JP6570172B2 - 導電性樹脂組成物及び樹脂成形体 - Google Patents

導電性樹脂組成物及び樹脂成形体 Download PDF

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JP6570172B2
JP6570172B2 JP2015131210A JP2015131210A JP6570172B2 JP 6570172 B2 JP6570172 B2 JP 6570172B2 JP 2015131210 A JP2015131210 A JP 2015131210A JP 2015131210 A JP2015131210 A JP 2015131210A JP 6570172 B2 JP6570172 B2 JP 6570172B2
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resin
molded body
resin composition
molding
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JP2016050306A5 (enrdf_load_stackoverflow
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飯田 和則
和則 飯田
悦秀 尾高
悦秀 尾高
幸夫 秋葉
幸夫 秋葉
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Mitsubishi Chemical Advanced Materials Japan Ltd
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JP2015131210A 2014-08-29 2015-06-30 導電性樹脂組成物及び樹脂成形体 Active JP6570172B2 (ja)

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JP2014176511 2014-08-29
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JP2015131210A JP6570172B2 (ja) 2014-08-29 2015-06-30 導電性樹脂組成物及び樹脂成形体

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JP2016050306A JP2016050306A (ja) 2016-04-11
JP2016050306A5 JP2016050306A5 (enrdf_load_stackoverflow) 2016-09-01
JP6570172B2 true JP6570172B2 (ja) 2019-09-04

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JP6031625B1 (ja) * 2016-03-11 2016-11-24 クオドラントポリペンコジャパン株式会社 樹脂組成物及び成形体
JP2018165331A (ja) * 2017-03-28 2018-10-25 クオドラントポリペンコジャパン株式会社 樹脂成形体及びその製造方法

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* Cited by examiner, † Cited by third party
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JPS6140346A (ja) * 1984-08-01 1986-02-26 Mitsuboshi Belting Ltd 帯電防止機能を有する超高分子量ポリエチレン樹脂組成物
JPS6346244A (ja) * 1986-08-12 1988-02-27 Mitsuboshi Belting Ltd 導電性ポリエチレン樹脂成形体の製造方法
CN1473174A (zh) * 2001-09-06 2004-02-04 ������ѧ��ʽ���� 聚乙烯树脂组合物
JP2011121992A (ja) * 2008-11-25 2011-06-23 Sakushin Kogyo Kk 半導電性超高分子量ポリエチレン成形品

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