JP6570964B2 - 筒状蛇腹カバー - Google Patents
筒状蛇腹カバー Download PDFInfo
- Publication number
- JP6570964B2 JP6570964B2 JP2015208729A JP2015208729A JP6570964B2 JP 6570964 B2 JP6570964 B2 JP 6570964B2 JP 2015208729 A JP2015208729 A JP 2015208729A JP 2015208729 A JP2015208729 A JP 2015208729A JP 6570964 B2 JP6570964 B2 JP 6570964B2
- Authority
- JP
- Japan
- Prior art keywords
- ring
- polishing
- cylindrical bellows
- reinforcing
- bellows cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000003014 reinforcing effect Effects 0.000 claims description 52
- 230000007246 mechanism Effects 0.000 claims description 35
- 239000004744 fabric Substances 0.000 claims description 29
- 238000005498 polishing Methods 0.000 description 92
- 235000012431 wafers Nutrition 0.000 description 48
- 238000004140 cleaning Methods 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 230000002787 reinforcement Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000009466 transformation Effects 0.000 description 3
- 239000006061 abrasive grain Substances 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000007517 polishing process Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000006261 foam material Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/24—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
- H01L21/67219—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one polishing chamber
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Auxiliary Devices For Machine Tools (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Description
91 筒状蛇腹カバー
96a 上リング
96b 下リング
96c 補強リング
97 蛇腹布
97a 山部
98 突出部
99 孔
101 ワイヤー部材
Claims (1)
- 上下左右方向に動作する駆動機構の動作領域をカバーする筒状蛇腹カバーであって、
円リング状の上リングと、長円リング状の下リングと、上下に配置される該上リングと該下リングとを連結しかつ上下に段階的に該上リングの円形部分から該下リングの長円形部分に至る複数の山部を有する山谷形状で形成された筒状の蛇腹布と、該上リングと該下リングと平行で該蛇腹布の該複数の山部の内部に配設される該蛇腹布を補強する補強リングと、を備え、
該蛇腹布の複数の該山部には、各山部の外側に突出し孔を有する突出部と、複数の該突出部の該孔が摺動可能に複数の該孔内に挿入され複数の該山部の該補強リングの上下順序を維持するワイヤー部材と、を備えた補強リング上下順序維持部を備え、
各複数の山部の該補強リングの上下順序を維持しつつ上下左右方向に動作する該駆動機構の動作領域をカバーする筒状蛇腹カバー。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015208729A JP6570964B2 (ja) | 2015-10-23 | 2015-10-23 | 筒状蛇腹カバー |
TW105131077A TWI694897B (zh) | 2015-10-23 | 2016-09-26 | 筒狀蛇腹罩 |
KR1020160134916A KR102436344B1 (ko) | 2015-10-23 | 2016-10-18 | 통상 벨로스 커버 |
CN201610912550.XA CN106976017B (zh) | 2015-10-23 | 2016-10-19 | 筒状折皱罩 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015208729A JP6570964B2 (ja) | 2015-10-23 | 2015-10-23 | 筒状蛇腹カバー |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017080823A JP2017080823A (ja) | 2017-05-18 |
JP6570964B2 true JP6570964B2 (ja) | 2019-09-04 |
Family
ID=58713970
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015208729A Active JP6570964B2 (ja) | 2015-10-23 | 2015-10-23 | 筒状蛇腹カバー |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6570964B2 (ja) |
KR (1) | KR102436344B1 (ja) |
CN (1) | CN106976017B (ja) |
TW (1) | TWI694897B (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7002291B2 (ja) * | 2017-11-06 | 2022-01-20 | 株式会社ディスコ | 研磨装置 |
JP2019135071A (ja) * | 2018-02-05 | 2019-08-15 | 株式会社ディスコ | 筒状蛇腹カバー |
JP7483998B1 (ja) | 2023-08-15 | 2024-05-15 | 有限会社エイケイアイ | 電動ドリル用粉塵飛散防止アタッチメント |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03162900A (ja) * | 1989-11-22 | 1991-07-12 | Yoshiyuki Kobayashi | 衣服仕上げ装置 |
US5662568A (en) * | 1995-05-12 | 1997-09-02 | Ingersoll Milling Machine Co. | Symmetrical multi-axis linear motor machine tool |
US6164881A (en) * | 1996-07-23 | 2000-12-26 | Toko, Inc. | Machine tool |
IT1305551B1 (it) * | 1998-09-30 | 2001-05-09 | Pei Protezioni Elaborazioni | Copertura di protezione associabile ad un organo di lavoro mobilealmeno in un piano |
JP3060989U (ja) * | 1999-01-22 | 1999-09-14 | 日本ジャバラ工業株式会社 | 円形中空ガイド体付き、カ―テン状保護カバ―。 |
JP4464113B2 (ja) * | 2003-11-27 | 2010-05-19 | 株式会社ディスコ | ウエーハの加工装置 |
TWM296756U (en) * | 2006-02-23 | 2006-09-01 | Sun Yuan Technology Inc | Improved structure for retractable protecting shield |
KR100734211B1 (ko) | 2006-12-11 | 2007-07-02 | 용광후렉시블공업 주식회사 | 벨로우즈커버 프리세팅장치 및 이를 이용한 벨로우즈커버설치방법 |
JP5480543B2 (ja) * | 2009-06-25 | 2014-04-23 | コマツNtc株式会社 | 工作機械における主軸カバーの取り付け構造 |
TWI448352B (zh) * | 2010-10-08 | 2014-08-11 | Hon Hai Prec Ind Co Ltd | 伸縮式罩體裝置 |
JP5693391B2 (ja) * | 2011-06-14 | 2015-04-01 | 株式会社ショーワ | カバー部材および懸架装置 |
TWM426462U (en) * | 2011-11-01 | 2012-04-11 | Tien Ding Ind Co Ltd | Telescopic pull rod fixing structure for dust-proof protection cover |
JP5990010B2 (ja) * | 2012-02-27 | 2016-09-07 | 株式会社ディスコ | 研磨装置 |
US20130340875A1 (en) * | 2012-06-26 | 2013-12-26 | A & A Manufacturing Co., Inc. | Folded bellows |
JP6004580B2 (ja) * | 2013-03-22 | 2016-10-12 | 住友理工株式会社 | ダストカバー組立体 |
KR101852697B1 (ko) * | 2013-10-23 | 2018-04-26 | 비와이디 컴퍼니 리미티드 | 금속 성형 장치 |
CN203900513U (zh) * | 2014-06-06 | 2014-10-29 | 浙江特普机床制造有限公司 | 机床 |
CN203856919U (zh) * | 2014-07-30 | 2014-10-01 | 浙江崇富橡塑有限公司 | 球笼防尘罩 |
CN203991610U (zh) * | 2014-08-18 | 2014-12-10 | 蔡海锋 | 钻孔防尘罩 |
TWM494041U (zh) * | 2014-09-25 | 2015-01-21 | Wang-Lian Zhang | 適用於加工機台的防塵護蓋同動組件 |
MY177228A (en) * | 2014-12-08 | 2020-09-09 | Alcon Inc | Method and device for cleaning deposited material from a molding surface of a mold for forming ophthalmic lenses |
CN104959752B (zh) * | 2015-07-02 | 2016-10-05 | 中国航天科技集团公司长征机械厂 | 波纹管补偿器伸缩夹具 |
-
2015
- 2015-10-23 JP JP2015208729A patent/JP6570964B2/ja active Active
-
2016
- 2016-09-26 TW TW105131077A patent/TWI694897B/zh active
- 2016-10-18 KR KR1020160134916A patent/KR102436344B1/ko active IP Right Grant
- 2016-10-19 CN CN201610912550.XA patent/CN106976017B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
TWI694897B (zh) | 2020-06-01 |
TW201726311A (zh) | 2017-08-01 |
KR20170048174A (ko) | 2017-05-08 |
JP2017080823A (ja) | 2017-05-18 |
CN106976017A (zh) | 2017-07-25 |
CN106976017B (zh) | 2020-07-31 |
KR102436344B1 (ko) | 2022-08-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4790322B2 (ja) | 加工装置および加工方法 | |
JP2007173487A (ja) | ウエーハの加工方法および装置 | |
KR101531820B1 (ko) | 반도체 스트립 그라인더 | |
JP6570964B2 (ja) | 筒状蛇腹カバー | |
JP6522437B2 (ja) | 筒状蛇腹カバー | |
US20180093361A1 (en) | Processing apparatus | |
KR101530269B1 (ko) | 웨이퍼 그라인딩 장치 | |
JP2009125915A (ja) | 研削ホイール装着機構 | |
CN110405961A (zh) | 切削装置 | |
JP5466963B2 (ja) | 研削装置 | |
JP6420105B2 (ja) | 加工装置 | |
JP6045926B2 (ja) | 研削研磨装置 | |
JP2008098574A (ja) | ウエーハの研磨装置 | |
JP2006055971A (ja) | 研磨パッドのドレッシング方法 | |
JP7002291B2 (ja) | 研磨装置 | |
JP6990720B2 (ja) | 洗浄装置、洗浄方法及びコンピュータ記憶媒体 | |
JP6736372B2 (ja) | 加工装置 | |
JP2010087443A (ja) | 搬送機構 | |
JP4295469B2 (ja) | 研磨方法 | |
JP4074118B2 (ja) | 研磨装置 | |
JP2020131367A (ja) | 研削装置 | |
JP2003305643A (ja) | 研磨装置 | |
JP5973284B2 (ja) | 研削装置 | |
JP6983311B2 (ja) | 基板処理システム及び基板処理方法 | |
KR20070017256A (ko) | 연마 공정이 끝난 웨이퍼를 크리닝하는 스피너 장치 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20180816 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20190531 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20190709 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20190807 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6570964 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |