the component holding part relative to the circuit board held by the board holding part in a direction along the main surface of the circuit board;
With
The electronic component mounting apparatus, wherein an operation sound generated while the component holding unit is moved by the moving mechanism is acquired by the operation sound acquisition unit. An electronic component mounting apparatus according to any one of claims 1 to 4,
The mounting mechanism is
A component holding unit that receives and holds an electronic component from the component supply unit;
A rotation mechanism for rotating the component holding portion;
With
The electronic component mounting apparatus, wherein an operation sound generated when the component holding unit is rotated by the rotation mechanism is acquired by the operation sound acquisition unit. An electronic component mounting apparatus according to any one of claims 1 to 4,
The mounting mechanism is
A component holding unit that receives and holds an electronic component from the component supply unit;
An elevating mechanism for elevating and lowering the component holder;
With
The electronic component mounting apparatus, wherein an operation sound generated when the component holding unit moves up and down by the lifting mechanism is acquired by the operation sound acquisition unit. An electronic component mounting apparatus according to any one of claims 1 to 4,
The mounting mechanism includes a component holding unit that receives an electronic component from the component supply unit and holds the electronic component by vacuum suction,
The electronic component mounting apparatus, wherein an operation sound generated when the electronic component is sucked by the component holding unit is acquired by the operation sound acquisition unit. It is an electronic component mounting apparatus of Claim 11, Comprising:
The mounting mechanism further includes a switching valve that switches between suction and blow of the electronic component by the component holding unit,
The electronic component mounting apparatus according to claim 1, wherein an operational sound generated when the switching valve is operated is acquired by the operational sound acquisition unit. A screen printing apparatus for printing a solder paste on a circuit board through a mask in which an opening of a printed pattern is formed,
A board holding unit for holding a circuit board;
A squeegee that fills the opening of the mask with the solder paste on the mask by moving relative to the mask in a predetermined direction along the main surface of the mask held on the circuit board;
A squeegee moving mechanism for moving the squeegee relative to the mask in the predetermined direction;
An operation sound acquisition unit for acquiring operation sound generated during operation of the substrate holding unit or the squeegee moving mechanism;
A detection unit that detects an abnormal operation of the substrate holding unit or the squeegee moving mechanism based on the operation sound acquired by the operation sound acquisition unit;
A screen printing apparatus comprising: The screen printing apparatus according to claim 13,
The screen printing apparatus according to claim 1, wherein an operation sound generated while the squeegee moves while the squeegee is in contact with the mask is acquired by the operation sound acquisition unit. A reflow apparatus for performing reflow on a circuit board having electronic components mounted on a printed solder paste,
A board transfer mechanism for transferring a circuit board along a predetermined transfer path;
A heat source,
A blower mechanism that guides the gas heated by the heat source to a circuit board being transported by the transport mechanism;
An operation sound acquisition unit for acquiring an operation sound generated during operation of the substrate transport mechanism or the blower mechanism;
A detection unit for detecting an operation abnormality of the substrate transport mechanism or the blower mechanism based on the operation sound acquired by the operation sound acquisition unit;
A reflow apparatus comprising: An electronic component mounting system for mounting electronic components on a circuit board,
A plurality of devices that perform processing related to mounting electronic components;
An operation sound acquisition unit for acquiring operation sounds of the plurality of devices;
A detection unit that detects abnormal operation of the plurality of devices based on the operation sound acquired by the operation sound acquisition unit;
A storage unit for storing information related to the operation abnormality detected by the detection unit;
An electronic component mounting system comprising: The electronic component mounting system according to claim 16,
An electronic component mounting system, further comprising: a system control unit that transmits a control signal to another device when an abnormal operation of any of the plurality of devices is detected by the detection unit. The electronic component mounting system according to claim 16 or 17,
A storage unit that stores in advance a combination of a type of operation abnormality and a corresponding worker for each of a plurality of types of operation abnormality;
An abnormality notification means for notifying the operator corresponding to the type of operation abnormality detected by the detection unit;
An electronic component mounting system further comprising: The electronic component mounting system according to claim 17,
The plurality of devices includes a plurality of electronic component mounting devices for mounting electronic components on a circuit board,
The operation of the plurality of electronic component mounting devices is changed by the system control unit when an operation abnormality indicating inoperability is detected in any of the plurality of electronic component mounting devices by the detection unit. Electronic component mounting system. An electronic component mounting method for mounting an electronic component on a circuit board,
a) holding the circuit board in a predetermined position by the board holding unit;
b) supplying electronic components from the component supply unit to the mounting mechanism;
c) mounting the electronic component on the circuit board;
d) obtaining an operation sound generated in accordance with the operation of the substrate holding unit, the component supply unit or the mounting mechanism in the steps a) to c);
e) detecting an operation abnormality of the board holding unit, the mounting mechanism or the component supply unit based on the operation sound;
An electronic component mounting method comprising the steps of: A screen printing method for printing a solder paste on a circuit board through a mask in which an opening of a printed pattern is formed,
a) holding the circuit board in a predetermined position by the board holding unit;
b) contacting the circuit board against the lower surface of the mask;
c) filling the solder paste on the mask into the opening of the mask by moving the squeegee relative to the mask in a predetermined direction along the main surface of the mask by a squeegee moving mechanism;
d) obtaining an operation sound generated in accordance with the operation of the substrate holding part or the squeegee moving mechanism in the steps a) to c);
e) detecting an operation abnormality of the substrate holding unit or the squeegee moving mechanism based on the operation sound;
A screen printing method comprising: A reflow method for performing reflow on a printed circuit board on which electronic components are mounted on a solder paste,
a) transporting a circuit board along a predetermined transport path by a substrate transport mechanism;
b) guiding the gas heated by the blower mechanism to the circuit board being transported by the transport mechanism;
c) obtaining an operation sound generated in association with the operation of the substrate transfer mechanism or the air blowing mechanism in the step a) and the step b);
d) detecting an operation abnormality of the substrate holding unit or the air blowing mechanism based on the operation sound;
A reflow method comprising:

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