JP4360257B2 - Electronic component mounting apparatus and state determination method in electronic component mounting apparatus - Google Patents

Electronic component mounting apparatus and state determination method in electronic component mounting apparatus Download PDF

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JP4360257B2
JP4360257B2 JP2004120165A JP2004120165A JP4360257B2 JP 4360257 B2 JP4360257 B2 JP 4360257B2 JP 2004120165 A JP2004120165 A JP 2004120165A JP 2004120165 A JP2004120165 A JP 2004120165A JP 4360257 B2 JP4360257 B2 JP 4360257B2
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electronic component
motor
component mounting
torque
moving mechanism
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JP2005303179A (en
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純 山内
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Panasonic Corp
Panasonic Holdings Corp
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Panasonic Corp
Matsushita Electric Industrial Co Ltd
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本発明は、電子部品を基板に実装する電子部品実装ラインにおいて使用される電子部品実装用装置およびこの電子部品実装用装置における状態判定方法に関するものである。   The present invention relates to an electronic component mounting apparatus used in an electronic component mounting line for mounting an electronic component on a substrate, and a state determination method in the electronic component mounting apparatus.

電子部品実装ラインは、スクリーン印刷装置や電子部品搭載装置など複数の電子部品実装用装置を連結して構成される。これらの装置は、スクリーン印刷のためのスキージヘッドや電子部品を基板に移送搭載するための搭載ヘッドなどの作業ヘッドを、モータを駆動源とするヘッド移動機構によって移動させることにより、所定の作業動作を実行する。   The electronic component mounting line is configured by connecting a plurality of electronic component mounting devices such as a screen printing device and an electronic component mounting device. These devices perform predetermined work operations by moving work heads such as squeegee heads for screen printing and mounting heads for transferring and mounting electronic components on a substrate by a head moving mechanism using a motor as a drive source. Execute.

ヘッド移動機構はボールねじや直動ガイドなどの機構要素を組み合わせて構成されており、このような機構要素によって円滑な動作を長期間安定して行わせるためには、機構各部の潤滑状態や機械調整精度などの装置状態を良好に保つことが不可欠である。そして潤滑不良や機械調整不良、異物噛込みなど装置状態が不正常のまま長時間運転を継続すると、摺動異常による部品の損耗など修復不能な状態に移行する場合があり、この場合には高価な部品交換を伴う大掛かりな修理を余儀なくされる。このような事態の発生を事前に防止するため、従来より機構部の損傷などの異常を検出する方法が提案されている(例えば特許文献1参照)。
特開2001−58342号公報
The head moving mechanism is composed of a combination of mechanism elements such as ball screws and linear guides. In order to ensure smooth operation over a long period of time with such mechanism elements, the lubrication state of each part of the mechanism and the machine It is indispensable to maintain a good apparatus state such as adjustment accuracy. If operation continues for a long period of time, such as poor lubrication, poor machine adjustment, or foreign object biting, the system may shift to a state where it cannot be repaired due to wear of parts due to abnormal sliding. Large-scale repairs that involve complicated parts replacement. In order to prevent the occurrence of such a situation in advance, a method for detecting an abnormality such as damage to the mechanism has been proposed (see, for example, Patent Document 1).
JP 2001-58342 A

しかしながら上述の先行技術例においては、異常状態が温度の異常上昇やボールの傷発生など具体的な症状として発生するまでは状態判定を行うことができず、何らかの異常状態の兆候を検知して部品損傷などの事態を予防することは困難であった。   However, in the above-described prior art examples, the state cannot be determined until the abnormal state occurs as a specific symptom such as an abnormal rise in temperature or the occurrence of a flaw on the ball. It was difficult to prevent situations such as damage.

そこで本発明は、異常状態の兆候を検知して部品損傷の発生を低減することができる電子部品実装用装置を提供することを目的とする。   Accordingly, an object of the present invention is to provide an electronic component mounting apparatus that can detect the sign of an abnormal state and reduce the occurrence of component damage.

本発明の電子部品実装用装置は、電子部品を基板に実装する電子部品実装ラインにおいて使用される電子部品実装用装置であって、少なくとも1方向へ移動し所定の作業動作を行う作業ヘッドと、モータによって駆動され前記作業ヘッドを移動させるヘッド移動機構と、前記モータを制御して前記ヘッド移動機構に所定の状態判定用動作を実行させる制御手段と、前記モータの負荷トルクを検出するトルク検出手段と、前記状態判定用動作を実行したときの前記トルク検出手段によるトルク検出結果に基づいて前記ヘッド移動機構が不正常状態であるか否かを判定する状態判定手段とを備え、前記状態判定手段は前記モータの負荷トルクが判定しきい値を超えた場合、及び前記判定しきい値を超えない場合であっても前記ヘッド移動機構の所定の対象距離範囲内における前記モータの負荷トルクの変動範囲が変動許容しきい値を超えていれば不正常な状態がある範囲にわたって存在する状態異常と判定する。 An electronic component mounting apparatus according to the present invention is an electronic component mounting apparatus used in an electronic component mounting line for mounting an electronic component on a board, and includes a work head that moves in at least one direction and performs a predetermined work operation; A head moving mechanism that is driven by a motor to move the working head; a control unit that controls the motor to cause the head moving mechanism to execute a predetermined state determination operation; and a torque detection unit that detects a load torque of the motor. And a state determination unit that determines whether or not the head moving mechanism is in an abnormal state based on a torque detection result by the torque detection unit when the state determination operation is performed. where the said when the load torque of the motor exceeds a determination threshold value, and said even if not exceeding the judgment threshold the head moving mechanism If the variation range in the load torque of the motor in the subject distance range exceeds the allowable variation threshold, it is determined that the abnormal state present over a certain range not normal.

本発明の電子部品実装用装置における状態判定方法は、電子部品を基板に実装する電子部品実装ラインにおいて使用され、少なくとも1方向へ移動し所定の作業動作を行う作業ヘッドと、モータによって駆動され前記作業ヘッドを移動させるヘッド移動機構と、前記モータを制御して前記ヘッド移動機構に所定の状態判定用動作を実行させる制御手段と、前記モータの負荷トルクを検出するトルク検出手段とを備えた電子部品実装用装置において、前記ヘッド移動機構が不正常状態であるか否かを判定する電子部品実装用装置における状態判定方法であって、前記状態判定用動作を実行したときの前記トルク検出手段によるトルク検出結果に基づいて前記ヘッド移動機構が不正常状態であるか否かを判定する工程を含み、前記モータの負荷トルクが判定しきい値を超えた場合、及び前記判定しきい値を超えない場合であっても前記ヘッド移動機構の所定の対象距離範囲内における前記モータの負荷トルクの変動範囲が変動許容しきい値を超えていれば不正常な状態がある範囲にわたって存在する状態異常と判定する。 The state determination method in the electronic component mounting apparatus according to the present invention is used in an electronic component mounting line for mounting an electronic component on a board, and is driven by a motor, which is driven by a motor, which moves in at least one direction and performs a predetermined work operation. An electronic device comprising: a head moving mechanism that moves a work head; a control unit that controls the motor to cause the head moving mechanism to execute a predetermined state determination operation; and a torque detection unit that detects a load torque of the motor. In the component mounting apparatus, a state determination method in the electronic component mounting apparatus that determines whether or not the head moving mechanism is in an abnormal state, wherein the torque detection unit performs the state determination operation. includes a step of determining whether the or head moving mechanism is in an abnormal state based on the torque detection result, the load bets of the motor If the click exceeds a determination threshold, and the predetermined target distance variation range variation tolerance threshold of the load torque of the motor within the scope of the even if not exceeding the judgment threshold the head moving mechanism if greater than the value, it is determined that the abnormal state present over a certain range not normal.

本発明によれば、ヘッド移動機構を駆動するモータの負荷トルクを検出するトルク検出手段と、状態判定用動作を実行したときのトルク検出手段によるトルク検出結果に基づいてヘッド移動機構の不正常状態の有無を判定する状態判定手段とを備え、状態判定手段はヘッド移動機構の所定の対象距離範囲内におけるモータの負荷トルクの変動範囲が変動許容しきい値を超えていれば状態異常と判定することにより、何らかの異常状態の兆候を検知して部品損傷の発生を低減することができる。 According to the present invention, the abnormal state of the head moving mechanism based on the torque detection result by the torque detecting means for detecting the load torque of the motor that drives the head moving mechanism and the torque detecting means when the state determination operation is executed. State determining means for determining the presence or absence of the motor, and the state determining means determines that the state is abnormal if the fluctuation range of the motor load torque within a predetermined target distance range of the head moving mechanism exceeds a fluctuation allowable threshold. Accordingly, it is possible to detect signs of some abnormal state and reduce the occurrence of component damage.

次に本発明の実施の形態を図面を参照して説明する。図1は本発明の一実施の形態の電子部品搭載装置の平面図、図2、図3は本発明の一実施の形態の電子部品搭載装置の断面図、図4は本発明の一実施の形態の電子部品搭載装置の制御系の構成を示すブロック図、図5は本発明の一実施の形態の電子部品搭載装置におけるトルク計測結果を示すグラフ、図6は本発明の一実施の形態の電子部品搭載装置における状態判定のフロー図である。   Next, embodiments of the present invention will be described with reference to the drawings. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention, FIGS. 2 and 3 are sectional views of the electronic component mounting apparatus according to an embodiment of the present invention, and FIG. 4 is an embodiment of the present invention. The block diagram which shows the structure of the control system of the electronic component mounting apparatus of form, FIG. 5 is the graph which shows the torque measurement result in the electronic component mounting apparatus of one embodiment of this invention, FIG. 6 is one embodiment of this invention It is a flowchart of the state determination in an electronic component mounting apparatus.

まず図1、図2、図3を参照して、電子部品を基板に実装する電子部品実装ラインにおいて使用される電子部品実装用装置としての電子部品搭載装置の構造を説明する。図1において、基台1上にはX方向に搬送路2が配設されている。搬送路2は電子部品が実装される基板3を搬送し、搬送路2上に設定された実装位置において基板3を位置決めする。搬送路2の両側には部品供給部4が設けられており、部品供給部4には複数のテープフィーダ5が装着されている。   First, the structure of an electronic component mounting apparatus as an electronic component mounting apparatus used in an electronic component mounting line for mounting electronic components on a substrate will be described with reference to FIGS. In FIG. 1, a transport path 2 is disposed on a base 1 in the X direction. The transport path 2 transports the substrate 3 on which electronic components are mounted, and positions the substrate 3 at a mounting position set on the transport path 2. Component supply units 4 are provided on both sides of the conveyance path 2, and a plurality of tape feeders 5 are mounted on the component supply unit 4.

基台1のX方向の両端部にはY軸フレーム6aがY方向に設けられており、Y軸フレーム6aの上面にはガイドレール6が配設されている。図2、図3(b)に示すように、ガ
イドレール6にはスライダ7がY方向にスライド自在に嵌着しており、スライダ7はX軸テーブル8の両端に設けられたテーブル端部8a、8bの下面に固着されている。テーブル端部8aの下面には送りねじ9が螺合したナット11が結合されており、図1、図(a)に示すように、送りねじ9はY軸モータ10によって回転駆動される。Y軸モータ10を回転駆動することにより、テーブル端部8aはY方向に駆動され、これによりX軸テーブル8はY方向に移動する。
Y-axis frames 6a are provided in the Y direction at both ends of the base 1 in the X direction, and guide rails 6 are disposed on the upper surface of the Y-axis frame 6a. As shown in FIGS. 2 and 3B, a slider 7 is fitted on the guide rail 6 so as to be slidable in the Y direction. The slider 7 has table end portions 8a provided at both ends of the X-axis table 8. , 8b is fixed to the lower surface. Nut 11 screw 9 sends to the lower surface of the table end 8a is screwed is coupled, as shown in FIG. 1, FIG. 3 (a), the feed screw 9 is driven to rotate by the Y-axis motor 10. By rotating and driving the Y-axis motor 10, the table end 8a is driven in the Y direction, whereby the X-axis table 8 moves in the Y direction.

テーブル端部8a、8bの間には送りねじ16が配設されており、送りねじ16はテーブル端部8aに配置されたX軸モータ17によって回転駆動される。送りねじ16はナット18に螺合しており、ナット18はX軸テーブル8に沿ってX方向にスライド自在な搭載ヘッド12に結合されている。なお搭載ヘッド12をガイドするスライドガイド機構は図示を省略している。X軸モータ17を駆動することにより、搭載ヘッド12はX方向に移動する。   A feed screw 16 is disposed between the table end portions 8a and 8b, and the feed screw 16 is rotationally driven by an X-axis motor 17 disposed at the table end portion 8a. The feed screw 16 is screwed into a nut 18, and the nut 18 is coupled to the mounting head 12 slidable in the X direction along the X axis table 8. A slide guide mechanism for guiding the mounting head 12 is not shown. By driving the X-axis motor 17, the mounting head 12 moves in the X direction.

図2に示すように、搭載ヘッド12は複数の単位搭載ヘッド12aを備えたマルチ型ヘッドであり、単位搭載ヘッド12aは下端部にノズル13を備えている。ノズル13は共通に設けられたθ軸モータ14によってノズル軸廻りに回転する。また搭載ヘッド12は一体に移動するカメラ15を備えており、搭載ヘッド12が基板3上に移動することによりカメラ15は基板3上に位置し、基板3をを撮像して位置を認識する。   As shown in FIG. 2, the mounting head 12 is a multi-type head including a plurality of unit mounting heads 12a, and the unit mounting head 12a includes a nozzle 13 at the lower end. The nozzle 13 is rotated around the nozzle axis by a θ-axis motor 14 provided in common. The mounting head 12 includes a camera 15 that moves integrally. When the mounting head 12 moves onto the substrate 3, the camera 15 is positioned on the substrate 3, and the substrate 3 is imaged to recognize the position.

Y軸モータ10、X軸モータ17を駆動することにより、搭載ヘッド12はXY方向に移動し、これにより各単位搭載ヘッド12aのノズル13によって部品供給部4のテープフィーダ5から電子部品をピックアップし、搬送路2に位置決めされた基板3上に移送して搭載する実装動作を行う。すなわち搭載ヘッド12は、少なくとも1方向へ移動し所定の作業動作を行う作業ヘッドとなっており、ガイドレール6、スライダ7、送りねじ9、ナット11より成るY軸機構、ナット18、送りねじ16およびX方向スライドガイド機構より成るX軸機構は、モータによって駆動され前述の作業ヘッドを移動させるヘッド移動機構を構成する。   By driving the Y-axis motor 10 and the X-axis motor 17, the mounting head 12 moves in the XY direction, whereby an electronic component is picked up from the tape feeder 5 of the component supply unit 4 by the nozzle 13 of each unit mounting head 12 a. Then, the mounting operation of transferring and mounting on the substrate 3 positioned in the transport path 2 is performed. That is, the mounting head 12 is a work head that moves in at least one direction and performs a predetermined work operation. The mounting head 12 includes a guide rail 6, a slider 7, a feed screw 9, a Y-axis mechanism including a nut 11, a nut 18, and a feed screw 16. The X-axis mechanism including the X-direction slide guide mechanism constitutes a head moving mechanism that is driven by a motor and moves the aforementioned working head.

搬送路2と部品供給部4との間には部品認識カメラ20、ツールストッカ21が配設されている。テープフィーダ5からノズル13によって電子部品を取り出した搭載ヘッド12が部品認識カメラ20の上方を移動することにより、部品認識カメラ20はノズル13に保持された状態の電子部品を撮像し、これにより電子部品の位置が認識される。ツールストッカ21には複数種類の電子部品の対応したノズル13が収納保持されており、搭載ヘッド12がツールストッカ21にアクセスすることにより、必要に応じてノズル13が交換される。   A component recognition camera 20 and a tool stocker 21 are disposed between the conveyance path 2 and the component supply unit 4. When the mounting head 12 that has picked up the electronic component from the tape feeder 5 by the nozzle 13 moves above the component recognition camera 20, the component recognition camera 20 images the electronic component held by the nozzle 13 and thereby electronically The position of the part is recognized. The tool stocker 21 stores and holds nozzles 13 corresponding to a plurality of types of electronic components. When the mounting head 12 accesses the tool stocker 21, the nozzles 13 are replaced as necessary.

次に図4を参照して制御系の構成を説明する。制御部30はCPUであり実装装置各部の動作を制御するとともに、以下の説明する各部を制御して後述する自動給脂動作を行わせる。モータ駆動部31はY軸モータ10、X軸モータ17を駆動する。制御部30がモータ駆動部31を介してY軸モータ10、X軸モータ17を制御することにより、ヘッド移動機構は後述する状態判定用動作を実行する。したがって制御部30は、モータを制御してヘッド移動機構に所定の状態判定用動作を実行させる制御手段となっている。   Next, the configuration of the control system will be described with reference to FIG. The control unit 30 is a CPU and controls the operation of each part of the mounting apparatus, and controls each part described below to perform an automatic greasing operation to be described later. The motor drive unit 31 drives the Y-axis motor 10 and the X-axis motor 17. When the control unit 30 controls the Y-axis motor 10 and the X-axis motor 17 via the motor driving unit 31, the head moving mechanism executes a state determination operation described later. Therefore, the control unit 30 is a control unit that controls the motor to cause the head moving mechanism to execute a predetermined state determination operation.

トルク計測部32はモータの負荷トルクを検出するトルク検出手段であり、Y軸モータ10、X軸モータ17を駆動する際の負荷トルクをモータ駆動部31から各モータに供給される電力の電流値に基づいて計測する。状態判定部33は、ヘッド移動機構が状態判定用動作を実行したときのトルク計測部32によるトルク計測結果により、これらのモータによって駆動される負荷機構部に不正常状態、すなわち摺動部の異常摩耗など負荷機構部の正常な動作が阻害される状態へ移行する徴候が表れているか否かを判定する。すなわち状態判定部33は、状態判定用動作を実行したときのトルク検出手段によるトルク検出結果に基づいて負荷機構部であるヘッド移動機構が不正常状態であるか否かを判定する状態判定手段となっている。   The torque measuring unit 32 is a torque detecting unit that detects the load torque of the motor, and the current value of the electric power supplied from the motor driving unit 31 to each motor as the load torque when driving the Y-axis motor 10 and the X-axis motor 17. Measure based on Based on the torque measurement result by the torque measurement unit 32 when the head moving mechanism executes the state determination operation, the state determination unit 33 is in an abnormal state in the load mechanism unit driven by these motors, that is, the sliding unit is abnormal. It is determined whether or not there is a sign of transition to a state where normal operation of the load mechanism such as wear is inhibited. That is, the state determination unit 33 is a state determination unit that determines whether or not the head moving mechanism that is the load mechanism unit is in an abnormal state based on a torque detection result by the torque detection unit when the state determination operation is executed. It has become.

表示部34は表示パネルなどの画面表示手段であり、トルク計測部32によって取得されたトルク計測結果(図5参照)や、状態判定部33による判定結果などを表示する。操作入力部35はキーボードやタッチパネルなどの入力手段であり、後述する状態判定用動作のパターンや判定しきい値の設定のための操作入力を行う。   The display unit 34 is a screen display unit such as a display panel, and displays a torque measurement result (see FIG. 5) acquired by the torque measurement unit 32, a determination result by the state determination unit 33, and the like. The operation input unit 35 is an input unit such as a keyboard or a touch panel, and performs operation input for setting a state determination operation pattern and a determination threshold value, which will be described later.

次に図5を参照して、負荷機構部の状態判定および状態判定用動作について説明する。図5のグラフは、負荷機構部を駆動するモータ(ここではY軸モータ10又はX軸モータ17)を所定の回転数(グリース量の影響によるトルク値の変動が少ない50〜100rpm程度の低速回転域)にて駆動して、ヘッド移動機構に所定の状態判定用動作を実行させた場合のトルク計測値を、移動ストロークを横軸に取って示したものである。状態判定用動作のパターンとしては、ここでは低速回転域での正逆反転動作を用いている。   Next, with reference to FIG. 5, the state determination of the load mechanism unit and the state determination operation will be described. The graph of FIG. 5 shows that the motor (in this case, the Y-axis motor 10 or the X-axis motor 17) that drives the load mechanism is rotated at a low speed of about 50 to 100 rpm with little fluctuation in torque value due to the influence of the amount of grease. The torque measurement value when the head movement mechanism is caused to execute a predetermined state determination operation is shown with the movement stroke taken on the horizontal axis. Here, as the pattern of the state determination operation, a forward / reverse inversion operation in a low-speed rotation region is used here.

図5(a)は、負荷機構部が正常な状態にある場合におけるトルク計測結果を示している。この状態においてモータを駆動して負荷機構部に状態判定用動作を実行させると、正回転時・逆回転時においてそれぞれ回転方向に応じたトルク値(+)(−)が記録される。このとき、トルク値は幾分かの増減を示すものの、全体としてはその時点での負荷機構部の摺動抵抗などによって規定されるトルクレベルにほぼ収束する。   FIG. 5A shows the torque measurement result when the load mechanism is in a normal state. When the motor is driven in this state to cause the load mechanism unit to execute the state determination operation, torque values (+) (−) corresponding to the rotation direction are recorded during forward rotation and reverse rotation, respectively. At this time, although the torque value shows some increase / decrease, as a whole, it almost converges to the torque level defined by the sliding resistance of the load mechanism at that time.

そしてこのトルクレベルに対して許容範囲と考えられる余裕値を加味して、判定しきい値+Tth、−Tthが設定される。すなわちトルク計測結果が、判定しきい値+Tth〜−Tthの範囲内にあり、且つ大きな変動を示していないことが、このモータの負荷機構部の装置状態が正常であると判定されるための条件となる。   Determination threshold values + Tth and -Tth are set by adding a margin value considered to be an allowable range to the torque level. That is, the condition for determining that the device state of the load mechanism portion of the motor is normal that the torque measurement result is within the range of the determination threshold value + Tth to −Tth and does not show a large fluctuation. It becomes.

図5(b)は、負荷機構部の装置状態が不正常であると判定される場合の計測結果の1
パターンを示している。この例では、正回転時のある特定位置において判定しきい値+Tthを超えたトルク計測波形(矢印で示すピーク波形参照)が得られており、この位置において微細異物噛込みやガイドレールの局部的な表面傷など、局部的に負荷抵抗を増大させるような不正常な状態が存在することを示している。
FIG. 5B shows a measurement result 1 when it is determined that the device state of the load mechanism unit is abnormal.
The pattern is shown. In this example, a torque measurement waveform (see peak waveform indicated by an arrow) exceeding a determination threshold value + Tth is obtained at a specific position at the time of forward rotation. This indicates that there is an abnormal state that locally increases the load resistance, such as a surface flaw.

また逆回転時においては、トルク計測波形全体としては判定しきい値−Tthの範囲内には収まっているものの、所定の対象距離範囲L内におけるトルク値の変動範囲Rが変動許容しきい値Rthを超えており、ガイドレールのかじり傷などの不正常な状態がある範囲にわたって存在することを示している。すなわち、トルク計測によって図5(b)に例示するような計測結果が得られたならば、状態判定部33は状態異常と判定し、表示部34にその旨を表示する。   During reverse rotation, the entire torque measurement waveform is within the range of the determination threshold value −Tth, but the torque value fluctuation range R within the predetermined target distance range L is the fluctuation allowable threshold value Rth. This indicates that the abnormal state such as a galling of the guide rail exists over a certain range. That is, if a measurement result as illustrated in FIG. 5B is obtained by torque measurement, the state determination unit 33 determines that the state is abnormal and displays that fact on the display unit 34.

次に図6のフローを参照して、電子部品搭載装置においてヘッド移動機構が不正常状態であるか否かを判定する状態判定方法について説明する。ここではヘッド移動機構のX軸機構、Y軸機構の軸破損診断を行う。まず図6において、制御部30によって軸破損診断開始が指令され(ST1)、これにより所定の状態判定用動作が実行される。   Next, a state determination method for determining whether or not the head moving mechanism is in an abnormal state in the electronic component mounting apparatus will be described with reference to the flow of FIG. Here, the shaft breakage diagnosis of the X-axis mechanism and the Y-axis mechanism of the head moving mechanism is performed. First, in FIG. 6, the shaft breakage diagnosis start is instructed by the control unit 30 (ST1), whereby a predetermined state determination operation is executed.

すなわちまずモータを低回転数で軸を正方向に回転し(ST2)、トルク計測部32によってトルク値が計測される(ST3)。次いで、モータの回転方向が切り換えられ、所定の低回転数で軸を逆方向に回転し(ST4)、トルク計測部32によってトルク値が計測される(ST5)。これにより、図5に示すような判定用のトルク計測結果が取得され、この計測結果に基づいて、状態判定部33によってモータの負荷機構部であるヘッド移動機構の状態判定(ここでは破損判定)が行われる(ST6)。   That is, first, the motor is rotated in the positive direction at a low rotational speed (ST2), and the torque value is measured by the torque measuring unit 32 (ST3). Next, the rotational direction of the motor is switched, the shaft is rotated in the reverse direction at a predetermined low rotational speed (ST4), and the torque value is measured by the torque measuring unit 32 (ST5). As a result, a torque measurement result for determination as shown in FIG. 5 is acquired, and based on this measurement result, the state determination unit 33 determines the state of the head moving mechanism that is the load mechanism unit of the motor (in this case, damage determination). (ST6).

すなわちこの状態判定においては、ヘッド移動機構に所定の状態判定用動作を実行させたときのトルク検出手段によるトルク検出結果に基づいて、ヘッド移動機構が不正常状態であるか否かを判定するようにしている。そして状態判定において、ヘッド移動機構に何らかの不正常な状態が存在すると判断されたならば、装置稼動を停止して不正常部位の探索と原因究明を行い、必要な保守作業を行う。このように電子部品実装装置の稼動を連続して継続する過程において、所定タイミングにて上述の状態判定を行うことにより、動作異常の具体的な症状が発生する以前に異常状態の兆候を検知して、部品損傷の発生を低減することができる。   That is, in this state determination, it is determined whether or not the head moving mechanism is in an abnormal state based on a torque detection result by the torque detecting means when the head moving mechanism is caused to execute a predetermined state determining operation. I have to. In the state determination, if it is determined that any abnormal state exists in the head moving mechanism, the operation of the apparatus is stopped, the abnormal part is searched and the cause is investigated, and necessary maintenance work is performed. Thus, in the process of continuing the operation of the electronic component mounting apparatus, by performing the above-described state determination at a predetermined timing, signs of abnormal conditions are detected before specific symptoms of abnormal operation occur. Thus, occurrence of component damage can be reduced.

なお本実施の形態では、電子部品実装用装置として電子部品を基板に搭載する電子部品搭載装置の例を示したが、スクリーン印刷装置など電子部品実装ラインを構成する他種類の電子部品実装用装置にも、本発明を適用することができる。   In the present embodiment, an example of an electronic component mounting apparatus that mounts an electronic component on a substrate is shown as an electronic component mounting apparatus. However, other types of electronic component mounting apparatuses that constitute an electronic component mounting line such as a screen printing apparatus. Also, the present invention can be applied.

本発明の電子部品実装用装置は、異常状態の兆候を検知して部品損傷の発生を低減することができるという効果を有し、電子部品搭載装置など電子部品を基板に実装する電子部品実装ラインにおいて使用される電子部品実装用装置に有用である。   The electronic component mounting apparatus of the present invention has an effect of detecting signs of abnormal conditions and reducing the occurrence of component damage, and an electronic component mounting line for mounting an electronic component such as an electronic component mounting device on a substrate. It is useful for an electronic component mounting apparatus used in the above.

本発明の一実施の形態の電子部品搭載装置の平面図The top view of the electronic component mounting apparatus of one embodiment of this invention 本発明の一実施の形態の電子部品搭載装置の断面図Sectional drawing of the electronic component mounting apparatus of one embodiment of this invention 本発明の一実施の形態の電子部品搭載装置の断面図Sectional drawing of the electronic component mounting apparatus of one embodiment of this invention 本発明の一実施の形態の電子部品搭載装置の制御系の構成を示すブロック図The block diagram which shows the structure of the control system of the electronic component mounting apparatus of one embodiment of this invention 本発明の一実施の形態の電子部品搭載装置におけるトルク計測結果を示すグラフThe graph which shows the torque measurement result in the electronic component mounting apparatus of one embodiment of this invention 本発明の一実施の形態の電子部品搭載装置における状態判定のフロー図Flow chart of state determination in electronic component mounting apparatus of one embodiment of the present invention

符号の説明Explanation of symbols

6 ガイドレール
7 スライダ
8 X軸テーブル
9 送りねじ
10 Y軸モータ
11 ナット
12 搭載ヘッド
16 送りねじ
17 X軸モータ
18 ナット
6 Guide rail 7 Slider 8 X-axis table 9 Feed screw 10 Y-axis motor 11 Nut 12 Mounting head 16 Feed screw 17 X-axis motor 18 Nut

Claims (2)

電子部品を基板に実装する電子部品実装ラインにおいて使用される電子部品実装用装置であって、少なくとも1方向へ移動し所定の作業動作を行う作業ヘッドと、モータによって駆動され前記作業ヘッドを移動させるヘッド移動機構と、前記モータを制御して前記ヘッド移動機構に所定の状態判定用動作を実行させる制御手段と、前記モータの負荷トルクを検出するトルク検出手段と、前記状態判定用動作を実行したときの前記トルク検出手段によるトルク検出結果に基づいて前記ヘッド移動機構が不正常状態であるか否かを判定する状態判定手段とを備え、
前記状態判定手段は前記モータの負荷トルクが判定しきい値を超えた場合、及び前記判定しきい値を超えない場合であっても前記ヘッド移動機構の所定の対象距離範囲内における前記モータの負荷トルクの変動範囲が変動許容しきい値を超えていれば不正常な状態がある範囲にわたって存在する状態異常と判定することを特徴とする電子部品実装用装置。
An electronic component mounting apparatus used in an electronic component mounting line for mounting an electronic component on a substrate, wherein the working head moves in at least one direction and performs a predetermined working operation, and is driven by a motor to move the working head. A head moving mechanism, control means for controlling the motor to cause the head moving mechanism to execute a predetermined state determining operation, torque detecting means for detecting a load torque of the motor, and the state determining operation. State determining means for determining whether or not the head moving mechanism is in an abnormal state based on a torque detection result by the torque detecting means at the time,
The state determination unit is configured to load the motor within a predetermined target distance range of the head moving mechanism even when the load torque of the motor exceeds a determination threshold and when the motor does not exceed the determination threshold. An electronic component mounting apparatus , wherein if the torque fluctuation range exceeds a fluctuation allowable threshold, it is determined that the abnormal state exists over a certain range.
電子部品を基板に実装する電子部品実装ラインにおいて使用され、少なくとも1方向へ移動し所定の作業動作を行う作業ヘッドと、モータによって駆動され前記作業ヘッドを移動させるヘッド移動機構と、前記モータを制御して前記ヘッド移動機構に所定の状態判定用動作を実行させる制御手段と、前記モータの負荷トルクを検出するトルク検出手段とを備えた電子部品実装用装置において、前記ヘッド移動機構が不正常状態であるか否かを判定する電子部品実装用装置における状態判定方法であって、前記状態判定用動作を実行したときの前記トルク検出手段によるトルク検出結果に基づいて前記ヘッド移動機構が不正常状態であるか否かを判定する工程を含み、
前記モータの負荷トルクが判定しきい値を超えた場合、及び前記判定しきい値を超えない場合であっても前記ヘッド移動機構の所定の対象距離範囲内における前記モータの負荷トルクの変動範囲が変動許容しきい値を超えていれば不正常な状態がある範囲にわたって存在する状態異常と判定することを特徴とする電子部品実装用装置における状態判定方法。
Used in an electronic component mounting line for mounting electronic components on a board, a work head that moves in at least one direction and performs a predetermined work operation, a head moving mechanism that is driven by a motor to move the work head, and controls the motor Then, in the electronic component mounting apparatus comprising: a control unit that causes the head moving mechanism to execute a predetermined state determination operation; and a torque detection unit that detects a load torque of the motor, the head moving mechanism is in an abnormal state. A state determination method in the electronic component mounting apparatus for determining whether the head movement mechanism is in an abnormal state based on a torque detection result by the torque detection unit when the state determination operation is executed. Including the step of determining whether or not
Even if the load torque of the motor exceeds the determination threshold value and does not exceed the determination threshold value, the fluctuation range of the load torque of the motor within a predetermined target distance range of the head moving mechanism is if exceeding the allowable variation threshold, the state determination method in the electronic component mounting apparatus characterized by determining the abnormal state which exists over a range where there is an abnormal state.
JP2004120165A 2004-04-15 2004-04-15 Electronic component mounting apparatus and state determination method in electronic component mounting apparatus Expired - Fee Related JP4360257B2 (en)

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